KR20150082042A - Electronic device having waterproof structure - Google Patents

Abstract

According to various embodiments of the present invention, provided is an electronic device which comprises a housing including a mounting part having a sealing member arranged on at least one portion of the edge, and an electronic component arranged on the mounting part for at least one area to contact with the sealing member, and to be exposed to the outside through at least one surface of the electronic device, thereby contributing to make the device be slimmer while applying a waterproof function, reducing the manufacturing costs, and improving assembling properties.

Description

ELECTRONIC DEVICE HAVING WATERPROOF STRUCTURE [0002]

Various embodiments of the present invention are directed to an electronic device, for example, an electronic device having a waterproof structure.

[0002] A mobile terminal generally classified as an electronic device has been developed to provide wireless communication between users, but can provide many additional functions in addition to simply communicating with the other party as the technology advances. For example, the mobile terminal can be provided with various functions such as an alarm, a short message service (SMS), a multimedia message service (MMS), an e-mail, a game, a remote control of a short distance communication, an image capture function using a mounted digital camera, Functions, a schedule function, a web surfing function, and the like.

Electronic devices have been transformed in various ways in response to their functional diversification. For example, electronic devices are becoming slimmer in order to maximize portability while performing the same function or a better function, and they are being developed so as to be easy to operate while being light and thin.

In recent years, we have been trying to provide a waterproof function to prevent flooding, and we are racing to improve the structure of an electronic device which has excellent waterproof function, excellent assemblability and can reduce manufacturing cost.

Various embodiments of the present invention can provide an electronic device having a waterproof structure.

Various embodiments of the present invention can provide an electronic device having a waterproof structure that is implemented such that the assemblability can be improved.

The various embodiments of the present invention can provide an electronic device having a waterproof structure that is configured to contribute to slimming while applying a waterproof function.

Various embodiments of the present invention can provide an electronic device having a waterproof structure that is implemented to reduce manufacturing costs.

Various embodiments of the present invention can provide an electronic device having a waterproof structure that is implemented so as to implement a waterproof function but not to cause performance degradation of peripheral electronic components.

According to various embodiments of the present invention, in accordance with various embodiments of the present invention, a housing including a seating portion having a sealing member disposed on at least a portion of an edge, and at least a portion of the housing contacting the sealing member, And an electronic component disposed in the seating portion to be exposed to the outside through at least one surface.

According to various embodiments of the present invention there is provided an electronic device comprising a first housing including a seating portion having a sealing member disposed on at least a portion of an edge, at least a portion of the first housing contacting the sealing member, And at least one internal member that contacts the electronic component and the sealing member disposed in the seating portion to be exposed to the sealing member.

According to various embodiments of the present invention, there is provided a method of manufacturing a semiconductor device comprising a first housing, a substrate mounted on the first housing, a connector port mounted on the substrate, A sealing member fixed to the housing and a second housing coupled to the first housing and having at least one guide rib which is in contact with an upper surface of the sealing member when engaged.

According to various embodiments of the present invention, it is possible to provide an electronic device which can contribute to slimming down of the apparatus while the waterproof function is applied, the manufacturing cost is reduced, and the assemblability is improved.

1 is a diagram illustrating a network environment including an electronic device according to various embodiments of the present invention.
2 is an exploded perspective view of an interface portion showing a sealing structure of an electronic device according to an embodiment of the present invention.
3A and 3B are perspective views of a sealing member according to an embodiment of the present invention.
4 is a perspective view showing a combined state of an interface part showing a sealing structure of an electronic device according to an embodiment of the present invention.
5 is a cross-sectional view showing a region A of FIG. 4 according to an embodiment of the present invention.
6 is a cross-sectional view of the main part showing the area B in FIG. 4 according to an embodiment of the present invention.
FIG. 7 is a cross-sectional view showing a principal part of the C region of FIG. 4 according to an embodiment of the present invention.
8 is a block diagram of an electronic device according to various embodiments of the present invention.

Best Mode for Carrying Out the Invention Various embodiments of the present invention will be described below with reference to the accompanying drawings. The various embodiments of the present invention are capable of various changes and may have various embodiments, and specific embodiments are illustrated in the drawings and the detailed description is described with reference to the drawings. It should be understood, however, that it is not intended to limit the various embodiments of the invention to the specific embodiments, but includes all changes and / or equivalents and alternatives falling within the spirit and scope of the various embodiments of the invention. In connection with the description of the drawings, like reference numerals have been used for like elements.

The use of "including" or "including" in various embodiments of the present invention can be used to refer to the presence of a corresponding function, operation or component, etc., which is disclosed, Components and the like. Also, in various embodiments of the invention, the terms "comprise" or "having" are intended to specify the presence of stated features, integers, steps, operations, components, parts or combinations thereof, But do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

The " or " in various embodiments of the present invention includes any and all combinations of words listed together. For example, " A or B " may comprise A, comprise B, or both A and B.

