WO2020262849A1

WO2020262849A1 - Electronic apparatus including heat dissipating structure

Info

Publication number: WO2020262849A1
Application number: PCT/KR2020/007452
Authority: WO
Inventors: 구강현; 김민수; 성영섭
Original assignee: 삼성전자 주식회사
Priority date: 2019-06-27
Filing date: 2020-06-09
Publication date: 2020-12-30
Also published as: KR20210001152A

Abstract

Provided is an electronic apparatus comprising: a front plate oriented in a first direction; a rear plate oriented in a second direction that is the opposite direction of the first direction; an inner structure which forms an inner space together with the front plate and the rear plate, and includes a first region positioned in a third direction perpendicular to the first and second directions and a second region positioned in a fourth direction that is the opposite direction of the third direction; a display visible through at least a portion of the front plate; a first electronic component disposed in the first region; and a first heat dissipating member of which an end portion on one side is disposed closer to the first electronic component than the inner structure and thermally connected to the first electronic component, and which extends from the end portion on one side to the second region. Various other embodiments are also possible.

Description

Electronic device including heat dissipation structure

Various embodiments of the present invention relate to a heat dissipation structure and an electronic device including the same.

With the development of hardware, electronic devices are increasingly similar in performance to PCs, such as driving high-end games and playing high-definition video beyond simple communication functions. In order to realize this performance, highly integrated electronic components (eg, application processors) are used, and significant heat can be generated during operation. Research for effective heat dissipation is being conducted for smooth operation of such electronic components.

In order to effectively dissipate heat from electronic components, it is necessary to increase the heat dissipation area and secure the heat dissipation space to the maximum. In order to increase the heat dissipation area, a member having excellent thermal conductivity and a large surface area must be used to receive and diffuse heat from an electronic component. However, if heat is not effectively extracted from an electronic component, heat dissipation may not be effectively achieved even if the heat dissipation area is wide. In order to effectively extract heat from an electronic component, a method of extracting through conduction by contacting a member having excellent thermal conductivity with the electronic component may be used.

The heat dissipation structure of an electronic device according to various embodiments of the present invention provides a structure capable of performing heat dissipation by directly contacting an electronic component in a limited internal space of an electromagnetic field to extract heat and maximizing the space inside the electronic device. can do.

An electronic device according to an embodiment of the present invention forms an internal space together with a front plate facing in a first direction, a rear plate facing in a second direction opposite to the first direction, and the front plate and the rear plate, An internal structure including a first region positioned in a third direction perpendicular to the first direction and the second direction, and a second region positioned in a fourth direction opposite to the third direction, at least of the front plate A display viewed through a portion, a first electronic component and one end disposed in the first area are disposed closer to the first electronic component than the internal structure and are thermally connected to the first electronic component, and the one end And a first heat dissipating member extending from the second region.

It is possible to increase the heat dissipation efficiency of electronic components by providing a structure that can utilize the limited space of the electronic device as a whole.

The heat dissipation efficiency of electronic components can be increased by simultaneously utilizing structures (eg, displays, batteries) with high heat capacity in the electronic device as structures for heat dissipation.

1 is a front perspective view of a mobile electronic device according to an exemplary embodiment.

2 is a perspective view of the rear side of the electronic device of FIG. 1.

3 is an exploded perspective view of the electronic device of FIG. 1.

4 is an exploded perspective view of an electronic device according to an embodiment of the present invention.

5 is an exploded perspective view illustrating an electronic device according to an embodiment of the present invention from a different direction.

6 is a cross-sectional view taken along line A-A of FIG. 4.

7 is a diagram illustrating an electronic device according to an embodiment of the present invention by adding a battery.

8 is a plan view illustrating an electronic device according to an embodiment of the present invention by adding a battery.

9 is a cross-sectional view taken along line B-B of FIG. 7.

10 to 11 are cross-sectional views illustrating a stacking sequence of a heat dissipation structure of an electronic device according to an embodiment of the present invention.

12 is a view showing a first heat dissipating member according to an embodiment of the present invention.

13 is a view showing a first heat dissipating member according to an embodiment of the present invention from a different direction.

14 is a diagram mainly showing a second insulating material of an electronic device according to an embodiment of the present invention.

15 is a cross-sectional view taken along line C-C of FIG. 14.

16 is a cross-sectional view showing the center of a wireless charging module of an electronic device according to an embodiment of the present invention.

17 is a diagram mainly showing a second electronic component of an electronic device according to an exemplary embodiment of the present invention.

18 is a diagram illustrating a display removed from an electronic device according to another embodiment of the present invention.

FIG. 19 is a diagram illustrating removal of a third insulating material from the electronic device of FIG. 18.

20 is a cross-sectional view taken along line D-D of FIG. 18.

