WO2012081395A1 - Illumination device and liquid crystal display device comprising same - Google Patents

Illumination device and liquid crystal display device comprising same Download PDF

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Publication number
WO2012081395A1
WO2012081395A1 PCT/JP2011/077515 JP2011077515W WO2012081395A1 WO 2012081395 A1 WO2012081395 A1 WO 2012081395A1 JP 2011077515 W JP2011077515 W JP 2011077515W WO 2012081395 A1 WO2012081395 A1 WO 2012081395A1
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WO
WIPO (PCT)
Prior art keywords
led
guide plate
light guide
plate
chassis
Prior art date
Application number
PCT/JP2011/077515
Other languages
French (fr)
Japanese (ja)
Inventor
裕紀 行方
篤志 河村
義紀 大橋
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2012081395A1 publication Critical patent/WO2012081395A1/en

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/0091—Positioning aspects of the light source relative to the light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/50—Protective arrangements
    • G02F2201/503—Arrangements improving the resistance to shock

Definitions

  • the present invention relates to an illumination device disposed on the back surface of a liquid crystal display panel and a liquid crystal display device including the illumination device.
  • a general liquid crystal display device includes a liquid crystal display panel and an illumination device (backlight device) disposed on the back side of the liquid crystal display panel so as to irradiate the liquid crystal display panel with light.
  • a sidelight including a plate-like light guide plate made of a transparent material such as acrylic resin and a light source made up of LEDs (light emitting diodes) arranged along one side or a plurality of sides of the light guide plate A type (edge light type) is known.
  • Such a sidelight type illuminating device has advantages such as being easily reduced in thickness as compared with a direct type illuminating device in which a light source is disposed on the back surface of a liquid crystal display panel.
  • FIG. 8 is an exploded perspective view of a liquid crystal display device provided with a sidelight type illumination device using such LEDs
  • FIG. 9A is an enlarged view of a main part after assembly of the liquid crystal display device of FIG. It is sectional drawing shown.
  • the liquid crystal display device 100 includes a bezel 102, a liquid crystal display panel 103, and a lighting device 104.
  • the bezel 102 has a frame shape that covers the periphery of the liquid crystal display panel 103, and ensures the strength of the entire liquid crystal display device 100 together with the chassis 114.
  • the liquid crystal display panel 103 is formed by bonding two pieces of glass and sealing the liquid crystal therebetween, so that an image can be displayed on the front surface.
  • the illuminating device 104 includes a chassis 114 having a shallow box shape. Inside the chassis 114, an LED substrate on which optical sheets 109 to 111, a light guide plate 112, a reflection sheet 113, and a plurality of LEDs 121 are mounted. 120 can be stored.
  • the light guide plate 112 includes a light incident surface 112a for introducing light from the LEDs 121 included in the LED substrate 120, and a light emission surface for emitting light introduced from the light incident surface 112a upward (irradiation direction). 112b.
  • the light incident surface 112 a is configured by a predetermined side end surface of the light guide plate 112, and the light emitting surface 112 b is configured by the front surface of the light guide plate 112.
  • the optical sheets 109 to 111 include a diffusion sheet, a lens sheet, and the like, and are disposed on the light emitting surface 112b of the light guide plate 112. Further, the reflection sheet 113 is disposed so as to cover the back surface 112c of the light guide plate 112 on the side opposite to the light emitting surface 112b.
  • the optical sheets 109 to 111, the light guide plate 112, and the reflection sheet 113 are fixed in a stacked state on the bottom plate 114a of the chassis 114 by the frame 105.
  • the plurality of LEDs 121 provided on the LED substrate 120 are disposed in the vicinity of the light incident surface 112 a of the light guide plate 112. Furthermore, the light emitting surface 121a of the LED 121 is disposed at a predetermined interval along the light incident surface 112a so as to face the light incident surface 112a of the light guide plate 112.
  • the LED board 120 is attached to the side plate 114b rising from the outer edge of the bottom plate 114a of the chassis 114 by double-sided tape or screwing, and is held so as to stand vertically with respect to the bottom plate 114a.
  • the following patent document is mentioned as a prior art document relevant to this invention.
  • the distance between the side end surface (light incident surface) 112 a of the light guide plate 112 and the light emitting surface 121 a of the LED 121 is set from the viewpoint of the utilization efficiency of light introduced from the LED 121 to the light guide plate 112.
  • the LED 121 is preferably disposed close to the side end surface 112a of the light guide plate 112 so as to be small.
  • thermal contraction occurs due to thermal expansion of a member formed by the temperature rise due to the lighting of the LED 121 or temperature drop due to the light extinguishing of the LED 121.
  • the light guide plate 112 made of resin and the metal made of metal Since time differences occur in the thermal expansion and contraction due to the difference in linear expansion coefficient and volume of the chassis 114, the LED 121 (LED substrate 120) is placed close to the side end surface 112a of the light guide plate 112 and FIG. As shown in b), the side end surface 112a of the light guide plate 112 extended by thermal expansion is in contact with the LED 121, and the LED 121 may be damaged by receiving an excessive load from the side end surface 112a of the light guide plate 112. was there.
  • a problem to be solved by the present invention is that a light guide plate is disposed on the inner bottom surface of a chassis having a box shape with an upper surface opening, and LEDs for introducing light into the light guide plate are disposed along the inner side surface of the chassis.
  • an illumination device includes a light guide plate having a plate shape, a chassis having a box shape with an upper surface opened and housing the light guide plate, and a mounting surface on which LEDs are mounted. And an LED substrate arranged upright on the bottom plate of the chassis so as to face the side end surface of the light guide plate, and the board mounting plate facing the side end surface of the light guide plate on the bottom plate of the chassis.
  • the LED board is mounted on the board via a buffer member disposed between the back surface opposite to the mounting surface of the LED board and the inner surface of the board mounting plate.
  • the gist is that it is attached to a plate.
  • a protruding portion that protrudes toward the side end surface of the light guide plate is formed on the mounting surface of the LED substrate, and the length of the protruding portion is longer than the height from the mounting surface of the LED.
  • the side end surface of the light guide plate extended by thermal expansion and the protruding portion abut (contact), thereby avoiding contact between the side end surface of the light guide plate and the LED.
  • the distance between the side end face of the light guide plate and the light emitting face of the LED when thermally expanded can be kept constant so as to be the difference between the protrusion length and the LED height.
  • connection member for connecting the LED substrate and the end portion of the light guide plate.
  • the buffer member is crushed (shrinks) or bulges (extends) according to the amount of expansion due to thermal expansion or the amount of contraction due to thermal contraction, so that the side end surface of the light guide plate and the light emitting surface of the LED It is possible to keep the distance between the two members substantially constant by the connecting member.
  • the buffer member is configured to have thermal conductivity, the heat generated by the LED by lighting is radiated to the board mounting plate and the chassis through the buffer member (thermal conductive member) by thermal conduction. This contributes to suppressing the temperature rise of the LED.
  • the board mounting plate is a side plate that rises from the outer edge of the bottom plate of the chassis. According to such a configuration, it is not necessary to prepare the board mounting plate as a member different from the chassis, and the heat generated by the LED by lighting is directly applied to the side plate of the chassis via the buffer member. Since it can be made to conduct, the temperature rise of LED can be suppressed more. In addition, since the LED substrate is attached to the side plate of the chassis via the buffer member, it is possible to contribute to the reduction of the frame-shaped region surrounding the light emitting region of the lighting device.
  • the liquid crystal display device which concerns on this invention makes it a summary to provide such an illuminating device and the liquid crystal display panel which performs a display using the light from the illuminating device.
  • the efficiency of the light introduced from the LED to the light guide plate is improved by arranging the LED included in the lighting device so as to be closer to the side end surface of the light guide plate than before. This can contribute to improving the display quality of the liquid crystal display device.
  • the LED is prevented from being damaged even if the LED is disposed closer to the side end surface of the thermally expanding light guide plate than before, the utilization efficiency of light introduced from the LED to the light guide plate is prevented. It is possible to improve.
  • FIG. 1 is an exploded perspective view schematically showing a schematic configuration of a liquid crystal display device according to a first embodiment of the present invention.
  • (A) is sectional drawing which expanded and showed the principal part after the assembly of the liquid crystal display device of FIG. 1, (b) is for demonstrating the effect
  • FIG. It is the disassembled perspective view which showed typically schematic structure of the liquid crystal display device which concerns on the 2nd Embodiment of this invention.
  • (A) is sectional drawing which expanded and showed the principal part after the assembly of the liquid crystal display device of FIG. 3, (b) is for demonstrating the effect
  • FIG. 5 is sectional drawing which expanded and showed the principal part after the assembly of the liquid crystal display device of FIG. 5
  • (b) is a figure explaining the effect
  • (C) is a figure for demonstrating the effect
  • (A) is sectional drawing which expanded and showed the principal part of the liquid crystal display device (illuminating device) which concerns on the modification of 1st Embodiment
  • (b) is the liquid crystal display device which concerns on the modification of 2nd Embodiment.
  • Sectional drawing which expanded and showed the principal part of (illuminating device) is sectional drawing which expanded and showed the principal part of the liquid crystal display device (illuminating device) which concerns on the modification of 3rd Embodiment. . It is the disassembled perspective view which showed typically the schematic structure of the liquid crystal display device used conventionally.
  • (A) is sectional drawing which expanded and showed the principal part after the assembly of the liquid crystal display device of FIG. 8,
  • (b) is a figure for demonstrating the malfunction of the liquid crystal display device (illuminating device) of (a). .
  • FIG. 1 is an exploded perspective view schematically showing a liquid crystal display device according to a first embodiment of the present invention
  • FIG. 2A is an enlarged view of a main part after assembly of the liquid crystal display device of FIG. It is a figure.
  • the liquid crystal display device 1 includes a liquid crystal display panel 3 and an illumination device (backlight device) 4 for irradiating the liquid crystal display panel 3 with light, which are integrated by a bezel 2 or the like. It is supposed to be retained.
  • the bezel 2 has a frame shape that covers the periphery of the liquid crystal display panel 3, and ensures the strength of the entire liquid crystal display device 1 together with the chassis 14 included in the illumination device 4.
  • the liquid crystal display panel 3 has a horizontally long rectangular shape when viewed from above.
  • a pair of glass substrates comprising a thin film transistor (TFT) array substrate and a color filter (CF) substrate are bonded together in parallel at a predetermined interval, and a liquid crystal is sandwiched between the glass substrates. It has a sealed configuration.
  • TFT thin film transistor
  • CF color filter
  • a plurality of TFTs and pixel electrodes are formed in a matrix on the TFT array substrate, and a plurality of colored patterns are formed in a matrix on the CF substrate, and a common electrode is formed on almost the entire surface.
  • An image can be displayed by controlling the orientation of the liquid crystal by changing the voltage applied between the first electrode and the common electrode.
  • a polarizing plate is disposed on each of the front and back surfaces of the liquid crystal display panel 3.
  • the illumination device 4 is a so-called side light type (edge light type) illumination device.
  • the illumination device 4 includes a substantially box-shaped chassis 14 having an opening that opens toward the liquid crystal display panel 3 side, and optical sheets 9 to 11 arranged so as to cover the opening of the chassis 14. Is provided. Further, inside the chassis 14, an LED substrate 20 on which a plurality of LEDs (light emitting diodes) 21 that are light sources are mounted, a light guide plate 12 that guides light from the LEDs 21 to the liquid crystal display panel 3 side, and the light guide plate 12.
  • the reflective sheet 13 distribute
  • the frame 5 is for fixing the optical sheets 9 to 11, the light guide plate 12 and the reflection sheet 13 to the chassis 14 in a state where they are laminated in this order from above.
  • the frame 5 is formed in a frame shape (frame shape) extending along the outer peripheral end portion of the light guide plate 12, and the optical sheets 9 to 11 and the light guide plate 12 are formed by the lower surface of the frame portion 5a.
  • the outer peripheral end can be pressed from the front side over almost the entire circumference.
  • the frame 5 is, for example, a black metal member or a black synthetic resin member, and has a light shielding property. Further, the frame 5 can receive the back surface of the outer peripheral end portion of the liquid crystal display panel 3 with a concave surface 5b formed inside the upper surface of the frame portion 5a.