&Quot; first, " " second, " " first, " or " second, " etc. used in various embodiments of the present invention may modify various components of various embodiments, Lt; / RTI > For example, the representations do not limit the order and / or importance of the components. The representations may be used to distinguish one component from another. For example, both the first user equipment and the second user equipment are user equipment and represent different user equipment. For example, without departing from the scope of the various embodiments of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it is to be understood that the element may be directly connected or connected to the other element, It should be understood that there may be other new components between the different components. On the other hand, when it is mentioned that an element is "directly connected" or "directly connected" to another element, it is understood that there is no other element between the element and the other element It should be possible.

The terminology used in the various embodiments of the present invention is used only to describe a specific embodiment and is not intended to limit the various embodiments of the present invention. The singular expressions may include plural expressions unless the context clearly dictates otherwise.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the various embodiments of the present invention belong. Terms such as those defined in commonly used dictionaries should be interpreted to have the meanings consistent with the contextual meanings of the related art and, unless expressly defined in the various embodiments of the present invention, It is not interpreted as meaning.

An electronic device according to various embodiments of the present invention may be a device including a communication function. For example, the electronic device can be a smartphone, a tablet personal computer, a mobile phone, a videophone, an e-book reader, a desktop personal computer, a laptop Such as a laptop personal computer (PC), a netbook computer, a personal digital assistant (PDA), a portable multimedia player (PMP), an MP3 player, a mobile medical device, a camera, or a wearable device Such as a head-mounted device (HMD) such as electronic glasses, an electronic garment, an electronic bracelet, an electronic necklace, an electronic app apparel, an electronic tattoo, or a smart watch.

According to some embodiments, the electronic device may be a smart home appliance with communication capabilities. [0003] Smart household appliances, such as electronic devices, are widely used in the fields of television, digital video disk (DVD) player, audio, refrigerator, air conditioner, vacuum cleaner, oven, microwave oven, washing machine, air cleaner, set- And may include at least one of a box (e.g., Samsung HomeSyncTM, Apple TVTM, or Google TVTM), game consoles, an electronic dictionary, an electronic key, a camcorder, or an electronic frame.

According to some embodiments, the electronic device may be a variety of medical devices (e.g., magnetic resonance angiography (MRA), magnetic resonance imaging (MRI), computed tomography (CT) (global positioning system receiver), EDR (event data recorder), flight data recorder (FDR), automotive infotainment device, marine electronic equipment (eg marine navigation device and gyro compass), avionics, A security device, a head unit for a vehicle, an industrial or home robot, an ATM (automatic teller's machine) of a financial institution, or a POS (point of sale) of a shop.

According to some embodiments, the electronic device may be a piece of furniture or a structure / structure including a communication function, an electronic board, an electronic signature receiving device, a projector, (E.g., water, electricity, gas, or radio wave measuring instruments, etc.). An electronic device according to various embodiments of the present invention may be one or more of the various devices described above. Further, the electronic device according to various embodiments of the present invention may be a flexible device. It should also be apparent to those skilled in the art that the electronic device according to various embodiments of the present invention is not limited to the above-described devices.

Hereinafter, an electronic device according to various embodiments will be described with reference to the accompanying drawings. The term user as used in various embodiments may refer to a person using an electronic device or a device using an electronic device (e.g., an artificial intelligence electronic device).

1 is a diagram illustrating a network environment 100 including an electronic device 101 in accordance with various embodiments of the present invention.

Referring to FIG. 1, the electronic device 101 may include a bus 110, a processor 120, a memory 130, an input / output interface 140, a display 150, and a communication interface 160.

The bus 110 may be a circuit that interconnects the components described above and communicates (e.g., control messages) between the components described above.

The processor 120 receives instructions from other components (e.g., the memory 130, the input / output interface 140, the display 150, the communication interface 160, etc.) described above via the bus 110, It is possible to decode the instruction and execute the operation or data processing according to the decoded instruction.

The memory 130 may store instructions or data received from the processor 120 or other components (e.g., the input / output interface 140, the display 150, the communication interface 160, etc.) or generated by the processor 120 or other components Can be stored. The memory 130 may include, for example, a kernel 131, a middleware 132, an application programming interface (API) 133, or an application 134. Each of the above-described programming modules may be composed of software, firmware, hardware, or a combination of at least two of them.

The kernel 131 may include system resources (e.g., the bus 110, the processor 120, or the like) used to execute the operations or functions implemented in the other programming modules, e.g., the middleware 132, the API 133, The memory 130 and the like). In addition, the kernel 131 may provide an interface for accessing and controlling or managing individual components of the electronic device 101 in the middleware 132, the API 133, or the application 134.

