KR20150078361A - Flat type image display device and mathod for manufacturing the same - Google Patents

Abstract

The present invention relates to a flat-type image display device and an assembly method thereof, wherein the device is capable of improving heat dissipation efficiency by enhancing a heat dissipation structure of a driving integrated circuit of a flat-type image display device and improving the reliability of a product by preventing damage and operation failure of the driving integrated circuits. The flat-type image display device, in which an image display panel is arranged on a front side of a bottom cover as a panel guide is placed on a front side of the bottom cover, comprises: at least one data circuit film which is attached to a data pad area of the image display panel and is extended in the form enclosing the side of the panel guide and the bottom cover; a data integrated circuit which is mounted in each of the data circuit film in the direction of the panel guide; and a first heat dissipation pad which is respectively attached between the data integrated circuit and the bottom cover and is configured to allow the data integrated circuit to radiate heat by the bottom cover.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a flat display device,

The present invention relates to a flat panel display device and a method of assembling the flat panel display device, which can improve the heat radiation efficiency of the driving integrated circuit of the flat panel display device and improve the reliability of the product by preventing breakage and driving failure of the driving integrated circuits .

BACKGROUND ART Demands for video display devices have been increasing in various forms as an information society has developed. In recent years, a liquid crystal display, a field emission display, a plasma display panel, Various flat panel display devices such as a light emitting display are utilized.

2. Description of the Related Art Flat panel display devices used in monitors for personal computers, portable terminals and various information devices include liquid crystal display devices, plasma display devices, field emission display devices Field emission display devices and organic light emitting diode display devices are emerging.

In such flat panel display devices, an image display panel for displaying an image is mounted on a separate guide bracket or a panel guide, and is assembled inside a top case or a bottom cover constituting the appearance of the flat panel display. Particularly, in the case of a liquid crystal display device, since the liquid crystal panel itself can not emit light, it is assembled together with a panel guide and a back cover so that a backlight unit or the like is further provided on the back surface thereof.

The data integrated circuits constituting the driving circuit of the video display panel are respectively attached to a plurality of different source printed circuit boards or printed circuit films. In the case of the gate integrated circuits, the data integrated circuits are attached to either side of the video display panel, It may be constructed directly. As described above, the image display panel, the driving circuit, and the backlight unit are formed in a form that is assembled inside a case, for example, a bottom cover, a panel guide, a top case, For example, in the case of a timing controller or a drive system, a control means for controlling the driving of the image display module may be provided separately on a control printed circuit board, and may be connected to the drive circuits through at least one cable, And supplies necessary control signals.

Since the gate and data integrated circuits are mounted on the printed circuit film and attached to the side surfaces of the image display panel, the image display panel and the backlight unit are assembled together in the bottom case and the top case The printed circuit films attached to the periphery of the liquid crystal panel must be assembled so as to surround the side surfaces of the panel guide or the bottom case.

However, the gate and data integrated circuits mounted on the printed circuit film require an assembling structure in which heat is generated when the panel is driven, and the heat is dissipated. Conventionally, the top case is brought into contact with the gates or data integrated circuits mounted on the printed circuit film to dissipate the heat accumulated in the integrated circuits. However, in case of dissipating the respective integrated circuits by using the metallic materials as described above, the defective rate is increased due to the impact on the integrated circuits. In addition, since the metallic parts must be further formed during the product assembly, And the like.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems and it is an object of the present invention to improve the heat dissipation structure of the driving integrated circuit of the flat panel display device to improve the heat dissipation efficiency and to prevent the damage and drive failure of the driving integrated circuits, And a method of assembling the same.

According to another aspect of the present invention, there is provided a flat display device including a bottom cover, a panel guide disposed on a front surface of the bottom cover, At least one data circuit film attached to a data pad area of the image display panel and extending in a form of wrapping the side surfaces of the panel guide and the bottom cover; Each of the data integrated circuits mounted on the data circuit film in the panel guide direction; And a first heat dissipation pad attached between each of the data integration circuits and the bottom cover to allow the data integrated circuit to radiate heat by the bottom cover.

Wherein a heat dissipating groove is formed in a side portion of a panel guide corresponding to a data integrated circuit mounted on the data circuit film, the panel guide facing the front surface of the data integrated circuit, and the first heat dissipating pad is formed in the heat dissipating groove, And one heat dissipation pad is attached to the side surface of the bottom cover.

