KR20150108262A - Shield can, electronic apparatus and manufacturing method thereof - Google Patents

Abstract

A shield can for shielding EMI according to the present disclosure includes: a shield cover which includes a lateral protrusion; and a shield frame which includes a connection part to selectively fix the lateral protrusion at a first height or a second height to be connected to the shield cover. But, the embodiment of the present invention is not limited and the present invention includes different embodiments.

Description

[0001] SHIELD CAN, ELECTRONIC DEVICE, AND ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF [0002]

The present disclosure relates to a shield can, an electronic device including the same, and a method of manufacturing the shield can.

2. Description of the Related Art Recently, various electronic devices including a mobile device have been made smaller and lighter. The trend toward higher integration and higher performance of electronic component devices is further accelerated.

Accordingly, 'electromagnetic waves' which directly affect the performance of electronic component devices have attracted great attention. Electron waves are collectively referred to as physical phenomena in which electromagnetic fields whose intensities change periodically are propagated into a space. However, in recent years, 'electromagnetic waves' mean electromagnetic noise that can be emitted from electronic components or affect electronic components. At present, there is a practical approach to the electromagnetic wave shielding in various angles such as materials, structures, and methods.

When an electronic component is covered with a predetermined material for shielding electromagnetic waves, there is a problem in releasing heat generated in the electronic component. If the heat is not properly discharged, the stable operation of the electronic parts can not be guaranteed, which may result in lowering the product performance or shortening the life span.

Embodiments of the present invention provide a shield can for shielding electromagnetic waves and an electronic device including the same, which can reduce the above problems.

A shield can according to various embodiments of the present disclosure is for a shielded shield, and includes a shield cover on which a side protrusion is formed; And a shield frame having a connection portion for selectively fixing the lateral projection at a first height or a second height to be engaged with the shield cover.

An electronic device according to various embodiments of the present disclosure includes a substrate; An inner device stacked on the substrate; And a shield cover formed on the upper surface of the internal element and formed with a side projection; and a shield cover vertically extending from the substrate to shield the periphery of the internal element, and the side projection to a first height or a second And a shielding frame having a connecting portion for selectively fixing at a height thereof.

A method of manufacturing an electronic device according to various embodiments of the present disclosure includes the steps of fastening the shield cover to the shield frame by fixing the side projection of the shield cover to a first hole located at a first height of the shield frame ; Soldering an internal element on the substrate and the shield frame surrounding the internal element; And applying pressure to the shield cover to fix the lateral projection to a second hole located at a second height of the shield frame.

The shield can according to various embodiments of the present disclosure can provide the function of electromagnetic wave shielding while effectively solving the heat dissipation problem of the electronic component element.

An electronic device according to various embodiments of the present disclosure can improve electromagnetic wave shielding and heat radiation performance of an electronic component.

The method of manufacturing an electronic device according to various embodiments of the present disclosure can provide a shielding structure that can reduce the defective rate in the course of the SMD process.

1 illustrates a network environment including an electronic device, in accordance with various embodiments of the present disclosure.
Figure 2 shows a block diagram of an electronic device according to various embodiments of the present disclosure.
Figure 3 shows a side view of an electronic device including a shield can according to various embodiments of the present disclosure.
4A shows a cross-sectional view illustrating an example of a fastening portion of a shield frame and a shield cover according to an embodiment of the present disclosure prior to the SMD process.
4B shows a cross-sectional view illustrating an example of a fastening portion of a shield frame and a shield cover according to an embodiment of the present disclosure when pressure is applied after the SMD process.
5 shows a perspective view illustrating the structure of a shield frame according to various embodiments of the present disclosure;
6A-6C illustrate various examples of connections of a shield frame in accordance with various embodiments of the present disclosure.
7A shows a side view of the structure of a shield can according to one embodiment of the present disclosure prior to the SMD process.
Fig. 7B shows a side view showing the structure of the shield can according to one embodiment of the present disclosure when pressure is applied after the SMD process.
8A shows a side view of the structure of a shield can according to another embodiment of the present disclosure prior to the SMD process.
8B shows a side view showing the structure of the shield can according to another embodiment of the present disclosure when pressurization is performed after the SMD process.

The present disclosure will be described below with reference to the accompanying drawings. The present disclosure is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and detailed description of the invention is set forth. It is to be understood, however, that this disclosure is not intended to be limited to the specific embodiments, but includes all changes and / or equivalents and alternatives falling within the spirit and scope of the disclosure. In connection with the description of the drawings, like reference numerals have been used for like elements.

The use of the terms "comprises" or "comprising" may be used in the present disclosure to indicate the presence of a corresponding function, operation, or element, etc., and does not limit the presence of one or more other features, operations, or components. Also, in this disclosure, the terms "comprises" or "having ", and the like, specify that the presence of stated features, integers, But do not preclude the presence or addition of other features, numbers, steps, operations, components, parts, or combinations thereof.