The middleware 132 can act as an intermediary for the API 133 or the application 134 to communicate with the kernel 131 to exchange data. In addition, the middleware 132 may be configured to communicate with at least one of the applications 134, for example, system resources of the electronic device 101 (e.g., the bus 110, the processor 120, or the like) (E.g., scheduling or load balancing) of a work request using a method of assigning a priority that can be used to the job (e.g., the memory 130).

The API 133 is an interface for the application 134 to control the functions provided by the kernel 131 or the middleware 132. For example, the API 133 includes at least one interface or function for file control, window control, image processing, (E.g., commands).

According to various embodiments, the application 134 may be an SMS / MMS application, an email application, a calendar application, an alarm application, a health care application (e.g., an application that measures momentum or blood glucose) Pressure, humidity, or temperature information, etc.), and the like. Additionally or alternatively, the application 134 may be an application related to the exchange of information between the electronic device 101 and an external electronic device (e.g., electronic device 104). The application associated with the information exchange may include, for example, a notification relay application for communicating specific information to the external electronic device, or a device management application for managing the external electronic device .

For example, the notification delivery application may send notification information generated by another application (e.g., SMS / MMS application, email application, healthcare application, or environment information application) of the electronic device 101 to an external electronic device ). ≪ / RTI > Additionally or alternatively, the notification delivery application may receive notification information from, for example, an external electronic device (e.g., electronic device 104) and provide it to the user. The device management application may be used to control the function (e.g., the function of the external electronic device itself (or some component)) for at least a portion of an external electronic device (e.g., electronic device 104) (E.g., adjusting, turning off, or adjusting the brightness (or resolution) of the display), an application running on the external electronic device or a service provided on the external electronic device Or updated).

According to various embodiments, the application 134 may include an application designated according to an attribute (e.g., an electronic device type) of the external electronic device (e.g., electronic device 104). For example, if the external electronic device is an MP3 player, the application 134 may include an application related to music playback. Similarly, if the external electronic device is a mobile medical device, the application 134 may include applications related to health care. According to one embodiment, the application 134 may include at least one of an application specified in the electronic device 101 or an application received from an external electronic device (e.g., the server 106 or the electronic device 104).

The input / output interface 140 connects commands or data input from a user via an input / output device (e.g., a sensor, a keyboard or a touch screen) to the processor 120, the memory 130, the communication interface 160 . For example, the input / output interface 140 may provide the processor 120 with data on the user's touch input through the touch screen. The input / output interface 140 outputs commands or data received from the processor 120, the memory 130, and the communication interface 160 via the input / output device (e.g., a speaker or a display) through the bus 110 . For example, the input / output interface 140 can output voice data processed through the processor 120 to a user through a speaker.

The display 150 may display various information (e.g., multimedia data or text data) to the user.

The communication interface 160 can connect the communication between the electronic device 101 and an external device (e.g., the electronic device 104 or the server 106). For example, the communication interface 160 may be connected to the network 162 via wireless communication or wired communication to communicate with the external device. The wireless communication may include, for example, wireless fidelity, Bluetooth, near field communication (NFC), global positioning system (GPS) , WiBro or GSM, etc.). The wired communication may include at least one of, for example, a universal serial bus (USB), a high definition multimedia interface (HDMI), a recommended standard 232 (RS-232) or a plain old telephone service (POTS).

According to one embodiment, the network 162 may be a telecommunications network. The communication network may include at least one of a computer network, an internet, an internet of things, or a telephone network. According to one embodiment, a protocol (e.g., a transport layer protocol, a data link layer protocol, or a physical layer protocol) for communication between the electronic device 101 and an external device includes an application 134, an application programming interface 133, the middleware 132, And may be supported in at least one of the communication interface 160.

2 is an exploded perspective view of an interface portion showing a sealing structure of an electronic device according to an embodiment of the present invention.

Referring to Figure 2, First, at operation 201, at least a portion (e.g., a front housing) of the housing 220 of the electronic device may be provided with an interface 210 (e.g., a PCB coupled with MICRO-USB or MICRO-USB).

At operation 202, at least a portion of the housing 220 of the electronic device may be provided with a sealing member 230 (e.g., a SUS + silicone insert injected waterproofing rubber) adjacent the interface 210. [

According to one embodiment, at least a part (e.g., rear) of the housing 220 of the electronic device may further include an internal member (e.g., Guide Rib) formed in a shape connectable to the shape of the sealing member 230.

For example, by sealing the sealing member 230 with the inner member, the waterproof function of the interface unit 210 of the electronic device can be realized.

According to one embodiment, the interface unit 210 may include various electronic components that are installed inside the electronic device and can be partially exposed to the outside of the electronic device. According to one embodiment, the electronic component includes a micro USB connector port, a general USB connector port, an ear jack assembly, various key buttons, a card slot for inserting a card type external device, an HDMI connector port, various sensor modules (for example, A temperature sensor that should be exposed to the outside from the device, etc.), and a microphone device.