Wherein a front surface of each of the data integrated circuits is held in contact with the first heat radiation pads disposed in the respective heat radiation grooves and the bottom cover having the first heat radiation pads and the first heat radiation pads attached thereto, And is radiated by a panel guide that maintains contact with the pad.

Wherein a back surface of the data circuit film corresponding to a mounting surface of each of the data integrated circuits is further comprised of a second heat radiation pad such that each of the data integrated circuits is in contact with the data circuit film and the second heat radiation pads and the second heat radiation pads So that the heat is dissipated by the top case which maintains the state.

According to another aspect of the present invention, there is provided a method of assembling a flat panel display, the flat panel display having an image display panel disposed on a front surface of the bottom cover, A method of assembling an image display device, comprising the steps of: attaching at least one data circuit film to a data pad area of the image display panel to extend the side surface of the panel guide and the bottom cover; Mounting each data circuit on each data circuit film in the direction of the bottom cover; And attaching a first heat dissipation pad between each of the data integrated circuits and the bottom cover so that the respective data integrated circuits are dissipated by the bottom cover.

Wherein a heat dissipating groove is formed in a side surface portion of a panel guide corresponding to each of the data integrated circuits, and each of the first heat dissipation pads is formed in each of the heat dissipating grooves, And the pad is attached to the side surface of the bottom cover.

Wherein a front surface of each of the data integrated circuits is held in contact with the first heat radiation pads disposed in the respective heat radiation grooves and the bottom cover having the first heat radiation pads and the first heat radiation pads attached thereto, And is radiated by a panel guide that maintains contact with the pad.

Wherein the back surface of the data circuit film corresponding to the attachment surface of each of the data integration circuits further comprises a second heat dissipation pad, wherein each of the data integration circuits includes the data circuit film, the second heat dissipation pad, And the heat is radiated by the top case which keeps contact with the two heat dissipation pads.

A flat panel display device and a method of assembling the flat panel display according to an embodiment of the present invention having the above characteristics can improve the heat radiation efficiency of the driving integrated circuit of the flat panel display device and prevent the damage and drive failure of the driving integrated circuits Whereby the reliability of the product can be improved.

1 is an exploded perspective view schematically showing a liquid crystal display device according to an embodiment of the present invention.
FIG. 2 is an assembly sectional view showing a cutting plane II 'in FIG. 1; FIG.
3 is a partial perspective view of the "A" portion of the panel guide and bottom case of FIG. 1 assembled.
FIG. 4 is a partial perspective view of the "A" portion of the panel guide of FIG. 1 with the first heat radiation pad attached to the heat radiation groove.

Hereinafter, a flat panel display according to an embodiment of the present invention and a method of assembling the same will be described in detail with reference to the accompanying drawings.

In the flat panel display of the present invention, a plasma display panel and a field emission display may be used in addition to a liquid crystal display and an organic light emitting display. The technical features of the present invention can be applied to all of the above flat panel display devices, but an example applied to a liquid crystal display device will be described below.

1 is an exploded perspective view schematically showing a liquid crystal display device according to an embodiment of the present invention. 2 is an assembled cross-sectional view of the I-I 'section of FIG.

The liquid crystal display device shown in Figs. 1 and 2 includes a backlight unit 2; A panel guide 90; And includes a liquid crystal panel 100 and a top case 120.

The liquid crystal panel 100 is stacked on the panel support portion of the panel guide 90 to adjust the transmittance of light from the backlight unit 2 to display an image. The liquid crystal panel 100 includes a liquid crystal (not shown) formed between a lower substrate 102 and an upper substrate 104, a lower substrate 102 and an upper substrate 104, a lower substrate 102, And a spacer (not shown) that maintains a constant distance between the electrodes 104 and 104.

The upper substrate 104 includes a color filter; Black matrix; And a common electrode.

The lower substrate 102 includes a thin film transistor formed in each cell region defined by data lines and gate lines, and a pixel electrode connected to the thin film transistor. The thin film transistor switches the image signal supplied from the data line to the pixel electrode in response to the gate-on voltage supplied from the gate line. Here, the common electrode formed on the upper substrate 104 may be formed on the lower substrate 102 depending on the mode of the liquid crystal.

A non-display region of the lower substrate 102 is provided with a data pad region connected to each of the data lines and a gate pad region connected to each of the gate lines. A gate pad region, not shown, may be implemented by a gate integrated circuit chip-on-glass method that supplies a gate-on voltage to the gate lines, or may be formed together with the manufacturing process of the thin film transistor.