  • the chassis 14 is formed into a shallow box shape by bending a metal plate made of aluminum or the like, and accommodates the optical sheets 9 to 11, the light guide plate 12, the reflection sheet 13, and the LED substrate 20 therein. You can do that.
  • the chassis 14 includes a bottom plate 14a having a horizontally long rectangular shape when viewed from above and a side plate 14b rising from outer edges of four sides of the bottom plate 14a. Further, the above-described frame 5 and bezel 2 can be fixed to the side plate 14b by screws or the like.
  • the three optical sheets 9 to 11 are composed of thin resin sheets having a horizontally long rectangular shape when seen in a plan view.
  • the optical sheets 9 to 11 are placed on the front side (light emitting side) of the light guide plate 12 and are interposed between the liquid crystal display panel 3 and the light guide plate 12.
  • a polarization selective reflection sheet 9 for example, a lens sheet 10 and a diffusion sheet 11 having a thickness of about 0.1 to 0.5 mm are used in order from the top.
  • the diffusion sheet 11 is for making the luminance distribution uniform by diffusing the light emitted from the light guide plate 12.
  • the lens sheet 10 is for increasing the front luminance by condensing the light emitted from the diffusion sheet 11.
  • the polarization selective reflection sheet 9 is for selectively reflecting the light emitted from the lens sheet 10 so that the light is not absorbed by a polarizing plate (not shown) attached to the back surface of the liquid crystal display panel 3.
  • the light guide plate 12 is formed of a transparent resin plate having a horizontally long rectangular shape in a plan view and having a thickness of about 3 to 4 mm, for example.
  • the light guide plate 12 has a light incident surface 12a for introducing light from the LED 21 and a light emitting surface 12b for emitting light introduced from the light incident surface 12a upward (irradiation direction). ing.
  • the light incident surface 12 a is configured by the side end surface on the long side of the light guide plate 12, and the light output surface 12 b is configured by the front surface of the light guide plate 12.
  • the light guide plate 12 reflects light incident from the light incident surface 12a repeatedly between the light emitting surface (front surface) 12b and the back surface 12c opposite to the light emitting surface 12b, and forms a planar shape inside the light guiding plate 12 It can be expanded.
  • a plurality of scattering portions are formed on the back surface 12c of the light guide plate 12 to scatter light incident from the light incident surface 12a and emit the light from the light emitting surface 12b.
  • a scattering part what was formed by printing the coating material containing a white pigment etc. on the back surface 12c of the light-guide plate 12 in the shape of a spot is applied.
  • the reflection sheet 13 is disposed so as to cover the back surface 12c of the light guide plate 12 opposite to the light emitting surface 12b.
  • the reflection sheet 13 is laid on the bottom plate 14a of the chassis 14.
  • the reflection sheet 13 is for reflecting the light emitted from the back surface 12c of the light guide plate 12 to the back side toward the light guide plate 12, and is, for example, a resin sheet having a thickness of about 0.1 to 2 mm. Composed.
  • the front surface of the reflection sheet 13 is white, and the light emitted from the back surface 12c of the light guide plate 12 is efficiently reflected to the light guide plate 12 side so that the light utilization efficiency and the light emission surface of the light guide plate 12 are improved.
  • the brightness at 12b is increased.
  • the illumination device 4 can convert the light from the LED 21 into the planar light by the optical sheets 9 to 11, the light guide plate 12 and the reflection sheet 13 and irradiate the back side of the liquid crystal display panel 3. Yes.
  • a power supply board 18 for supplying power to the LED board 20 and a control board 19 for driving the liquid crystal display panel 3 are disposed on the rear surface of the chassis 14.
  • the plurality of LEDs 21 provided on the LED substrate 20 are disposed in the vicinity of the light incident surface 12 a of the light guide plate 12.
  • the LED 21 has a package structure in which, for example, an LED chip that generates blue light is sealed with a transparent resin mixed with a yellow phosphor, and white light can be emitted from the light emitting surface 21a of the LED 21. Yes.
  • Such an LED 21 is arranged at a predetermined interval along the light incident surface 12 a so that the light emitting surface 21 a faces the light incident surface 12 a of the light guide plate 12.
  • the LED substrate 20 includes a base material 22 made of metal such as aluminum.
  • the base material 22 has a horizontally long rectangular shape, and has a function as a heat radiating member that suppresses a temperature rise due to heat generated by the LED 21.
  • An insulating layer (not shown) is formed on the front surface (mounting surface) 20a of the base material 22, and a plurality of LEDs 21, 21, 21,... Along the longitudinal direction are formed on the insulating layer. It is mounted in a straight line.
  • the plurality of LEDs 21 are connected in series by a wiring pattern (not shown) formed on the insulating layer.
  • Such an LED board 20 is attached to the side plate 14b of the chassis 14 by a buffer member (cushion material) 15 having adhesive layers on both left and right side surfaces, and is standing on the bottom plate 14a of the chassis 14 (upright state) ).
  • the buffer member 15 has a rectangular parallelepiped shape having a length equivalent to the length of the LED substrate 20.
  • the light guide plate 12 having a plate shape
  • the chassis 14 having a box shape with the upper surface opened and accommodating the light guide plate 12, and the mounting surface 20a on which the LEDs 21 are mounted are the side end surfaces 12a of the light guide plate 12.
  • the side plate 14b facing the side end face 12a of the light guide plate 12 is placed on the bottom plate 14a of the chassis 14.
  • the LED board 20 is provided on the side plate 14b via a buffer member 15 disposed between the back surface 20b opposite to the mounting surface 20a of the LED board 20 and the inner surface of the side plate 14b. It becomes the structure attached to.
  • the LED substrate 20 is mounted on the side opposite to the mounting surface 20a on which the LED 21 is mounted.
  • the LED substrate 20 is attached to the side plate 14b by going through one of the procedures of attaching the other side surface (adhesive layer) of the buffer member 15 to the inner surface of the side plate 14b.
  • the buffer member 15 interposed between the base material 22 and the side plate 14a of the chassis 14 has a function as a heat conducting member, and the heat generated by the LED 21 is generated by the base material 22, the buffer member ( By conducting heat to the side plate 14b via the heat conduction member 15, the temperature of the LED 21 due to lighting is suppressed from rising too much.
  • a cushioning material having thermal conductivity applied to such a buffer member FESATHER series manufactured by Polymertech Co., Ltd. and the like can be mentioned.
  • FIG. 2B is a diagram for explaining the action of the buffer member 15 when the light guide plate 12 expands due to thermal expansion.
  • the buffer member 15 moves in the right direction. By being crushed (shrinks), it is suppressed so that an excessive load is not applied to the LED 21 from the side end surface (light incident surface) 12a.
  • the buffer member 15 is crushed (shrinks), so that the LED 21 is on the side end surface of the light guide plate 12. Since the excessive load from 12a is suppressed, there is no possibility that the LED 21 is damaged. Thus, the LED 21 can be disposed closer to the side end surface (light incident surface) 12a of the light guide plate 12 than before, and is introduced from the LED 21 to the side end surface (light incident surface) 12a of the light guide plate 12. Light utilization efficiency can be improved.
  • the mounting surface 20a of the LED substrate 20 is provided with a plurality of protruding portions 23 protruding toward the side end surface 12a of the light guide plate 12.
  • a plurality of protruding portions 23 are provided along the longitudinal direction of the LED substrate 20 at each of the upper end and the lower end of the mounting surface 20a of the LED substrate 20, and the length of the protruding portion 23 is the mounting surface of the LED 21.
  • the structure is longer than the height from 20a. Therefore, the protrusion part 23 can contact
  • the protrusion 23 contacts (contacts) the side end surface 12a of the light guide plate 12 extended by thermal expansion, thereby preventing contact (contact) between the side end surface 12a and the LED 21.
  • the distance between the side end surface 12a of the light guide plate 12 and the light emitting surface 21a of the LED 21 when thermally expanded is the difference between the length of the protrusion 23 and the height of the LED 21 (for example, 0.01 mm to 0.2 mm).
  • the protrusion 23 functions as a spacer that keeps the distance between the side end surface 12a of the light guide plate 12 and the light emitting surface 21a of the LED 21 constant (for example, 0.01 mm or more and 0.2 mm or less) when thermally expanded. Is supposed to do.
  • a connecting member 24 that connects the upper end of the LED substrate 20 and the end of the light guide plate 12 is provided.
  • the connecting member 24 has a shape similar to a staple, and the engaging piece 24a at one end is inserted into the mounting hole 12d opened at the upper surface of the end portion of the light guide plate 12 to engage the connecting member 24.
  • the locking piece 24b at the other end is inserted into the mounting hole 20c opened at the upper end of the LED substrate 20 (base material 22) and locked, whereby the end of the light guide plate 12 and the LED substrate 20 are locked. Can be connected via the connecting member 24.
  • a plurality of such connecting members 24 are provided along the longitudinal direction of the LED substrate 20, and the attachment holes 12 d correspond to the longitudinal direction of the end portion on the long side of the light guide plate 12.
  • a plurality of attachment holes 20 c are formed along the longitudinal direction of the upper end of the LED substrate 20.
  • the buffer member 15 is crushed (shrinks) according to the amount of expansion due to the thermal expansion of the light guide plate 12, as shown in FIG. 6B. 6), or as shown in FIG. 6C, the buffer member 15 expands (extends) in accordance with the amount of contraction due to the thermal contraction of the light guide plate 12. Therefore, as shown in FIGS. 6A to 6C, the distance between the side end surface (light incident surface) 12a of the light guide plate 12 and the light emitting surface 21a of the LED 21 is set as the thermal expansion or heat of the light guide plate 12. Regardless of the contraction, the connecting member 24 can hold the member substantially constant.
  • FIG. 7 shows a modification of the above-described first embodiment, second embodiment, and third embodiment.
  • FIG. 7A is a modification of the first embodiment shown in FIG. 2A
  • FIG. 7B is a modification of the second embodiment shown in FIG. 4A
  • FIG. 7 (c) shows a modification of the third embodiment shown in FIG. 6 (a).
  • the LED board 20 is attached to an L-shaped support member 16 fixed on the bottom plate 14a in the vicinity of the side plate 14b of the chassis 14 via a buffer member 15.
  • the support member 16 has a shape like a so-called bracket (an L-shaped mounting (mounting) fitting), and is formed by, for example, cutting of an aluminum material.
  • the support member 16 is a board-mounting plate 16 a having a long shape, which is a portion to which the LED board 20 is attached via the buffer member 15, and a long shape, which is a portion fixed to the bottom plate 14 a of the chassis 14.
  • a chassis fixing plate 16b having a substantially L-shaped configuration.
  • a mounting hole 16c is formed in a predetermined portion of the chassis fixing plate 16b of the support member 16.
  • a screw hole 14c is formed in a predetermined portion of the bottom plate 14a of the chassis 14. Therefore, the support member 16 is fixed to the chassis 14 by passing the fixing screw 17 through the mounting hole 16c of the support member 16 and screwing the fixing screw 17 into the screw hole 14c of the bottom plate 14a.
  • the LED substrate 20 is attached to the side plate 14b erected on the bottom plate 14a of the chassis 14 via the buffer member 15.
  • the LED board 20 as shown in the modification of FIGS. 7A, 7B, and 7C is placed on the board mounting plate 16a erected on the bottom plate 14a of the chassis 14 via the buffer member 15.
  • the structure which attaches may be sufficient. Even with such a configuration, the same operations and effects as those of the first embodiment, the second embodiment, and the third embodiment described above can be achieved.
  • the LED substrate 20 as shown in FIG. 7 is attached to the substrate attachment plate 16a of the support member 16 via the buffer member 15, rather than the configuration shown in FIG. 2 (first embodiment) and FIG. 2) and the LED board 20 as shown in FIG. 6 (third embodiment) is preferably attached to the side plate 14b of the chassis 14 via the buffer member 15.
  • the support member 16 (substrate mounting plate 16 a) as a member different from the chassis 14, and the heat generated by the LED 21 by lighting. Can be directly conducted to the side plate 14b of the chassis 14 via the buffer member 15, so that the temperature rise of the LED 21 due to lighting can be further suppressed. Further, since the LED board 20 is attached to the side plate 14b of the chassis 14, that is, the support member 16 is unnecessary, the frame-shaped region (the area of the frame portion 5a of the frame 5) surrounding the light emitting region of the lighting device 4 is reduced. Also contribute to.
  • the present invention is not limited to these embodiments, and can be variously modified without departing from the gist of the present invention. Of course, it can be implemented.
  • the LED boards 20 and 20 are arranged so as to face the pair of long sides of the light guide plate 12 having a rectangular shape, and the pair of long sides of the chassis 14 corresponding to this.
  • the LED board 20 is disposed so as to face one long side and one short side of the light guide plate 12, respectively, and the side plate 14b on one long side of the chassis 14 and one short side corresponding to this are arranged.
  • the side plate 14b on the side may be provided with the buffer member 15 and is not limited to the above-described embodiment.

