KR20150070052A - Apparatus for loading substrate - Google Patents

Abstract

Disclosed is an apparatus for loading a substrate. According to an embodiment of the present invention, the apparatus for loading a substrate comprises: a carrier conveyor supporting a carrier having a sub carrier in which a plurality of substrates are installed, and a main carrier in which the sub carrier is combined to be removable to be transferred; a substrate handling unit for carrier loading combined to be movable on the carrier conveyor so that a plurality of substrates loaded in a substrate loading position neighboring with the carrier conveyor is transferred to the carrier on the carrier conveyor and is installed in the carrier; a cassette loading unit transferring a cassette for loading the substrate in which a plurality of substrates are loaded to a position for loading the cassette; a substrate transfer unit arranged to be neighbored with the cassette loading unit, sequentially drawing the substrate in the cassette for loading the substrate, and transferring the same in a substrate buffer position; and a substrate buffer unit arranged to be transferred between the substrate buffer position and the substrate loading position and transferring substrate on the substrate buffer position to the substrate loading position.

Description

[0001] Apparatus for loading substrate [0002]

[0001] The present invention relates to a substrate loading apparatus, and more particularly, to a substrate loading apparatus capable of carrying out a series of loading operations for mounting substrates on a carrier applied as a separation structure of a main and a sub, To a substrate loading apparatus capable of significantly improving the loading efficiency of the substrate loading apparatus.

Flat panel display substrates such as LCD (Liquid Crystal Display), PDP (Plasma Display Panel) and OLED (Organic Light Emitting Diodes) and semiconductor substrates are manufactured through various processes such as thin film deposition and etching .

The deposition process of the substrate in various processes is performed by the substrate deposition apparatus. There are two major processes for the deposition of substrates.

One is Chemical Vapor Deposition (CVD), and the other is Physical Vapor Deposition (PVD), which is widely used in accordance with current process characteristics.

The chemical vapor deposition is plasma-enhanced by an external high-frequency power source so that silicon compound ions having high energy are ejected from the showerhead through the electrode and deposited on the substrate.

In contrast, physical vapor deposition, which is referred to as a sputter, is a method of causing sufficient energy to be applied to ions in a plasma to collide with a target, and then sputtering target atoms to be deposited on the substrate.

Of course, in spite of the above-mentioned sputtering method, physical vapor deposition is mainly performed by a sputtering method, though there are methods such as E-Beam, Evaporation and Thermal Evaporation.

Meanwhile, the deposition process or the etching process described above is performed through a chamber designed to correspond to the respective processes. In order to proceed these processes, the substrate must be transferred to the corresponding chamber.

In the case of performing a deposition process or an etching process on a large-area substrate, for example, a large-area LCD substrate having a length of about 2 meters (m), the robot handles a single substrate, It is common to transfer them.

However, substrates such as those for a touch screen panel that are somewhat smaller in size or need to be increased in production per unit time are collected by transferring them to a chamber. In this case, after a plurality of substrates are mounted on a carrier called a carrier, the carriers are transferred to the chamber.

Particularly, when a substrate for a touch screen panel (TSP) described above is to be deposited by a sputtering method, a plurality of substrates are mounted on a carrier so that the carrier is transferred to the sputter chamber. When the carrier passes the sputter chamber, So that the productivity can be improved by increasing the yield by continuously performing the sputter deposition process on the substrate on the substrate.

However, since a large number of substrates are mounted on a carrier having a single body, if the size of the substrate is changed, a problem such as a carrier coupling structure including a carrier must be changed .

If a carrier capable of detachably connecting a sub carrier on which a substrate is mounted to a main carrier is developed apart from a conventional integrated carrier structure, if only a sub carrier is replaced corresponding to various substrate sizes It is expected that the process loss can be reduced. Therefore, it is necessary to develop a structure for a carrier having such a separation structure.

In order to carry out a sputtering process on a plurality of substrates, in particular, a substrate for a touch screen panel (TSP) using a carrier such as a carrier having such a separation structure, the substrates must be once handled and mounted on the carrier. In order to proceed sequentially, however, there is a need for a substrate loading apparatus.

However, until now, a series of loading methods for handling substrates for a touch screen panel (TSP) one by one using a simple transfer robot or a robot and then transferring them to a carrier have been applied or prepared. However, It is required to research and develop a substrate loading apparatus capable of efficiently loading the substrate without any temporal and process loss.

Korea Patent Office Application No. 10-2011-0037080

SUMMARY OF THE INVENTION Accordingly, the present invention has been made in view of the above problems, and it is an object of the present invention to provide an apparatus and a method for mounting a substrate on a carrier applied with a main structure and a sub structure, And to provide a substrate loading apparatus capable of making the substrate.