On the other hand, a plurality of data circuit films 110 mounted with a data integration circuit 111 for supplying image signals to the data lines are attached to the data pad area. Each data circuit film 110 may be a tape carrier package or a chip on film. Each of the data circuit films 110 supplies a data signal or the like from a data printed circuit board (not shown) to the data integration circuit 112 and supplies an image signal output from the data integration circuit 111 to each data line do. Therefore, in the case of each data circuit film 110, the data collecting circuit 111 is attached and extended from the data pad area in the form of wrapping the side surfaces of the panel guide 90 and the backlight unit 2, A data printed circuit board formed on the back surface of the unit 2, and the like.

Each of the data integrated circuits 111 may be mounted on each of the data circuit films 110 in the outward direction, that is, in the direction of the top case 120. However, in assembling the top case 120, An impact may be generated between the top case 120 and the data integrated circuit 111. If there is a gap between the top case 120 and the data integrated circuit 111,

Conversely, when the data integrated circuits 111 of the data circuit film 110 are mounted in the direction of the panel guide 90, they can be directly in contact with the panel guide 90 to be radiated, An impact or a pressure may be generated between the bottom covers 10. Therefore, in the present invention, the data integrated circuits 111 are mounted on the data circuit film 110 in a direction facing the panel guide 90, and the panel guides The heat dissipating grooves 90b are formed in the heat dissipating grooves 90 and the first heat dissipating pads 114 are disposed in the heat dissipating grooves 90b. That is, in the assembled state, the front surfaces of the respective data integrated circuits 111 are brought into contact with the first heat radiation pads 114 disposed in the respective heat radiation grooves 90b, so that the first heat radiation pads 114 and the first heat radiation pads The bottom cover 10 having the first heat radiation pad 114 attached thereto and the panel guide 90 maintaining the contact state with the first heat radiation pad. The second heat dissipation pad 112 is also attached to the back surface of the data circuit film 110 to which the data integrated circuit 111 is attached so that the data integrated circuit 111 can be mounted on the back surface of the data circuit film 110, The heat is also radiated by the top case 120 that keeps the pad 112 and the second heat-radiating pad 112 in contact with each other. The structure of the first and second heat radiating pads 114 and 112 and the attaching structure will be described in detail with reference to the accompanying drawings hereinafter.

The panel guide 90 is mounted on the seating portion of the bottom cover 10 so as to wrap the edges and sides of the diffuser plate 70 and the plurality of optical sheets 80 and to cover the side surface of the bottom cover 10. A panel support portion for supporting the liquid crystal panel 100 is formed on a front surface of the panel guide 90. The panel support portion is formed so as to support the rear surface non-display region and the side surface of the liquid crystal panel 100. [ A side surface portion of the panel guide 90 facing the data integrated circuit 111 and corresponding to the data integrated circuit 111 attached to the data circuit film 110 at the time of assembling the liquid crystal panel 100 is provided with a heat dissipating groove 90b are formed. The side fixing grooves 90a of the panel guide 90 are fastened and fixed to the protruding fixing portions 10a protruding from the side surface of the bottom cover 10 when the panel guide 90 and the bottom cover 10 are assembled. A first heat radiation pad 114 is formed in the heat dissipation groove 90b on the side surface of the panel guide 90 and the first heat radiation pads 114 are attached to the side surface of the bottom cover 10.

The top case 120 is bent so as to cover the front non-display area of the liquid crystal panel 100 and the side surface of the bottom cover 10. [ At this time, the top case 120 is fastened and fixed to the panel guide 90 or the bottom cover 10 which encloses the side surface of the bottom cover 10.

The backlight unit (2) includes a lamp fixing part (41) mounted with a plurality of lamps for generating light and fixedly arranged on the inner side surface of the bottom cover (10); A light guide plate (70) for receiving light from each lamp (40) to the side incidence surface and changing the proceeding direction of the light to the front and outputting the light; And a plurality of optical sheets 80 disposed on the light guide plate 70 for vertically outputting light from the light guide plate 70 and light incidence surfaces thereof.