The "or" in the present disclosure includes any and all combinations of words listed together. For example, "A or B" may comprise A, comprise B, or both A and B.

The expressions "first," " second, "" first," or "second, " and the like in the present disclosure may modify various elements of the disclosure, but do not limit the elements. For example, the representations do not limit the order and / or importance of the components. The representations may be used to distinguish one component from another. For example, both the first user equipment and the second user equipment are user equipment and represent different user equipment. For example, without departing from the scope of the present disclosure, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, . On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between.

The terminology used in this disclosure is used only to describe a specific embodiment and is not intended to limit the disclosure. The singular expressions include plural expressions unless the context clearly dictates otherwise.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the relevant art and are to be interpreted as either ideal or overly formal in the sense of the art unless explicitly defined in this disclosure Do not.

An electronic device according to the present disclosure may be a smartphone, a tablet personal computer, a mobile phone, a videophone, an e-book reader, a desktop personal computer, Such as a laptop personal computer, a netbook computer, a personal digital assistant (PDA), a portable multimedia player (PMP), an MP3 player, a mobile medical device, a camera, or a wearable device : At least one of a head-mounted-device (HMD) such as electronic glasses, an electronic garment, an electronic bracelet, an electronic necklace, an electronic app apparel, an electronic tattoo, or a smartwatch.

According to some embodiments, the electronic device may be a smart home appliance. [0003] Smart household appliances, such as electronic devices, are widely used in the fields of television, digital video disk (DVD) player, audio, refrigerator, air conditioner, vacuum cleaner, oven, microwave oven, washing machine, air cleaner, set- And may include at least one of a box (e.g., Samsung HomeSyncTM, Apple TVTM, or Google TVTM), game consoles, an electronic dictionary, an electronic key, a camcorder, or an electronic frame.

According to some embodiments, the electronic device may be a variety of medical devices (e.g., magnetic resonance angiography (MRA), magnetic resonance imaging (MRI), computed tomography (CT) (global positioning system receiver), EDR (event data recorder), flight data recorder (FDR), automotive infotainment device, marine electronic equipment (eg marine navigation device and gyro compass), avionics, A security device, a head unit for a vehicle, an industrial or home robot, an ATM (automatic teller machine) of a financial institution, or a point of sale (POS) of a shop.

According to some embodiments, the electronic device is a piece of furniture or a part of a building / structure, an electronic board, an electronic signature receiving device, a projector, : Water, electricity, gas, or radio wave measuring instruments, etc.). An electronic device according to the present disclosure may be one or more of the various devices described above. Further, the electronic device according to the present expansion may be a flexible device. It should also be apparent to those skilled in the art that the electronic device according to the present disclosure is not limited to the above-described devices.

Hereinafter, an electronic device according to various embodiments will be described with reference to the accompanying drawings. The term user as used in various embodiments may refer to a person using an electronic device or a device using an electronic device (e.g., an artificial intelligence electronic device).

1 illustrates a network environment 100 including an electronic device 101, in accordance with various embodiments. 1, the electronic device 101 includes a bus 110, a processor 120, a memory 130, an input / output interface 140, a display 150, a communication interface 160, and an application control module 170 ).

The bus 110 may be a circuit that interconnects the components described above and communicates (e.g., control messages) between the components described above.

The processor 120 may communicate with other components (e.g., the memory 130, the input / output interface 140, the display 150, the communication interface 160, or the application control module 170), decrypt the received command, and execute an operation or data processing according to the decrypted command.

The memory 130 may be coupled to the processor 120 or other components such as the input and output interface 140, the display 150, the communication interface 160, or the application control module 170, Or store instructions or data generated by the processor 120 or other components. The memory 130 may include programming modules such as, for example, a kernel 131, a middleware 132, an application programming interface (API) 133, or an application 134. Each of the above-described programming modules may be composed of software, firmware, hardware, or a combination of at least two of them.

The kernel 131 may include system resources used to execute operations or functions implemented in other programming modules, such as the middleware 132, the API 133 or the application 134 (E.g., the bus 110, the processor 120, or the memory 130). The kernel 131 may also provide an interface for accessing and controlling or managing the individual components of the electronic device 101 at the middleware 132, the API 133 or the application 134 have.

The middleware 132 can act as an intermediary for the API 133 or the application 134 to communicate with the kernel 131 to exchange data. The middleware 132 may also be operable to associate at least one application of the application 134 with system resources of the electronic device 101, for example, (E.g., scheduling or load balancing) for a work request using a method such as assigning a priority that can be used by the processor 110 (e.g., the bus 110, the processor 120, or the memory 130) .

The API 133 is an interface for the application 134 to control the functions provided by the kernel 131 or the middleware 132. For example, the API 133 may be a file control, a window control, an image processing, At least one interface or function (e.g.