According to an aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: a sub-carrier on which a plurality of substrates are mounted; and a carrier conveyor for transportably supporting a carrier having a main carrier detachably coupled with the sub- Carrier Conveyor); A substrate handling unit for loading a carrier, the substrate handling unit being movably coupled to the carrier conveyor such that a plurality of substrates loaded at a substrate loading position adjacent to the carrier conveyor are transferred to the carrier on the carrier conveyor and mounted on the carrier; A cassette loading unit for transferring a cassette for loading substrates onto which the plurality of substrates are loaded, to a cassette loading position; A substrate transfer unit disposed adjacent to the cassette loading unit and configured to sequentially take out the substrate in the cassette for loading and transfer it to a substrate buffer position; And a substrate buffer unit transferable between the substrate buffer position and the substrate loading position to transfer the substrates on the substrate buffer position to the substrate loading position.

Wherein the carrier conveyor comprises: a conveyor block having a front surface opened and a slot for a carrier entrance / exit through which the carrier enters and exits, And a carrier conveyor provided in the conveyor block for conveying the carrier into or out of the conveyor block.

Wherein the carrier conveyor is disposed on a rear surface of the conveyor block and the substrate handling unit for loading the carrier moves the substrate to the sub carrier by adsorbing the substrate to the sub carrier when the substrate is disposed adjacent to the sub carrier And a load pad.

The carrier conveying body includes a carrier conveying roller which is disposed in a lower region of the conveyor block and is supported at a lower end of the carrier and conveys the carrier by rolling movement; And a carrier guide disposed in an upper area within the conveyor block and guiding an upper end of the carrier when the carrier is transported.

The substrate handling unit for loading a carrier includes: a plurality of carrier side substrate holding members for gripping a plurality of substrates loaded at the substrate loading position; And a holding member handler for handling the plurality of carrier-side substrate holding members such that the plurality of carrier-side substrate holding members are moved to positions on the carrier.

The substrate handling unit for loading a carrier may further include a gripping member connecting part for integrally connecting the plurality of carrier side substrate holding members, and the gripping member handler may be connected to the gripping member connecting part.

Wherein the grip member handler includes: a pair of hands to which an end region is coupled to the grip member connection portion; A hand rotating module in which the pair of hands are rotatably supported; A rotary module supporting slider for supporting the hand rotating module; And a pair of guide columns connected to the slider for supporting the rotation module and guiding the slider for supporting the rotation module to move in the vertical direction of the carrier.

Wherein the cassette loading unit comprises: a cassette supply unit for supplying a cassette for loading a substrate on which the substrate is loaded to the cassette loading position; And a cassette collecting unit disposed at a position lower than the cassette supplying unit and collecting empty cassettes from which the substrate has been drawn out.

Wherein the cassette supply unit includes a plurality of cassette supply conveyors arranged to be separated from each other along a feeding direction of the cassettes for loading the cassettes into the cassette loading position, And a plurality of cassette collection conveyors disposed to be separated from each other along the longitudinal direction.

The cassette feed conveyor and the cassette return conveyor are both roller conveyors, the rollers on the cassette feed conveyor are arranged in a line, and the rollers on the cassette return conveyor can be arranged in an intersecting manner.

The cassette supply conveyor adjacent to the cassette loading position among the cassette supply conveyors may further include a cassette up / down driving unit for driving the cassette for loading / unloading the substrate.

Wherein the substrate transfer unit comprises: a cassette-side fork for withdrawing a substrate loaded on the cassette for mounting a substrate; A cassette side substrate holding member for holding a substrate drawn out through the cassette side fork; And a gripping member transfer connected to the cassette-side substrate holding member for transferring the cassette-side substrate holding member.

The cassette side fork and the cassette side substrate holding member may be arranged in a dual arrangement.

The gripping member transfer being connected to the cassette-side substrate grasping member and moving the cassette-side substrate holding member along an X-axis direction that is a direction in which the cassette for loading a substrate is supplied; And a Y-axis moving body connected to the X-axis moving body and moving the X-axis moving body along a Y-axis direction crossing the X-axis.

The substrate transfer unit may further include a cassette-side fork X-axis driving unit connected to the cassette-side fork to drive the cassette-side fork along an X-axis direction in which the cassette for supplying a substrate is supplied.

The substrate buffer unit comprising: a substrate buffer die disposed at the substrate buffer location; And a plurality of carrier-side forks for transferring substrates on the die for substrate buffer to the substrate loading position while being moved toward or away from the substrate buffer die.

A plurality of spacers for separating the substrate from the upper surface of the substrate buffer die may be provided on the substrate buffer die.

The substrate buffer unit further includes a carrier-side fork X-axis driving unit connected to the plurality of carrier-side forks to drive the plurality of carrier-side forks along an X-axis direction in which the plurality of carrier-side forks are driven .

According to the carrier of the present invention, it is possible to carry out a series of loading operations for mounting substrates on a carrier applied with a separation structure of a main (main) and a sub (sub) by an organic mechanism, .