Each of the plurality of lamps is detachably mounted on the lamp fixing portion 41 and positioned so as to face the side light incidence surface of the light guide plate 70 and the side light incidence surface of at least one of the plurality of optical sheets 80. [ Here, as the plurality of lamps 40, a light emitting diode may be used. In the case of Fig. 1, the lamp 40 of the present invention is an edge type backlight unit composed of light emitting diodes, but a direct light type backlight unit other than an edge type may also be applied. The plurality of lamps 40 are illuminated by the lamp driving power source supplied through the respective lamp fixing portions 41 and irradiate light to the light incidence surfaces of the light guide plate 70 and the respective optical sheets 80.

The bottom cover 10 has a lower surface opposed to the liquid crystal panel 100 or the optical sheet 80 and a lower surface opposed to the lamps 40 so that the lamps 40 can be arranged and formed so as to accommodate and fix the light guide plate 70 and the respective optical sheets 80 An inner side surface, and a seating portion extending from the inner side surface so as to face the bottom surface of the lower side. (Not shown) for reflecting the light from each lamp 40 toward the liquid crystal panel 100, that is, the front surface, is further formed on the bottom bottom surface and the inner side surface of the bottom cover 10. Thus, the bottom cover 10 has a rectangular frame shape as shown in Fig.

The lamp fixing part 41 is provided on the inner side of the bottom cover 10 with the plurality of lamps 40 and supplies the lamp driving power transmitted from the outside to the plurality of lamps 40.

The diffusion plate 70 is stacked on the front opening of the bottom cover 10 having a square frame shape, that is, the inner bottom surface. The diffusion plate 70 converts the path of the light irradiated to the side light incidence surface to diffuse the light to the entire area of the liquid crystal panel 100.

The plurality of optical sheets 80 diffuse through the diffusion plate 70 to adjust the optical path so that the incident light is perpendicularly irradiated to the liquid crystal panel 100. To this end, the plurality of optical sheets 80 include at least one prism sheet 82 for condensing the light diffused by the diffuser plate 70, a diffusion sheet 84, a polarizing sheet 84 and a protective sheet (not shown) ) And the like.

As described above, the backlight unit 2 generates light by irradiating a plurality of lamps 40 with the lamp driving power supplied from the lamp driving circuit unit, and irradiates the liquid crystal panel 100 and the like. As described above, the backlight unit 2 is provided with a plurality of optical sheets 80, and the light incident from the light guide plate 70 or the lamp 40 is vertically irradiated onto the front surface thereof. The plurality of optical sheets 80 adjust the optical path so that the light is emitted vertically so that the optical sheets 80 include at least one prism sheet 82, a diffusion sheet 84, a polarizing sheet 84, A protective sheet, and the like are sequentially stacked.

3 is a partial perspective view of the "A" part in a state in which the panel guide and the bottom cover of Fig. 1 are assembled. 4 is a partial "A" perspective view of the panel guide of FIG. 1 with the first heat-radiating pad attached to the heat-radiating groove.

2 and 3, when the liquid crystal display device is assembled, the panel guide 90 is seated on the backlight unit 2, and the liquid crystal panel 100 is disposed on the front surface of the backlight unit 2 . A heat dissipation groove 90b is formed in a side surface portion of the panel guide 90 which faces the data integration circuit 111 in association with the data integration circuit 111 when the liquid crystal panel 100 is arranged and assembled.

4, the first heat radiation pads 114 are formed in the heat radiation grooves 90b of the panel guide 90 and the first heat radiation pads 114 formed in the heat radiation grooves 90b are connected to the bottom cover 10).

The data circuit film 110 attached to the data pad area of the liquid crystal panel 100 is wound around the side surfaces of the panel guide 90 and the backlight unit 2 in a state in which the data integrated circuit 110 is attached, And is connected to a data printed circuit board formed on the back surface of the backlight unit 2. [ In other words, a panel guide is disposed on the front surface of the bottom cover 10 including the backlight unit 2 so that the liquid crystal panel 100 is seated on the edge thereof, so that the liquid crystal panel 100 is placed on the front surface of the bottom cover 10 do. Each of the at least one data circuit film 110 is attached to the data pad area of the liquid crystal panel 100 by mounting the data integrated circuit 112 so that the side surfaces of the panel guide 90 and the bottom cover 10 Wrapped around.

Thus, in the assembled state of the liquid crystal panel 100 and the data circuit film 110, the front surfaces of the respective data integrated circuits 111 are brought into contact with the first heat radiation pads 114 disposed in the respective heat radiation grooves 90b. Accordingly, each data integration circuit 111 can be dissipated by the first heat dissipation pad 114 and the bottom cover 10 to which the first heat dissipation pad 114 is attached.