1 and 2, an electronic device 100 according to an embodiment includes a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a first surface 110A. And it may include a housing 110 including a side surface (110C) surrounding the space between the second surface (110B). In another embodiment (not shown), the housing may refer to a structure forming some of the first surface 110A, the second surface 110B, and the side surfaces 110C of FIG. 1. According to an embodiment, the first surface 110A may be formed by the front plate 102 (eg, a glass plate including various coating layers, or a polymer plate) at least partially transparent. The second surface 110B may be formed by a substantially opaque rear plate 111. The back plate 111 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. Can be. The side surface 110C is coupled to the front plate 102 and the rear plate 111 and may be formed by a side bezel structure (or “side member”) 118 including metal and/or polymer. In some embodiments, the back plate 111 and the side bezel structure 118 are integrally formed and may include the same material (eg, a metal material such as aluminum).

In the illustrated embodiment, the front plate 102 includes two first regions 110D that are curved toward the rear plate 111 from the first surface 110A and extend seamlessly, the front plate It may be included at both ends of the long edge (102). In the illustrated embodiment (see FIG. 2), the rear plate 111 is curved toward the front plate 102 from the second surface 110B to seamlessly extend two second regions 110E with a long edge. Can be included at both ends. In some embodiments, the front plate 102 (or the rear plate 111) may include only one of the first regions 110D (or the second regions 110E). In another embodiment, some of the first regions 110D or the second regions 110E may not be included. In the above embodiments, when viewed from the side of the electronic device 100, the side bezel structure 118 may be formed on a side side where the first areas 110D or the second areas 110E are not included. It may have a first thickness (or width), and may have a second thickness that is thinner than the first thickness on a side surface including the first regions 110D or the second regions 110E.

According to an embodiment, the electronic device 100 includes a display 101, an

audio module

103, 107, 114, a

sensor module

104, 116, 119, a

camera module

105, 112, 113, and a key input. It may include at least one or more of the device 117, the light emitting element 106, and the

connector holes

108, 109. In some embodiments, the electronic device 100 may omit at least one of the components (for example, the key input device 117 or the light emitting device 106) or additionally include other components.

Display 101 may be exposed through a substantial portion of front plate 102, for example. In some embodiments, at least a portion of the display 101 may be exposed through the first surface 110A and the front plate 102 forming the first regions 110D of the side surface 110C. In some embodiments, the edge of the display 101 may be formed substantially the same as the adjacent outer shape of the front plate 102. In another embodiment (not shown), in order to expand the area to which the display 101 is exposed, the distance between the outer periphery of the display 101 and the outer periphery of the front plate 102 may be formed substantially the same.

In another embodiment (not shown), a recess or opening is formed in a part of the screen display area of the display 101, and the audio module 114 and the sensor are aligned with the recess or the opening. It may include at least one or more of the module 104, the camera module 105, and the light emitting device 106. In another embodiment (not shown), on the rear surface of the screen display area of the display 101, the audio module 114, the sensor module 104, the camera module 105, the fingerprint sensor 116, and the light emitting element 106 ) May include at least one or more of. In another embodiment (not shown), the display 101 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen. Can be placed. In some embodiments, at least a portion of the

sensor module

104, 119, and/or at least a portion of the key input device 117, may include the first regions 110D, and/or the second regions 110E. Can be placed in the field.

The

audio modules

103, 107, and 114 may include microphone holes 103 and

speaker holes

107 and 114. In the microphone hole 103, a microphone for acquiring external sound may be disposed inside, and in some embodiments, a plurality of microphones may be disposed to detect the direction of sound. The speaker holes 107 and 114 may include an external speaker hole 107 and a call receiver hole 114. In some embodiments, the speaker holes 107 and 114 and the microphone hole 103 may be implemented as a single hole, or a speaker may be included without the speaker holes 107 and 114 (eg, piezo speakers).

The

sensor modules

104, 116, and 119 may generate electrical signals or data values corresponding to an internal operating state of the electronic device 100 or an external environmental state. The

sensor modules

104, 116, 119 are, for example, a first sensor module 104 (eg, a proximity sensor) and/or a second sensor module disposed on the first surface 110A of the housing 110 ( Not shown) (for example, a fingerprint sensor), and/or a third sensor module 119 (for example, an HRM sensor) and/or a fourth sensor module 116 disposed on the second surface 110B of the housing 110 ) (E.g. fingerprint sensor). The fingerprint sensor may be disposed on the first surface 110A of the housing 110 (eg, not only the display 101 but also the second surface 110B. The electronic device 100 is a sensor module, not shown, for example, For example, at least one of a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 104 is further included. Can include.