1 is a schematic perspective view of a substrate loading apparatus according to an embodiment of the present invention.
2 is an enlarged perspective view of the cassette loading unit;
3 is an enlarged perspective view of the substrate transfer unit.
Figures 4 and 5 are views of a carrier conveyor, a substrate handling unit for carrier loading, and a substrate buffer unit, respectively.
6 is a side view of the carrier conveyor.
7 is a front structural view of the carrier.
8 to 10 are diagrams showing the operation of the rotary clamping module in a step-by-step manner.
11 to 13 are diagrams showing the operation of the safety pin module in stages.
FIGS. 14 to 18 are diagrams showing steps in which a substrate is mounted on a subcarrier, respectively.
FIGS. 19 to 27 are diagrams showing the operation of the substrate loading apparatus according to an embodiment of the present invention, respectively.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

FIG. 1 is a schematic perspective view of a substrate loading apparatus according to an embodiment of the present invention, FIG. 2 is an enlarged perspective view of a cassette loading unit, FIG. 3 is an enlarged perspective view of a substrate transfer unit, 6 is a side view of the carrier conveyor, Fig. 7 is a front structural view of the carrier, and Figs. 8 to 10 are views showing steps of the operation of the rotary clamping module, respectively, FIGS. 11 to 13 are diagrams showing the operation of the safety pin module in stages, FIGS. 14 to 18 are views showing steps of mounting the substrate on the subcarriers, respectively, and FIGS. 19 to 27 Are diagrams each showing a stepwise operation of the substrate loading apparatus according to an embodiment of the present invention.

Referring to these drawings, the substrate loading apparatus according to the present embodiment can perform a series of loading operations for mounting substrates on the carrier 100 by an organic mechanism, thereby greatly improving the loading efficiency of the substrate. A carrier conveyor 140, a substrate handling unit 150 for loading a carrier, a cassette loading unit 160, a substrate transfer unit 170, and a substrate buffer unit 180.

A carrier conveying unit 140, a carrier handling unit 150 for loading a carrier, a cassette loading unit 160, a substrate transfer unit 170, and a substrate buffer unit 180, as shown in FIGS. 1 and 19 to 27, The substrates can be mounted on the carrier 100 by the interaction of the substrates. Since the loading mechanisms at this time are operated mutually organically, the loading efficiency of the substrate can be greatly improved.

Particularly, in the case of this embodiment, since the carrier 100 is applied as a separate structure of main and sub rather than the conventional integrated structure, it can be applied to various substrate sizes without much process loss It is advantageous.

The structure of the carrier 100 will be described first. In this embodiment, the carrier 100 includes a sub-carrier 110 on which a plurality of substrates are mounted, a main carrier 110 on which the sub- 120, Main Carrier).

As the carrier 100 has a structure in which the sub carrier 110 is attached to and detached from the main carrier 120, there is an advantage that the carrier 100 can be easily changed.

For example, the substrate used in this embodiment may be a substrate for a touch screen panel. If the size of the substrate is changed, a carrier coupling structure including an integrated carrier (not shown) change has occurred.

However, in the present embodiment, since the carrier 100 has a structure in which the sub carrier 110 is attached to and detached from the main carrier 120, only the sub carrier 110 corresponding to various substrate sizes needs to be replaced, It is possible to reduce the loss.

A plurality of rotation clamping modules 131 and a plurality of safety pin modules 133 are mounted on the subcarrier 110 and the main carrier 120 so that the subcarriers 110 on which a plurality of substrates are mounted are fixed to the main carrier 120. [ .

The rotary clamping module 131 is configured to clamp the subcarrier 110 relative to the main carrier 120 while being rotated as the subcarrier 110 is mounted on the main carrier 120. [ .

As shown in FIG. 7, the rotation clamping modules 131 are disposed along the circumferential direction of the subcarriers 110 to mount and couple the subcarriers 110 to the main carrier 120.

8 to 10, the rotary clamping module 131 includes a module body 131a and a pair of clamps 131a and 132b rotatably coupled to the module body 131a via a rotary shaft 131b. And clamps 131c and 131d.

At this time, the pair of clamp clamps 131c and 131d includes a fixed clamp clamp 131c and a movable clamp clamp 131d in which a relative position with respect to the fixed clamp clamp 131c is adjustable.

The fixed clamp clamp 131c is connected to the rotary shaft 131b and is coupled to the module body 131a. The fixed clamp clamp 131c is rotated with the rotary shaft 131b as the central axis, but the fixed clamp clamp 131c is not moved to the movable clamp clamp 131d.

On the other hand, the movable clamp clamp 131d is engaged by the clamp pin 131e at one end region of the fixed clamp clamp 131c. At this time, a separate sliding pad 131f is connected to the movable clamp 131d and is coupled to the clamp pin 131e. When the clamp pin 131e is coupled to the elongated hole 131g on the fixed clamp clamp 131c, It is possible to adjust the position of the movable clamp 133d through the clamp pin 131e, that is, the relative position with respect to the fixed clamp clamp 131c.