The second heat dissipation pad 112 is also disposed and attached to the back surface of the data circuit film 110 with the data integration circuit 111 so that the data integration circuit 111 is formed after the top case 120 is assembled The heat is also radiated by the second heat radiation pad 112 on the back surface of the data circuit film 110 and the top case 120 maintaining the contact state with the second heat radiation pads 112.

The first and second heat dissipation pads 114 and 112 are made of a material such as silicone that can mitigate external pressure or impact and heat the heat generated from the respective data integrated circuits 112 to the external or bottom cover 10 and the top case 120, respectively, to radiate heat. The first heat radiation pads 114 may be previously attached to the front surfaces of the respective data integrated circuits 112 and inserted into the respective heat radiation grooves 90b.

The top case 120 is fastened to the panel guide 90 or the bottom cover 10 which encloses the side surface of the bottom cover 10 to thereby press and fix the data circuit film 110 to the bottom cover 10. At least one rib is formed on the inner surface of the top case 120 at a position corresponding to each data circuit film 110 so as to form a hemispherical or quadrangular shape so that each data circuit film 110 is sandwiched between the bottom cover 10 ).

According to the constitution and the assembling method, the flat panel display device and the assembling method thereof according to the embodiment of the present invention can improve the heat radiation efficiency of the driving integrated circuit of the flat panel display, improve the heat radiation efficiency, The reliability of the product can be improved by preventing the failure.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Will be apparent to those of ordinary skill in the art.

Claims (8)

And a panel guide disposed on a front surface of the bottom cover to thereby dispose an image display panel on the front surface of the bottom cover,
At least one data circuit film attached to a data pad area of the image display panel and extending in a form of wrapping a side surface of the panel guide and the bottom cover;
Each of the data integrated circuits mounted on the data circuit film in the panel guide direction; And
And a first heat dissipation pad attached between each of the data integration circuits and the bottom cover for allowing the data integrated circuit to radiate heat by the bottom cover. The method according to claim 1,
Wherein a heat dissipation groove is formed in a side surface portion of a panel guide corresponding to a data integrated circuit mounted on the data circuit film and facing the front surface of the data integrated circuit,
Wherein the first heat dissipation pad is formed inside the heat dissipation groove, and the first heat dissipation pad is attached to a side surface of the bottom cover. 3. The method of claim 2,
The front face of each data integration circuit
The bottom cover having the first heat radiation pad and the first heat radiation pad attached thereto and the panel holding the first heat radiation pad in contact with the first heat radiation pad while being kept in contact with the first heat radiation pads disposed in the respective heat radiation grooves, And the heat is radiated by the guide. The method according to claim 1,
Wherein a back surface of the data circuit film corresponding to a mounting surface of each of the data integrated circuits is further comprised of a second heat radiation pad such that each of the data integrated circuits is in contact with the data circuit film and the second heat radiation pads and the second heat radiation pads And the heat is radiated by the top case which maintains the state of the flat display. A method of assembling a flat panel display device in which an image display panel is disposed on a front surface of a bottom cover by disposing a panel guide on a front surface of a bottom cover,
Attaching at least one data circuit film to a data pad area of the image display panel to extend the side surfaces of the panel guide and the bottom cover to surround the data pad area;
Mounting each data circuit on each data circuit film in the direction of the bottom cover; And
And attaching a first heat radiation pad between each of the data integrated circuits and the bottom cover so that the respective data integrated circuits are discharged by the bottom cover. 6. The method of claim 5,
And heat dissipation grooves are respectively formed in the side portions of the panel guides corresponding to the respective data integrated circuits and facing the front surface of the data integrated circuit,
Wherein each of the first heat radiation pads is formed in each of the heat dissipation grooves, and each of the first heat radiation pads is attached to a side surface of the bottom cover. The method according to claim 6,
The front face of each data integration circuit
The bottom cover having the first heat radiation pad and the first heat radiation pad attached thereto and the panel holding the first heat radiation pad in contact with the first heat radiation pad while being kept in contact with the first heat radiation pads disposed in the respective heat radiation grooves, And the heat is radiated by a guide. 6. The method of claim 5,
The back surface of the data circuit film corresponding to the attachment surface of each data integration circuit further comprises a second heat radiation pad,
Wherein each of the data integrated circuits is made to radiate heat by a top case that maintains contact with the data circuit film, the second heat radiation pads, and the second heat radiation pads.

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