According to various embodiments, the application 134 may be an SMS / MMS application, an email application, a calendar application, an alarm application, a health care application (e.g., an application that measures momentum or blood glucose) E.g., applications that provide air pressure, humidity, or temperature information, etc.). Additionally or alternatively, the application 134 may be an application related to the exchange of information between the electronic device 101 and an external electronic device (e.g., electronic device 104). The application associated with the information exchange may include, for example, a notification relay application for communicating specific information to the external electronic device, or a device management application for managing the external electronic device .

For example, the notification delivery application may transmit notification information generated by another application (e.g., SMS / MMS application, email application, healthcare application, or environment information application) of the electronic device 101 to an external electronic device (E.g., device 104). Additionally or alternatively, the notification delivery application may receive notification information from, for example, an external electronic device (e.g., electronic device 104) and provide it to the user. The device management application may be configured to perform functions for at least a portion of an external electronic device (e.g., electronic device 104) that communicates with the electronic device 101 (e.g., (E.g., controlling the turn-on / turn-off of the external electronic device or adjusting the brightness (or resolution) of the display), managing an application running on the external electronic device or services , Deleted or updated).

According to various embodiments, the application 134 may include an application specified according to attributes (e.g., the type of electronic device) of the external electronic device (e.g., electronic device 104). For example, if the external electronic device is an MP3 player, the application 134 may include an application related to music playback. Similarly, if the external electronic device is a mobile medical device, the application 134 may include applications related to health care. According to one embodiment, the application 134 may include at least one of an application specified in the electronic device 101 or an application received from an external electronic device (e.g., server 106 or electronic device 104) .

The input / output interface 140 connects commands or data input from a user via an input / output device (e.g., a sensor, a keyboard, or a touch screen) to the processor 120, (130), the communication interface (160), or the application control module (170). For example, the input / output interface 140 may provide the processor 120 with data on the user's touch input through the touch screen. The input / output interface 140 is connected to the processor 120, the memory 130, the communication interface 160, or the application control module 170 via the bus 110 Outputting the command or data through the input / output device (e.g., a speaker or a display). For example, the input / output interface 140 may output voice data processed through the processor 120 to a user through a speaker.

The display 150 may display various information (e.g., multimedia data or text data) to the user.

The communication interface 160 may connect the communication between the electronic device 101 and an external device (e.g., the electronic device 104 or the server 106). For example, the communication interface 160 may be connected to the network 162 via wireless or wired communication to communicate with the external device. The wireless communication may include, for example, wireless fidelity, Bluetooth, near field communication (NFC), global positioning system (GPS) , WiBro or GSM, etc.). The wired communication may include at least one of, for example, a universal serial bus (USB), a high definition multimedia interface (HDMI), a recommended standard 232 (RS-232) or a plain old telephone service (POTS).

According to one embodiment, the network 162 may be a telecommunications network. The communication network may include at least one of a computer network, an internet, an internet of things, or a telephone network. According to one embodiment, a protocol (e.g., transport layer protocol, data link layer protocol or physical layer protocol) for communication between the electronic device 101 and an external device is provided by the application 134, application programming interface 133, May be supported by at least one of the middleware 132, the kernel 131, or the communication interface 160.

The application control module 170 may be configured to receive at least some of the information obtained from other components (e.g., the processor 120, the memory 130, the input / output interface 140, or the communication interface 160) And can provide it to the user in various ways. For example, the application control module 170 recognizes the information of the connected components provided in the electronic device 101, stores the information of the connected components in the memory 130, So that the application 134 can be executed.

2 shows a block diagram of an electronic device 200 in accordance with various embodiments. The electronic device 200 may constitute all or part of the electronic device 101 shown in Fig. 1, for example. 2, the electronic device 200 includes at least one application processor (AP) 210, a communication module 220, a subscriber identification module (SIM) card 224, a memory 230, Module 240, input device 250, display 260, interface 270, audio module 280, camera module 291, power management module 295, battery 296, indicator 297, And a motor 298.

The AP 210 may control a plurality of hardware or software components connected to the AP 210 by operating an operating system or an application program, and may perform various data processing and operations including multimedia data. The AP 210 may be implemented as a system on chip (SoC), for example. According to one embodiment, the AP 210 may further include a graphics processing unit (GPU) (not shown).

The communications module 220 (e.g., the communications interface 160) may communicate with other electronic devices (e. G., Electronic devices 104) that are networked with the electronic device 200 Or the server 106). According to one embodiment, the communication module 220 includes a cellular module 221, a Wifi module 223, a BT module 225, a GPS module 227, an NFC module 228, and a radio frequency (RF) module 229).

