KR20150053084A - Method of fabricating flexible organic light emitting diode display device - Google Patents

Abstract

A method for manufacturing a flexible organic light emitting diode display device is to connect, easily, an organic light emitting diode panel with a cover window which is bent at a radius of curvature of 20 mm or less by completing the connection through hardening after a first connection of the cover window and the organic light emitting diode panel with a half-hardened adhesive, and at the same time, to improve a curved part concrescence defect generated during the connection. The method for manufacturing a flexible organic light emitting diode display device comprises the steps of: preparing an organic light emitting diode panel; adhering a half hardened adhesive on the upper part of the organic light emitting diode panel; loading the organic light emitting diode panel adhered with the half hardened adhesive on a jig; positioning a cover window whose both ends are bent on the upper part of the jig on which the organic light emitting diode panel is loaded; combining the organic light emitting diode panel with the cover window by using the half hardened adhesive; completing the connection of the organic light emitting diode panel and the cover window by hardening the half hardened adhesive through radiation of ultraviolet rays in the state that the organic light emitting diode panel and the cover window are combined; and separating the completely connected organic light emitting diode panel from the jig.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a flexible organic light emitting diode (LED)

The present invention relates to a method of manufacturing a flexible organic light emitting diode display device, and more particularly, to a method of manufacturing a flexible organic light emitting diode display device bending with a small radius of curvature.

In recent years, there has been a growing interest in information display and a demand for a portable information medium has increased, and a lightweight flat panel display (FPD) that replaces a cathode ray tube (CRT) And research and commercialization are being carried out.

In the field of flat panel display devices, a liquid crystal display device (LCD), which has been light and consumes less power, has attracted the greatest attention, but a new display device has been actively developed according to various demands.

Since the organic light emitting diode display device, which is one of the new display devices, has a self-emission type, it has a better viewing angle and contrast ratio than the liquid crystal display device and does not require a backlight. Do. In addition, it has the advantage of being able to drive a DC low voltage and has a high response speed, and is particularly advantageous in terms of manufacturing cost.

Unlike a liquid crystal display device or a plasma display panel (PDP), the manufacturing process of the organic light emitting diode display device is very simple because the deposition and encapsulation processes are all processes . Further, if the organic light emitting diode display device is driven by an active matrix method having a thin film transistor (TFT) as a switching element for each pixel, even if a low current is applied, the same luminance is exhibited, It has advantages of fixed tax and large size.

1 is a diagram for explaining the principle of light emission of a general organic light emitting diode display device.

A typical organic light emitting diode display device includes an organic light emitting diode panel having an organic light emitting diode formed therein. 1, the organic light emitting diode includes organic compound layers 30a, 30b, 30c, 30d, and 30e formed between an anode 18 as a pixel electrode and a cathode 28 as a common electrode, Respectively.

The hole injection layer 30a, the hole transport layer 30b, the emission layer 30c, the electron injection layer 30b, the electron injection layer 30c, and the electron injection layer 30c are formed on the organic compound layers 30a, 30b, 30c, An electron transport layer 30d, and an electron injection layer 30e.

When a driving voltage is applied to the anode 18 and the cathode 28, holes passing through the hole transport layer 30b and electrons passing through the electron transport layer 30d move to the light emitting layer 30c to form excitons, As a result, the light emitting layer 30c emits visible light.

An organic light emitting diode panel displays an image by arranging pixels having organic light emitting diodes of the above structure on a TFT substrate in a matrix form and selectively controlling the pixels with a data voltage and a scan voltage.

The organic light emitting diode display device is divided into a passive matrix type display device or an active matrix type display device using a TFT as a switching device. The active matrix method selectively turns on the TFT as an active element to select a pixel and maintains the light emission of the pixel at a voltage held in a storage capacitor.

The pixels of the active matrix type organic light emitting diode display device include organic light emitting diodes, data lines and gate lines crossing each other, a switching TFT, a driving TFT, and a storage capacitor.

The switching TFT is turned on in response to a scan pulse from the gate line, thereby conducting a current path between the source electrode and the drain electrode. The data voltage from the data line during the on-time period of the switching TFT is applied to the gate electrode of the driving TFT and the storage capacitor via the source electrode and the drain electrode of the switching TFT.

The driving TFT controls a current flowing in the organic light emitting diode according to a data voltage applied to its gate electrode. Then, the storage capacitor stores the voltage between the data voltage and the low potential power supply voltage, and keeps it constant for one frame period.