According to one embodiment, the interface unit 210 may be a board on which the connector port 211 is mounted. The interface unit 210 is installed in one housing (e.g., a front housing) 220, and a sealing member 230 may be disposed along the periphery of the interface unit 210. According to one embodiment, the sealing member 230 may include a closed loop area. According to one embodiment, the interface portion 210 may be disposed within the closed loop region of the sealing member 230 and interrupted. According to one embodiment, one housing 220 may be coupled to another housing (e.g., a rear housing). According to one embodiment, the inner member may be installed in another housing or formed integrally. According to one embodiment, when another housing is coupled to one housing 220, the interface 210 may be sealed in such a manner that the inner member contacts the upper surface of the sealing member 220.

3A and 3B are perspective views of a sealing member 300 according to an embodiment of the present invention.

Referring to FIGS. 3A and 3B, the sealing member 300 may be formed of a different material having different ductility by an insert molding method. According to one embodiment, the sealing member 300 may include a second member 320 to which the first member 310 and the first member 310 are coupled in an insert molding manner.

According to one embodiment, the sealing member 300 may be manufactured by attaching a plurality of parts made of respective materials with tape or bond. According to one embodiment, a part made of one material (for example, a rigid material) can be attached to a fabric of another material (for example, a soft material) in a bundle, and then punched out and bent or bent to be produced.

According to one embodiment, the first member 310 may be formed of a material having elasticity. According to one embodiment, the first member 310 may be formed of at least one of silicon, rubber, and urethane.

According to one embodiment, the second member 320 may be formed of a material harder than the first member 310. According to one embodiment, the second member 320 may be formed of various materials such as a metal material, a synthetic resin material, a glass material, and a composite fiber material.

In the exemplary embodiment of the present invention, a silicon material is adopted as the first member 310, and an SUS material is adopted as the second member 320. However, the present invention is not limited thereto.

According to one embodiment, the sealing member 3003 may include a flat portion 3001 formed in the x-axis direction and a y-axis direction and a bent portion 3002 bent in the z-axis direction. However, this is an exemplary embodiment only, and the bending portion 3002 may be formed in a plurality of portions in contact with or spaced from each other at various positions of the flat portion 3001. According to one embodiment, the bends 3002 may be bent at different angles and directions at least once. According to one embodiment, the sealing member 300 may include a closed loop region 3003.

Conventionally, since the sealing member is formed of a single soft material such as a rubber, it has only a flat structure, or its shape can not be maintained even if it has a three-dimensional structure, and the assemblability is significantly deteriorated. However, in various embodiments of the present invention, the assemblability can be improved by implementing a three-dimensional solid sealing structure with a single sealing member 300 in which at least two different materials are coupled to each other by an insert molding method.

According to one embodiment, the shape of the bent portion 3002 bent at the flat portion 3001 and the flat portion 3001 can be maintained by the second member 320 formed of the SUS material of the sealing member 300. Such an advantage is advantageous in that it is appropriately placed on a portion having a mechanical assembling structure of various shapes of electronic devices.

According to one embodiment, the sealing member 300 need not have at least two members all having a closed loop shape. For example, only at least one member of the plurality of members may be formed to have a closed loop shape.

According to an exemplary embodiment of the present invention, the sealing member 300 has only the first member 310 of silicon formed in a closed loop shape, and the second member 320 can have a partially opened shape. This open portion can help prevent the radiation performance of surrounding electronic components, such as antenna radiators, located nearby by the second member 320 of metal from deteriorating.

4 is a perspective view showing a combined state of an interface part showing a sealing structure of an electronic device according to an embodiment of the present invention.

Referring to FIG. 4, the substrate 430 may be mounted on the upper surface 461 of the housing of the first housing 460. According to one embodiment, the connector port 420 may be mounted on the upper surface 431 of the substrate 430. According to one embodiment, the sealing member 440 may be installed in a manner surrounding the connector port 420. According to one embodiment, the sealing member 440 may include a closed loop region. According to one embodiment, a connector port 420 may be included in the closed loop region of the sealing member 440.

According to one embodiment, the connector port 420 may include a body 421 having a connector insert 422 and a fastener 423 extending from both sides of the body 421. According to one embodiment, the fastening piece 423 can be fixed to the screw fastening part 463 formed on the housing upper surface 461 of the first housing 460 by a screw.