The cellular module 221 may provide voice calls, video calls, text services, or Internet services over a communication network (e.g., LTE, LTE-A, CDMA, WCDMA, UMTS, WiBro or GSM). The cellular module 221 can also perform identification and authentication of electronic devices within the communication network using, for example, a subscriber identity module (e.g., a SIM card 224). According to one embodiment, the cellular module 221 may perform at least some of the functions that the AP 210 may provide. For example, the cellular module 221 may perform at least some of the multimedia control functions.

According to one embodiment, the cellular module 221 may include a communication processor (CP). In addition, the cellular module 221 may be implemented with an SoC, for example. Components such as the cellular module 221 (e.g., communications processor), the memory 230 or the power management module 295 are shown as separate components from the AP 210, but according to one embodiment , The AP 210 may be implemented to include at least a portion of the aforementioned components (e.g., cellular module 221).

According to one embodiment, the AP 210 or the cellular module 221 (e.g., a communications processor) may load (e.g., load) a command or data received from at least one of non-volatile memory or other components coupled to the volatile memory load. In addition, the AP 210 or the cellular module 221 may store data generated from at least one of the other components or generated by at least one of the other components in the non-volatile memory.

Each of the Wifi module 223, the BT module 225, the GPS module 227 and the NFC module 228 includes a processor for processing data transmitted and received through a corresponding module . Although the cellular module 221, the Wifi module 223, the BT module 225, the GPS module 227 or the NFC module 228 are shown as separate blocks, according to one embodiment, the cellular module 221, At least some (e.g., two or more) of the Wifi module 223, the BT module 225, the GPS module 227, or the NFC module 228 may be included in one integrated chip (IC) or IC package. At least some of the processors (e.g., cellular module 221) corresponding to each of cellular module 221, Wifi module 223, BT module 225, GPS module 227 or NFC module 228, And a Wifi processor corresponding to the Wifi module 223) may be implemented as one SoC.

The RF module 229 can transmit and receive data, for example, transmit and receive RF signals. The RF module 229 may include, for example, a transceiver, a power amplifier module (PAM), a frequency filter, or a low noise amplifier (LNA). In addition, the RF module 229 may further include a component, for example, a conductor or a lead wire, for transmitting and receiving electromagnetic waves in free space in wireless communication. Although the cellular module 221, the Wifi module 223, the BT module 225, the GPS module 227 and the NFC module 228 are shown sharing one RF module 229, At least one of the cellular module 221, the WiFi module 223, the BT module 225, the GPS module 227 or the NFC module 228 can transmit and receive RF signals through separate RF modules .

The SIM cards 224_1 to N may be cards including a subscriber identity module, and may be inserted into slots 225_1 to N formed at specific positions of the electronic device. The SIM cards 224_1-N may include unique identification information (e.g., an integrated circuit card identifier (ICCID)) or subscriber information (e.g., international mobile subscriber identity (IMSI)).

The memory 230 (e.g., the memory 130) may include an internal memory 232 or an external memory 234. The built-in memory 232 may be a nonvolatile memory such as a dynamic RAM (DRAM), a static RAM (SRAM), a synchronous dynamic RAM (SDRAM), or the like, Such as one time programmable ROM (OTPROM), programmable ROM (PROM), erasable and programmable ROM (EPROM), electrically erasable and programmable ROM (EEPROM), mask ROM, flash ROM, NAND flash memory, And may include at least one.

According to one embodiment, the internal memory 232 may be a solid state drive (SSD). The external memory 234 may be a flash drive such as a compact flash (CF), a secure digital (SD), a micro secure digital (SD), a mini secure digital (SD), an extreme digital A Memory Stick, and the like. The external memory 234 may be operatively coupled to the electronic device 200 via various interfaces. According to one embodiment, the electronic device 200 may further include a storage device (or storage medium) such as a hard drive.

The sensor module 240 may measure a physical quantity or sense an operation state of the electronic device 200, and convert the measured or sensed information into an electrical signal. The sensor module 240 includes a gesture sensor 240A, a gyro sensor 240B, an air pressure sensor 240C, a magnetic sensor 240D, an acceleration sensor 240E, a grip sensor 240F, A light sensor 240G, a color sensor 240H (e.g., an RGB (red, green, blue) sensor), a living body sensor 240I, a temperature / humidity sensor 240J, 240M). ≪ / RTI > Additionally or alternatively, the sensor module 240 may include, for example, an E-nose sensor (not shown), an EMG sensor (not shown), an EEG sensor (not shown) (Not shown), an iris sensor (not shown), or a fingerprint sensor (not shown). The sensor module 240 may further include a control circuit for controlling at least one sensor included therein.

The input device 250 includes a touch panel 252, a (digital) pen sensor 254, a key 256, or an ultrasonic input device 258 . The touch panel 252 can recognize the touch input by at least one of an electrostatic type, a pressure sensitive type, an infrared type, and an ultrasonic type. In addition, the touch panel 252 may further include a control circuit. In electrostatic mode, physical contact or proximity recognition is possible. The touch panel 252 may further include a tactile layer. In this case, the touch panel 252 may provide a tactile response to the user.

