WO2013018648A1

WO2013018648A1 - Illumination device, display device, and television receiving device

Info

Publication number: WO2013018648A1
Application number: PCT/JP2012/068950
Authority: WO
Inventors: 信宏笠井
Original assignee: シャープ株式会社
Priority date: 2011-08-03
Filing date: 2012-07-26
Publication date: 2013-02-07

Abstract

A backlight device (24) according to the present invention comprises: a light-guiding plate (20), with a light entry face (20a) disposed on a lateral face thereof; a radiating plate (36) which has a heat radiation property; an LED substrate (30) which is positioned with one plate face thereof in contact with the radiating plate (36); an LED light source (28) which is positioned upon the other plate face of the LED substrate (30) opposite the light entry face (20a) of the light-guiding plate (20); and a pressure member (34) which is positioned between the light-guiding plate (20) and the radiating plate (36), has an aperture wherein the light from the LED light source (28) illuminates the light entry face (20a), is attached at a site of the radiating plate (36) which does not make contact with the LED substrate (30), and wherein a portion thereof presses the other plate face of the LED substrate (30) on the radiating plate (36) side.

Description

Lighting device, display device, and television receiver

The present invention relates to a lighting device, a display device, and a television receiver.

In recent years, display elements of image display devices such as television receivers are shifting from conventional cathode ray tubes to thin display devices to which thin display elements such as liquid crystal panels and plasma display panels are applied. Is possible. The liquid crystal display device requires a backlight device as a separate illumination device because the liquid crystal panel used for this does not emit light. As an example of such a backlight device, an edge light type backlight device in which a light incident surface is provided on a side surface of a light guide plate and a light source such as an LED is disposed on a side surface side of the light guide plate is known.

Patent Document 1 discloses an edge light type backlight device. In this backlight device, an LED substrate is attached to a side plate of a case as a casing via an adhesive tape having thermal conductivity. A spacer is arranged between the LED substrate and the light incident surface of the light guide plate. The spacer is fixed to the bottom plate of the chassis by inserting a protrusion provided at the lower end of the spacer into an opening provided in the bottom plate of the chassis. The spacer is in contact with both the plate surface of the LED substrate and the light incident surface of the light guide plate, and has a function of regulating the distance between the light source and the light incident surface. In this backlight device, heat generated in the vicinity of the light source is radiated to the outside from the LED substrate via the adhesive tape.

JP 2008-89944 A

(Problems to be solved by the invention)
However, in the backlight device of Patent Document 1 described above, when heat is generated in the vicinity of the light source, heat shrinkage or warpage may occur in the LED substrate due to the heat, and adhesion between the LED substrate and the adhesive tape may decrease. is there. In this case, sufficient heat dissipation from the LED substrate to the pressure-sensitive adhesive tape side is not performed, so that the heat dissipation performance is reduced, and this may reduce the emission efficiency of the light source and cause a reduction in the life of the light source.

The technology disclosed in this specification has been created in view of the above problems. An object of the technology disclosed in this specification is to provide a lighting device that can ensure good heat dissipation.

(Means for solving the problem)
The technology disclosed in this specification includes a light guide plate provided with a light incident surface on a side surface, a heat radiating plate having heat dissipation, and a light source substrate disposed on one plate surface in contact with the heat radiating plate, A light source disposed on the other plate surface of the light source substrate so as to face the light incident surface of the light guide plate, and disposed between the light guide plate and the heat radiating plate, and receives light from the light source. A holding member that has an opening for irradiating the light surface, is attached to a portion that does not contact the light source substrate of the heat radiating plate, and a part of which presses the other plate surface of the light source substrate against the heat radiating plate side, It is related with an illuminating device provided.

According to the above illumination device, the light source substrate is pressed against the heat radiating plate by the pressing member, thereby improving the adhesion between the light source substrate and the heat radiating plate. For this reason, a light source board | substrate can be closely_contact | adhered with a heat sink with the number of small screws, and favorable heat dissipation can be ensured.

