KR20150113471A

KR20150113471A - The manufactoring method of fine metal mesh

Info

Publication number: KR20150113471A
Application number: KR1020140037380A
Authority: KR
Inventors: 고종수; 정경국
Original assignee: 부산대학교 산학협력단
Priority date: 2014-03-31
Filing date: 2014-03-31
Publication date: 2015-10-08

Abstract

The present invention relates to a method for manufacturing a fine metal mesh and, more specifically, to a method for manufacturing a fine metal mesh, wherein the fine metal mesh has a high aspect ratio as the mesh is manufactured by forming fine grooves, forming conductive layers on the bottom surfaces of the grooves and conducting metal electroplating. The method for manufacturing a fine metal mesh according to the present invention comprises: a substrate manufacturing step; a conductive material forming step; an electroplating step; and a substrate removing step. The substrate manufacturing step is to manufacture a nonconducting substrate having fine grooves formed thereon. The conductive material forming step is to form conductive materials on the bottom surfaces of the grooves. The electroplating step is to form an electroplating layer of a metal mesh on the grooves by conducting electroplating after connecting an electrode to the conductive material. The substrate removing step is to remove the nonconducting substrate after the electroplating. Also, in the method for manufacturing a fine metal mesh, it is desirable that the conductive material forming step be to insert a metal mesh or wire into the bottom surfaces of the grooves. According to the present invention, a metallic layer is formed from the bottoms of the grooves by forming fine grooves on the nonconducting substrate, forming conductive layers on the bottoms of the grooves and conducting electroplating. Therefore, a mesh with a great height can be manufactured a metal mesh with a high aspect ratio can be manufactured.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fine metal mesh,

The present invention relates to a method of manufacturing a fine metal mesh, and more particularly, to a method of manufacturing a fine metal mesh by forming a conductive layer on a bottom surface of a groove after forming a fine groove, and then performing metal electroplating to form a mesh, The present invention also relates to a method for producing a fine metal mesh.

A method for producing a fine metal mesh is disclosed in many publications such as Published Japanese Patent Application No. 10-2009-0013890, Published Patent Application No. 10-2011-0034401, Registered Patent No. 10-1211136, and Published Patent Application No. 10-2013-0104492 .

In the case of manufacturing the fine metal mesh manufactured by the disclosed conventional method, the height of the fine metal mesh can not be increased by electroplating even on the wall surface of the fine groove by electroplating. Therefore, there was a problem that a mesh having a high aspect ratio could not be formed.

The present invention is intended to solve the above problems. SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of manufacturing a fine metal mesh having a high cross section by increasing the height of the mesh.

The method for manufacturing a fine metal mesh according to the present invention includes a substrate manufacturing step, a conductive material forming step, an electroplating step, and a substrate removing step. The substrate manufacturing step produces a non-conductive substrate on which fine grooves are formed. The conductive material forming step forms a conductive material on the bottom surface of the groove. In the electroplating step, an electrode is connected to the conductive material, and electroplating is performed to form a plating layer of a metal mesh in the groove. The substrate removing step removes the nonconductive substrate after the electroplating.

In addition, in the method of manufacturing a fine metal mesh, it is preferable that the conductive material forming step sandwich the conductive mesh or wire for the electrode on the bottom surface of the groove.

Also, in the method of manufacturing a fine metal mesh, the conductive material forming step may include attaching a magnet to the back surface of the nonconductive substrate to sandwich the conductive mesh or wire for the electrode on the bottom surface of the groove.

In addition, in the method for manufacturing a fine metal mesh, it is preferable that the conductive material is formed by pouring a solution containing conductive particles into the groove of the nonconductive substrate, and then precipitating the conductive particles to evaporate the solution.

In the method of manufacturing a fine metal mesh, the conductive material may be formed by depositing a conductive ink on the groove and then evaporating the conductive ink to form a conductive material on the bottom of the groove.

In addition, in the method of manufacturing a fine metal mesh, the conductive material forming step may modify the bottom of the groove to an ink-like property so that the conductive ink is buried in the groove.

In addition, in the above-described fine metal mesh manufacturing method, it is possible to perform plating while changing the plating solution so that different materials are laminated in the electroplating step.

Preferably, the method further includes a planarizing step of planarizing the upper surface of the plating layer by milling or polishing the surface of the plating layer to planarize the surface after the electroplating step.

In the method of manufacturing a fine metal mesh, it is preferable that the substrate is further formed with two additional grooves in the non-conductive substrate on which the fine grooves are formed.

Preferably, the fine metal mesh manufacturing method further includes an etching step of etching the metal mesh with a chemical solution after the step of removing the substrate.