Abstract

Provided is an illumination device such that LED damage is avoided even if the LEDs are positioned to be in close proximity to a lateral end face of a thermally expanding light guiding plate. An illumination device (4) comprises: a light guiding plate (12) further comprising a plate shape; a chassis (14) further comprising a box shape, the upper face whereof is open, and wherein the light guiding plate (12) is housed; and LED substrates (20) which are positioned standing upon the bottom plate (14a) of the chassis (14) such that mounting faces (20a) whereon LEDs (21) are mounted opposing lateral end faces (12a) of the light guiding plate (12). Lateral plates (14b) (substrate attachment plates (16a)), opposing the lateral end faces (12a) of the light guiding plate (12), are disposed standing upon the bottom plate (14a) of the chassis (14). The LED substrates (20) are attached to the lateral plates (14b) (the substrate attachment plates (16a)) with shock absorbing members (15) disposed therebetween, the shock absorbing members (15) positioned between rear faces (20b) which are on the opposite side of the LED substrates (20) from the mounting faces (20a) thereof, and faces on the inner sides of the lateral plates (14b) (the substrate attachment plates (16a)).

Description

照明装置およびこれを備えた液晶表示装置LIGHTING DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE HAVING THE SAME
　本発明は、液晶表示パネルの背面に配設される照明装置およびその照明装置を備えた液晶表示装置に関する。 The present invention relates to an illumination device disposed on the back surface of a liquid crystal display panel and a liquid crystal display device including the illumination device.
　近年、コンピュータやテレビなどの家電製品の表示部として、液晶表示装置が広く用いられている。一般的な液晶表示装置は、液晶表示パネルと、その液晶表示パネルに光を照射するようにその背面側に配設される照明装置（バックライト装置）を備えている。この種の照明装置としては、アクリル樹脂などの透明材料からなる板状の導光板と、この導光板の一辺または複数の辺に沿って配置されるＬＥＤ（発光ダイオード）からなる光源を備えるサイドライト型（エッジライト型）のものが知られている。このようなサイドライト型の照明装置は、光源が液晶表示パネルの背面に配設される直下型の照明装置と比べて、薄型化し易い等の利点を有している。 In recent years, liquid crystal display devices have been widely used as display units for home appliances such as computers and televisions. A general liquid crystal display device includes a liquid crystal display panel and an illumination device (backlight device) disposed on the back side of the liquid crystal display panel so as to irradiate the liquid crystal display panel with light. As this type of lighting device, a sidelight including a plate-like light guide plate made of a transparent material such as acrylic resin and a light source made up of LEDs (light emitting diodes) arranged along one side or a plurality of sides of the light guide plate A type (edge light type) is known. Such a sidelight type illuminating device has advantages such as being easily reduced in thickness as compared with a direct type illuminating device in which a light source is disposed on the back surface of a liquid crystal display panel.
　特に、このようなサイドライト型の照明装置の光源としてＬＥＤを用いたものは、長寿命、高発光効率の利点を有しているため、特に注目されている。図８は、このようなＬＥＤを用いたサイドライト型の照明装置を備えた液晶表示装置の分解斜視図、図９（ａ）は図８の液晶表示装置の組み立て後の要部を拡大して示した断面図である。 In particular, those using LEDs as the light source of such a sidelight type illumination device are particularly attracting attention because they have the advantages of long life and high luminous efficiency. FIG. 8 is an exploded perspective view of a liquid crystal display device provided with a sidelight type illumination device using such LEDs, and FIG. 9A is an enlarged view of a main part after assembly of the liquid crystal display device of FIG. It is sectional drawing shown.
　図示されるように液晶表示装置１００は、ベゼル１０２、液晶表示パネル１０３、および照明装置１０４を備える。 As illustrated, the liquid crystal display device 100 includes a bezel 102, a liquid crystal display panel 103, and a lighting device 104.
　ベゼル１０２は、液晶表示パネル１０３の周縁に被せられる額縁形状を有しており、シャーシ１１４と共に液晶表示装置１００全体の強度を確保するものである。液晶表示パネル１０３は、２枚のガラスを貼り合わせてその間に液晶を封止したもので、前面に画像を表示することができるようになっている。 The bezel 102 has a frame shape that covers the periphery of the liquid crystal display panel 103, and ensures the strength of the entire liquid crystal display device 100 together with the chassis 114. The liquid crystal display panel 103 is formed by bonding two pieces of glass and sealing the liquid crystal therebetween, so that an image can be displayed on the front surface.
　照明装置１０４は、浅底の箱形状を有するシャーシ１１４を備えており、このシャーシ１１４の内部には、光学シート１０９～１１１、導光板１１２、反射シート１１３および複数のＬＥＤ１２１が実装されたＬＥＤ基板１２０が収納可能とされている。 The illuminating device 104 includes a chassis 114 having a shallow box shape. Inside the chassis 114, an LED substrate on which optical sheets 109 to 111, a light guide plate 112, a reflection sheet 113, and a plurality of LEDs 121 are mounted. 120 can be stored.
　導光板１１２は、ＬＥＤ基板１２０が備えるＬＥＤ１２１からの光を導入するための光入射面１１２ａと、その光入射面１１２ａから導入された光を上方向（照射方向）に出射するための光出射面１１２ｂとを有している。光入射面１１２ａは、導光板１１２の所定の側端面によって構成されると共に、光出射面１１２ｂは導光板１１２の前面によって構成されている。 The light guide plate 112 includes a light incident surface 112a for introducing light from the LEDs 121 included in the LED substrate 120, and a light emission surface for emitting light introduced from the light incident surface 112a upward (irradiation direction). 112b. The light incident surface 112 a is configured by a predetermined side end surface of the light guide plate 112, and the light emitting surface 112 b is configured by the front surface of the light guide plate 112.
　光学シート１０９～１１１は、拡散シートやレンズシートなどを含んでおり、導光板１１２の光出射面１１２ｂの上に配置されている。また、反射シート１１３は、導光板１１２の光出射面１１２ｂとは反対側の背面１１２ｃを覆うように配置されている。 The optical sheets 109 to 111 include a diffusion sheet, a lens sheet, and the like, and are disposed on the light emitting surface 112b of the light guide plate 112. Further, the reflection sheet 113 is disposed so as to cover the back surface 112c of the light guide plate 112 on the side opposite to the light emitting surface 112b.
　これら光学シート１０９～１１１、導光板１１２、反射シート１１３は、フレーム１０５によってシャーシ１１４の底板１１４ａ上に、積層された状態で固定されるようになっている。 The optical sheets 109 to 111, the light guide plate 112, and the reflection sheet 113 are fixed in a stacked state on the bottom plate 114a of the chassis 114 by the frame 105.
　また、ＬＥＤ基板１２０に備えられた複数個のＬＥＤ１２１は、導光板１１２の光入射面１１２ａの近傍に配置されている。更に、ＬＥＤ１２１の発光面１２１ａが導光板１１２の光入射面１１２ａに対向するように、その光入射面１１２ａに沿って所定の間隔を隔てて配置されている。 Further, the plurality of LEDs 121 provided on the LED substrate 120 are disposed in the vicinity of the light incident surface 112 a of the light guide plate 112. Furthermore, the light emitting surface 121a of the LED 121 is disposed at a predetermined interval along the light incident surface 112a so as to face the light incident surface 112a of the light guide plate 112.
　この場合、ＬＥＤ基板１２０は、シャーシ１１４の底板１１４ａの外縁から立ち上がる側板１１４ｂに、両面テープやネジ止め等によって取り付けられており、底板１１４ａに対して垂直に起立した状態になるように保持されている。尚、本発明に関連する先行技術文献としては下記特許文献が挙げられる。 In this case, the LED board 120 is attached to the side plate 114b rising from the outer edge of the bottom plate 114a of the chassis 114 by double-sided tape or screwing, and is held so as to stand vertically with respect to the bottom plate 114a. Yes. In addition, the following patent document is mentioned as a prior art document relevant to this invention.
特開２０１０－７８７３８号公報JP 2010-78738 A
　このような照明装置１００においては、ＬＥＤ１２１から導光板１１２に導入される光の利用効率の観点から、導光板１１２の側端面（光入射面）１１２ａとＬＥＤ１２１の発光面１２１ａとの間の距離が小さくなるように、ＬＥＤ１２１を導光板１１２の側端面１１２ａに接近させて配置するのが好ましい。 In such an illumination device 100, the distance between the side end surface (light incident surface) 112 a of the light guide plate 112 and the light emitting surface 121 a of the LED 121 is set from the viewpoint of the utilization efficiency of light introduced from the LED 121 to the light guide plate 112. The LED 121 is preferably disposed close to the side end surface 112a of the light guide plate 112 so as to be small.
　しかしながら、このような照明装置１００においては、ＬＥＤ１２１の点灯による温度上昇によって構成する部材に熱膨張、あるいはＬＥＤ１２１の消灯による温度低下によって熱収縮が起き、特に、樹脂製の導光板１１２と金属製のシャーシ１１４の線膨張係数の違いや体積の違いによるそれらの熱膨張や熱収縮に時間差が生じるため、ＬＥＤ１２１（ＬＥＤ基板１２０）を導光板１１２の側端面１１２ａに接近させて配置すると、図９（ｂ）に示されるように、熱膨張により伸びた導光板１１２の側端面１１２ａが、ＬＥＤ１２１と接触して、ＬＥＤ１２１が導光板１１２の側端面１１２ａから過大な荷重を受けることで破損してしまうおそれがあった。 However, in such an illuminating device 100, thermal contraction occurs due to thermal expansion of a member formed by the temperature rise due to the lighting of the LED 121 or temperature drop due to the light extinguishing of the LED 121. In particular, the light guide plate 112 made of resin and the metal made of metal Since time differences occur in the thermal expansion and contraction due to the difference in linear expansion coefficient and volume of the chassis 114, the LED 121 (LED substrate 120) is placed close to the side end surface 112a of the light guide plate 112 and FIG. As shown in b), the side end surface 112a of the light guide plate 112 extended by thermal expansion is in contact with the LED 121, and the LED 121 may be damaged by receiving an excessive load from the side end surface 112a of the light guide plate 112. was there.
　そこで、本発明が解決する課題は、上面開口の箱形状を有するシャーシの内底面に導光板が配設され、該導光板に光を導入するＬＥＤがシャーシの内側面に沿って配設されるに際し、熱膨張する導光板の側端面にＬＥＤを接近するように配置してもＬＥＤの破損が防止される照明装置およびこれを備えた液晶表示装置を提供することである。 Accordingly, a problem to be solved by the present invention is that a light guide plate is disposed on the inner bottom surface of a chassis having a box shape with an upper surface opening, and LEDs for introducing light into the light guide plate are disposed along the inner side surface of the chassis. At the same time, it is an object to provide an illuminating device and a liquid crystal display device provided with the illuminating device in which the LED is prevented from being damaged even if the LED is arranged so as to approach the side end surface of the thermally expanding light guide plate.
　上記課題を解決するため本発明に係る照明装置は、板形状を有する導光板と、上面が開口された箱形状を有して前記導光板が収容されるシャーシと、ＬＥＤが実装された実装面が前記導光板の側端面に対向するように前記シャーシの底板上に直立して配されるＬＥＤ基板とを備え、前記シャーシの底板上には前記導光板の側端面に対向する基板取付用板が立設されると共に、前記ＬＥＤ基板は、該ＬＥＤ基板の実装面とは反対側の背面と前記基板取付用板の内側の面との間に配される緩衝部材を介して該基板取付用板に取り付けられていることを要旨とするものである。 In order to solve the above-described problems, an illumination device according to the present invention includes a light guide plate having a plate shape, a chassis having a box shape with an upper surface opened and housing the light guide plate, and a mounting surface on which LEDs are mounted. And an LED substrate arranged upright on the bottom plate of the chassis so as to face the side end surface of the light guide plate, and the board mounting plate facing the side end surface of the light guide plate on the bottom plate of the chassis The LED board is mounted on the board via a buffer member disposed between the back surface opposite to the mounting surface of the LED board and the inner surface of the board mounting plate. The gist is that it is attached to a plate.
　このような構成によれば、熱膨張により伸びた導光板の側端面が、ＬＥＤ基板のＬＥＤと接触しても、緩衝部材が潰れる（縮む）ことによってＬＥＤが導光板の側端面から過大な荷重を受けることが抑制されるので、ＬＥＤが破損するおそれがなくなる。これにより、ＬＥＤを導光板の側端面に従来よりも接近するように配置することが可能となり、ＬＥＤから導光板に導入される光の利用効率を向上させることができる。 According to such a configuration, even if the side end surface of the light guide plate extended by thermal expansion comes into contact with the LED of the LED substrate, the LED is excessively loaded from the side end surface of the light guide plate by collapsing (shrinking) the buffer member. Therefore, there is no possibility that the LED is damaged. Thereby, it becomes possible to arrange | position LED so that it may approach the side end surface of a light-guide plate rather than before, and the utilization efficiency of the light introduce | transduced into a light-guide plate from LED can be improved.