The (digital) pen sensor 254 may be implemented using the same or similar method as receiving the touch input of the user, for example, or using a separate recognition sheet. The key 256 may include, for example, a physical button, an optical key or a keypad. The ultrasonic input device 258 is a device that can confirm data by sensing a sound wave from the electronic device 200 to a microphone (e.g., a microphone 288) through an input tool for generating an ultrasonic signal, Recognition is possible. According to one embodiment, the electronic device 200 may use the communication module 220 to receive user input from an external device (e.g., a computer or a server) connected thereto.

The display 260 (e.g., the display 150) may include a panel 262, a hologram device 264, or a projector 266. The panel 262 may be, for example, a liquid-crystal display (LCD) or an active-matrix organic light-emitting diode (AM-OLED). The panel 262 may be embodied, for example, in a flexible, transparent or wearable manner. The panel 262 may be configured as one module with the touch panel 252. The hologram device 264 can display a stereoscopic image in the air using interference of light. The projector 266 can display an image by projecting light onto a screen. The screen may, for example, be located inside or outside the electronic device 200. According to one embodiment, the display 260 may further include control circuitry for controlling the panel 262, the hologram device 264, or the projector 266.

The interface 270 may be implemented as a high-definition multimedia interface (HDMI) 272, a universal serial bus (USB) 274, an optical interface 276, or a D- ) ≪ / RTI > The interface 270 may, for example, be included in the communication interface 160 shown in FIG. Additionally or alternatively, the interface 270 may be implemented, for example, by a mobile high-definition link (MHL) interface, a secure digital (SD) card / multi-media card (MMC) interface, or an infrared data association . ≪ / RTI >

The audio module 280 may convert both sound and electrical signals into bi-directional signals. At least some of the components of the audio module 280 may be included, for example, in the input / output interface 140 shown in FIG. The audio module 280 may process sound information input or output through, for example, a speaker 282, a receiver 284, an earphone 286, a microphone 288, or the like.

The camera module 291 can capture still images and moving images. The camera module 291 may include one or more image sensors (e.g., a front sensor or a rear sensor), a lens (not shown), an image signal processor (Not shown) or a flash (not shown), such as an LED or xenon lamp.

The power management module 295 may manage the power of the electronic device 200. Although not shown, the power management module 295 may include, for example, a power management integrated circuit (PMIC), a charger integrated circuit (PMIC), or a battery or fuel gauge.

The PMIC can be mounted, for example, in an integrated circuit or a SoC semiconductor. The charging method can be classified into wired and wireless. The charging IC can charge the battery, and can prevent an overvoltage or an overcurrent from the charger. According to one embodiment, the charging IC may comprise a charging IC for at least one of a wired charging scheme or a wireless charging scheme. The wireless charging system may be, for example, a magnetic resonance system, a magnetic induction system or an electromagnetic wave system, and additional circuits for wireless charging may be added, such as a coil loop, a resonant circuit or a rectifier have.

The battery gauge can measure the remaining amount of the battery 296, the voltage during charging, the current or the temperature, for example. The battery 296 may store or generate electricity and may supply power to the electronic device 200 using stored or generated electricity. The battery 296 may include, for example, a rechargeable battery or a solar battery.

The indicator 297 may indicate a specific state of the electronic device 200 or a portion thereof (e.g., the AP 210), for example, a boot state, a message state, or a charged state. The motor 298 may convert an electrical signal to mechanical vibration. Although not shown, the electronic device 200 may include a processing unit (e.g., a GPU) for mobile TV support. The processing device for supporting the mobile TV can process media data conforming to standards such as digital multimedia broadcasting (DMB), digital video broadcasting (DVB), or media flow.

Each of the above-described components of the electronic device according to the present disclosure may be composed of one or more components, and the name of the component may be changed according to the type of the electronic device. The electronic device according to the present disclosure may be configured to include at least one of the above-described components, and some components may be omitted or further include other additional components. In addition, some of the components of the electronic device according to the present disclosure may be combined and configured as an entity, so that the functions of the corresponding components before being combined can be performed in the same manner.

The term "module" as used herein may mean a unit comprising, for example, one or a combination of two or more of hardware, software or firmware. A "module" may be interchangeably used with terms such as, for example, unit, logic, logical block, component or circuit. A "module" may be a minimum unit or a portion of an integrally constructed component. A "module" may be a minimum unit or a portion thereof that performs one or more functions. "Modules" may be implemented either mechanically or electronically. For example, a "module" in accordance with the present disclosure may be implemented as an application-specific integrated circuit (ASIC) chip, field-programmable gate arrays (FPGAs) or programmable logic arrays (FPGAs) logic device).