The

camera modules

105, 112, and 113 include a first camera device 105 disposed on the first surface 110A of the electronic device 100, and a second camera device 112 disposed on the second surface 110B. ), and/or a flash 113. The

camera devices

105 and 112 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 113 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared cameras, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 100.

The key input device 117 may be disposed on the side surface 110C of the housing 110. In another embodiment, the electronic device 100 may not include some or all of the aforementioned key input devices 117, and the key input device 117 that is not included is a soft key or the like on the display 101. It can be implemented in a form. In some embodiments, the key input device may include a sensor module 116 disposed on the second side 110B of the housing 110.

The light emitting element 106 may be disposed on the first surface 110A of the housing 110, for example. The light-emitting element 106 may provide state information of the electronic device 100 in the form of light, for example. In another embodiment, the light emitting device 106 may provide a light source that is interlocked with the operation of the camera module 105, for example. The light-emitting element 106 may include, for example, an LED, an IR LED, and a xenon lamp.

The connector holes 108 and 109 are a first connector hole 108 capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data with an external electronic device, and/or an external electronic device. And a second connector hole (eg, an earphone jack) 109 capable of accommodating a connector for transmitting and receiving an audio signal.

Referring to FIG. 3, the electronic device 300 includes a side bezel structure 310, a first support member 311 (eg, a bracket), a front plate 320, a display 330, and a printed circuit board 340. , A battery 350, a second support member 360 (eg, a rear case), an antenna 370, and a rear plate 380. In some embodiments, the electronic device 300 may omit at least one of the components (eg, the first support member 311 or the second support member 360) or may additionally include other components. . At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 100 of FIG. 1 or 2, and redundant descriptions will be omitted below.

The first support member 311 may be disposed inside the electronic device 300 and connected to the side bezel structure 310 or may be integrally formed with the side bezel structure 310. The first support member 311 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. In the first support member 311, a display 330 may be coupled to one surface and a printed circuit board 340 may be coupled to the other surface. A processor, memory, and/or interface may be mounted on the printed circuit board 340. The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor.

The memory may include, for example, volatile memory or nonvolatile memory.

The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device 300 to an external electronic device, for example, and may include a USB connector, an SD card/MMC connector, or an audio connector.

The battery 350 is a device for supplying power to at least one component of the electronic device 300, and may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell. . At least a portion of the battery 350 may be disposed substantially on the same plane as the printed circuit board 340, for example. The battery 350 may be integrally disposed within the electronic device 300 or may be disposed detachably from the electronic device 300.

The antenna 370 may be disposed between the rear plate 380 and the battery 350. The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna 370 may perform short-range communication with an external device or wirelessly transmit/receive power required for charging. In another embodiment, an antenna structure may be formed by a side bezel structure 310 and/or a part of the first support member 311 or a combination thereof.

In describing the electronic device 400 according to various embodiments of the present disclosure, the same or similar reference numerals may be used for the same or similar components. In describing the electronic device 400 according to various embodiments of the present disclosure, the first direction may mean a front direction of the electronic device 400. The second direction may mean a rear direction of the electronic device 400. The third direction may mean an upper direction when the front plate 410 of the electronic device 400 is viewed in front. The fourth direction may mean a bottom direction when looking at the front plate 410 of the electronic device 400 in front. The fifth direction may mean a right direction when the front plate 410 of the electronic device 400 is viewed in front. The sixth direction may mean a left direction when the front plate 410 of the electronic device 400 is viewed in front. The rear surface of the front plate 410 may mean a surface in the second direction of the front plate 410, and the rear surface of the rear plate 420 means a surface in the first direction of the rear plate 420 I can.

4 is an exploded perspective view of an electronic device 400 according to an embodiment of the present invention, and FIG. 5 is an exploded perspective view of the electronic device 400 according to an embodiment of the present invention viewed from a different direction.

Electronic device 400 according to an embodiment of the present invention includes a front plate 410, a rear plate 420, an internal structure 430, a display 440, a first electronic component 450, a first heat dissipating member ( 460) and/or a second heat dissipating member 470 may be included.

The front plate 410 according to an embodiment of the present invention may be the same as or similar to the front plate 102 shown in FIG. 1. The front plate 410 according to an embodiment of the present invention is disposed to face the first direction, may have a substantially rectangular plate shape, and may mean a window of the electronic device 400. The first direction is a direction in which the window of the electronic device 400 faces, and may mean downward based on the illustrated state of FIG. 4.

The rear plate 420 according to an embodiment of the present invention may be the same as or similar to the rear plate 111 shown in FIG. 2, and is disposed to face the second direction, and may have a substantially rectangular plate shape, It may mean a rear cover or a rear glass of the electronic device 400. The second direction is a direction opposite to the first direction, and may mean an upward direction based on the illustrated state of FIG. 4.