The pressing member may have a surface on a side opposite to a surface in contact with the light source substrate positioned closer to the light incident surface than the light exit surface of the light source.
According to this configuration, when the light incident surface of the light guide plate moves to the light source side due to vibration or thermal expansion, the light incident surface comes into contact with the pressing member. Can be prevented. Thereby, it can prevent that a light-incidence surface contact | abuts with a light source and a light source is damaged.

A plurality of the light sources may be arranged on the light source substrate, and a plurality of the openings may be provided at a position overlapping with each of the light sources of the pressing member.
According to this configuration, between the light sources on the plate surface of the light source substrate on which the light source is disposed, the light source substrate is pressed against the pressing member, so that the light source substrate can be effectively pressed by the pressing member.

The pressing member may be attached to the heat radiating plate by a part thereof being screwed to the heat radiating plate.
According to this configuration, since the pressing member can be effectively pressed against the heat radiating plate by screwing a part of the pressing member, the light source substrate and the heat radiating plate can be more closely attached, and the heat dissipation can be further improved. Can be increased.

The pressing member may be formed of a hard member.
According to this configuration, the light source substrate can be more effectively pressed against the heat radiating plate by the pressing member, and the heat dissipation can be further enhanced.

The said heat sink has a bottom face part and the side part which stands | starts up from one outer edge of this bottom face part, and may have comprised the substantially L shape in the cross sectional view.
According to this structure, since the bottom part of a heat sink can be fixed to a housing etc. and a light source substrate can be pressed against the side part of a heat sink by a pressing member, the suitable shape of a heat sink can be implement | achieved.

The light source may be a white light emitting diode.
According to this configuration, the life of the light source can be extended and the power consumption can be reduced.

The white light emitting diode is a combination of a first light emitting chip that emits blue light and a first light emitting layer that is provided around the first light emitting chip and has a light emission peak in a yellow region, or A combination of a first light-emitting chip that emits blue light and a second light-emitting layer provided around the first light-emitting chip and having a light emission peak in each of a green region and a red region, or blue A first light emitting chip that emits blue light, and a third light emitting layer that is provided around the first light emitting chip and has a light emission peak in a green region, or a first light emitting chip that emits blue light And a second light-emitting chip that emits red light and a third light-emitting chip that emits green light, or a fourth light-emitting chip that emits ultraviolet light, and a periphery of the fourth light-emitting chip. The blue area A fourth light-emitting layer having a respective emission peak in the red region, the combination may include any combination of.
According to this configuration, the color tone is averaged as a whole, and illumination light having a substantially uniform color tone can be obtained.

The technology disclosed in this specification can also be expressed as a display device including a display panel that performs display using light from the above-described lighting device. A display device in which the display panel is a liquid crystal panel using liquid crystal is also new and useful. A television receiver provided with the above display device is also new and useful.

(The invention's effect)
According to the technology disclosed in this specification, it is possible to provide an illumination device that can ensure good heat dissipation.

1 is an exploded perspective view of a television receiver TV according to Embodiment 1. FIG. An exploded perspective view of the liquid crystal display device 10 is shown. A cross-sectional view of the liquid crystal display device 10 is shown. FIG. 3 is an enlarged view of a part of FIG. The figure which looked at the pressing member 34 of the state pressed against the LED board 30 from the front is shown. In Embodiment 2, the figure which looked at the pressing member 134 of the state pressed against the LED board 130 from the front is shown. In Embodiment 3, the figure which looked at the

pressing members

234 and 235 in the state pressed against LED board 230 from the front is shown. FIG. 6 is a cross-sectional view of a main part of a liquid crystal display device 310 according to a fourth embodiment.

<Embodiment 1>
Embodiment 1 will be described with reference to the drawings. A part of each drawing shows an X-axis, a Y-axis, and a Z-axis, and each axis direction is drawn in a common direction in each drawing. Among these, the Y-axis direction coincides with the vertical direction, and the X-axis direction coincides with the horizontal direction. In addition, unless otherwise noted, the vertical direction is used as a reference for upper and lower descriptions.

FIG. 1 is an exploded perspective view of the television receiver TV according to the first embodiment. The television receiver TV includes a liquid crystal display device 10, front and back cabinets Ca and Cb that are accommodated so as to sandwich the display device D, a power source P, a tuner T, and a stand S.