3 illustrates a side view of an electronic device 200 that includes a shield can in accordance with various embodiments of the present disclosure.

The shield can 320, 330 according to the present disclosure may be used for electromagnetic interference shielding of various internal elements (e.g., AP 210 of FIG. 2) stacked on a substrate 310 (e.g., a printed circuit board Lt; / RTI > The shield can 320 and 330 may be configured to be coupled to the substrate to cover the internal elements 210 on the substrate 310 as shown and may include a shield frame 320 and a shield cover 320. In one embodiment, (Not shown).

According to one embodiment, the shield frame 320 attached to the substrate may be soldered together during a SMD (Surface Mount Device) process in which the internal elements 210 are soldered onto the substrate 310. Therefore, the shield can is required to have high heat resistance in addition to conductivity and insulation for shielding electromagnetic waves. The shield frame 320 is soldered so that the entire shield can can be fixed to the substrate 310. According to the present embodiment, since the shield cover 330 can be separated from the shield frame 320, if the internal element 210 is defective even after the SMD process is performed, the internal element 210 can be replaced .

According to one embodiment, the shield cover 330 may be located on top of the inner element 210. For example, the shield cover 330 may include a planar portion and a side portion extending along the periphery of the planar portion, and the side portion may be formed with a lateral protrusion protruding inward. The side projections may be at least one or more. As shown, the flat portion of the shield cover 330 may cover the upper portion of the inner element 210, and the side portion may cover at least a portion of the shield frame 320.

 According to one embodiment, the shield frame 320 may be formed vertically on the substrate 310 to shield the periphery of the internal element 210. For example, the shield frame 320 may include a side portion vertically formed on the substrate 310 and a support portion having one end opposite to the substrate 310 folded inward. And a side portion may be formed with a connection portion capable of receiving the side projections of the shield cover 330. [ The support portion can support the shield cover 330 when the shield cover 330 is fastened.

In accordance with various embodiments of the present disclosure, the shield frame 320 and the shield cover 330 may include a fastening portion 340. The coupling part 340 may include the coupling part formed to receive the lateral projection on the side projection and the shield frame 320 formed toward the inner side of the shield cover 330. The connection portion may include, for example, at least one hole capable of fixing the side projection. Examples of the fastening portion 230 will be discussed in detail below.

According to one embodiment, a thermal interface material (TIM) 350 may be attached to a surface of the shield cover 330 facing the internal element 210. The thermal conduction element can, for example, serve to lower the contact thermal resistance. When different objects are brought into contact with each other (in this embodiment, the internal element 210 and the shield cover 330, and the shield cover 330 and the bracket 370), the heat is smoothly moved by the contact thermal resistance It can be inhibited. Therefore, the heat generated by the operation of the internal element 210 may not be properly discharged to the outside. Therefore, heat dissipation can be achieved by using the heat conduction element 350 capable of minimizing the contact heat resistance. According to one embodiment, a heat conducting element 350 attached to the inside of the shield cover 330 may contact the internal element 210. Another thermal conductive element 360 is attached to the outer side of the shield cover 330, that is, the surface opposite to the inner element 210, and the bracket 370 is covered. The heat generated by the heat can be discharged to the outside through the bracket 370.

4A and 4B are cross-sectional views illustrating an example of a fastening portion 340 of a shield frame 320 and a shield cover 330, according to various embodiments of the present disclosure.

4A, according to an embodiment, the fastening portion 340 may include the side projections 331 of the shield cover 330 and the connecting portions 321 and 323 of the shield frame 320. [ The connection portions 321 and 323 of the shield frame 320 can selectively fix the lateral protrusion 331 of the shield cover 330 at the first height h1 or the second height h2. For example, the connection portion of the shield frame 320 may include a first hole 321 formed at a first height h1 and a second hole 323 formed at a second height h2. The first hole 321 may be formed at a point extending vertically in the second hole 323.

The heat conductive element 350 can be attached to the surface of the shield cover 330 facing the internal element 210 before the shield cover 330 is fastened to the shield frame 320. [ The shield cover 330 to which the heat conduction element 350 is attached may first be fixed to the first hole 321 of the shield frame 320. [ The SMD process for soldering the internal element 210 and the shield frame 320 to the substrate 310 can be performed while the shield cover 330 is fastened through the first hole 321 of the shield frame 320 . The internal element 210 may be soldered to the substrate 310 using, for example, a solder ball 211. The shield cover 330 may have a first height h1 from the substrate 310 so that a predetermined space may be formed between the internal element 210 and the heat conduction device 350. [

Referring to FIG. 4B, a pressure can be applied to the shield cover 330 in the direction of the substrate 310, and the shield cover 330, which receives the pressure, can move toward the substrate 310. For example, when a pressure equal to or greater than a threshold value is applied, the lateral protrusion 321 fixed to the first hole 321 in the fastening portion 340 can be moved to the second hole 323 and fixed. The shield cover 330 has a second height h2 from the substrate 310 so that the thermal conductive element 350 attached to the inner surface of the shield cover 330 can be brought into contact with the internal element 210 .