　この場合、前記ＬＥＤ基板の実装面には、前記導光板の側端面に向かって突出した突出部が形成されると共に、該突出部長さが前記ＬＥＤの実装面からの高さよりも長い構成にするのが好ましい。このような構成によれば、熱膨張により伸びた導光板の側端面と突出部が当接（接触）することによって、導光板の側端面とＬＥＤとの接触が回避される。また、熱膨張した際の導光板の側端面とＬＥＤの発光面との間の距離を、突出部長さとＬＥＤ高さの差となるように一定に保持することが可能である。 In this case, a protruding portion that protrudes toward the side end surface of the light guide plate is formed on the mounting surface of the LED substrate, and the length of the protruding portion is longer than the height from the mounting surface of the LED. Is preferred. According to such a configuration, the side end surface of the light guide plate extended by thermal expansion and the protruding portion abut (contact), thereby avoiding contact between the side end surface of the light guide plate and the LED. In addition, the distance between the side end face of the light guide plate and the light emitting face of the LED when thermally expanded can be kept constant so as to be the difference between the protrusion length and the LED height.
　また、前記ＬＥＤ基板と前記導光板の端部とを連結する連結部材を備えている構成にするのが好ましい。このような構成によれば、導光板の熱膨張による伸び量または熱収縮による縮み量に応じて緩衝部材が潰れる（縮む）または膨らむ（伸びる）ことで、導光板の側端面とＬＥＤの発光面との間の距離を連結部材によってほぼ一定に保持することが可能である。 Further, it is preferable that a connection member for connecting the LED substrate and the end portion of the light guide plate is provided. According to such a configuration, the buffer member is crushed (shrinks) or bulges (extends) according to the amount of expansion due to thermal expansion or the amount of contraction due to thermal contraction, so that the side end surface of the light guide plate and the light emitting surface of the LED It is possible to keep the distance between the two members substantially constant by the connecting member.
　更に、前記緩衝部材は、熱伝導性を有する構成にすれば、点灯によりＬＥＤが発した熱を、緩衝部材（熱伝導性部材）を介して基板取付板およびシャーシへと熱伝導により放熱させることができるので、ＬＥＤの温度上昇を抑制することに貢献する。 Further, if the buffer member is configured to have thermal conductivity, the heat generated by the LED by lighting is radiated to the board mounting plate and the chassis through the buffer member (thermal conductive member) by thermal conduction. This contributes to suppressing the temperature rise of the LED.
　そして、前記基板取付用板が、前記シャーシの底板の外縁から立ち上がる側板である構成にするのが好ましい。このような構成によれば、基板取付用板をシャーシとは別の部材で用意する必要がない上に、点灯によりＬＥＤが発した熱を、緩衝部材を介してシャーシの側板に直接的に熱伝導させることができるので、ＬＥＤの温度上昇をより抑制することができる。また、シャーシの側板に緩衝部材を介してＬＥＤ基板を取り付ける構成なので、照明装置の発光領域を囲む額縁状の領域の縮小化にも貢献することが可能である。 It is preferable that the board mounting plate is a side plate that rises from the outer edge of the bottom plate of the chassis. According to such a configuration, it is not necessary to prepare the board mounting plate as a member different from the chassis, and the heat generated by the LED by lighting is directly applied to the side plate of the chassis via the buffer member. Since it can be made to conduct, the temperature rise of LED can be suppressed more. In addition, since the LED substrate is attached to the side plate of the chassis via the buffer member, it is possible to contribute to the reduction of the frame-shaped region surrounding the light emitting region of the lighting device.
　また、上記課題を解決するために、本発明に係る液晶表示装置は、このような照明装置と、その照明装置からの光を利用して表示を行う液晶表示パネルとを備えることを要旨とするものである。このような液晶表示装置によれば、照明装置が備えるＬＥＤを導光板の側端面に従来よりも接近するように配置してＬＥＤから導光板に導入される光の利用効率が向上しているので、液晶表示装置の表示品位の向上に貢献することができる。 Moreover, in order to solve the said subject, the liquid crystal display device which concerns on this invention makes it a summary to provide such an illuminating device and the liquid crystal display panel which performs a display using the light from the illuminating device. Is. According to such a liquid crystal display device, the efficiency of the light introduced from the LED to the light guide plate is improved by arranging the LED included in the lighting device so as to be closer to the side end surface of the light guide plate than before. This can contribute to improving the display quality of the liquid crystal display device.
　本発明によれば、熱膨張する導光板の側端面にＬＥＤを従来よりも接近するように配置してもＬＥＤの破損が防止されているので、ＬＥＤから導光板に導入される光の利用効率を向上させることが可能である。 According to the present invention, since the LED is prevented from being damaged even if the LED is disposed closer to the side end surface of the thermally expanding light guide plate than before, the utilization efficiency of light introduced from the LED to the light guide plate is prevented. It is possible to improve.
本発明の第１の実施形態に係る液晶表示装置の概略構成を模式的に示した分解斜視図である。1 is an exploded perspective view schematically showing a schematic configuration of a liquid crystal display device according to a first embodiment of the present invention. （ａ）は図１の液晶表示装置の組み立て後の要部を拡大して示した断面図、（ｂ）は（ａ）の導光板が熱膨張したときの緩衝部材の作用を説明するための図である。(A) is sectional drawing which expanded and showed the principal part after the assembly of the liquid crystal display device of FIG. 1, (b) is for demonstrating the effect | action of a buffer member when the light-guide plate of (a) expands thermally. FIG. 本発明の第２の実施形態に係る液晶表示装置の概略構成を模式的に示した分解斜視図である。It is the disassembled perspective view which showed typically schematic structure of the liquid crystal display device which concerns on the 2nd Embodiment of this invention. （ａ）は図３の液晶表示装置の組み立て後の要部を拡大して示した断面図、（ｂ）は（ａ）の導光板が熱膨張したときの緩衝部材の作用を説明するための図である。(A) is sectional drawing which expanded and showed the principal part after the assembly of the liquid crystal display device of FIG. 3, (b) is for demonstrating the effect | action of a buffer member when the light-guide plate of (a) thermally expands. FIG. 本発明の第３の実施形態に係る液晶表示装置の概略構成を模式的に示した分解斜視図である。It is the disassembled perspective view which showed typically schematic structure of the liquid crystal display device which concerns on the 3rd Embodiment of this invention. （ａ）は図５の液晶表示装置の組み立て後の要部を拡大して示した断面図、（ｂ）は（ａ）の導光板が熱膨張したときの緩衝部材の作用を説明する図、（ｃ）は（ａ）の導光板が熱収縮したときの緩衝部材の作用を説明するための図である。(A) is sectional drawing which expanded and showed the principal part after the assembly of the liquid crystal display device of FIG. 5, (b) is a figure explaining the effect | action of a buffer member when the light-guide plate of (a) thermally expands, (C) is a figure for demonstrating the effect | action of a buffer member when the light-guide plate of (a) heat-shrinks. （ａ）は第１の実施形態の変形例に係る液晶表示装置（照明装置）の要部を拡大して示した断面図、（ｂ）は第２の実施形態の変形例に係る液晶表示装置（照明装置）の要部を拡大して示した断面図、（ｃ）は第３の実施形態の変形例に係る液晶表示装置（照明装置）の要部を拡大して示した断面図である。(A) is sectional drawing which expanded and showed the principal part of the liquid crystal display device (illuminating device) which concerns on the modification of 1st Embodiment, (b) is the liquid crystal display device which concerns on the modification of 2nd Embodiment. Sectional drawing which expanded and showed the principal part of (illuminating device), (c) is sectional drawing which expanded and showed the principal part of the liquid crystal display device (illuminating device) which concerns on the modification of 3rd Embodiment. . 従来用いられてきた液晶表示装置の概略構成を模式的に示した分解斜視図である。It is the disassembled perspective view which showed typically the schematic structure of the liquid crystal display device used conventionally. （ａ）は図８の液晶表示装置の組み立て後の要部を拡大して示した断面図、（ｂ）は（ａ）の液晶表示装置（照明装置）の不具合を説明するための図である。(A) is sectional drawing which expanded and showed the principal part after the assembly of the liquid crystal display device of FIG. 8, (b) is a figure for demonstrating the malfunction of the liquid crystal display device (illuminating device) of (a). .
　以下に、本発明に係る照明装置およびこれを備えた液晶表示装置の実施の形態ついて、図面を参照して詳細に説明する。 Hereinafter, embodiments of a lighting device and a liquid crystal display device including the same according to the present invention will be described in detail with reference to the drawings.
　先ず、本発明の第１の実施形態について図１および図２を用いて説明する。図１は、本発明の第１の実施形態に係る液晶表示装置を模式的に示した分解斜視図、図２（ａ）は図１の液晶表示装置の組み立て後の要部を拡大して示した図である。 First, a first embodiment of the present invention will be described with reference to FIG. 1 and FIG. FIG. 1 is an exploded perspective view schematically showing a liquid crystal display device according to a first embodiment of the present invention, and FIG. 2A is an enlarged view of a main part after assembly of the liquid crystal display device of FIG. It is a figure.
　図示されるように液晶表示装置１は、液晶表示パネル３と、この液晶表示パネル３に光を照射するための照明装置（バックライト装置）４とを備え、これらがベゼル２などにより一体的に保持されるようになっている。ベゼル２は、液晶表示パネル３の周縁に被せられる額縁形状を有しており、照明装置４が備えるシャーシ１４と共に液晶表示装置１全体の強度を確保するものである。 As shown in the figure, the liquid crystal display device 1 includes a liquid crystal display panel 3 and an illumination device (backlight device) 4 for irradiating the liquid crystal display panel 3 with light, which are integrated by a bezel 2 or the like. It is supposed to be retained. The bezel 2 has a frame shape that covers the periphery of the liquid crystal display panel 3, and ensures the strength of the entire liquid crystal display device 1 together with the chassis 14 included in the illumination device 4.
　液晶表示パネル３は、平面に視て横長の長方形状を有している。この液晶表示パネル３は、薄膜トランジスタ（ＴＦＴ）アレイ基板とカラーフィルタ（ＣＦ）基板とからなる一対のガラス基板が所定の間隔を置いて平行に対向して貼り合わせられ、両ガラス基板間に液晶が封止された構成をなしている。 The liquid crystal display panel 3 has a horizontally long rectangular shape when viewed from above. In this liquid crystal display panel 3, a pair of glass substrates comprising a thin film transistor (TFT) array substrate and a color filter (CF) substrate are bonded together in parallel at a predetermined interval, and a liquid crystal is sandwiched between the glass substrates. It has a sealed configuration.
　ＴＦＴアレイ基板には複数のＴＦＴおよび画素電極がマトリクス状に形成され、ＣＦ基板には複数の着色パターンがマトリクス状に形成されると共に、そのほぼ全面に共通電極が形成されており、これら画素電極と共通電極との間に印加する電圧を変化させて液晶を配向制御することで、画像を表示することができるようになっている。尚、液晶表示パネル３の表面と背面にはそれぞれ偏光板が配されている。 A plurality of TFTs and pixel electrodes are formed in a matrix on the TFT array substrate, and a plurality of colored patterns are formed in a matrix on the CF substrate, and a common electrode is formed on almost the entire surface. An image can be displayed by controlling the orientation of the liquid crystal by changing the voltage applied between the first electrode and the common electrode. A polarizing plate is disposed on each of the front and back surfaces of the liquid crystal display panel 3.
　照明装置４は、いわゆるサイドライト型（エッジライト型）の照明装置である。図示されるように照明装置４は、液晶表示パネル３側に向けて開口した開口部を有した略箱形のシャーシ１４と、シャーシ１４の開口部を覆うように配される光学シート９～１１を備える。また、シャーシ１４の内部には、光源であるＬＥＤ（発光ダイオード）２１が複数実装されたＬＥＤ基板２０と、ＬＥＤ２１からの光を液晶表示パネル３側へと導く導光板１２と、この導光板１２の背面側に配される反射シート１３を備える。 The illumination device 4 is a so-called side light type (edge light type) illumination device. As shown in the figure, the illumination device 4 includes a substantially box-shaped chassis 14 having an opening that opens toward the liquid crystal display panel 3 side, and optical sheets 9 to 11 arranged so as to cover the opening of the chassis 14. Is provided. Further, inside the chassis 14, an LED substrate 20 on which a plurality of LEDs (light emitting diodes) 21 that are light sources are mounted, a light guide plate 12 that guides light from the LEDs 21 to the liquid crystal display panel 3 side, and the light guide plate 12. The reflective sheet 13 distribute | arranged to the back side is provided.
　フレーム５は、光学シート９～１１、導光板１２および反射シート１３を、この順番で上から積層させた状態でシャーシ１４に固定するためのものである。この場合、フレーム５は、導光板１２の外周端部に沿って延在する枠状（額縁状）に形成されており、その枠部５ａの下面によって、光学シート９～１１および導光板１２の外周端部を、ほぼ全周にわたって表側から押さえることが可能となっている。尚、フレーム５は、例えば黒塗りされた金属製の部材または黒色の合成樹脂製の部材とされ、遮光性を有するものである。また、フレーム５は、液晶表示パネル３の外周端部の背面を、枠部５ａの上面の内側に形成された凹面５ｂで受けることが可能になっている。 The frame 5 is for fixing the optical sheets 9 to 11, the light guide plate 12 and the reflection sheet 13 to the chassis 14 in a state where they are laminated in this order from above. In this case, the frame 5 is formed in a frame shape (frame shape) extending along the outer peripheral end portion of the light guide plate 12, and the optical sheets 9 to 11 and the light guide plate 12 are formed by the lower surface of the frame portion 5a. The outer peripheral end can be pressed from the front side over almost the entire circumference. The frame 5 is, for example, a black metal member or a black synthetic resin member, and has a light shielding property. Further, the frame 5 can receive the back surface of the outer peripheral end portion of the liquid crystal display panel 3 with a concave surface 5b formed inside the upper surface of the frame portion 5a.