FIG. 2 is an exploded perspective view of the liquid crystal display device 10. Here, the upper side shown in FIG. 2 is the front side, and the lower side is the back side. As shown in FIG. 2, the liquid crystal display device 10 has a horizontally long rectangular shape as a whole, and includes a liquid crystal panel 16 as a display panel and a backlight device 24 as an external light source, and these form a bezel having a frame shape. 12 and the like are integrally held.

Subsequently, the liquid crystal panel 16 will be described. The liquid crystal panel 16 has a configuration in which a pair of transparent (highly translucent) glass substrates are bonded together with a predetermined gap therebetween, and a liquid crystal layer (not shown) is enclosed between the glass substrates. Is done. One glass substrate is provided with a switching element (for example, TFT) connected to a source wiring and a gate wiring orthogonal to each other, a pixel electrode connected to the switching element, an alignment film, and the like. The substrate is provided with a color filter and counter electrodes in which colored portions such as R (red), G (green), and B (blue) are arranged in a predetermined arrangement, and an alignment film. Among these, image data and various control signals necessary for displaying an image are supplied to a source wiring, a gate wiring, a counter electrode, and the like from a driving circuit board (not shown). A polarizing plate (not shown) is disposed outside both glass substrates.

Subsequently, the backlight device 24 will be described. FIG. 3 shows a cross-sectional view of a cross section of the liquid crystal display device 10 cut along the vertical direction (Y-axis direction). As shown in FIGS. 2 and 3, the backlight device 24 includes a frame 14, an optical member 18, and a chassis 22. The frame 14 has a frame shape, is disposed along the edge side of the surface of the light guide plate 20 (light output surface 20b), and supports the liquid crystal panel 16 along the inner edge. The optical member 18 is placed on the front side of the light guide plate 20 (the light exit surface 20b side). The chassis 22 has a substantially box shape opened to the front side (light emission side, liquid crystal panel 16 side).

In the chassis 22, a pair of

heat radiation plates

36, 36, a pair of light emitting diode (LED)

units

32, 32, a pair of pressing

members

34, 34, the reflection sheet 26, and the light guide plate 20 are accommodated. ing. The pair of

heat radiation plates

36, 36 extend in the long side direction of the chassis 22 and have a rectangular cross section, and are arranged in contact with the

side plates

22 b, 22 c on the long side of the chassis 22. The pair of

LED units

32, 32 extend in the long side direction of the chassis 22, and are arranged on the long side of the chassis 22 in contact with the inside of the heat radiating plate 36. Light is emitted toward the surface 20a side. The pair of pressing

members

34, 34 respectively extend in the long side direction of the chassis 22, and are arranged on the long side of the chassis 22 and inside the LED substrate 30 (between the LED unit 32 and the light guide plate 20). . The longitudinal side surface (light incident surface) 20a of the light guide plate 20 is disposed at a position facing each

LED unit

32, 32 via the pressing member 34, and the light emitted from the LED unit 32 is transmitted to the liquid crystal panel 16 side. Lead to. The optical member 18 is placed on the front side of the light guide plate 20. In the backlight device 24 according to the present embodiment, the light guide plate 20 and the optical member 18 are arranged directly below the liquid crystal panel 16 and the LED unit 32 that is a light source is arranged at the side end of the light guide plate 20. A so-called edge light system (side light system) is adopted.

The chassis 22 is made of a metal such as an aluminum-based material, for example, and has a bottom plate 22a having a rectangular shape in plan view,

side plates

22b and 22c rising from outer edges of both long sides of the bottom plate 22a, and each of short sides of the bottom plate 22a. It consists of a side plate that rises from the outer edge. A space facing the

LED units

32, 32 in the chassis 22 is a housing space for the light guide plate 20. A power circuit board (not shown) for supplying power to the LED unit 32 is attached to the back side of the bottom plate 22a.