It is preferable that the method further comprises a nanoparticle forming step of forming nanoparticles on the surface of the metal mesh after the step of removing the substrate.

The method may further include deforming the nonconductive substrate before the electroplating step after the conductive material forming step.

In the method of manufacturing a fine metal mesh, it is preferable that the electroplating step electroplates the plating layer so as to cover the upper surface of the nonconductive substrate.

The method may further include oxidizing the surface of the metal mesh after the step of removing the substrate, causing a chemical reaction, or coating the metal mesh with a metal, a polymer, or a ceramic material.

Preferably, the method further comprises a step of bending the metal mesh after the step of removing the substrate, or performing cold or hot forming to deform the metal mesh.

According to the present invention, a metal layer is formed from the bottom of the groove by forming a fine groove in the non-conductive substrate, forming a conductive layer on the bottom of the groove, and performing electroplating. Therefore, it is possible to manufacture a mesh having a high height, and a metal mesh having a high cross-sectional ratio can be produced.

1 is a flow chart of one embodiment of a method for manufacturing a fine metal mesh according to the present invention,
Fig. 2 is a perspective view of the non-conductive substrate of the embodiment shown in Fig. 1,
3 is a conceptual view of a conductive material forming step of the embodiment shown in Fig. 1,
FIG. 4 is another conceptual view of the conductive material forming step of the embodiment shown in FIG. 1,
Fig. 5 is another conceptual view of the conductive material forming step of the embodiment shown in Fig. 1,
FIG. 6 is a conceptual view of the electroplating step of the embodiment shown in FIG. 1,
FIG. 7 is a conceptual view of a fine metal mesh manufactured according to the embodiment shown in FIG. 1,
FIG. 8 is another perspective view of a non-conductive substrate of a method of manufacturing a fine metal mesh according to the present invention,
FIG. 9 is a conceptual view of a fine metal mesh manufactured using the nonconductive substrate of FIG. 8,
10 is a conceptual diagram of a modification step of the method for manufacturing a fine metal mesh according to the present invention,
FIG. 11 is another conceptual diagram illustrating the electroplating step of the method of manufacturing a fine metal mesh according to the present invention. FIG.
12 is a photograph of the nickel mesh produced according to the present invention,
13 is a photograph of the nickel mesh of FIG. 12 etched with an etching solution.

An embodiment of a method of manufacturing a fine metal mesh according to the present invention will be described with reference to FIGS. 1 to 13. FIG.

The method for manufacturing a fine metal mesh according to the present invention includes a substrate manufacturing step S11, a conductive material forming step S13, an electroplating step S15, and a substrate removing step S17.

In the substrate manufacturing step S11, the nonconductive substrate 10 on which the fine grooves 11 are formed is manufactured. The grooves 11 of the nonconductor substrate 10 can be processed by a direct processing method such as dicing saw, laser, water jet, lathe processing, photolithography, and X-ray lithography. The non-conductive material may be formed by a method such as injection molding, casting, embossing or the like using the other mold to form the groove 11. Then, the interval of the grooves 11 is narrow, but the depth of the grooves 11 is large, and the non-conductive substrate 10 can be manufactured.

The material of the nonconductive substrate 10 may be acrylic, PMMA, polyethylene, PTFE, poly carbonate, PVDF, or cyclic olefin copolymer (COC). A polymer composite material containing a polymer material such as nylon, polyester, polyvinyl, Kapton or photoresist or a synthetic material thereof and a metal particle, ceramic particle or carbon fiber in the polymer, Or a polymer that can be removed by plasma etching. In addition, various inorganic materials such as alumina, ceramics such as zirconia, silicon, glass, and quartz can be used. Materials such as paper, wood, and elastic rubber can also be used.

The conductive material forming step S13 is a step of forming a conductive material on the bottom surface of the groove 11. [ Several different methods can be used at this time.

First, as shown in FIGS. 3 and 4, a conductive mesh 13 for a electrode or a wire 15 is inserted into a bottom surface of the groove 11. 5, when the magnet 17 is attached to the back surface of the non-conductive substrate 10, the conductive mesh 13 for the electrode or the wire 15 is inserted into the groove 11 In the present invention.

Second, a solution in which the conductive particles are mixed may be poured into the grooves 11 of the nonconductive substrate 10, and then the conductive particles may be precipitated to evaporate the solution. Then, a conductive material is formed on the bottom surface of the groove 11.