　シャーシ１４は、アルミなどからなる金属製の板材を折り曲げ加工等によって浅底の箱形状に成形されており、その内部に光学シート９～１１、導光板１２、反射シート１３およびＬＥＤ基板２０を収容することができるようなっている。シャーシ１４は、平面に視て横長の長方形状を有した底板１４ａと、この底板１４ａの四辺の外縁から立ち上がる側板１４ｂとから構成される。また、側板１４ｂには、上述したフレーム５およびベゼル２がネジ止め等によって固定可能とされている。 The chassis 14 is formed into a shallow box shape by bending a metal plate made of aluminum or the like, and accommodates the optical sheets 9 to 11, the light guide plate 12, the reflection sheet 13, and the LED substrate 20 therein. You can do that. The chassis 14 includes a bottom plate 14a having a horizontally long rectangular shape when viewed from above and a side plate 14b rising from outer edges of four sides of the bottom plate 14a. Further, the above-described frame 5 and bezel 2 can be fixed to the side plate 14b by screws or the like.
　３枚の光学シート９～１１は、平面に視て横長の長方形状を有した薄い樹脂製のシートで構成される。光学シート９～１１は、導光板１２の表側（光出射側）に載せられて液晶表示パネル３と導光板１２との間に介在して配される。これら光学シート９～１１としては、上から順に例えば、厚さが０．１～０．５ｍｍ程度の偏光選択性反射シート９、レンズシート１０、拡散シート１１が用いられている。 The three optical sheets 9 to 11 are composed of thin resin sheets having a horizontally long rectangular shape when seen in a plan view. The optical sheets 9 to 11 are placed on the front side (light emitting side) of the light guide plate 12 and are interposed between the liquid crystal display panel 3 and the light guide plate 12. As these optical sheets 9 to 11, for example, a polarization selective reflection sheet 9, a lens sheet 10 and a diffusion sheet 11 having a thickness of about 0.1 to 0.5 mm are used in order from the top.
　この場合、拡散シート１１は、導光板１２から出射される光を拡散させることで、輝度分布を均一にするためのものである。レンズシート１０は、拡散シート１１から出射される光を集光することで、正面輝度を高めるためのものである。また、偏光選択性反射シート９は、レンズシート１０から出射された光が液晶表示パネル３の背面に貼り付けられた図示しない偏光板に吸収されないように選択的に反射させるためのものである。 In this case, the diffusion sheet 11 is for making the luminance distribution uniform by diffusing the light emitted from the light guide plate 12. The lens sheet 10 is for increasing the front luminance by condensing the light emitted from the diffusion sheet 11. The polarization selective reflection sheet 9 is for selectively reflecting the light emitted from the lens sheet 10 so that the light is not absorbed by a polarizing plate (not shown) attached to the back surface of the liquid crystal display panel 3.
　導光板１２は、平面に視て横長の長方形状を有して、例えば厚さが３～４ｍｍ程度の透明な樹脂製の板で構成される。導光板１２は、ＬＥＤ２１からの光を導入するための光入射面１２ａと、その光入射面１２ａから導入された光を上方向（照射方向）に出射するための光出射面１２ｂとを有している。光入射面１２ａは、導光板１２の長辺側の側端面によって構成されると共に、光出射面１２ｂは導光板１２の前面によって構成されている。 The light guide plate 12 is formed of a transparent resin plate having a horizontally long rectangular shape in a plan view and having a thickness of about 3 to 4 mm, for example. The light guide plate 12 has a light incident surface 12a for introducing light from the LED 21 and a light emitting surface 12b for emitting light introduced from the light incident surface 12a upward (irradiation direction). ing. The light incident surface 12 a is configured by the side end surface on the long side of the light guide plate 12, and the light output surface 12 b is configured by the front surface of the light guide plate 12.
　導光板１２は、光入射面１２ａから入射した光を光出射面（前面）１２ｂと、この光出射面１２ｂとは反対側の背面１２ｃとの間で繰り返し反射させて、その内部で平面状に広げることが可能になっている。図示しないが、導光板１２の背面１２ｃには、光入射面１２ａから入射した光を散乱させて光出射面１２ｂから出射させるための複数個の散乱部が形成されている。このような散乱部としては、白色顔料等を含む塗料を導光板１２の背面１２ｃに斑点状に印刷して形成されたものなどが適用される。 The light guide plate 12 reflects light incident from the light incident surface 12a repeatedly between the light emitting surface (front surface) 12b and the back surface 12c opposite to the light emitting surface 12b, and forms a planar shape inside the light guiding plate 12 It can be expanded. Although not shown, a plurality of scattering portions are formed on the back surface 12c of the light guide plate 12 to scatter light incident from the light incident surface 12a and emit the light from the light emitting surface 12b. As such a scattering part, what was formed by printing the coating material containing a white pigment etc. on the back surface 12c of the light-guide plate 12 in the shape of a spot is applied.
　反射シート１３は、導光板１２の光出射面１２ｂとは反対側の背面１２ｃを覆うように配置されており、この場合、シャーシ１４の底板１４ａ上に敷設されている。この反射シート１３は、導光板１２の背面１２ｃから背面側へと出射される光を導光板１２側に反射させるためのもので、例えば厚さが０．１～２ｍｍ程度の樹脂製のシートで構成される。この場合、反射シート１３の前面は、白色を呈しており、導光板１２の背面１２ｃから出射される光を導光板１２側に効率良く反射させその光の利用効率および導光板１２の光出射面１２ｂでの輝度を高めている。 The reflection sheet 13 is disposed so as to cover the back surface 12c of the light guide plate 12 opposite to the light emitting surface 12b. In this case, the reflection sheet 13 is laid on the bottom plate 14a of the chassis 14. The reflection sheet 13 is for reflecting the light emitted from the back surface 12c of the light guide plate 12 to the back side toward the light guide plate 12, and is, for example, a resin sheet having a thickness of about 0.1 to 2 mm. Composed. In this case, the front surface of the reflection sheet 13 is white, and the light emitted from the back surface 12c of the light guide plate 12 is efficiently reflected to the light guide plate 12 side so that the light utilization efficiency and the light emission surface of the light guide plate 12 are improved. The brightness at 12b is increased.
　このように照明装置４は、光学シート９～１１、導光板１２および反射シート１３によって、ＬＥＤ２１からの光を面状の光に変換して液晶表示パネル３の背面側に照射できるようになっている。尚、シャーシ１４の背面には、ＬＥＤ基板２０に電源を供給する電源基板１８と、液晶表示パネル３を駆動するコントロール基板１９が配設されている。 As described above, the illumination device 4 can convert the light from the LED 21 into the planar light by the optical sheets 9 to 11, the light guide plate 12 and the reflection sheet 13 and irradiate the back side of the liquid crystal display panel 3. Yes. A power supply board 18 for supplying power to the LED board 20 and a control board 19 for driving the liquid crystal display panel 3 are disposed on the rear surface of the chassis 14.
　ＬＥＤ基板２０に備えられた複数個のＬＥＤ２１は、導光板１２の光入射面１２ａの近傍に配置されている。ＬＥＤ２１は、例えば青色光を発生させるＬＥＤチップを、黄色蛍光体が混合された透明樹脂で密封したパッケージ構造を有しており、ＬＥＤ２１の発光面２１ａから白色光を放出することが可能となっている。このようなＬＥＤ２１は、その発光面２１ａが導光板１２の光入射面１２ａに対向するように、その光入射面１２ａに沿って所定の間隔を隔てて配置されている。 The plurality of LEDs 21 provided on the LED substrate 20 are disposed in the vicinity of the light incident surface 12 a of the light guide plate 12. The LED 21 has a package structure in which, for example, an LED chip that generates blue light is sealed with a transparent resin mixed with a yellow phosphor, and white light can be emitted from the light emitting surface 21a of the LED 21. Yes. Such an LED 21 is arranged at a predetermined interval along the light incident surface 12 a so that the light emitting surface 21 a faces the light incident surface 12 a of the light guide plate 12.
　図２に示されるように、ＬＥＤ基板２０は、アルミなどの金属製の基材２２を備えている。この基材２２は、横長の長方形状をなしており、ＬＥＤ２１の発熱による温度上昇を抑制する放熱部材としての機能を有している。この基材２２の前面（実装面）２０ａには図示しない絶縁層が形成されており、この絶縁層の上には、その長手方向に沿って複数個のＬＥＤ２１，２１，２１，・・・が一直線に並ぶように実装されている。これら複数個のＬＥＤ２１は、絶縁層上に形成された図示しない配線パターンによって直列に接続されている。 As shown in FIG. 2, the LED substrate 20 includes a base material 22 made of metal such as aluminum. The base material 22 has a horizontally long rectangular shape, and has a function as a heat radiating member that suppresses a temperature rise due to heat generated by the LED 21. An insulating layer (not shown) is formed on the front surface (mounting surface) 20a of the base material 22, and a plurality of LEDs 21, 21, 21,... Along the longitudinal direction are formed on the insulating layer. It is mounted in a straight line. The plurality of LEDs 21 are connected in series by a wiring pattern (not shown) formed on the insulating layer.
　このようなＬＥＤ基板２０は、左右の両側面に粘着層を有する緩衝部材（クッション材）１５によってシャーシ１４の側板１４ｂに取り付けられており、シャーシ１４の底板１４ａ上で立てた状態（直立した状態）に保持されている。この緩衝部材１５は、ＬＥＤ基板２０の長さと同等の長さの直方体形状を有している。 Such an LED board 20 is attached to the side plate 14b of the chassis 14 by a buffer member (cushion material) 15 having adhesive layers on both left and right side surfaces, and is standing on the bottom plate 14a of the chassis 14 (upright state) ). The buffer member 15 has a rectangular parallelepiped shape having a length equivalent to the length of the LED substrate 20.
　このように板形状を有する導光板１２と、上面が開口された箱形状を有して導光板１２が収容されるシャーシ１４と、ＬＥＤ２１が実装された実装面２０ａが導光板１２の側端面１２ａに対向するようにシャーシ１４の底板１４ａ上に直立して配されるＬＥＤ基板２０とを備えた照明装置４において、シャーシ１４の底板１４ａ上には導光板１２の側端面１２ａに対向する側板１４ｂが立設されると共に、ＬＥＤ基板２０は、そのＬＥＤ基板２０の実装面２０ａとは反対側の背面２０ｂと側板１４ｂの内側の面との間に配される緩衝部材１５を介してその側板１４ｂに取り付けられた構成となっている。 Thus, the light guide plate 12 having a plate shape, the chassis 14 having a box shape with the upper surface opened and accommodating the light guide plate 12, and the mounting surface 20a on which the LEDs 21 are mounted are the side end surfaces 12a of the light guide plate 12. In the illuminating device 4 having the LED board 20 arranged upright on the bottom plate 14a of the chassis 14 so as to face the side plate 14b, the side plate 14b facing the side end face 12a of the light guide plate 12 is placed on the bottom plate 14a of the chassis 14. The LED board 20 is provided on the side plate 14b via a buffer member 15 disposed between the back surface 20b opposite to the mounting surface 20a of the LED board 20 and the inner surface of the side plate 14b. It becomes the structure attached to.
　この場合、先に緩衝部材１５の一方の側面（粘着層）を、側板１４ｂの内側の面に貼り付けた後、ＬＥＤ基板２０のＬＥＤ２１が実装されている側の実装面２０ａとは反対側の背面２０ｂを、その緩衝部材１５の他方の側面（粘着層）に貼り付けるか、または、先にＬＥＤ基板２０の背面２０ｂに緩衝部材１５の一方の側面（粘着層）を貼り付けた後、その緩衝部材１５の他方の側面（粘着層）を側板１４ｂの内側の面に貼り付けるかのいずれか手順を経ることによって、ＬＥＤ基板２０は側板１４ｂに取り付けられている。 In this case, after pasting one side surface (adhesive layer) of the buffer member 15 to the inner surface of the side plate 14b, the LED substrate 20 is mounted on the side opposite to the mounting surface 20a on which the LED 21 is mounted. After attaching the back surface 20b to the other side surface (adhesion layer) of the buffer member 15, or after pasting one side surface (adhesion layer) of the buffer member 15 to the back surface 20b of the LED substrate 20, The LED substrate 20 is attached to the side plate 14b by going through one of the procedures of attaching the other side surface (adhesive layer) of the buffer member 15 to the inner surface of the side plate 14b.
　このような基材２２とシャーシ１４の側板１４ａとの間に介在される緩衝部材１５は、熱伝導部材としての機能を有しており、ＬＥＤ２１が発した熱は、基材２２、緩衝部材（熱伝導部材）１５を介して側板１４ｂに熱伝導することで、点灯によるＬＥＤ２１の温度が上昇し過ぎないように抑制されている。尚、このような緩衝部材１５に適用される熱伝導性を有するクッション材としては、ポリマテック株式会社製のＦＥＳＡＴＨＥＲシリーズなどが挙げられる。 The buffer member 15 interposed between the base material 22 and the side plate 14a of the chassis 14 has a function as a heat conducting member, and the heat generated by the LED 21 is generated by the base material 22, the buffer member ( By conducting heat to the side plate 14b via the heat conduction member 15, the temperature of the LED 21 due to lighting is suppressed from rising too much. In addition, as a cushioning material having thermal conductivity applied to such a buffer member 15, FESATHER series manufactured by Polymertech Co., Ltd. and the like can be mentioned.
　図２（ｂ）は、導光板１２が熱膨張して伸びたときの緩衝部材１５の作用を説明するための図である。図示されるように、導光板１２が熱膨張により右方向への伸びると、ＬＥＤ２１の発光面２１ａに接触（当接）してＬＥＤ２１を右方向へと押圧するが、緩衝部材１５が右方向へと潰れる（縮む）ことで、側端面（光入射面）１２ａからＬＥＤ２１に過大な加重が加わらないように抑制されている。 FIG. 2B is a diagram for explaining the action of the buffer member 15 when the light guide plate 12 expands due to thermal expansion. As shown in the drawing, when the light guide plate 12 extends in the right direction due to thermal expansion, it contacts (abuts) the light emitting surface 21a of the LED 21 to press the LED 21 in the right direction, but the buffer member 15 moves in the right direction. By being crushed (shrinks), it is suppressed so that an excessive load is not applied to the LED 21 from the side end surface (light incident surface) 12a.
　このように熱膨張により伸びた導光板１２の側端面１２ａが、ＬＥＤ基板２０のＬＥＤ２１と接触（当接）しても、緩衝部材１５が潰れる（縮む）ことによってＬＥＤ２１が導光板１２の側端面１２ａから過大な荷重を受けることが抑制されているので、ＬＥＤ２１が破損するおそれがなくなる。これにより、ＬＥＤ２１を導光板１２の側端面（光入射面）１２ａに従来よりも接近するように配置することが可能となり、ＬＥＤ２１から導光板１２の側端面（光入射面）１２ａに導入される光の利用効率を向上させることができる。 Thus, even if the side end surface 12a of the light guide plate 12 extended by thermal expansion contacts (abuts) the LED 21 of the LED substrate 20, the buffer member 15 is crushed (shrinks), so that the LED 21 is on the side end surface of the light guide plate 12. Since the excessive load from 12a is suppressed, there is no possibility that the LED 21 is damaged. Thus, the LED 21 can be disposed closer to the side end surface (light incident surface) 12a of the light guide plate 12 than before, and is introduced from the LED 21 to the side end surface (light incident surface) 12a of the light guide plate 12. Light utilization efficiency can be improved.