The optical member 18 is formed by laminating a diffusion sheet 18a, a lens sheet 18b, and a reflective polarizing plate 18c in order from the light guide plate 20 side. The diffusion sheet 18a, the lens sheet 18b, and the reflective polarizing plate 18c have a function of converting light emitted from the LED unit 32 and passing through the light guide plate 20 into planar light. A liquid crystal panel 16 is installed on the upper surface side of the reflective polarizing plate 18 d, and the optical member 18 is disposed between the light guide plate 20 and the liquid crystal panel 16.

The LED unit 32 has a configuration in which LED light sources 28 that emit white light are arranged in a row on a resin-made rectangular LED board 30. The LED substrate 30 is disposed in a state where the surface opposite to the surface on which the LED light source 28 is disposed is in contact with the heat radiating plate 36. The LED light source 28 may emit white light by applying a phosphor having a light emission peak in a yellow region to a blue light emitting element. Alternatively, the blue light emitting element may emit white light by applying a phosphor having emission peaks in the green and red regions. Further, a phosphor having a light emission peak in a green region may be applied to a blue light emitting element, and white light may be emitted by combining a red light emitting element. The LED light source 28 may emit white light by combining a blue light emitting element, a green light emitting element, and a red light emitting element. Further, a combination of an ultraviolet light emitting element and a phosphor may be used. In particular, an ultraviolet light-emitting element may emit white light by applying a phosphor having emission peaks in blue, green, and red, respectively.

The light guide plate 20 is a rectangular plate-like member, is formed of a highly transparent (highly transparent) resin such as acrylic, is in contact with the reflective sheet 26 and is supported by the chassis 22. Yes. 2 and 3, the light guide plate 20 is a plate opposite to the light output surface 20b, with the light output surface 20b being the main plate surface facing the diffusion sheet 18a between the pair of

LED units

32 and 32. The opposite plate surface 20c, which is a surface, is arranged so as to face the reflection sheet 26 side. By arranging such a light guide plate 20, the light generated from the LED unit 32 enters from the light incident surface 20 a of the light guide plate 20 and exits from the light exit surface 20 b facing the diffusion sheet 18 a, The liquid crystal panel 16 is irradiated from the back side.

The pair of

heat radiation plates

36 and 36 is a plate-like member having heat dissipation properties, one plate surface of which is in contact with both

side plates

22b and 22c on the long side of the chassis 22, and the other plate surface is the LED substrate 30. The LED light source 28 is in contact with the plate surface on which the LED light source 28 is not disposed. The heat radiating plate 36 and the

side plates

22b and 22c of the chassis 22 are bonded to each other with, for example, an adhesive tape, so that the heat radiating plate 36 is fixed to the

side plates

22b and 22c of the chassis 22.

Next, the configuration of the pressing member 34 that is a main part of the present embodiment will be described in detail. Here, FIG. 4 is an enlarged view of a part of FIG. 3 and shows a cross-sectional view of the main part of the liquid crystal display device 10. FIG. 5 shows a view of the pressing member 34 pressed against the LED substrate 30 from the front (from the light guide plate 20 side). The pressing member 34 is formed of a hard member and has a plate shape having a plurality of openings 34a. Further, the upper and lower end portions of the pressing member 34 have a shape that protrudes toward the LED substrate 30 perpendicularly to the plate surface of the pressing member 34 (see FIGS. 2, 4, and 5).

A part of the plate surface of the pressing member 34 is in contact with the plate surface of the LED substrate 30 on the side where the LED light source 28 is disposed. The protruding portion of the pressing member 34 covers the upper end surface and the lower end surface of the LED substrate 30, and the tip thereof is in contact with the plate surface of the heat sink 36. Further, as shown in FIG. 5, a plurality of screw holes 34d are provided at both upper and lower ends of the pressing member 34, and a screw 38 is inserted into the screw hole 34d so as to penetrate the protruding portion of the pressing member 34. Then, the holding member 34 is attached to the heat dissipation plate 36 by being fastened to the heat dissipation plate 36 (see FIG. 4).

When the pressing member 34 is attached to the heat radiating plate 36, the upper and lower ends of the LED substrate 30 are sandwiched between the pressing member and the heat radiating plate (see FIG. 4). In this state, the upper and lower ends of the LED substrate 30 are pressed against the heat radiating plate 36 by the pressing member 34 by screwing the pressing member 34. Thereby, the adhesiveness of the LED board 30 and the heat sink 36 improves, and the heat which generate | occur | produces in the LED board 30 is favorably transferred to the heat sink 36 side.