Since the relative position of the movable clamp 113d with respect to the fixed clamp 113c can be adjusted, it is advantageous to be commonly applied to the sub-carriers 110 of various sizes.

When the sub carrier 110 is approached to the main carrier 120 as shown in FIGS. 8 to 10, the pair of clamp clamps 131c and 131d are rotated about the rotating shaft 131b, The sub carrier 110 can be easily coupled onto the main carrier 120 by pressing the sub carrier 110 toward the main carrier 120 side.

As shown in FIGS. 7 and 11 to 13, a plurality of safety pin modules 133 are provided at neighboring positions of the rotary clamping module 131 having such a structure.

The safety pin modules 133 are disposed at neighboring positions of the rotary clamping module 131 and serve to prevent any deviation of the subcarriers 110 when the subcarriers 110 are mounted on the main carrier 120 do.

11 to 13, the safety pin module 133 includes a module frame 133a fixed to the main carrier 120, and a module frame 133a provided in the module frame 133a so as to be able to move in and out of the module frame 133a, And a safety pin 133b which is inserted into the pin groove 111 selectively.

The safety pin 133b is a member which moves to the inside or outside of the module frame 133a as shown in FIGS. 11 and 13. The safety pin 133b is connected to a safety pin elastic member (not shown).

At this time, the safety pin elastic member is a torsion coil compression spring, and the safety pin 133b is elastically biased in a direction in which the safety pin 133b is inserted into the pin groove 111. Therefore, when the inclined stopping bar 133e is released from the inclined groove 133d of the safety pin drive block 133c, the compressed safety pin elastic member is expanded and the safety pin 133b is pushed by the force, The safety pin 133b is inserted into the pin groove 111 of the sub carrier 110 while being exposed to the outside of the module frame 133a as shown in FIG.

A safety pin driving block 133c connected to the safety pin 133b and driving the safety pin 133b is provided in the module frame 133a.

The safety pin drive block 133c is formed with an inclined groove portion 133d into which an end of the inclined stopping bar 133e is inserted or released. Due to the structural feature of the inclined groove 133d, the operation of the inclined stopping bar 133e is made free.

11 and 12, when the sub carrier 110 approaches and is adjacent to the main carrier 120, the inclined stopping bar 133e is separated from the inclined groove portion 133d of the safety pin driving block 133c as shown in FIG. do. The safety pin 133b is exposed to the outside of the module frame 133a as shown in FIG. 13, and the pin hole 111b of the sub pin 110 So that any deviation of the subcarrier 110 is prevented.

On the other hand, as described above, after the substrate is mounted on the sub-carrier 110, the sub-carrier 110 takes the form of being mounted on, i.e., coupled to, the main carrier 120.

Of course, since there is no need to handle substrates of different sizes during the process, there is no need to separate the main carrier 120 and the subcarrier 110 from time to time. Only when the process is changed and the size of the substrate is changed, Replace.

Even if any kind of subcarrier 110 is replaced, the substrates are transported by the substrate loading apparatus, that is, the carrier conveyor 140, the substrate handling unit 150 for loading a carrier, Is loaded into the subcarrier 110 after being transferred by the interaction of the loading unit 160, the substrate transfer unit 170, and the substrate buffer unit 180.

To this end, a sub-carrier 110 is provided with a substrate holder 136 for locking or unlocking the substrate while being rotated by a push pin 135 provided on the carrier conveyor 140 side .

The carrier conveyor 140 is further provided with a movable rod pad 137 as a means for mounting the substrate in addition to the push pin 135. The operation of the push pin 135 and the movable rod pad 137 allows the substrate First, the process of mounting the antenna to the carrier 110 will be described with reference to FIGS. 14 to 18. FIG.

The push pin 135 provided on the carrier conveyor 140 side is a rod-like member that is advanced or retracted by the cylinder and presses the substrate holder 136 provided on the sub carrier 110 at the time of advancing. The substrate holder 136 is a member rotated with the holder rotation shaft 136a as an axis, and an elastic clip 136b (see Figs. 15 and 17) for fixing the substrate is provided at one side thereof.

The movable load pad 137 is disposed on the rear side of the conveyor block 141 and the carrier side substrate holding member 151 of the substrate handling unit 150 for loading a carrier places the substrate adjacent to the sub carrier 110 The substrate is attracted and moved to the sub carrier 110 side. The movable rod pad 137 can also be advanced or retracted by the cylinder.

14, when the push pin 135 is advanced as shown in FIG. 14, the substrate holder 136 is rotated with the holder rotation shaft 136a as an axis by the urging force of the push pin 135, And waits in an unlocking state. At this time, the movable rod pad 137 is advanced to adsorb the substrate transferred by the carrier-side substrate holding member 151 of the substrate loading handling handling unit 150 in vacuum.