　次に、図３および図４（ａ）を用いて本発明の第２の実施形態について説明する。尚、上述した第１の実施形態と同一の構成については同符号を付して説明は省略し、異なる点を中心に説明する。 Next, a second embodiment of the present invention will be described with reference to FIGS. 3 and 4 (a). In addition, about the same structure as 1st Embodiment mentioned above, the same code | symbol is attached | subjected and description is abbreviate | omitted and it demonstrates centering on a different point.
　図示されるようにＬＥＤ基板２０の実装面２０ａには、導光板１２の側端面１２ａに向かって突出した複数の突出部２３が設けられている。この場合、突出部２３は、ＬＥＤ基板２０の実装面２０ａの上端と下端のそれぞれにおいて、ＬＥＤ基板２０の長手方向に沿って複数設けられており、突出部２３の長さは、ＬＥＤ２１の実装面２０ａからの高さよりも長い構成になっている。したがって、突出部２３は、熱膨張により伸びてきた導光板１２の側端面１２ａの上端と下端にそれぞれ当接することが可能になっている（図４（ｂ）参照）。 As shown in the figure, the mounting surface 20a of the LED substrate 20 is provided with a plurality of protruding portions 23 protruding toward the side end surface 12a of the light guide plate 12. In this case, a plurality of protruding portions 23 are provided along the longitudinal direction of the LED substrate 20 at each of the upper end and the lower end of the mounting surface 20a of the LED substrate 20, and the length of the protruding portion 23 is the mounting surface of the LED 21. The structure is longer than the height from 20a. Therefore, the protrusion part 23 can contact | abut to the upper end and lower end of the side end surface 12a of the light-guide plate 12 extended by thermal expansion, respectively (refer FIG.4 (b)).
　このような構成によれば、熱膨張により伸びた導光板１２の側端面１２ａに突出部２３が当接（接触）することにより、側端面１２ａとＬＥＤ２１との接触（当接）が防止されている。また、熱膨張した際の導光板１２の側端面１２ａとＬＥＤ２１の発光面２１ａとの間の距離を、突出部２３長さとＬＥＤ２１高さの差（例えば０．０１ｍｍ以上０．２ｍｍ以下など）となるように設定することが可能である。つまり、突出部２３は、熱膨張した際の導光板１２の側端面１２ａとＬＥＤ２１の発光面２１ａとの間の距離を一定（例えば０．０１ｍｍ以上０．２ｍｍ以下など）に保持するスペーサとして機能することになっている。 According to such a configuration, the protrusion 23 contacts (contacts) the side end surface 12a of the light guide plate 12 extended by thermal expansion, thereby preventing contact (contact) between the side end surface 12a and the LED 21. Yes. Further, the distance between the side end surface 12a of the light guide plate 12 and the light emitting surface 21a of the LED 21 when thermally expanded is the difference between the length of the protrusion 23 and the height of the LED 21 (for example, 0.01 mm to 0.2 mm). It is possible to set so that That is, the protrusion 23 functions as a spacer that keeps the distance between the side end surface 12a of the light guide plate 12 and the light emitting surface 21a of the LED 21 constant (for example, 0.01 mm or more and 0.2 mm or less) when thermally expanded. Is supposed to do.
　次に、図５および図６（ａ）を用いて本発明の第３の実施形態について説明する。尚、上述した第１の実施形態と同一の構成については同符号を付して説明は省略し、異なる点を中心に説明する。 Next, a third embodiment of the present invention will be described using FIG. 5 and FIG. 6 (a). In addition, about the same structure as 1st Embodiment mentioned above, the same code | symbol is attached | subjected and description is abbreviate | omitted and it demonstrates centering on a different point.
　図示されるように、ＬＥＤ基板２０の上端と導光板１２の端部とを連結する連結部材２４が備えられている。具体的には、連結部材２４はホチキスの針に似た形状を有しており、一端の係止片２４ａを、導光板１２の端部の上面に開口された取付孔１２ｄに挿入して係止させると共に、他端の係止片２４ｂを、ＬＥＤ基板２０（基材２２）の上端に開口された取付孔２０ｃに挿入して係止させることで、導光板１２の端部とＬＥＤ基板２０をこの連結部材２４を介して連結することが可能になっている。 As shown in the figure, a connecting member 24 that connects the upper end of the LED substrate 20 and the end of the light guide plate 12 is provided. Specifically, the connecting member 24 has a shape similar to a staple, and the engaging piece 24a at one end is inserted into the mounting hole 12d opened at the upper surface of the end portion of the light guide plate 12 to engage the connecting member 24. At the same time, the locking piece 24b at the other end is inserted into the mounting hole 20c opened at the upper end of the LED substrate 20 (base material 22) and locked, whereby the end of the light guide plate 12 and the LED substrate 20 are locked. Can be connected via the connecting member 24.
　この場合、このような連結部材２４は、ＬＥＤ基板２０の長手方向に沿って複数設けられており、これに対応して、取付孔１２ｄは導光板１２の長辺側の端部の長手方向に沿って複数形成されると共に、取付孔２０ｃはＬＥＤ基板２０の上端の長手方向に沿って複数形成されている。 In this case, a plurality of such connecting members 24 are provided along the longitudinal direction of the LED substrate 20, and the attachment holes 12 d correspond to the longitudinal direction of the end portion on the long side of the light guide plate 12. A plurality of attachment holes 20 c are formed along the longitudinal direction of the upper end of the LED substrate 20.
　このような導光板１２の端部とＬＥＤ基板２０を連結する連結部材２４によって、図６（ｂ）に示されるように導光板１２の熱膨張による伸び量に応じて緩衝部材１５が潰れる（縮む）、または、図６（ｃ）に示されるように導光板１２の熱収縮による縮み量に応じて緩衝部材１５が膨らむ（伸びる）ようになっている。したがって、図６（ａ）～（ｃ）に示されるように、導光板１２の側端面（光入射面）１２ａとＬＥＤ２１の発光面２１ａとの間の距離を、導光板１２の熱膨張や熱収縮に関係なく連結部材２４によってほぼ一定に保持することが可能である。 By the connecting member 24 that connects the end portion of the light guide plate 12 and the LED substrate 20, the buffer member 15 is crushed (shrinks) according to the amount of expansion due to the thermal expansion of the light guide plate 12, as shown in FIG. 6B. 6), or as shown in FIG. 6C, the buffer member 15 expands (extends) in accordance with the amount of contraction due to the thermal contraction of the light guide plate 12. Therefore, as shown in FIGS. 6A to 6C, the distance between the side end surface (light incident surface) 12a of the light guide plate 12 and the light emitting surface 21a of the LED 21 is set as the thermal expansion or heat of the light guide plate 12. Regardless of the contraction, the connecting member 24 can hold the member substantially constant.
　図７は、上述した第１の実施形態、第２の実施形態および第３の実施形態の変形例を示している。具体的には、図７（ａ）は図２（ａ）に示した第１の実施形態の変形例、図７（ｂ）は図４（ａ）に示した第２の実施形態の変形例、図７（ｃ）は図６（ａ）に示した第３の実施形態の変形例を示している。 FIG. 7 shows a modification of the above-described first embodiment, second embodiment, and third embodiment. Specifically, FIG. 7A is a modification of the first embodiment shown in FIG. 2A, and FIG. 7B is a modification of the second embodiment shown in FIG. 4A. FIG. 7 (c) shows a modification of the third embodiment shown in FIG. 6 (a).
　図示されるように、ＬＥＤ基板２０は、シャーシ１４の側板１４ｂ近傍の底板１４ａ上に固定されたＬ字形の支持部材１６に緩衝部材１５を介して取り付けられている。この支持部材１６は、いわゆるブラケット（Ｌ字形の取り（据え）付け用金具）のような形状を有しており、例えばアルミ材の切削加工等によって成形される。この場合、支持部材１６は、ＬＥＤ基板２０が緩衝部材１５を介して取り付けられる部分である長尺形状を有する基板取付用板１６ａと、シャーシ１４の底板１４ａに固定される部分である長尺形状を有するシャーシ固定用板１６ｂとが、略Ｌ字形に配された構成となっている。 As shown in the figure, the LED board 20 is attached to an L-shaped support member 16 fixed on the bottom plate 14a in the vicinity of the side plate 14b of the chassis 14 via a buffer member 15. The support member 16 has a shape like a so-called bracket (an L-shaped mounting (mounting) fitting), and is formed by, for example, cutting of an aluminum material. In this case, the support member 16 is a board-mounting plate 16 a having a long shape, which is a portion to which the LED board 20 is attached via the buffer member 15, and a long shape, which is a portion fixed to the bottom plate 14 a of the chassis 14. And a chassis fixing plate 16b having a substantially L-shaped configuration.
　支持部材１６のシャーシ固定用板１６ｂの所定の箇所には取付孔１６ｃが形成されている。また、これに対応してシャーシ１４の底板１４ａの所定の箇所には、ネジ孔１４ｃが形成されている。したがって、支持部材１６の取付孔１６ｃに固定ネジ１７を通して、底板１４ａのネジ孔１４ｃにその固定ネジ１７を螺合させることで、支持部材１６はシャーシ１４に固定されるようになっている。 A mounting hole 16c is formed in a predetermined portion of the chassis fixing plate 16b of the support member 16. Correspondingly, a screw hole 14c is formed in a predetermined portion of the bottom plate 14a of the chassis 14. Therefore, the support member 16 is fixed to the chassis 14 by passing the fixing screw 17 through the mounting hole 16c of the support member 16 and screwing the fixing screw 17 into the screw hole 14c of the bottom plate 14a.
　上述した第１の実施形態、第２の実施形態および第３の実施形態では、ＬＥＤ基板２０をシャーシ１４の底板１４ａ上で立設される側板１４ｂに緩衝部材１５を介して取り付ける構成であったが、図７（ａ），（ｂ），（ｃ）の変形例に示されるようなＬＥＤ基板２０をシャーシ１４の底板１４ａ上で立設される基板取付用板１６ａに緩衝部材１５を介して取り付ける構成でも良い。このような構成でも、上述した第１の実施形態、第２の実施形態および第３の実施形態と同様の作用・効果を奏することができる。 In the first embodiment, the second embodiment, and the third embodiment described above, the LED substrate 20 is attached to the side plate 14b erected on the bottom plate 14a of the chassis 14 via the buffer member 15. However, the LED board 20 as shown in the modification of FIGS. 7A, 7B, and 7C is placed on the board mounting plate 16a erected on the bottom plate 14a of the chassis 14 via the buffer member 15. The structure which attaches may be sufficient. Even with such a configuration, the same operations and effects as those of the first embodiment, the second embodiment, and the third embodiment described above can be achieved.
　尚、図７に示したようなＬＥＤ基板２０を支持部材１６の基板取付板１６ａに緩衝部材１５を介して取り付けた構成よりも、上述した図２（第１の実施形態）、図４（第２の実施形態）および図６（第３の実施形態）に示したようなＬＥＤ基板２０をシャーシ１４の側板１４ｂに緩衝部材１５を介して取り付けた構成のほうが好ましい。 Note that the LED substrate 20 as shown in FIG. 7 is attached to the substrate attachment plate 16a of the support member 16 via the buffer member 15, rather than the configuration shown in FIG. 2 (first embodiment) and FIG. 2) and the LED board 20 as shown in FIG. 6 (third embodiment) is preferably attached to the side plate 14b of the chassis 14 via the buffer member 15.
　図２、図４および図６に示される構成によれば、支持部材１６（基板取付用板１６ａ）をシャーシ１４とは別の部材で用意する必要がない上に、点灯によりＬＥＤ２１が発した熱を、緩衝部材１５を介してシャーシ１４の側板１４ｂに直接的に熱伝導させることができるので、点灯によるＬＥＤ２１の温度上昇をより抑制することができる。また、シャーシ１４の側板１４ｂにＬＥＤ基板２０を取り付ける構成、つまり支持部材１６が不要な構成なので、照明装置４の発光領域を囲む額縁状の領域（フレーム５の枠部５ａの面積）の縮小化にも貢献する。 According to the configuration shown in FIGS. 2, 4, and 6, it is not necessary to prepare the support member 16 (substrate mounting plate 16 a) as a member different from the chassis 14, and the heat generated by the LED 21 by lighting. Can be directly conducted to the side plate 14b of the chassis 14 via the buffer member 15, so that the temperature rise of the LED 21 due to lighting can be further suppressed. Further, since the LED board 20 is attached to the side plate 14b of the chassis 14, that is, the support member 16 is unnecessary, the frame-shaped region (the area of the frame portion 5a of the frame 5) surrounding the light emitting region of the lighting device 4 is reduced. Also contribute to.
　以上、本発明に係る照明装置および液晶表示装置の実施の形態について説明したが、本発明はこうした実施形態に何ら限定されるものではなく、本発明の要旨を逸脱しない範囲において、種々なる態様で実施できることは勿論である。 The embodiments of the illumination device and the liquid crystal display device according to the present invention have been described above. However, the present invention is not limited to these embodiments, and can be variously modified without departing from the gist of the present invention. Of course, it can be implemented.
　例えば、上述した実施の形態では、ＬＥＤ基板２０，２０を、長方形を有する導光板１２の一対の長辺にそれぞれ対向するように配すると共に、これに対応してシャーシ１４の一対の長辺側の側板１４ｂ，１４ｂにそれぞれ緩衝部材１５，１５を設けた構成について説明したが、ＬＥＤ基板２０の設置数やそれに対応した緩衝部材１５の設置数は適宜変更可能である。 For example, in the above-described embodiment, the LED boards 20 and 20 are arranged so as to face the pair of long sides of the light guide plate 12 having a rectangular shape, and the pair of long sides of the chassis 14 corresponding to this. The configuration in which the buffer members 15 and 15 are provided on the side plates 14b and 14b, respectively, has been described, but the number of LED substrates 20 and the number of buffer members 15 corresponding thereto can be changed as appropriate.
　例えば、導光板１２の１つの長辺および１つの短辺にそれぞれに対向するようにＬＥＤ基板２０を配すると共に、これに対応してシャーシ１４の１つの長辺側の側板１４ｂおよび１つの短辺側の側板１４ｂにそれぞれ緩衝部材１５を設けた構成にしても良く、上述した実施の形態には限定されない。 For example, the LED board 20 is disposed so as to face one long side and one short side of the light guide plate 12, respectively, and the side plate 14b on one long side of the chassis 14 and one short side corresponding to this are arranged. The side plate 14b on the side may be provided with the buffer member 15 and is not limited to the above-described embodiment.