The internal structure 430 according to an embodiment of the present invention may be the same as or similar to the side member 118 or the side bezel shown in FIG. 1. The internal structure 430 according to an embodiment of the present invention may form an internal space together with the front plate 410 and the rear plate 420. The internal structure 430 according to an embodiment may include a first support member 311 (see FIG. 3) on which the display 440 is mounted. In other words, the internal structure 430 may be a concept including both the side member 118 and the first support member 311. The side member 118 and the first support member 311 may be formed integrally or separately.

The display 440 according to an embodiment of the present invention may be disposed between the front plate 410 and the rear plate 420 and may be viewed to a user through a part of the front plate 410. The display 440 according to an embodiment includes a touch sensor that senses a touch signal input through the front plate 410, a display panel that receives power and emits light under the control of a driver IC of the display 440, a display panel. It may be a concept including both a polarizing plate and a cover panel that prevents the generated light from being diffusely reflected or diffused in an unintended direction. In the display 440 according to an exemplary embodiment, an adhesive layer 441 is formed on a surface facing the second direction, and thus, may be combined with the internal structure 430. Holes 443 are formed in the adhesive layer 441 to correspond to the positions of the first heat dissipating members 460 so that they may not overlap each other.

The internal structure 430 according to an embodiment may include a first region 435 (top of the electronic device) positioned in a third direction and a second region 437 (bottom of the electronic device) positioned in a fourth direction. have. A printed circuit board 401 may be mainly located in the first area 435 according to an embodiment, and the printed circuit board 401 includes a first electronic component 450, a memory, a sensor module, a camera module, etc. Various internal parts can be mounted. In the second area 437, a battery 480 (refer to FIG. 7) and various interfaces for connection with external devices may be mainly disposed. The first region 435 and the second region 437 may be separated by a partition wall 431. A slit 433 through which the first region 435 and the second region 437 can communicate may be formed in the partition wall 431. The widths of the first region 435 and the second region 437 may be adjusted as necessary.

The first electronic component 450 according to an exemplary embodiment of the present invention generates heat during an operation process and may be an electronic component requiring heat dissipation. The first electronic component 450 according to an embodiment of the present invention may include not only a component such as an application processor (AP), but also a shield can surrounding it. The heat dissipation of the first electronic component 450 may be necessary to secure operation reliability of the first electronic component 450 and increase operating efficiency.

The heat dissipation of the first electronic component 450 according to an exemplary embodiment may be achieved by diffusion of heat from the surface of the first electronic component 450 into the air in the internal space of the electronic device 400. Such diffusion may increase the diffusion speed as the area in which the first electronic component 450 and air contact becomes wider, thereby increasing the heat dissipation efficiency of the first electronic component 450. Therefore, the heat dissipation area of the first electronic component 450 can be increased by thermally connecting the heat dissipating member having excellent thermal conductivity to the first electronic component 450. For example, the heat dissipation member may be made of a material such as copper, aluminum, stainless steel, or graphite. When a material such as copper, aluminum, or stainless steel is used as the heat dissipating member, the heat dissipating member may be manufactured in a plate shape. When a material such as graphite is used as the heat dissipating member, the heat dissipating member may be manufactured in the form of an attachable film.

The electronic device 400 according to an exemplary embodiment may utilize both the first region 435 and the second region 437 for heat dissipation of the first electronic component 450. The heat dissipation efficiency of the first electronic component 450 may be increased by expanding a space to be heat dissipated. For example, the electronic device 400 according to an embodiment may utilize both the first region 435 and the second region 437 as a heat dissipation space by utilizing the first heat radiation member 460. In the first heat dissipating member 460 according to an embodiment, one end portion 460a may be thermally connected to the first electronic component 450 and may extend to the second region 437. 4 and 5, one end portion 460a of the first heat dissipating member 460 may directly contact the first electronic component 450. The first heat dissipating member 460 extending to the second region 437 transfers heat generated from the first electronic component 450 to the second region 437 and radiates heat in the second region 437 to generate a first The heat dissipation efficiency of the electronic component 450 may be increased.

According to an exemplary embodiment, the first heat dissipating member 460 extending to the second region 437 may be thermally connected to the display 440. The first heat dissipating member 460 may be thermally connected to the display 440 by contacting the display 440 through a hole 443 formed in the adhesive layer 441, and the adhesive layer 441 and the first heat dissipating member 460 It is possible to prevent the increase in thickness due to the overlapping of.

The first heat dissipation member 460 according to an embodiment not only radiates heat to the internal space of the electronic device 400 within the second region 437, but also to the first electronic component 450 like the display 440. In contrast, when heat is transferred to an object having a large heat capacity, heat from the first electronic component 450 can be radiated more efficiently.