In the case of a mobile product, a cover window of a glass material is attached to the upper surface of the organic light emitting diode panel in the organic light emitting diode display device having such a structure. In the case of a flat product, There is no change in the shape of the cover for another purpose but a change in the shape of the cover window in a planar view to the front.

A technique for lamination of a flexible organic light emitting diode panel to a cover window having a curvature is currently being developed. However, a process for fastening an organic light emitting diode panel to a cover window bent with a small radius of curvature of 20 mm or less It is not being developed. The fastening process with a small radius of curvature is a process that is very difficult to access, either equipment or equipment, and many items need to be developed in various parts.

2A and 2B are cross-sectional views schematically showing a method of attaching an organic light emitting diode panel to a cover window in general.

2A illustrates a method of attaching an organic light emitting diode panel to a flat type cover window, and FIG. 2B illustrates a method of attaching an organic light emitting diode panel to a curved cover window .

2A, when the organic light emitting diode panel 10 'is attached to the flat type cover window 40', a soluble adhesive such as a film or a resin (for example, After the organic light emitting diode panel 10 'is placed on the cover window 40' with the organic light emitting diode panel 10 'mounted thereon, the organic light emitting diode panel 10' is laminated by using the roller 50 ' .

In the case of attaching the organic light emitting diode panel to a cover window having a curvature radius of 100 mm or more, the same fastening method as in the flat type cover window described above is used.

However, as shown in Fig. 2B, when the organic light emitting diode panel 10 "is attached to the cover window 40" having a small radius of curvature of 20 mm or less in accordance with the customer product design development direction, , It is impossible to attach the adhesive 19 "inside the cover window 40 ", so that it is attached onto the organic light emitting diode panel 10 ".

In this case, it is difficult to apply the lamination process using the rollers 50 " to the cover window 40 "having a small radius of curvature of 20 mm or less due to the restoring force of the organic light emitting diode panel 10"

Further, the adhesive agent 19 "to which a film OCA (optical clear adhesive) is applied is prepared by first attaching the adhesive 19" to the organic light emitting diode panel 10 "through a lamination process and then attaching the cover window 40" . At this time, the organic light emitting diode panel 10 "is adhered to the bend cover window 40 ", and the organic light emitting diode panel 10" is pushed due to the bending. The cover window 40 "will be adhered to the cover window 40 ", so that a portion contacting with the cover window 40" is generated in addition to the portion where the rolling starts, regardless of the beginning of rolling.

On the other hand, although not shown in the drawings, when the resin is fastened using a soluble adhesive such as a resin, the resin flows out of the organic light emitting diode panel during the fastening,

It is an object of the present invention to provide a method of manufacturing a flexible organic light emitting diode display device bending at a small radius of curvature.

Another object of the present invention is to provide a method of fabricating a flexible organic light emitting diode display device in which an organic light emitting diode panel is more easily fastened to a cover window bent at a small radius of curvature, have.

Other objects and features of the present invention will be described in the following description of the invention and the claims.

According to an aspect of the present invention, there is provided a method of fabricating a flexible organic light emitting diode display device, including: preparing an organic light emitting diode panel; Attaching a semi-hardened adhesive onto the organic light emitting diode panel; Loading the organic light emitting diode panel having the semi-cured adhesive on a jig; Placing a cover window on both sides of the jig on which the organic light emitting diode panel is loaded; Attaching the organic light emitting diode panel and the cover window using the semi-cured adhesive; Completing the coupling of the organic light emitting diode panel and the cover window by curing the semi-cured adhesive agent by irradiating ultraviolet rays while the organic light emitting diode panel and the cover window are attached to each other; And separating the clamped organic light emitting diode panel from the jig.

At this time, the semi-cured pressure-sensitive adhesive may include an optical clear adhesive (OCA) whose surface attached to the cover window is semi-cured.

And a buffer portion of a rubber material containing urethane may be formed on the surface of the jig.

Both sides of the jig extend outward to form a support on which the both ends of the cover window and the organic light emitting diode panel to be bent are placed.

The jig may further include an alignment guide formed along an edge of the support and guiding the organic light emitting diode panel to be positioned at the center of the cover window.

The cover window may be made of reinforced glass or plastic coated with a barrier layer.

The cover window may be bent at a small radius of curvature of 20 mm or less on both sides in the minor axis or major axis direction for bending the organic light emitting diode panel.

If the protective film is attached to the surface of the semi-cured pressure-sensitive adhesive, it may further include removing the protective film from the surface of the semi-cured pressure-sensitive adhesive.

After aligning the organic light emitting diode panel and the cover window, the cover window may be squeezed at the upper portion to attach the organic light emitting diode panel and the cover window together.