Then, as the carrier side substrate holding member 151 is operated as shown in FIG. 16, the substrate is separated from the carrier side substrate holding member 151. In this state, as shown in FIG. 17, the movable rod pad 137 which adsorbs the substrate is moved backward to dispose the substrate on the surface of the sub carrier 110. 18 where the substrate holder 136 is rotated and the elastic clip 136b of the substrate holder 136 elastically fixes the substrate as the push pin 135 pushing the substrate holder 136 is retracted State.

In this embodiment, the substrates may be arranged on the subcarrier 110 in the form of, for example, five rows and four columns, in which case the substrate holders 136 of each row may be operated simultaneously. Of course, individual operations are possible, but it is advantageous in terms of control to be operated simultaneously. For reference, the substrates do not have to be arranged in a form on the subcarrier 110, so that the scope of the present invention can not be limited to such a figure.

The structure of the substrate loading apparatus for mounting the substrate on the sub carrier 110 in this manner will be described in detail.

First, the carrier conveyor 140 is a structure for transportably supporting the carrier 100, as shown in Figs. 1 and 4 to 6.

The carrier conveyor 140 includes a conveyor block 141 having a front opening and a slot 141a for a carrier entrance and exit through which the carrier 100 enters and exits and a conveyor block 141 provided on the conveyor block 141, And a carrier conveying member 142 for conveying the conveyor block 141 inside and outside.

After the carrier 100 is pulled into the conveyor block 141 of the carrier conveyor 140 having the above structure, the substrates are mounted on the subcarriers 110 of the carrier 100, and the carriers 100 Is conveyed by the carrier conveyer 142 through the carrier entrance slot 141a of the carrier conveyor 140 and transferred to a place for the process.

A carrier conveying body 142 for conveying the carrier 100 is disposed in a lower region of the conveyor block 141 and is supported at the lower end of the carrier 100 and is supported by a carrier conveying roller And a carrier guide 144 disposed in an upper region within the conveyor block 141 and guiding an upper end portion of the carrier 100 when the carrier 100 is conveyed. At this time, the carrier guide 144 may be a magnet type guide.

Since the carrier is mounted on the carrier 100 in a state where the carrier 100 is vertically erected, the carrier conveying body 142 is supported by the carrier conveying roller 143 at the lower end and the carrier guide 144 at the upper end, . ≪ / RTI >

However, the substrate may be mounted on the carrier 100 in a state where the carrier 100 is laid horizontally. In such a case, it may suffice that the carrier transfer body 142 is applied to the carrier transferring roller 143.

The push pins 135 and the movable rod pads 137 described above may be disposed behind the conveyor block 141 and operated.

Next, a substrate handling unit 150 for loading a carrier, as shown in FIGS. 1 and 4 and 5, includes a plurality of substrates loaded at a substrate loading position adjacent to the carrier conveyor 140, And is movably coupled to the carrier conveyor 140 so that the sub carrier 110 can be mounted on the sub carrier 110. [

Here, the substrate loading position is a position where the substrates are lined and loaded at a position directly under the front side of the carrier conveyor 140 as shown in FIG. 27. When the substrate is loaded at the substrate loading position, the substrate handling unit 150 for loading a carrier Are operated to transfer the substrates to the subcarrier 110 and then the substrates can be mounted on the subcarrier 110 by the operation of the push pins 135 and the mobile rod pads 137. [

The substrate handling unit 150 for loading a carrier includes a plurality of carrier side substrate holding members 151 for gripping a plurality of substrates loaded at a substrate loading position and a plurality of carrier side substrate holding members 151, Side substrate grasping member 151 to move the carrier-side substrate grasping member 151 to a predetermined position.

The carrier-side substrate holding member 151 is a member holding the substrate while being moved forward and backward on both sides of the substrate similarly to the cassette-side substrate holding member 172 (see FIG. 3) described later.

The carrier side substrate holding member 151 includes a gripping body 151a and a pair of gripping grips 151b which are driven so as to approach each other or to be separated from each other at both sides of the gripping body 151a.

The pair of gripping tabs 151b can grasp the substrate when they are mutually approached, and can release the substrate when mutually spaced. A state in which the pair of gripping tabs 151b are separated from each other and the substrate is placed corresponds to FIG.

In this embodiment, a plurality of carrier-side substrate holding members 151 are provided, and a plurality of carrier-side substrate holding members 151 are integrally connected so that a plurality of carrier-side substrate holding members 151 can be operated together at one time And a grip member handler 152 is further connected to the grip member connecting portion 153. [

Therefore, when the grip member handler 152 is operated, all of the carrier-side substrate holding members 151 connected to the grip member connecting portion 153 can be operated at the same time.

The grip member handler 152 includes a pair of hands 152a to which an end region is coupled to the grip member connecting portion 153, a hand rotating module 152b to which the pair of hands 152a are rotatably supported, A slider 152c for supporting the rotation module 152b supporting the rotation module 152b and a slider 152c for supporting the rotation module are connected to the slider 152c for supporting the rotation module 152, And a pair of guide columns 152d.