The second heat dissipating member 470 according to an embodiment extends in the fifth and/or sixth directions within the first region 435 to heat radiation of the first electronic component 450 within the first region 435. You can increase the area. When the heat dissipation area of the first electronic component 450 is increased, the heat dissipation efficiency can be increased. Therefore, the heat dissipation area of the first electronic component 450 can be maximized in the first region 435 through the second heat dissipating member 470. I can.

FIG. 6 is a cross-sectional view taken along line A-A of FIG. 4 and is an exploded view showing the connection structure of the first heat dissipating member 460 leading to the first region 435 and the second region 437. In order to facilitate understanding of the electronic device 400 according to an exemplary embodiment of the present invention, parts are spaced apart from each other by a predetermined distance.

Looking at the electronic device 400 according to an embodiment of the present invention with reference to FIG. 6, a display (eg, a first region 435 and a second region 437) is formed in a first direction with an internal structure 430 as the center. 440 and the front plate 410 may be located. A second heat dissipation member 470, a first electronic component 450, and a printed circuit board 401 may be located in the first region 435 in the second direction of the internal structure 430, and The first heat dissipating member 460 may be positioned across the first region 435 and the second region 437. In FIG. 6, the first heat dissipating member 460 is stacked in a first direction with respect to the first electronic component 450 and a second heat dissipating member 470 is stacked thereon, but the first heat dissipating member ( The stacking order of the 460 and the second heat dissipating member 470 may be changed.

A partition wall 431 may be formed between the first region 435 and the second region 437 of the internal structure 430 according to an exemplary embodiment. A slit 433 communicating the first region 435 and the second region 437 may be formed in a part of the partition wall 431 according to an exemplary embodiment. The first heat dissipating member 460 according to an exemplary embodiment may extend from the first region 435 to the second region 437 by passing through the slit 433. The first heat dissipating member 460 is stacked on the first electronic component 450 in the second direction of the first region 435 and contacts the battery 480 in the first direction of the second region 437. Through this, the first heat dissipating member 460 may be located in the first region 435 and the second region 437 without increasing the thickness (length in the first direction and the second direction) of the internal structure 430. I can. In FIG. 6, the through structure of the slit 433 of the first heat dissipating member 460 is exaggerated, but substantially all of the inner structure 430 is included in the inner structure 430 and may be in close contact with each other, and the thickness of the electronic device 400 is not increased. Does not.

7 is a diagram illustrating an electronic device 400 according to an embodiment of the present invention by adding a battery 480. 8 is a plan view illustrating an electronic device 400 to which a battery 480 is added.

The electronic device 400 according to an embodiment of the present invention may further include a battery 480, and the battery 480 is mainly located in the second area 437 on the second direction side of the internal structure 430. I can. In the battery 480 according to an exemplary embodiment, as shown in FIG. 7, an adhesive member 481 may be formed on the surface of the battery 480 in the first direction to be coupled to the internal structure 430. The adhesive member 481 may be formed entirely on the surface of the battery 480 in the second direction, or may be formed at the ends in the fifth and sixth directions, or at the ends in the third and fourth directions.

Referring to FIG. 7, the other end 460b of the first heat dissipating member 460 according to an exemplary embodiment may be thermally connected to the battery 480. The adhesive member 481 may include a second thermally conductive material 463 having excellent thermal conductivity (see FIG. 9) (eg, a thermal interface material (TIM) tape). The adhesive member 481 according to an embodiment may be formed of a second heat conductive material 463 (see FIG. 9 ). The first heat dissipating member 460 may overlap with the adhesive member 481 in some sections. Through this, the first heat dissipating member 460 and the battery 480 may be thermally coupled. The first heat dissipation member 460 according to an embodiment not only radiates heat to the internal space of the electronic device 400 within the second region 437, but also to the first electronic component 450 like the battery 480. In contrast, when heat is transferred to an object having a large heat capacity, heat from the first electronic component 450 can be radiated more efficiently.

Referring to FIG. 8, a location where the adhesive member 481 and the other end portion 460b of the first heat dissipating member 460 overlap may be located close to an end portion of the battery 480 in the fourth direction. A terminal for electrically connecting to the electronic device 400 may be formed at the end of the battery 480 in the third direction, and the terminal portion has a temperature higher than that of other parts in the battery 480 during the operation of the electronic device 400. It can be formed high. By placing a portion where the other end 460b of the first heat dissipating member 460 and the battery 480 are thermally connected to the end in the fourth direction, the temperature of the battery 480 can be uniformly overall, which is It is possible to induce an increase in the operating efficiency of 480).

9 to 11 are cross-sectional views taken along line B-B of FIG. 7.

In detail, FIG. 9 is a diagram conceptually showing a heat transfer path of the first heat dissipating member 460, the first electronic component 450, the display 440, and the battery 480.