Claims (6)

  1. 　板形状を有する導光板と、上面が開口された箱形状を有して前記導光板が収容されるシャーシと、ＬＥＤが実装された実装面が前記導光板の側端面に対向するように前記シャーシの底板上に直立して配されるＬＥＤ基板とを備え、
    　前記シャーシの底板上には前記導光板の側端面に対向する基板取付用板が立設されると共に、前記ＬＥＤ基板は、該ＬＥＤ基板の実装面とは反対側の背面と前記基板取付用板の内側の面との間に配される緩衝部材を介して該基板取付用板に取り付けられていることを特徴とする照明装置。     A light guide plate having a plate shape, a chassis having a box shape with an open top surface and housing the light guide plate, and the chassis so that a mounting surface on which an LED is mounted faces a side end surface of the light guide plate An LED board arranged upright on the bottom plate of
    On the bottom plate of the chassis, a board mounting plate facing the side end surface of the light guide plate is erected, and the LED board has a back surface opposite to the mounting surface of the LED board and the board mounting plate. The lighting device is attached to the board mounting plate via a buffer member disposed between the inner surface of the board and the inner surface of the board.
  2. 　前記ＬＥＤ基板の実装面には、前記導光板の側端面に向かって突出した突出部が形成されると共に、該突出部長さが前記ＬＥＤの実装面からの高さよりも長いことを特徴とする請求項１に記載の照明装置。 The mounting surface of the LED substrate is formed with a protruding portion that protrudes toward a side end surface of the light guide plate, and the length of the protruding portion is longer than the height from the mounting surface of the LED. Item 2. The lighting device according to Item 1.
  3. 　前記ＬＥＤ基板と前記導光板の端部とを連結する連結部材を備えていることを特徴とする請求項１に記載の照明装置。 The lighting device according to claim 1, further comprising a connecting member that connects the LED substrate and an end of the light guide plate.
  4. 　前記緩衝部材は、熱伝導性を有することを特徴とする請求項１から３のいずれか一項に記載の照明装置。 The lighting device according to any one of claims 1 to 3, wherein the buffer member has thermal conductivity.
  5. 　前記基板取付用板が、前記シャーシの底板の外縁から立ち上がる側板であることを特徴とする請求項１から４のいずれか一項に記載の照明装置。 The lighting device according to any one of claims 1 to 4, wherein the board mounting plate is a side plate rising from an outer edge of a bottom plate of the chassis.
  6. 　請求項１から５のいずれか一項に記載の照明装置と、その照明装置からの光を利用して表示を行う液晶表示パネルとを備えることを特徴とする液晶表示装置。 A liquid crystal display device comprising: the illumination device according to any one of claims 1 to 5; and a liquid crystal display panel that performs display using light from the illumination device.
PCT/JP2011/077515 2010-12-15 2011-11-29 Illumination device and liquid crystal display device comprising same WO2012081395A1 (en)