According to one embodiment, the sealing member 440 may be applied while the first member 4410 remains coupled to the second member 4420 in an insert molding manner. According to one embodiment, the first member 4410 may be a silicon material, and the second member 4420 may be an SUS material. According to one embodiment, the second member 4420 may be attached to at least one portion of the substrate top surface 431, the substrate side surface 432, the housing top surface 461, and the housing side surface 462. According to one embodiment, the sealing member 440 may be secured in a manner such that it is firmly attached to the substrate 430 and / or the corresponding portion of the first housing 460 by a double-sided tape. According to one embodiment, the second member 4420 of the sealing member 440 may be secured to the substrate 430 and / or the first housing 460. According to one embodiment, the sealing member 440 may be fixed by bonding. According to one embodiment, the first member 4410 is formed of a silicone material or the like, and is disposed on the upper portion of the sealing member 440 so that the guide ribs of the second housing 410 (Figs. 5 to 7) The connector port 420 may be sealed to be disconnected from the interior of the electronic device.

According to one embodiment, the sealing member 440 may include a flat portion 4401 formed in the x-axis direction and a y-axis direction and a bent portion 4402 bent in the z-axis direction. According to one embodiment, the planar portion 4401 contacts the substrate upper surface 430 of the substrate 430, and the bend portion 4402 can contact the substrate side 432 of the substrate 430 and the housing side 462 of the first housing 460. However, it is not limited to this, and the sealing member 440 may be formed by joining the second housing (410 of Figs. 5, 6, 7) while locating the connector port 420 in the closed loop region, Or may be formed in various shapes that can cut off the outside of the display device.

FIGS. 5 to 7 are cross-sectional views showing the principal parts of the regions A, B, C and D, respectively, of FIG. 4 according to an embodiment of the present invention.

Referring to FIGS. 5 and 6, the sealing member 440 may be fixed to the substrate 430 in such a manner that the sealing member 440 is attached to the substrate 430. When the second housing 410 is engaged with the first housing 460 (FIG. 4) The connector port 420 can be separated from the interior of the electronic device in such a manner that the rib 450 is in close contact with the upper portion of the sealing member 440. [

According to one embodiment, since the guide rib 450 is sealed while being in close contact with the first member (4410 of FIG. 4) located on the upper surface of the sealing member 440, water or foreign matter introduced into the connector port So that it can be prevented from flowing into the inside.

Referring to FIG. 7, the sealing member 440 may be fixed to the substrate 430 so that the second housing 410 is coupled to the first housing 460 (FIG. 4) The connector port 420 can be separated from the interior of the electronic device in such a manner as to be closely contacted with the connector 440.

According to one embodiment, the sealing member 440 may be secured in such a manner that it is simultaneously attached to the housing side surface 462 of the first housing 460 and the substrate side surface 432 of the substrate 430. According to one embodiment, when the second housing 410 is coupled with the first housing 460, the guide rib 450 at the corresponding position is in close contact with the sealing member 440, thereby performing a sealing function.

According to one embodiment, since the guide rib 450 is sealed while being in close contact with a first member (4410 of FIG. 4) of a silicon material located on one side of the sealing member 440, water or foreign matter introduced into the connector port 420 is introduced into the inside of the electronic device Can be prevented.

The various embodiments of the present invention can realize not only the two-dimensional waterproof structure but also the three-dimensional waterproof structure by one sealing member 440, thereby facilitating the assembling of the electronic device having the waterproof structure.

8 illustrates a block diagram 800 of an electronic device 801 in accordance with various embodiments of the present invention.

Referring to Fig. 8, the electronic device 801 may constitute all or part of the electronic device 101 shown in Fig. 1, for example. 8, the electronic device 801 includes at least one application processor (AP) 810, a communication module 820, a subscriber identification module (SIM) card 824, a memory 830, a sensor module 840, an input device 850, a display 860, An interface 870, an audio module 880, a camera module 891, a power management module 895, a battery 896, an indicator 897, and a motor 898.

The AP 810 may control a plurality of hardware or software components connected to the AP 810 by driving an operating system or an application program, and may perform various data processing and calculations including multimedia data. The AP 810 may be implemented as a system on chip (SoC), for example. According to one embodiment, the AP 810 may further include a graphics processing unit (GPU) (not shown).

The communication module 820 (e.g., the communication interface 160) can send and receive data in communication between the electronic device 801 (e.g., the electronic device 101) and other electronic devices (e.g., electronic device 104 or server 106) Can be performed. According to one embodiment, the communication module 820 may include a cellular module 821, a Wifi module 823, a BT module 825, a GPS module 827, an NFC module 828, and a radio frequency (RF) module 829.

The cellular module 821 may provide voice calls, video calls, text services, or Internet services over a communication network (e.g., LTE, LTE-A, CDMA, WCDMA, UMTS, WiBro or GSM). In addition, the cellular module 821 can perform identification and authentication of electronic devices within the communication network using, for example, a subscriber identity module (e.g., SIM card 824). According to one embodiment, the cellular module 821 may perform at least some of the functions that the AP 810 may provide. For example, the cellular module 821 may perform at least some of the multimedia control functions.