The heat conduction element 350 may be a material weak in heat and having high elastic force. According to the present embodiment, since the heat conduction device 350 forms a predetermined space with the internal device 210 in the SMD process in which the high temperature / high pressure environment is formed, the heat conduction device 350 The influence can be minimized. In addition, since the SMD process is performed while the shield cover 330 is fastened to the shield frame 320, the number of operations is effectively reduced as compared with the case where only the shield frame 320 is soldered and then the shield cover 330 is fastened . According to the present embodiment, after the SMD process is performed, the shield cover 330 can be simply pressed to form the final shield can structure. The final shield can structure shields the electromagnetic wave and can effectively dissipate the heat of the internal element 210 to the outside by contacting the internal element 210 with the heat conduction element 350.

5 shows a perspective view illustrating the structure of a shield frame 320 according to various embodiments of the present disclosure.

The shield frame 320 according to one embodiment may include sides extending vertically with a predetermined height. For example, when the internal element is a rectangular parallelepiped by the shield frame 320, the shield frame 320 may include four vertical sides so as to cover the outer periphery of the internal element. At least one of the side surfaces of the shield frame 320 may include a connection portion 500 that can selectively fix the side projection 331 of the shield cover 330 at a first height or a second height as shown in FIG. . The connection portion 500 may be formed in a plurality corresponding to the number of the side projections 331 of the shield cover 330. For example, the connection part 500 includes a first hole 321 for fixing the lateral projection 331 to the first height, and a second hole 323 for fixing the lateral projection 331 to the second height .

6A to 6C are views showing various embodiments of the connection part 500 of the shield frame 320. FIG.

Referring to FIG. 6A, the connection portion 500a may include first and second holes 321 and 323 at a first height and a second height, respectively. For example, the side projections 331 of the shield cover 330 are first fixed to the first holes 321, and after the SMD process is performed, a pressure is applied to the shield cover 330, Two holes 323 are formed.

Referring to FIG. 6B, the connection portion 500b may include a hole 324 for receiving the side projection 331 of the shield cover 330. FIG. The hole 324 has a first portion 325 capable of fixing the lateral projection 331 at a first height and a second portion 326 capable of fixing the lateral projection 331 at a second height . For example, by fixing the side projection 331 of the shield cover 330 to the first portion 325 and applying pressure to the shield cover 330 after performing the SMD process, 2 portion 326 of the second housing 326. [ According to the present embodiment, since the first and second portions 324 and 324 can be overlapped in one hole 324, the height of the shield frame 320 can be effectively reduced.

6C, the connection portion 500c includes at least two holes 324 and 327 to accommodate at least two lateral projections 331 having different heights formed on the side surface of the shield cover 330 can do. At least one hole 324 of the at least two holes includes a first portion 325 capable of fixing the lateral projection 331 received in the hole 324 at a first height, And a second portion 326 capable of securing the lateral projection 331 at a second height of the projection 331. The side projections 331 accommodated in the holes 324 can be formed at a lower position of the side surface of the shield cover 330 as compared with the other side projections 331 accommodated in the other holes 327. [ For example, by first fixing the side projections 331 of the shield cover 330 corresponding to the holes 324 to the first portion 325, applying pressure to the shield cover 330 after performing the SMD process The lateral protrusion 331 can be fixed to the second portion 326. [ The other hole 327 of the at least two holes may be formed in the other side protrusion 331 formed at a relatively high position in the side surface of the shield cover 330 when a pressure is applied to the shield cover 330 after performing the SMD process Can be accommodated. According to the present embodiment, the height of the shield frame 320 can be effectively reduced, and the shield cover 330 and the shield frame 320 can be more stably fixed.

7A and 7B show a side view of a shield can structure according to one embodiment of the present disclosure.

Referring to FIG. 7A, before the SMD process for the electronic device is performed, the side projections of the shield cover 330 attaching the heat conducting element to the inner plane can be fixed at the first height of the shield frame 320. FIG. Therefore, a predetermined distance d may be formed between the shield cover 330 to which the heat conduction element is attached and the internal element to be located in the shield frame 320.

After the SMD process is performed, the shield cover 330 may be pressurized. Referring to FIG. 7B, the side projections of the shield cover 330 can be fixed at the second height of the shield frame 320. Thus, a heat conducting element attached to the inner plane of the shield cover 330 can be attached to the upper plane of the inner element located in the shield frame 320. [

8A and 8B show a side view showing a shield can structure according to another embodiment of the present disclosure.