As shown in FIG. 4, the plurality of substrates loaded in the substrate loading position (FIG. 27) are held in the state in which the carrier side substrate holding members 151 are arranged in the horizontal direction, and then the hand rotating module 152b and the rotating module support The slider 152c can be vertically transmitted to the vertical carrier 100 as shown in FIG.

In this way, the substrate handling unit 150 for carrier loading grasps a plurality of substrates loaded at the substrate loading position and transfers them to the carrier 100, thereby performing a series of operations to allow the substrates to be automatically mounted on the carrier 100 And the loading efficiency of the substrate can be greatly improved.

Next, the cassette loading unit 160 serves to transfer the cassette C for loading a substrate onto which a plurality of substrates are stacked, as shown in Figs. 1 and 2, to the cassette loading position. The cassette loading position refers to a position disposed at the foremost position among the cassettes C for stacking substrates arranged along the + X axis direction in Fig.

The cassette loading unit 160 includes a cassette supply unit 161 for supplying a cassette C for loading a substrate with a substrate to a cassette loading position and a cassette loading unit 161 disposed at a position lower than the cassette supply unit 161, And a cassette recovery unit 162 for recovering the cassette.

For efficiency of the process, the cassette supply unit 161 may be disposed at a position higher than the cassette collecting unit 162. [

The cassette supply unit 161 may include a plurality of cassette supply conveyors 161a which are disposed to be separated from each other along a direction (X axis) in which cassettes C for loading a substrate are supplied to a cassette loading position. The cassette collecting unit 162 may include a plurality of cassette collecting conveyors 162a that are disposed to be separated from each other along the direction in which empty cassettes are collected at the cassette loading position.

At this time, both the cassette supply conveyor 161a and the cassette return conveyor 162a can be applied as roller conveyors, in which the rollers 161b on the cassette supply conveyor 161a are arranged in a line, while the cassette supply conveyor 162a, The rollers 162b and 162c are arranged in an intersecting manner.

Therefore, the cassettes C for loading substrates can be supplied while moving in the + X-axis direction along the cassette supply conveyor 161a. On the other hand, the empty cassettes can be retrieved while being moved in the -X-axis direction along the rollers 162b and 162c on the cassette recovery conveyor 162a and then moved again in the -Y-axis direction.

On the other hand, in the structure of the cassette loading unit 160, the cassette supply conveyor 161a adjacent to the cassette loading position among the cassette supply conveyors 161a is up / down driven A cassette up / down driving unit (not shown) is further provided.

Actually, when the substrate transfer unit 170 fetches and transports the substrates one by one from the cassette C for loading a substrate placed at the cassette loading position, it is interlocked with the operation of one time of the cassette side fork 171 of the substrate transfer unit 170 The cassette C for loading a substrate can be operated downward by one space. For this purpose, a cassette up / down driving unit is provided.

Next, the substrate transfer unit 170 is disposed adjacent to the cassette loading unit 160, as shown in FIGS. 1 and 3, sequentially taking out the substrates in the cassette C for loading a substrate, . The substrate buffer position refers to the area where the substrate buffer die 181 is located.

The substrate transfer unit 170 includes a cassette side fork 171 for pulling out the substrate loaded on the cassette C for loading a substrate and a cassette side substrate holding member for gripping the substrate pulled out through the cassette side fork 171 And a gripping member transfer 173 connected to the cassette-side substrate holding member 172 for transferring the cassette-side substrate holding member 172. [

The cassette-side fork 171 is operated forward and backward by the cassette-side fork X-axis driving portion 174. That is, the cassette-side fork 171 is moved back and forth by the cassette-side fork X-axis driving portion 174, and the substrates are sequentially taken out from the lower end portion of the cassette C for loading a substrate.

The cassette-side substrate holding member 172 serves to grip the substrate drawn out by the cassette-side fork 171. Since the structure of the cassette-side substrate holding member 172 is the same as the structure of the carrier-side substrate holding member 151 described above, duplicate explanation is avoided.

The gripping member transfer 173 is connected to the cassette side substrate holding member 172 and is movable in the X axis direction which is the direction in which the cassette C for loading a substrate is supplied. Axis moving body 173a which is connected to the X-axis moving body 173a and a Y-axis moving body 173b which moves the X-axis moving body 173a along the Y-axis direction crossing the X-axis.

As the cassette side substrate holding member 172 is connected to the X axis moving body 173a and the Y axis moving body 173b as described above, the substrate is held by the cassette side substrate holding member 172 at the substrate buffer position Lt; / RTI >

In the present embodiment, the cassette side fork 171 and the cassette side substrate holding member 172 are arranged in a dual manner and are alternately operated as in the operations of FIGS. 19 to 27, so that the substrate is held on the substrate buffer die 181 To the substrate buffer position. Therefore, it can contribute to productivity improvement due to reduction of tact time.