According to one embodiment, the cellular module 821 may include a communication processor (CP). In addition, the cellular module 821 may be implemented as an SoC, for example. In FIG. 8, components such as the cellular module 821 (e.g., a communication processor), the memory 830, or the power management module 895 are shown as separate components from the AP 810. However, according to one embodiment, May be implemented to include at least a portion of the above-described components (e.g., cellular module 821).

According to one embodiment, the AP 810 or the cellular module 821 (e.g., communication processor) loads commands or data received from at least one of non-volatile memory or other components connected to each other into a volatile memory for processing can do. In addition, the AP 810 or the cellular module 821 may receive data from at least one of the other components, or may store data generated by at least one of the other components in the non-volatile memory.

Each of the Wifi module 823, the BT module 825, the GPS module 827, and the NFC module 828 may include a processor for processing data transmitted and received through a corresponding module, for example. Although the cellular module 821, the Wifi module 823, the BT module 825, the GPS module 827, or the NFC module 828 are shown as separate blocks in FIG. 8, the cellular module 821, the Wifi module 823, the BT module 825, At least some (e.g., two or more) of the modules 827 or NFC modules 828 may be included in one integrated chip (IC) or IC package. At least some of the processors corresponding to the cellular module 821, the Wifi module 823, the BT module 825, the GPS module 827, or the NFC module 828, respectively (e.g., corresponding to the communication processor and Wifi module 823 corresponding to the cellular module 821) Wifi processor) can be implemented in a single SoC.

The RF module 829 can transmit and receive data, for example, transmit and receive RF signals. The RF module 829 may include, for example, a transceiver, a power amplifier module (PAM), a frequency filter, or a low noise amplifier (LNA). In addition, the RF module 829 may further include a component for transmitting and receiving electromagnetic waves in a free space in a wireless communication, for example, a conductor or a conductor. 8, the cellular module 821, the Wifi module 823, the BT module 825, the GPS module 827, and the NFC module 828 share one RF module 829. However, according to one embodiment, the cellular module 821, the Wifi module 823 , The BT module 825, the GPS module 827, or the NFC module 828 can transmit and receive RF signals through separate RF modules.

The SIM card 824 may be a card including a subscriber identity module and may be inserted into a slot formed at a specific location of the electronic device. The SIM card 824 may include unique identification information (e.g., an integrated circuit card identifier (ICCID)) or subscriber information (e.g., international mobile subscriber identity (IMSI)).

The memory 830 (e.g., the memory 130) may include an internal memory 832 or an external memory 834. The built-in memory 832 may include, for example, a nonvolatile memory such as a dynamic RAM (DRAM), a static RAM (SRAM), a synchronous dynamic RAM (SDRAM), or the like, , At least one of an OTPROM (one time programmable ROM), a PROM (programmable ROM), an EPROM (erasable and programmable ROM), an EEPROM (electrically erasable and programmable ROM), a mask ROM, a flash ROM, a NAND flash memory, . ≪ / RTI >

According to one embodiment, the internal memory 832 may be a solid state drive (SSD). The external memory 834 may be a flash drive such as a compact flash (CF), a secure digital (SD), a micro secure digital (SD), a mini secure digital (SD), an extreme digital And the like. The external memory 834 may be functionally connected to the electronic device 801 through various interfaces. According to one embodiment, the electronic device 801 may further include a storage device (or storage medium) such as a hard drive.

The sensor module 840 may measure a physical quantity or sense an operation state of the electronic device 801 and convert the measured or sensed information into an electric signal. The sensor module 840 includes a gyro sensor 840A, a gyro sensor 840B, an air pressure sensor 840C, a magnetic sensor 840D, an acceleration sensor 840E, a grip sensor 840F, a proximity sensor 840G, a color sensor 840H blue sensor), a living body sensor 840I, a temperature / humidity sensor 840J, an illuminance sensor 840K, or an ultraviolet (UV) sensor 840M. Additionally or alternatively, the sensor module 840 may include, for example, an E-nose sensor (not shown), an EMG sensor (not shown), an EEG sensor (not shown) an electrocardiogram sensor (not shown), an infra red sensor (not shown), an iris sensor (not shown), or a fingerprint sensor (not shown). The sensor module 840 may further include a control circuit for controlling at least one sensor included in the sensor module 840.

The input device 850 may include a touch panel 852, a (digital) pen sensor 854, a key 856, or an ultrasonic input device 858. The touch panel 852 can recognize a touch input by at least one of an electrostatic type, a pressure sensitive type, an infrared type, and an ultrasonic type, for example. The touch panel 852 may further include a control circuit. In electrostatic mode, physical contact or proximity recognition is possible. The touch panel 852 may further include a tactile layer. In this case, the touch panel 852 may provide a tactile response to the user.