A solution in which conductive particles such as metal particles, metal-coated particles, and carbon particles are mixed is placed on the non-conductive substrate 10, the conductive particles are immersed on the bottom surface of the groove, and then the solution is removed. If magnetic particles are used, the magnet can be used to precipitate particles faster. If necessary, the conductive particles on top of the non-conductive substrate 10 are removed.

In the case of magnetic particles, the particles can be directly attracted to the bottom surface of the groove 11 by magnetic attraction. At this time, vibration such as ultrasonic vibration can be applied to the bottom surface of the groove 11 to evenly fill the particles.

In addition, the particles filled in the grooves 11 may be melt-bonded to the particles by physical pressing or using a laser to increase the electrical conductivity.

Thirdly, a conductive material may be formed on the bottom of the groove 11 by depositing conductive ink on the groove 11 and then evaporating it.

The property of the bottom surface of the groove 11 can be modified to be ink-philic by a laser or a plasma treatment so as to selectively embed the conductive ink only on the bottom of the groove 11. The conductive ink on the upper portion of the nonconductive substrate 10 is removed. The conductive ink can selectively spotting only the groove 11 region.

In the electroplating step S15, an electrode is connected to a conductive material formed on the bottom of the groove 11, and electroplating is performed. Then, a plating layer of the metal mesh 20 is formed in the groove 11 as shown in FIG.

Electroplating can be performed in the form of a single metal such as copper, nickel, lead, tin, iron, aluminum, gold, silver, chromium, tungsten, molybdenum and alloys thereof.

Further, when plating is performed while changing the plating solution, different materials can be produced in a laminated form. After plating, the upper surface of the plating layer may be planarized by milling or polishing for surface planarization.

In the substrate removing step (S17), the non-conductive substrate 10 is removed after the electroplating. Then, only the fine metal mesh 20 is left as shown in FIG.

When removing the non-conductive substrate 10, a method of not damaging or minimizing damage to the plated metal mesh 20 structure is selected.

For example, if the non-conductive substrate 10 is a polymer such as acrylic or polyethylene, it may be wet-removed using an organic solvent such as acetone, or may be dry-removed by plasma etching. At this time, the organic solvent includes various aromatic organic solvents such as various alcohols including acetone, ethanol, methanol, isopropyl alcohol, and benzene, and the plasma etching can perform plasma etching using various gases such as oxygen, helium, and argon Do.

Also, the polymer can be removed from the melted state by raising the melting temperature of the polymer, and the polymer can be burned at a very high temperature.

Also, the polymer can be selectively removed using a laser.

When the insulating substrate 10 is made of glass, it can be removed using a fluorine (HF) based chemical solution. In the case of silicon, silicon etching such as potassium hydroxide (KOH), tetramethylammonium hydroxide (TMAH), and ethylenediamine pyrocatechol Solution. &Lt; / RTI >

In this embodiment, the fine grooves 11 are formed at one end when the nonconductive substrate 10 is manufactured in the substrate manufacturing step S11. However, as shown in FIG. 8, two stages of fine grooves 12 may be additionally formed to provide a multi-stage groove structure. When the conductive mesh or wire for electrode is inserted into only the fine grooves 11 in the above-described manner and plating is performed, not only the fine grooves 11 in one stage but also the fine grooves 12 formed in two stages are plated So that a multistage mesh having different mesh sizes can be fabricated as shown in FIG.

In addition, the present invention may further include an etching step after the substrate removing step (S17).

When the metal mesh 20 is isotropically etched with a chemical solution, the width of the metal mesh 20 becomes thinner. This additional etching makes it possible to fabricate a metal mesh 20 structure having a very high aspect ratio.

In addition, the surface of the mesh structure may be oxidized, a chemical reaction may be caused, or other kinds of metals, polymers, or ceramic materials may be coated. In this case, various coating methods such as plating, spraying, plasma and dip coating may be used .

For example, it is possible to manufacture a metal mesh made of multiple metals by additionally depositing a metal such as lead, gold, silver or tungsten on the surface of a primary nickel mesh or copper mesh on the surface of the primary metal mesh.

In addition, micro-nanoparticles can be formed on the surface of the mesh structure.

The surface of the fabricated mesh structure may be coated with a hydrophilic or hydrophobic or lipophilic or oleophobic material to realize a mesh having hydrophilic, water repellent, hydrophilic and oil-repellent properties selectively.

The metal mesh 20 thus manufactured can be deformed into an arbitrary shape through cold or hot forming.

Meanwhile, the above-described embodiment has fabricated the metal mesh 20 having a flat plane. In order to form a mesh having a curvature at this time, as shown in FIG. 10, it may further include a deforming step of bending the non-conductive substrate 10 before the electroplating step S15 after the conductive material forming step S13.