After the cassette loading unit 160 and the substrate transfer unit 170 transfer the cassettes C for loading the substrates to the cassette loading position, the substrates in the cassettes C for loading the substrates are sequentially taken out to the substrate loading position A series of operations for aligning can be carried out by an organic mechanism, and the loading efficiency of the substrate can be greatly improved.

Finally, the substrate buffer unit 180 is transportably provided between the substrate buffer position (Figure 26) and the substrate loading position (Figure 27), as shown in Figures 1, 4 and 5, And to transfer the substrates to the substrate loading position.

This substrate buffer unit 180 includes a die 181 for a substrate buffer disposed at a substrate buffer position and a substrate buffer 182 for holding substrates on the die 181 for substrate buffer into a substrate loading position Side forks 182 for transferring the carrier-side forks 182. [

Above the substrate buffering die 181 are provided a plurality of spacing members 181a for separating the substrate from the upper surface of the substrate buffering die 181. The carrier-side fork 182 can lift and move the substrate due to the spacing members 181a.

Although a total of five substrates are loaded on the substrate buffer die 181, the carrier-side forks 182 are also operated in a set of five.

The substrate buffer unit 180 is connected to a plurality of carrier-side forks 182 to drive the plurality of carrier-side forks 182 along the X-axis direction in which the plurality of carrier-side forks 182 are driven, The X-axis driver 183 is further applied. The carrier-side fork X-axis driving section 183 can be applied to a cylinder or a linear motor in the same manner as the cassette-side fork X-axis driving section 174 described above.

As described above, the substrate buffer unit 180 is applied to transfer a plurality of substrates to be mounted on the sub carrier 110 to the substrate buffer position first, and then to be transferred to the substrate loading position according to the process conditions. It is possible to improve the loading efficiency of the substrate, thereby reducing the tact time and contributing to the improvement of the productivity.

The operation of the substrate loading apparatus having such a configuration will be briefly described.

The substrate transfer unit 170 is moved by the cassette loading unit 160 in a state in which the cassette C for substrate stacking is moved to the cassette loading position, The substrate is sequentially transferred to the substrate buffer position on the substrate buffer die 181 (see Figs. 19 to 25).

When the substrates are firstly loaded into the substrate buffer position on the substrate buffer die 181, the carrier-side fork 182 is operated and transported to the substrate loading position as shown in Figs. 26 and 27.

When the substrate is loaded in the substrate loading position (see FIG. 27), the substrate handling unit 150 for carrier loading is operated to transfer the substrates to the subcarrier 110 and then the push pins 135 and the movable load pads The substrates can be mounted on the sub-carrier 110 by the operation of the sub-carrier 137.

According to this embodiment having such a structure and operation, it is possible to carry out a series of loading operations for mounting the substrates on the carrier 100 applied with the separation structure of Main and Sub, by an organic mechanism, It is possible to greatly improve the loading efficiency.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

100: carrier 110: subcarrier
111: Pin groove 120: Main carrier
131: rotation clamping module 131a: module body
131b: rotating shaft 131c: fixed clamp clamp
131d: movable clamp clamp 131e: clamp pin
131f: Sliding pad 131g: Long hole
133: Safety pin module 133a: Module frame
133b: Safety pin 133c: Safety pin driving block
133d: inclined groove portion 133e: inclined stopping bar
135: push pin 136: substrate holder
137: Mobile Road Pad 140: Carrier Conveyor
141: Conveyor block 141a: Slot for carrier entry and exit
142: Carrier conveying member 143: Carrier conveying roller
144: carrier guide 150: substrate handling unit for carrier loading
151: carrier side substrate holding member 152: holding member handler
152a: Hand 152b: Hand rotation module
152c: slider for supporting the rotation module 152d: guide column
153: gripping member connecting portion 160: cassette loading unit
161: Cassette supply unit 161a: Cassette supply conveyor
162: cassette collecting section 162a: cassette collecting conveyor
170: substrate transfer unit 171: cassette side fork
172: cassette side substrate holding member 173: holding member transfer
173a: X-axis moving body 173b: Y-axis moving body
174: cassette side fork X-axis driving unit 180: substrate buffer unit
181: substrate buffer die 181a: spacing member
182: Carrier-side fork 183: Carrier-side fork X-axis driver

Claims (18)