The internal structure 430, the display 440, the front plate 410, the first heat dissipating member 460, the second heat dissipating member 470, and the first electronic component 450 of the electronic device 400 according to an exemplary embodiment. ) And the printed circuit board 401 may be the same as or similar to FIG. 6.

The first heat dissipating member 460 according to an embodiment not only radiates heat to the internal space of the electronic device 400 within the second region 437, but also provides a first electronic device such as the display 440 and the battery 480. When heat is transferred to an object having a larger heat capacity than the component 450, the heat of the first electronic component 450 can be radiated more efficiently.

10 to 11 are cross-sectional views illustrating an electronic device 400 according to an embodiment of the present invention by adding a first heat conductive material 461.

The first thermally conductive material 461 according to an embodiment may be disposed between the first electronic component 450 and the first heat dissipating member 460 as shown in FIG. 10, and the first heat dissipating member 460 as shown in FIG. It may be located between the and the second heat dissipating member 470. The first heat conductive material 461 may be formed of a thermal interface material (TIM) having high heat conduction efficiency and elasticity, and may be formed between the first electronic component 450 and the first heat dissipating member 460 or between the first heat dissipating member 460. ) And the second heat dissipating member 470 so that an air layer is not formed in the space, thereby increasing the heat conduction efficiency. When the efficiency in which heat generated from the first electronic component 450 is conducted to the first heat dissipating member 460 and the second heat dissipating member 470 is increased, the overall heat dissipation efficiency of the first electronic component 450 may also increase. .

12 is a view showing the addition of the first heat insulating material 465 to the first heat dissipating member 460 according to an embodiment of the present invention, and FIG. 13 is a first heat dissipating member 460 and a first heat dissipating member according to an embodiment 1 is a view showing the insulating material 465 from a different direction.

A first heat insulating material 465 may be disposed on at least a part of the first heat dissipating member 460 according to an embodiment of the present invention. The first insulating material 465 according to an exemplary embodiment may be disposed on the first heat dissipating member 460 and formed to correspond to a position passing through the slit 433. The first heat insulating material 465 according to an embodiment may extend to a portion where the first heat dissipating member 460 is exposed to at least one of the front plate 410 (see FIG. 11) and the rear plate 420 (see FIG. 11). May be. A portion of the first heat dissipating member 460 corresponding to the position of the slit 433 may be a region that is not coupled with other components such as the first electronic component 450, the display 440, or the battery 480. Since heat diffused through this region may diffuse heat to an unintended portion of the electronic device 400, a first insulating material 465 may be disposed to block the heat. For example, the area through which the first heat dissipating member 460 passes through the slit 433 is adjacent to the first electronic component 450 and thus can be high temperature, while other components such as the display 440 or the battery 480 Since it is exposed without being combined with, it becomes a point of a high heat source (eg, a point where surface heat is high), which may cause discomfort to the user. The first heat insulating material 465 may be disposed in this part to block the diffusion of heat, thereby preventing it from becoming a high heat source point (eg, a point where surface heat is high).

In addition, the first heat insulating material 465 is formed of the same material as a polyimide film to protect the passage area of the slit 433 of the first heat radiation member 460 so that the first heat radiation member 460 is damaged. Can be prevented.

14 is a diagram illustrating the addition of a second insulating material 467 to the electronic device 400 according to an embodiment of the present invention. 15 is a cross-sectional view taken along line C-C of FIG. 14.

Referring to FIGS. 14 to 15, a second insulating material 467 may be disposed on a surface of the second heat dissipating member 470 in the first direction corresponding to the position of the first electronic component 450. The second heat dissipating member 470 may be attached to the front plate 410. The second insulating material 467 may be formed equal to or larger than the size of the first electronic component 450. The first electronic component 450 may generate heat during an operation process and may be a region with the highest temperature. Even if heat is radiated by conduction of the first heat dissipating member 460 and the second heat dissipating member 470, high heat may still be emitted. This portion becomes a high heat source point (eg, a point where surface heat is high) in the display 440 portion of the electronic device 400 and may cause discomfort to the user. The second insulating material 467 transfers heat generated from the first electronic component 450 itself and heat generated by heat conduction of the first heat dissipating member 460 and the second heat dissipating member 470 to the surface of the display 440. Blocks from going over. Accordingly, by disposing the second insulating material 467, it is possible to block a high heat source point (eg, a high surface heat generation point).

16 is a cross-sectional view illustrating a wireless charging module 490 added to the electronic device 400 according to an embodiment of the present invention.