The pressing member 34 has a plurality of openings 34d as described above. These openings 34d are slightly larger than the light exit surface of the LED light source 28, and each of the LED light sources 28 on the LED substrate 30 has a plurality of pieces when the pressing member 34 is attached to the heat radiating plate 36. It overlaps with the opening 34d and is inserted into the opening 34d, and irradiates the light incident surface 20a with light from the LED light source 28. For this reason, even when the pressing member 34 is attached to the heat radiating plate 36, the light emitted from the LED light source 28 can be incident on the light incident surface 20 a of the light guide plate 20.

Further, in a state where the pressing member 34 is attached to the heat radiating plate 36, the surface of the pressing member 34 opposite to the surface that contacts the LED substrate 30 is the light incident surface 20 a of the light guide plate 20 from the light emitting surface of the LED light source 28. And is in contact with the light incident surface 20a. For this reason, even when a force is exerted on the light guide plate 20 to move toward the LED light source 28 due to thermal expansion, vibration, or the like, the distance between the light incident surface 20 a of the light guide plate 20 and the LED light source 28 by the pressing member 34. Therefore, the light incident surface 20 a of the light guide plate 20 is prevented from coming into contact with the light output surface of the LED light source 28.

As described above, in the backlight device 24 according to the present embodiment, the LED substrate 30 is pressed against the heat radiating plate 36 by the pressing member 34, so that the adhesion between the LED substrate 30 and the heat radiating plate 36 is improved. For this reason, the LED substrate 30 can be brought into close contact with the heat radiating plate 36 with a small number of screws 38, and good heat dissipation can be ensured. As a result, the emission efficiency of the LED light source 28 can be prevented or suppressed from decreasing, and the life of the LED light source 28 can be prevented or suppressed from decreasing.

Further, in the backlight device 24 according to the present embodiment, the surface of the pressing member 34 opposite to the surface in contact with the LED substrate 30 is positioned on the light incident surface 20 a side from the light exit surface of the LED light source 28. For this reason, when the light incident surface 20a of the light guide plate 20 moves to the LED light source 28 side due to vibration, thermal expansion, or the like, the light incident surface 20a comes into contact with the pressing member 34. Contact with the light source 28 can be prevented. Thereby, it can prevent that the light-incidence surface 20a contact | abuts with the LED light source 28, and the LED light source 28 is damaged.

Further, in the backlight device 24 according to the present embodiment, a plurality of LED light sources 28 are arranged on the LED substrate 30, and a plurality of openings 34 a are provided at positions overlapping the LED light sources 28 of the pressing member 34. . For this reason, between the LED light sources 28 on the side of the LED substrate 30 on the side where the LED light sources 28 are arranged, the spaces between the LED light sources 28 come into contact with and are pressed against the pressing members 34. Can be pressed against.

Further, the backlight device 24 according to the present embodiment is attached to the heat sink by a part thereof being screwed to the heat sink. Thereby, since the holding member 34 can be effectively pressed against the heat radiating plate 36 by screwing a part of the holding member 34, the LED board 30 and the heat radiating plate 36 can be more closely attached to each other. It is possible to further improve the properties.

Moreover, in the backlight device 24 according to the present embodiment, the pressing member 34 is formed of a hard member. For this reason, the LED board 30 can be more effectively pressed against the heat radiating plate 36 by the pressing member 34, and the heat dissipation can be further enhanced.

<Embodiment 2>
A second embodiment will be described with reference to the drawings. FIG. 6 shows a view of the pressing member 134 pressed against the LED substrate 130 as viewed from the front in the second embodiment. In the second embodiment, the shape of the opening 134a of the pressing member 134 is different from that of the first embodiment. Since the other configuration is the same as that of the first embodiment, the description of the structure, operation, and effect is omitted. In FIG. 6, the part obtained by adding the numeral 100 to the reference numeral in FIG. 5 is the same as the part described in the first embodiment.