The (digital) pen sensor 854 can be implemented using the same or similar method as receiving the touch input of the user, or using a separate recognition sheet, for example. The key 856 may include, for example, a physical button, an optical key or a keypad. The ultrasonic input device 858 is a device that can confirm data by sensing a sound wave with a microphone (e.g., a microphone 888) in the electronic device 801 through an input tool for generating an ultrasonic signal, and is capable of wireless recognition. According to one embodiment, the electronic device 801 may receive user input from an external device (e.g., a computer or a server) connected thereto using the communication module 820.

The display 860 (e.g., the display 150) may include a panel 862, a hologram device 864, or a projector 866. The panel 862 may be, for example, a liquid-crystal display (LCD) or an active-matrix organic light-emitting diode (AM-OLED). The panel 862 may be embodied, for example, flexible, transparent or wearable. The panel 862 may be composed of the touch panel 852 and one module. The hologram device 864 can display a stereoscopic image in the air using interference of light. The projector 866 can display an image by projecting light onto a screen. The screen may be located, for example, inside or outside the electronic device 801. According to one embodiment, the display 860 may further include control circuitry for controlling the panel 862, the hologram device 864, or the projector 866.

The interface 870 may include, for example, a high-definition multimedia interface (HDMI) 872, a universal serial bus (USB) 874, an optical interface 876, or a D-sub (D-subminiature) The interface 870 may, for example, be included in the communication interface 160 shown in FIG. Additionally or alternatively, the interface 870 may include, for example, a mobile high-definition link (MHL) interface, a secure digital (SD) card / multi-media card (MMC) interface, or an infrared data association can do.

The audio module 880 can convert both sound and electrical signals in both directions. At least some of the components of the audio module 880 may be included, for example, in the input / output interface 140 shown in FIG. The audio module 880 may process sound information input or output through, for example, a speaker 882, a receiver 884, an earphone 886, a microphone 888, or the like.

The camera module 891 can capture still images and moving images. The camera module 891 may include one or more image sensors (e.g., a front sensor or a rear sensor), a lens (not shown), an image signal processor ) Or a flash (not shown), such as an LED or xenon lamp.

The power management module 895 can manage the power of the electronic device 801. Although not shown, the power management module 895 may include, for example, a power management integrated circuit (PMIC), a charger integrated circuit (PMIC), or a battery or fuel gauge.

The PMIC can be mounted, for example, in an integrated circuit or a SoC semiconductor. The charging method can be classified into wired and wireless. The charging IC can charge the battery, and can prevent an overvoltage or an overcurrent from the charger. According to one embodiment, the charging IC may comprise a charging IC for at least one of a wired charging scheme or a wireless charging scheme. The wireless charging system may be, for example, a magnetic resonance system, a magnetic induction system or an electromagnetic wave system, and additional circuits for wireless charging may be added, such as a coil loop, a resonant circuit or a rectifier have.

The battery gauge can measure the remaining amount of the battery 896, the voltage during charging, the current or the temperature, for example. The battery 896 may store or generate electricity, and may supply power to the electronic device 801 using stored or generated electricity. The battery 896 may include, for example, a rechargeable battery or a solar battery.

The indicator 897 may indicate a specific state of the electronic device 801 or a portion thereof (e.g., the AP 810), for example, a boot state, a message state, or a charged state. The motor 898 can convert an electrical signal into a mechanical vibration. Although not shown, the electronic device 801 may include a processing unit (e.g., a GPU) for mobile TV support. The processing device for supporting the mobile TV can process media data conforming to standards such as digital multimedia broadcasting (DMB), digital video broadcasting (DVB), or media flow.

Each of the above-described components of the electronic device according to various embodiments of the present invention may be composed of one or more components, and the name of the component may be changed according to the type of the electronic device. The electronic device according to various embodiments of the present invention may be configured to include at least one of the above-described components, and some components may be omitted or further include other additional components. In addition, some of the components of the electronic device according to various embodiments of the present invention may be combined into one entity, so that the functions of the components before being combined can be performed in the same manner.

The term "module" as used in various embodiments of the present invention may mean a unit including, for example, one or a combination of two or more of hardware, software or firmware. A "module" may be interchangeably used with terms such as, for example, unit, logic, logical block, component or circuit. A "module" may be a minimum unit or a portion of an integrally constructed component. A "module" may be a minimum unit or a portion thereof that performs one or more functions. "Modules" may be implemented either mechanically or electronically. For example, a "module" in accordance with various embodiments of the present invention may be implemented as an application-specific integrated circuit (ASIC) chip, field-programmable gate arrays (FPGAs) And a programmable-logic device.

According to various embodiments, at least a portion of a device (e.g., modules or functions thereof) or a method (e.g., operations) according to various embodiments of the present invention may be, for example, a computer readable And may be implemented with instructions stored on a computer-readable storage medium. The instructions, when executed by one or more processors (e.g., the processor 810), may cause the one or more processors to perform functions corresponding to the instructions. The computer readable storage medium may be, for example, the memory 830. At least some of the programming modules may be implemented (e.g., executed) by, for example, the processor 810. At least some of the programming modules may include, for example, modules, programs, routines, sets of instructions or processes, etc. to perform one or more functions.