A wireless charging module 490 may be disposed between the display 440 and the internal structure 430 of the electronic device 400 according to an exemplary embodiment. In the first heat dissipating member 460 according to an embodiment, one end portion 460a (see FIG. 4) is thermally connected to the first electronic component 450 and extends to the second region 437 to provide a wireless charging module 490. And the other end 460b (refer to FIG. 4) may be thermally connected to the battery 480. The first heat dissipating member 460 may transfer heat generated from the first electronic component 450 and the wireless charging module 490 to the battery 480 to radiate heat.

17 is a diagram illustrating an electronic device 400 according to an embodiment of the present invention by adding a second electronic component 451.

In the electronic device 400 according to an embodiment, not only a first electronic component 450 such as an application processor (AP), but also at least one or more second electronic components 451 such as a communication module and a graphic processing module may be further disposed. I can. In this case, the second heat dissipation member 470 collects heat generated from the electronic component and transfers the heat to the first heat dissipation member 460, and the first heat dissipation member 460 is the second region 437 of the internal structure 430 Can radiate heat from.

FIG. 18 is a view showing the front plate 410 (see FIG. 4) and the display 440 (see FIG. 4) of the electronic device 1800 according to another embodiment of the present invention removed, and FIG. 19 is a view of FIG. 18 It is a view showing the removal of the third insulating material (1861) from.

The electronic device 1800 according to another embodiment of the present invention may be described based on differences compared to the electronic device 400 of FIGS. 4 to 5. Configurations not described separately may be the same as or similar to the electronic device 400 of FIGS. 4 to 5.

The internal structure 430 according to another embodiment may include a first region 435 (see FIG. 4) positioned in a third direction and a second region 437 (see FIG. 4) positioned in a fourth direction, and , The first region 435 and the second region 437 may be divided by a partition wall 1831. The first region 435 and the second region 437 may be connected through an opening 1833 formed in the internal structure 430.

The opening 1833 according to another exemplary embodiment may be formed through the internal structure 430 and may be formed corresponding to the position of the first electronic component 450. The opening 1833 is formed to extend toward the partition wall 1831 at a position corresponding to the first electronic component 450, but is formed within a range that does not penetrate or remove the partition wall 1831, so that the first region 435 and the first Two areas 437 can be connected.

The third insulating material 1861 according to another exemplary embodiment may be disposed to cover an area in which the opening 1833 and the first electronic component 450 are disposed. The location where the first electronic component 450 is located may be a high temperature region, and as this portion is opened through the opening 1833, high heat may be radiated in the first direction. This part may become a point of a high heat source (eg, a point where surface heat is high) outside the electronic device 1800 and may cause discomfort to the user. Therefore, by disposing the third insulating material 1861, it is possible to block the high heat source point (eg, the point where surface heat is high).

In another embodiment, the adhesive layer 441 may be formed of an insulating material, and the adhesive layer 441 may be disposed to cover an area in which the opening 1833 and the first electronic component 450 are disposed. The adhesive layer 441 of the insulating material blocks heat emitted through the opening 1833, thereby effectively suppressing an increase in the external temperature of the electronic device 1800.

20 is a cross-sectional view taken along line D-D of FIG. 18.

The internal structure 430, the display 440, the front plate 410, the first heat dissipating member 460, the second heat dissipating member 470, the first electronic component of the electronic device 400 according to another embodiment ( 450) and the printed circuit board 401 may have the same or similar arrangement as in FIG. 6.

The opening 1833 according to another embodiment is formed to correspond to the position and size of the first electronic component 450 with respect to the third and fourth directions, and is formed to extend toward the partition wall 431, but the partition wall 431 It may be formed within a range that does not penetrate or remove. The third insulating material 1861 according to another exemplary embodiment may be disposed to cover the opening 1833 to prevent high heat from being radiated in the first direction.

According to various embodiments of the present invention, the internal structure may include three or more regions. Various components of the electronic device may be disposed in each area of the internal structure. The internal structure may include a plurality of partition walls separating a plurality of regions, and slits for communicating adjacent regions to each other may be formed in the plurality of partition walls. The first heat dissipating member may extend through a slit formed in each of the plurality of partition walls so as to pass through the plurality of regions, and may be attached to the internal structure in different directions in each region.

According to various embodiments of the present disclosure, the front plate may have an intaglio formed in a portion to which the first heat radiating member is attached to prevent an increase in thickness of the electronic device due to the arrangement of the first heat radiating member.

According to various embodiments of the present disclosure, the second insulating material may be formed to extend to a portion where the slit is formed.

The electronic device 400 according to an embodiment of the present invention provides an internal space with a front plate facing a first direction, a rear plate facing a second direction opposite to the first direction, and the front plate and the rear plate. And an internal structure including a first region positioned in the first direction and a third direction perpendicular to the second direction, and a second region positioned in a fourth direction opposite to the third direction, the front surface A display viewed through at least a portion of the plate, a first electronic component disposed in the first region, and a first heat dissipation extending from the one end to the second region, wherein the first electronic component and one end are thermally connected to the first electronic component It may include a member.