In the backlight device according to Embodiment 2, as shown in FIG. 6, the pressing member 134 has one rectangular opening 134 a that is horizontally long along the long side direction of the LED substrate 130. All the LED light sources 128 on the LED substrate 130 are inserted into the opening 134a. Even in such a configuration, the light emitted from the LED light source 128 is allowed to enter the light incident surface 120a of the light guide plate 120 while ensuring good heat dissipation by pressing the LED substrate 130 toward the heat radiating plate 136 by the pressing member 134. Can be incident.

<Embodiment 3>
Embodiment 3 will be described with reference to the drawings. FIG. 7 shows a view of the

pressing members

234 and 235 that are pressed against the LED substrate 230 as viewed from the front in the third embodiment. The third embodiment is different from the first embodiment in that the LED substrate 230 is pressed against the heat radiating plate 236 by the two

pressing members

234 and 235. Since the other configuration is the same as that of the first embodiment, the description of the structure, operation, and effect is omitted. In FIG. 7, a part obtained by adding the numeral 200 to the reference numeral in FIG. 5 is the same as the part described in the first embodiment.

As shown in FIG. 7, the backlight device according to Embodiment 3 has a configuration in which the upper and lower ends of the LED substrate 230 are pressed against the heat radiating plate 236 by two pressing members. In other words, the

pressing members

234 and 235 have a configuration in which the pressing member 34 in the configuration of the first embodiment is vertically separated and divided into two. Each pressing

member

234, 235 is attached to the heat sink by screws inserted into

screw holes

234d, 235d, respectively. Thus, even if it is a case where a some pressing member is used, the LED board 230 can be closely_contact | adhered with a heat sink, and favorable heat dissipation can be ensured.

<Embodiment 4>
Embodiment 4 will be described with reference to the drawings. FIG. 8 is a cross-sectional view of a main part of the liquid crystal display device 310 according to the fourth embodiment. In the fourth embodiment, the shape of the heat sink 336 is different from that of the first embodiment. Since the other configuration is the same as that of the first embodiment, the description of the structure, operation, and effect is omitted. In FIG. 8, the part obtained by adding the numeral 300 to the reference numeral in FIG. 4 is the same as the part described in the first embodiment.

In the backlight device 324 according to the fourth embodiment, as illustrated in FIG. 8, the heat radiating plate 336 includes a bottom surface portion 336 a attached to the bottom plate 322 a of the chassis 322, and a side surface portion 336 b rising from one outer edge of the bottom surface portion 336 a. And has a substantially L shape in cross-sectional view. The bottom surface portion 336a is attached to the bottom plate 322a of the chassis 322 by, for example, screwing, and thereby the heat radiating plate 336 is fixed to the bottom plate 322a. The side surface 336b is in contact with the LED substrate 330 at its plate surface. Even if the heat radiating plate 336 has such a shape, the LED substrate 330 is pressed against the heat radiating plate 336 by the pressing member 334, thereby improving the adhesion between the LED substrate 330 and the heat radiating plate 336. Can increase the sex.

The correspondence between the configuration of each embodiment and the configuration of the present invention is described. The LED substrates 30, 130, 230, and 330 are examples of the “light source substrate”. The

LED light sources

28, 128, and 228 are examples of “light sources”. The

backlight devices

24 and 324 are examples of “illumination devices”. Further, the liquid

crystal display devices

10 and 310 are examples of the “display device”.

The modifications of the above embodiments are listed below.
(1) In each of the above embodiments, the configuration in which the pressing member is attached to the heat dissipation plate by screwing the heat dissipation plate to the heat dissipation plate is illustrated, but the configuration for attaching the pressing member to the heat dissipation plate is not limited. It is only necessary that the pressing member is attached in such a manner that the LED substrate is pressed against the heat sink by the pressing member.

(2) In each of the above embodiments, the configuration in which the heat sink and the LED substrate are only in contact with each other has been exemplified. For example, the heat sink and the LED substrate are bonded to each other with an adhesive tape. Also good.

(3) In addition to the above embodiments, the shape and configuration of the pressing member, the shape and number of openings provided in the pressing member, and the like can be changed as appropriate.