When the non-conductive substrate 10 is bent, plating proceeds according to the shape of the curved non-conductive substrate 10, so that the metal mesh structure having the same curvature as that of the bent non- Can be produced.

On the other hand, if electroplating is further performed in the electroplating step S15, the plating layer covers the upper surface of the non-conductive substrate 10 as shown in FIG. 11, and the additional metal structure 22 can be manufactured.

Conventionally, when a metal mesh is produced by a method such as electroplating, plating occurs on the side wall of the groove, and therefore, it is impossible to fabricate a metal mesh having a high cross-sectional ratio because the inside of a narrow and deep groove can not be completely filled with plating. However, in this embodiment, since the plating is performed from the bottom of the groove, the height of the mesh can be increased to obtain a mesh having a high cross-sectional ratio.

High-shear mesh structures can be applied to devices that block X-rays, light, or particles. For example, it can be used as an anti-scatter or collimator to enhance the resolution of X-ray imaging devices.

It can also be applied to a filter that selectively filters fine particles.

It can also be applied to a biocide reaction device requiring a large surface area.

In addition, it can be used as a functional mesh that selectively passes any specific liquid among multiple liquids such as water, oil, or the like, or does not selectively pass a specific liquid. In addition, it can be used as a functional mesh that allows gas to pass without passing all liquid streams.

FIG. 12 is a structure of a nickel mesh fabricated by the method shown in FIG. 1, and FIG. 13 is an example in which the nickel mesh of FIG. 9 is further etched using a nickel isotropic etching solution to make the width of the mesh much thinner. With this additional etching, a nickel mesh structure having a very high aspect ratio can be fabricated.

10: non-conductive substrate 11: fine groove
12: additional fine grooves 13: conductive mesh for electrodes
15: Conductive wire for electrode 17: Magnet
20: metal mesh 21: multi-stage metal mesh
22: Additional plated metal constructions

Claims

A substrate manufacturing step of manufacturing a non-conductive substrate on which a fine groove is formed,
A conductive material forming step of forming a conductive material on a bottom surface of the groove;
An electroplating step of connecting an electrode to the conductive material and electroplating to form a plating layer of a metal mesh in the groove;
And a substrate removing step of removing the non-conductive substrate after the electroplating.

The method according to claim 1,
Wherein the conductive material forming step comprises sandwiching a conductive mesh or wire for an electrode on a bottom surface of the groove.

3. The method of claim 2,
Wherein the conductive material forming step comprises attaching a magnet to a back surface of the nonconductive substrate and sandwiching a conductive mesh or wire for an electrode on a bottom surface of the groove.

The method according to claim 1,
Wherein the forming of the conductive material comprises pouring a solution containing conductive particles into the groove of the nonconductive substrate, and then precipitating the conductive particles to evaporate the solution.

The method according to claim 1,
Wherein the forming of the conductive material comprises depositing a conductive ink in the groove and then evaporating the conductive ink to form a conductive material on the bottom of the groove.

6. The method of claim 5,
Wherein the forming of the conductive material comprises modifying the bottom of the groove into ink-philic property so that the conductive ink is buried in the groove.

The method of claim 1, wherein the electroplating is performed while changing the plating solution so that different materials are stacked.

The method according to claim 1,
Further comprising a planarizing step of planarizing an upper portion of the plating layer by milling or polishing to planarize the surface after the electroplating step.

The method according to claim 1,
Wherein the step of fabricating the substrate further comprises forming additional grooves in two stages on the non-conductive substrate on which the fine grooves are formed.

10. The method according to any one of claims 1 to 9,
Further comprising the step of etching the metal mesh with a chemical solution after the step of removing the substrate.

10. The method according to any one of claims 1 to 9,
Further comprising a step of forming nanoparticles on the surface of the metal mesh after the step of removing the substrate.

10. The method according to any one of claims 1 to 9,
Further comprising a deforming step of bending the nonconductive substrate before the electroplating step after the conductive material forming step.

10. The method according to any one of claims 1 to 9,
Wherein the electroplating step electroplats the electroplating so that the plating layer covers the upper surface of the nonconductive substrate.

10. The method according to any one of claims 1 to 9,
Further comprising the step of oxidizing the surface of the metal mesh after the step of removing the substrate, causing a chemical reaction, or coating the metal mesh with a metal, a polymer or a ceramic material.

10. The method according to any one of claims 1 to 9,
Further comprising the step of: bending the metal mesh or deforming the metal mesh by cold or hot forming after the substrate removing step.