The internal structure may include a partition wall separating the first region from the second region and a slit formed in the partition wall, and the first heat dissipating member may penetrate the slit.

The first heat dissipating member may be thermally connected to the display in the second area.

A battery disposed in the second region of the internal structure may be further included, and the other end of the first heat dissipating member may be thermally connected to the battery.

A second heat dissipating member disposed in the first region of the internal structure and thermally connected to the first heat dissipating member may be further included.

The first heat dissipating member and the second heat dissipating member may partially overlap with each other in the first direction, and the first heat dissipating member and the second heat dissipating member may be thermally connected by a first heat-conducting material.

The first heat dissipating member and the battery may be thermally connected by a second heat conductive material.

The second heat conductive material may be formed on a part of an adhesive member that couples the battery to the internal structure.

A portion where the first heat dissipating member and the second heat dissipating member overlap may overlap with a position of the first electronic component in the first direction.

It may further include a second electronic component thermally connected to the second heat dissipation member.

A first heat insulating material disposed on the first heat dissipating member and positioned at a portion where the first heat dissipating member penetrates the slit may be further included.

A second insulating material disposed between the display and the internal structure adjacent to the display and disposed to overlap with the position of the first electronic component in the first direction may be included.

The first heat dissipating member may include at least one of copper, aluminum, stainless steel, or graphite.

The second heat dissipating member may include at least one of copper, aluminum, stainless steel, or graphite.

Further comprising a wireless charging module disposed between the display and the internal structure adjacent to the display, the first heat dissipating member may be thermally connected to the wireless charging module in the second area.

The internal structure is formed over a partition wall dividing the first region and the second region, and across the first region and the second region, and overlaps a position of the first electronic component in the first direction, and the An opening formed extending toward the second region may be further included, and the first heat dissipating member may penetrate the opening.

It may further include a third insulating material that covers the opening in the first direction.

Claims

In the electronic device,

A front plate facing in the first direction;

A rear plate facing in a second direction opposite to the first direction;

A first area that forms an inner space together with the front plate and the rear plate, and is located in a third direction perpendicular to the first and second directions, and a fourth direction opposite to the third direction. An internal structure including a second region;

A display viewed through at least a portion of the front plate;

A first electronic component disposed in the first area; And

And a first heat dissipating member having one end disposed adjacent to the first electronic component rather than the internal structure, thermally connected to the first electronic component, and extending from the one end to the second region.
The method of claim 1,

The internal structure,

A partition wall separating the first region and the second region; And

Including; a slit formed in the partition wall,

The first heat dissipating member is an electronic device passing through the slit.
The method of claim 2,

The first heat dissipating member is an electronic device thermally connected to the internal structure in the second area.
The method of claim 3,

A battery disposed in the second region of the internal structure and fixed with an adhesive member; further comprising,

An electronic device in which the other end of the first heat dissipating member overlaps the adhesive member.
The method of claim 4,

The adhesive member is an electronic device including a second heat conductive material.
The method of claim 1,

And a second heat dissipating member disposed in the first region of the internal structure and thermally connected to the first heat dissipating member.
The method of claim 6,

The first heat dissipating member and the second heat dissipating member are formed to have an extension direction perpendicular to each other, and the first heat dissipating member and the first electronic component are thermally connected to each other by a first heat conductive material.
The method of claim 7,

A portion where the first heat dissipating member and the second heat dissipating member overlap with the position of the first electronic component with respect to the first direction.
The method of claim 2,

The electronic device further comprises a first heat insulating material disposed on the first heat dissipating member and positioned at a portion where the first heat dissipating member passes through the slit.
The method of claim 9,

The first insulating material,

An electronic device in which the first heat dissipating member extends to a portion exposed to at least one of the front plate and the rear plate.
The method of claim 2,

And a second insulating material disposed between the display and the internal structure adjacent to the display and disposed to overlap with the position of the first electronic component in the first direction.
The method of claim 11,

The second insulating material,

An electronic device extending to overlap the position of the slit.
The method of claim 2,

Further comprising a; wireless charging module disposed adjacent to the display between the display and the internal structure,

The first heat dissipating member is disposed between the wireless charging module and the internal structure, and is thermally connected to the wireless charging module in the second area.
The method of claim 1,

The internal structure,

A partition wall separating the first region and the second region; And

An opening formed over the first region and the second region, overlapping with a position of the first electronic component in the first direction, and extending toward the second region; and

The first heat dissipating member is an electronic device penetrating through the opening.
The method of claim 14,

The electronic device further comprises a third insulating material covering the opening with respect to the first direction.