The computer-readable recording medium includes a magnetic medium such as a hard disk, a floppy disk and a magnetic tape, an optical recording medium such as a CD-ROM (Compact Disc Read Only Memory), a DVD (Digital Versatile Disc) A magneto-optical medium such as a floppy disk, and a program command such as a read only memory (ROM), a random access memory (RAM), a flash memory, Module) that is configured to store and perform the functions described herein. The program instructions may also include machine language code such as those generated by a compiler, as well as high-level language code that may be executed by a computer using an interpreter or the like. The hardware devices described above may be configured to operate as one or more software modules to perform the operations of the various embodiments of the present invention, and vice versa.

Modules or programming modules according to various embodiments of the present invention may include at least one or more of the elements described above, some of which may be omitted, or may further include other additional elements. Operations performed by modules, programming modules, or other components in accordance with various embodiments of the invention may be performed in a sequential, parallel, iterative, or heuristic manner. Also, some operations may be performed in a different order, omitted, or other operations may be added.

It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. It is not intended to be limiting. Accordingly, the scope of various embodiments of the present invention should be construed as being included in the scope of various embodiments of the present invention without departing from the scope of the present invention, all changes or modifications derived from the technical idea of various embodiments of the present invention .

420: connector port 430: substrate
440: sealing member 450: guide rib
460: first housing

Claims (20)

In an electronic device,
A housing including a seating portion having a sealing member disposed on at least a portion of an edge; And
Wherein at least a portion of the electronic component is in contact with the sealing member and is exposed to the outside through at least one surface of the electronic device.
The method according to claim 1,
Wherein the sealing member prevents external water or foreign matter introduced from the electronic component from flowing into the electronic device through a connection with an internal member disposed inside the electronic device.
The method according to claim 1,
Wherein the sealing member is implemented by coupling an insert member onto the base member using an insert injection method.
The method of claim 3,
Wherein the base member comprises at least one of a metal, a sheet, or a plastic injection.
The method of claim 3,
Wherein the insert member comprises silicon.
In an electronic device,
A first housing including a seating portion in which a sealing member is disposed at least in part of an edge;
An electronic component disposed on the seating portion such that at least a portion of the contact portion is in contact with the sealing member and is exposed to the outside through at least one surface of the electronic device; And
And at least one inner member in contact with the sealing member.
The method according to claim 6,
Wherein the sealing member is formed in such a manner that at least two different materials having mutually different ductility are mutually insert molded.
The method according to claim 6,
Wherein the sealing member includes a flat portion formed in the x-axis and y-axis directions and a bent portion bent at least once in the z-axis direction in the flat portion.
The method according to claim 6,
Wherein the sealing member includes a base member in which a desired shape is maintained, and an insert member insert-molded into the base member.
10. The method of claim 9,
Wherein at least one of the base member and the insert member includes a closed loop region, wherein the electronic component is disposed in the closed loop region.
10. The method of claim 9,
Wherein the base member is formed of at least one of a metal material, a synthetic resin material, a glass material, and a composite fiber material.
10. The method of claim 9,
Wherein the insert member is formed of at least one of silicon, rubber, and urethane.
The method according to claim 6,
Wherein the sealing member prevents penetration of water introduced into the electronic device through the electronic component.
The method according to claim 6,
Wherein the electronic component is disposed in a first housing of the electronic device and the inner member is installed or formed in at least one second housing coupled to the first housing.
15. The method of claim 14,
Wherein the inner member contacts the sealing member when the first housing and the second housing are engaged.
The method according to claim 6,
Wherein the electronic component includes at least one of a micro USB connector port, a general USB connector port, an ear jack assembly, a key button, a card slot for inserting a card-type external device, an HDMI connector port, a sensor module and a microphone device.
In an electronic device,
A first housing;
A substrate mounted on the first housing;
A connector port mounted on the substrate;
A sealing member fixed to the substrate and the first housing in such a manner as to surround the rim of the connector port; And
And a second housing coupled to the first housing and having at least one guide rib in contact with an upper surface of the sealing member upon engagement.
18. The method of claim 17,
Wherein the sealing member prevents penetration of water entering the electronic device through the connector port.
18. The method of claim 17,
Wherein the sealing member is formed in such a manner that at least two different materials having mutually different ductility are mutually insert molded.
18. The method of claim 17,
Wherein the sealing member includes a flat portion formed in the x-axis and y-axis directions and a bent portion bent at least once in the z-axis direction in the flat portion,
Wherein the guide rib is simultaneously in contact with the planar portion and the bent portion.

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