Before performing the SMD process for an electronic device, referring to FIG. 8A, the shield cover 330 attaching the heat conducting element to the inner plane may include at least two side projections having different heights on the sides. The sizes of the two lateral projections may be the same or different. The shield frame 320 according to one embodiment may include at least two holes corresponding to the two side projections. One hole may include first and second portions capable of fixing one lateral projection at the first height and the second height. And the remaining one hole can fix the remaining axial projections at the second height. In the state before the SMD process is performed, the side projection at the lower position of the side surface of the shield cover 330 is received in the first portion of the hole of the corresponding shield frame 320 so that the shield cover 330 is fixed at the first height . Therefore, a predetermined distance d may be formed between the shield cover 330 to which the heat conduction element is attached and the internal element to be located in the shield frame 320.

After the SMD process is performed, the shield cover 330 may be pressurized. Referring to FIG. 8B, the side projections of the shield cover 330 housed in the first portion of the shield frame 320 may be moved and fixed to the second portion of the shield frame 320. Then, the remaining lateral projections can be accommodated in the corresponding holes. Accordingly, the shield cover 330 can be fixed at the second height, and the heat conduction element attached to the inner plane of the shield cover 330 can be attached to the upper plane of the inner element located in the shield frame 320. [

It is to be understood that both the foregoing description and the following detailed description are exemplary and explanatory only and are not intended to limit the scope of the present disclosure. Accordingly, the scope of the present disclosure should be construed as being included within the scope of the present disclosure in addition to the embodiments disclosed herein, all changes or modifications derived from the technical idea of the present disclosure.

Claims (20)

With a shield can shield for shielding before,
A shield cover on which a side projection is formed; And
And a shielding frame formed at a first height or a second height for selectively fixing the side projections to be engaged with the shield cover. The method according to claim 1,
The connecting portion
Wherein the first and second holes are formed at the first height and the second height, respectively, the first and second holes being configured to selectively receive the lateral projections. 3. The method of claim 2,
Wherein the first hole is formed at a point extending vertically in the second hole. The method according to claim 1,
The connecting portion
Wherein the hole has a first portion in which the lateral projection can be fixed at the first height and a second portion in which the lateral projection can be fixed in the second height, Included shield can. The method according to claim 1,
The shield cover
And at least two of the side projections having different heights on the side surfaces. 6. The method of claim 5,
The connecting portion
And at least two holes for receiving said at least two lateral projections. The method according to claim 6,
Wherein at least one of the at least two holes has a first portion in which a lateral projection received in the hole can be fixed at the first height and a second portion in which the lateral projection can be fixed in the second height Included shield can. Board;
An inner device stacked on the substrate; And
A shield cover formed on the upper surface of the internal element and formed with a side projection; and a shield cover vertically extending from the substrate to shield the periphery of the internal element, and the side projection being provided at a first height or a second height And a shielding frame having a connection portion formed therein for selectively fixing the shield can. 9. The method of claim 8,
And a heat conductive material adhered to a surface of the shield cover facing the upper surface of the internal element. 10. The method of claim 9,
Wherein the first height is set to be higher than the second height,
And wherein when the lateral projection of the shield cover is fixed at the second height, the thermally conductive material contacts the top surface of the inner element. 9. The method of claim 8,
The connecting portion
Wherein the first and second holes are formed at the first height and the second height, respectively, wherein the first and second holes are formed at the first height and the second height, respectively. 12. The method of claim 11,
Wherein the first hole is formed at a point extending vertically in the second hole. 9. The method of claim 8,
The connecting portion
Wherein the hole has a first portion in which the lateral projection can be fixed at the first height and a second portion in which the lateral projection can be fixed in the second height, ≪ / RTI > 9. The method of claim 8,
The shield cover
And at least two of said side projections having different heights at side surfaces. 15. The method of claim 14,
The connecting portion
And at least two holes for receiving the at least two lateral projections. 16. The method of claim 15,
Wherein at least one of the at least two holes has a first portion in which a lateral projection received in the hole can be fixed at the first height and a second portion in which the lateral projection can be fixed in the second height ≪ / RTI > Fixing the shield cover to the shield frame by fixing a side projection of the shield cover to a first hole located at a first height of the shield frame;
Soldering an internal element on the substrate and the shield frame surrounding the internal element; And
And applying pressure to the shield cover to secure the projections to a second hole located at a second height of the shield frame. 18. The method of claim 17,
Further comprising the step of attaching a heat conductive material to a surface of the shield cover facing the upper surface of the internal element before fastening the shield cover to the shield frame. 19. The method of claim 18,
And the heat conduction material contacts the upper surface of the internal element when the lateral projection is fixed to the second hole of the shield frame. 20. The method of claim 19,
Further comprising the step of attaching a heat conduction material to a surface of the shield cover facing the upper surface of the internal element and laminating the bracket after the lateral projection is fixed to the second hole.

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