A carrier conveyor for transportably supporting a carrier having a sub carrier on which a plurality of substrates are mounted and a main carrier on which the sub carrier is detachably coupled;
A substrate handling unit for loading a carrier, the substrate handling unit being movably coupled to the carrier conveyor such that a plurality of substrates loaded at a substrate loading position adjacent to the carrier conveyor are transferred to the carrier on the carrier conveyor and mounted on the carrier;
A cassette loading unit for transferring a cassette for loading substrates onto which the plurality of substrates are loaded, to a cassette loading position;
A substrate transfer unit disposed adjacent to the cassette loading unit and configured to sequentially take out the substrate in the cassette for loading and transfer it to a substrate buffer position; And
And a substrate buffer unit transportable between the substrate buffer position and the substrate loading position to transfer substrates on the substrate buffer location to the substrate loading position. The method according to claim 1,
The carrier conveyor includes:
A conveyor block having a front opening and a slot for a carrier entrance / exit through which the carrier enters and exits, And
And a carrier conveying body provided in the conveyor block for conveying the carrier into and out of the conveyor block. 3. The method of claim 2,
The carrier conveyor includes:
A load pad disposed on a rear surface of the conveyor block for moving the substrate to the sub carrier side when the substrate handling unit for loading the carrier places the substrate adjacent to the sub carrier The substrate loading apparatus comprising: 3. The method of claim 2,
Wherein the carrier transfer body comprises:
A carrier conveying roller disposed in a lower region of the conveyor block and supported at a lower end of the carrier, for conveying the carrier by rolling movement; And
And a carrier guide disposed in an upper region of the conveyor block and guiding an upper end portion of the carrier when the carrier is conveyed. The method according to claim 1,
Wherein the carrier handling unit for loading a carrier comprises:
A plurality of carrier side substrate holding members for gripping a plurality of substrates loaded at the substrate loading position; And
And a gripping member handler for handling the plurality of carrier side substrate holding members such that the plurality of carrier side substrate holding members are moved to positions on the carrier. 6. The method of claim 5,
Wherein the carrier handling unit for carrier loading further comprises a gripping member connection part for integrally connecting the plurality of carrier side substrate holding members,
And the gripping member handler is connected to the gripping member connecting portion. The method according to claim 6,
The grip member handler includes:
A pair of hands to which an end region is coupled to the holding member connecting portion;
A hand rotating module in which the pair of hands are rotatably supported;
A rotary module supporting slider for supporting the hand rotating module; And
And a pair of guide columns connected to the slider for supporting the rotation module and guiding the slider for supporting the rotation module to move in the vertical direction of the carrier. The method according to claim 1,
Wherein the cassette loading unit comprises:
A cassette supply unit for supplying a cassette for loading substrates onto the cassette loading position; And
And a cassette collecting unit disposed at a lower position than the cassette supplying unit and collecting a vacant cassette from which the substrate is drawn out. 9. The method of claim 8,
Wherein the cassette supply portion includes a plurality of cassette supply conveyors arranged to be separated from each other along a direction in which the cassettes for loading a substrate are supplied to the cassette loading position,
Wherein the cassette collecting unit includes a plurality of cassette collecting conveyors disposed to be separated from each other along a direction in which the empty cassettes are collected at the cassette loading position. 10. The method of claim 9,
Wherein the cassette supply conveyor and the cassette return conveyor are both roller conveyors,
The rollers on the cassette feed conveyor are arranged in a line,
Wherein the rollers on the cassette return conveyor are arranged in an intersecting manner. 10. The method of claim 9,
Wherein the cassette supply conveyor adjacent to the cassette loading position of the plurality of cassette supply conveyors further comprises a cassette up / down driving unit for up / down driving the cassettes for loading a substrate. . The method according to claim 1,
Wherein the substrate transfer unit comprises:
A cassette-side fork for withdrawing the substrate loaded on the cassette for loading a substrate;
A cassette side substrate holding member for holding a substrate drawn out through the cassette side fork; And
And a gripping member transfer device connected to the cassette-side substrate holding member for transferring the cassette-side substrate holding member. 13. The method of claim 12,
And the cassette side fork and the cassette side substrate holding member are arranged in a dual arrangement. 13. The method of claim 12,
The gripping member transfer may include:
An X-axis moving body connected to the cassette-side substrate holding member and moving the cassette-side substrate holding member along an X-axis direction that is a direction in which the cassette for loading a substrate is supplied; And
And a Y-axis moving body connected to the X-axis moving body and moving the X-axis moving body along a Y-axis direction intersecting with the X-axis. 13. The method of claim 12,
Wherein the substrate transfer unit comprises:
Further comprising a cassette-side fork X-axis driving unit connected to the cassette-side fork to drive the cassette-side fork along an X-axis direction in which the cassette for feeding a substrate is supplied. The method according to claim 1,
The substrate buffer unit includes:
A substrate buffer die disposed at the substrate buffer location; And
And a plurality of carrier-side forks for transferring substrates on the die for substrate buffer to the substrate loading position while being moved toward or away from the substrate buffer die. 17. The method of claim 16,
And a plurality of spacers for separating the substrate from the upper surface of the substrate buffer die are provided on the substrate buffer die. 17. The method of claim 16,
The substrate buffer unit includes:
Further comprising a carrier-side fork X-axis driving unit connected to the plurality of carrier-side forks to drive the plurality of carrier-side forks along an X-axis direction in which the plurality of carrier-side forks are driven. Device.

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