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014017391A1 (en) * 2012-07-27 2014-01-30 シャープ株式会社 Lighting apparatus, display apparatus, and television receiver
WO2014103385A1 (en) * 2012-12-26 2014-07-03 株式会社 東芝 Display apparatus and display unit
WO2014109301A1 (en) * 2013-01-09 2014-07-17 シャープ株式会社 Illumination device, display device and tv receiver
JP2014142614A (en) * 2013-01-24 2014-08-07 Lg Display Co Ltd Liquid crystal display device
JP2014170079A (en) * 2013-03-01 2014-09-18 Funai Electric Co Ltd Display device
JP2014219655A (en) * 2013-04-30 2014-11-20 エルジー ディスプレイ カンパニー リミテッド Display device
JP2014228862A (en) * 2013-05-27 2014-12-08 エルジー ディスプレイ カンパニー リミテッド Display device
EP3086171A1 (en) * 2015-04-21 2016-10-26 Himax Display, Inc. Display device
WO2017080149A1 (en) * 2015-11-13 2017-05-18 乐视控股（北京）有限公司 Led lamp group, backlight module and display device
US9841645B2 (en) 2015-04-02 2017-12-12 Himax Display, Inc. Display device
JP2019153505A (en) * 2018-03-05 2019-09-12 シャープ株式会社 Luminaire, display device and television receiver

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008219333A (en) * 2007-03-02 2008-09-18 Rohm Co Ltd Linear light source device
JP2009070756A (en) * 2007-09-18 2009-04-02 Oki Data Corp Led backlight device and liquid crystal display device
JP2010147012A (en) * 2008-12-22 2010-07-01 Panasonic Electric Works Co Ltd Planar light source, and display lighting fixture
WO2010134423A1 (en) * 2009-05-18 2010-11-25 シーシーエス株式会社 Light source unit and surface illuminant device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008219333A (en) * 2007-03-02 2008-09-18 Rohm Co Ltd Linear light source device
JP2009070756A (en) * 2007-09-18 2009-04-02 Oki Data Corp Led backlight device and liquid crystal display device
JP2010147012A (en) * 2008-12-22 2010-07-01 Panasonic Electric Works Co Ltd Planar light source, and display lighting fixture
WO2010134423A1 (en) * 2009-05-18 2010-11-25 シーシーエス株式会社 Light source unit and surface illuminant device

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104487759A (en) * 2012-07-27 2015-04-01 夏普株式会社 Lighting apparatus, display apparatus, and television receiver
WO2014017391A1 (en) * 2012-07-27 2014-01-30 シャープ株式会社 Lighting apparatus, display apparatus, and television receiver
JP5823617B2 (en) * 2012-07-27 2015-11-25 シャープ株式会社 Lighting device, display device, and television receiver
WO2014103385A1 (en) * 2012-12-26 2014-07-03 株式会社 東芝 Display apparatus and display unit
WO2014109301A1 (en) * 2013-01-09 2014-07-17 シャープ株式会社 Illumination device, display device and tv receiver
JP2014142614A (en) * 2013-01-24 2014-08-07 Lg Display Co Ltd Liquid crystal display device
US9182535B2 (en) 2013-01-24 2015-11-10 Lg Display Co., Ltd. Liquid crystal display device
US9372358B2 (en) 2013-01-24 2016-06-21 Lg Display Co., Ltd. Liquid crystal display device
JP2014170079A (en) * 2013-03-01 2014-09-18 Funai Electric Co Ltd Display device
JP2014219655A (en) * 2013-04-30 2014-11-20 エルジー ディスプレイ カンパニー リミテッド Display device
JP2014228862A (en) * 2013-05-27 2014-12-08 エルジー ディスプレイ カンパニー リミテッド Display device
US9841645B2 (en) 2015-04-02 2017-12-12 Himax Display, Inc. Display device
EP3086171A1 (en) * 2015-04-21 2016-10-26 Himax Display, Inc. Display device
WO2017080149A1 (en) * 2015-11-13 2017-05-18 乐视控股（北京）有限公司 Led lamp group, backlight module and display device
JP2019153505A (en) * 2018-03-05 2019-09-12 シャープ株式会社 Luminaire, display device and television receiver

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