(4) In addition to the above embodiments, the shape and configuration of the heat sink and the manner of attachment to the LED substrate can be changed as appropriate.

(5) In each of the above embodiments, a liquid crystal display device using a liquid crystal panel as the display panel has been illustrated, but the present invention can also be applied to display devices using other types of display panels.

(6) In each of the above embodiments, the television receiver provided with the tuner is exemplified, but the present invention can also be applied to a display device that does not include the tuner.

As mentioned above, although each embodiment of this invention was described in detail, these are only illustrations and do not limit a claim. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.

Further, the technical elements described in this specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology exemplified in this specification or the drawings can achieve a plurality of objects at the same time, and has technical usefulness by achieving one of the objects.

TV: TV receiver, Ca, Cb: cabinet, T: tuner, S: stand, 10, 110, 210: liquid crystal display, 12, 312: bezel, 14, 314: frame, 16, 316: liquid crystal panel, 18 318: optical member 20, 320: light guide plate, 20a, 320a: light incident surface, 22, 322: chassis, 24, 324: backlight device, 26, 326: reflection sheet, 28, 128, 228, 328: LED light source, 30, 130, 230, 330: LED substrate, 32, 332: LED unit, 34, 134, 234, 334: pressing member, 36, 136, 236, 336: heat sink, 38, 338: screw

Claims

A light guide plate provided with a light incident surface on a side surface;
A heat dissipating plate having heat dissipation,
A light source board disposed on one plate surface in contact with the heat sink;
A light source disposed on the other plate surface of the light source substrate so as to face the light incident surface of the light guide plate;
It is arranged between the light guide plate and the heat radiating plate, has an opening for irradiating the light incident surface with light from the light source, and is attached to a portion of the heat radiating plate that does not contact the light source substrate. A pressing member that presses the other plate surface of the light source substrate against the heat sink;
A lighting device comprising:
2. The lighting device according to claim 1, wherein the pressing member has a surface on a side opposite to a surface in contact with the light source substrate, which is located closer to the light incident surface than a light emitting surface of the light source.
A plurality of the light sources are arranged on the light source substrate,
3. The lighting device according to claim 1, wherein a plurality of the openings are provided at positions overlapping the light sources of the pressing member. 4.
4. The illumination according to claim 1, wherein a part of the pressing member is attached to the heat radiating plate by being screwed to the heat radiating plate. 5. apparatus.
The lighting device according to any one of claims 1 to 4, wherein the pressing member is formed of a hard member.
The said heat sink has a bottom face part and the side part which stands | starts up from one outer edge of this bottom face part, and makes | forms a substantially L shape in a cross sectional view. The lighting device according to item 1.
The lighting device according to any one of claims 1 to 6, wherein the light source is a white light emitting diode.
The white light-emitting diode includes a first light-emitting chip that emits blue light, and a first light-emitting layer that is provided around the first light-emitting chip and has a light emission peak in a yellow region. The lighting device according to claim 7.
The white light-emitting diode includes a first light-emitting chip that emits blue light, a second light-emitting layer that is provided around the first light-emitting chip and has emission peaks in a green region and a red region, respectively. The lighting device according to claim 7, comprising:
The white light-emitting diode includes a first light-emitting chip that emits blue light, a third light-emitting layer that is provided around the first light-emitting chip and has a light emission peak in a green region, and a second light that emits red light. The lighting device according to claim 7, further comprising: a light emitting chip.
8. The white light emitting diode includes a first light emitting chip that emits blue light, a second light emitting chip that emits red light, and a third light emitting chip that emits green light. The lighting device described.
The white light-emitting diode includes a fourth light-emitting chip that emits ultraviolet light, and a fourth light-emitting layer that is provided around the fourth light-emitting chip and has emission peaks in a blue region and a red region, respectively. The lighting device according to claim 7, further comprising:
A display device comprising a display panel that performs display using light from the illumination device according to any one of claims 1 to 12.
The display device according to claim 13, wherein the display panel is a liquid crystal panel using liquid crystal.
A television receiver comprising the display device according to claim 13 or 14.