A heating block capable of applying a temperature ranging from a normal temperature to 150 ° C may be provided in the jig during the joining.

The jig may have a bag filled with a fluid containing air or water on its surface.

As described above, in the method of fabricating a flexible organic light emitting diode display device according to an embodiment of the present invention, a cover window is firstly fastened to the organic light emitting diode panel using a half hardened adhesive agent The organic light emitting diode panel can be more easily fastened to the cover window bent with a small radius of curvature of 20 mm or less by completing the fastening through curing, and defective adhesion of the curved portion caused by fastening can be improved.

As a result, it is possible to acquire the structural source technology of flexible products with a radius of curvature of 20 mm or less, which was difficult to approach due to equipment or process conditions, and secure the mass production and source production technology of flexible products.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram for explaining the principle of light emission of a general organic light emitting diode display element. FIG.
2A and 2B are cross-sectional views schematically showing a method of attaching an organic light emitting diode panel to a cover window in general.
3 is a cross-sectional view schematically showing a structure of an organic light emitting diode panel according to a first embodiment of the present invention.
4 is a flowchart sequentially illustrating a method of manufacturing an organic light emitting diode display device according to a first embodiment of the present invention.
5A to 5E are sectional views sequentially illustrating a method of manufacturing an organic light emitting diode display device according to a first embodiment of the present invention.
6A and 6B are cross-sectional views illustrating another example of a jig structure according to the present invention.
7A to 7F are sectional views sequentially illustrating a method of manufacturing an organic light emitting diode display device according to a second embodiment of the present invention.
8A to 8F are perspective views sequentially illustrating a method of manufacturing an organic light emitting diode display device according to a second embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of a method for fabricating a flexible organic light emitting diode display device according to the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but is capable of many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification. The dimensions and relative sizes of the layers and regions in the figures may be exaggerated for clarity of illustration.

It will be understood that when an element or layer is referred to as being another element or "on" or "on ", it includes both intervening layers or other elements in the middle, do. On the other hand, when a device is referred to as "directly on" or "directly above ", it does not intervene another device or layer in the middle.

The terms spatially relative, "below," "lower," "above," "upper," and the like, And may be used to easily describe the correlation with other elements or components. Spatially relative terms should be understood to include, in addition to the orientation shown in the drawings, terms that include different orientations of the device during use or operation. For example, when inverting an element shown in the figures, an element described as "below" or "beneath" of another element may be placed "above" another element. Thus, the exemplary term "below" can include both downward and upward directions.

The terminology used herein is for the purpose of describing embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. &Quot; comprise "and / or" comprising ", as used in the specification, means that the presence of stated elements, Or additions.

3 is a cross-sectional view schematically showing the structure of an organic light emitting diode panel according to a first embodiment of the present invention.

The organic light emitting diode display device according to the first embodiment of the present invention includes an organic light emitting diode panel for displaying an image and a cover window attached to an upper surface of the organic light emitting diode panel.

Referring to FIG. 3, the organic light emitting diode panel includes a TFT substrate 111 defining an active region and a pad region, and an encapsulating layer 116 formed on the TFT substrate 111 while covering the active region .

A polyimide substrate may be used as the base substrate of the TFT substrate 111. In this case, a back film 101 made of polyethylene terephthalate (PET) is formed on the back surface of the TFT substrate 111 through a first adhesive layer 109 . However, the present invention is not limited thereto. Instead of the PET backbone film 101, a metal plate which is easy to prevent moisture permeation may be used.

On the TFT substrate 111, a multi-layered barrier layer 112 may be formed to prevent moisture from the back surface of the TFT substrate 111, but the present invention is not limited thereto.

On the sealing layer 116, a polarizing plate 120 is attached through a second adhesive layer 119 to prevent reflection of light incident from the outside.

At this time, although not shown, pixels are arranged in a matrix in the active region of the TFT substrate 111, and driving elements and other components such as a scan driver and a data driver for driving the pixels are disposed outside the active region do.

Pad electrodes for transmitting an electric signal to the scan driver and the data driver are located in a pad region of the TFT substrate 111.

The sealing layer 116 is formed on the organic light emitting diodes and the driving circuits formed on the TFT substrate 111 to seal the organic light emitting diodes and the driving circuits from the outside. Here, for convenience of explanation, the organic light emitting diodes and driving circuits are schematically shown at 130 in FIG.

The encapsulating layer 116 is specifically formed on the TFT substrate 111 on which the common electrode (not shown) is formed. The encapsulating unit 113 is formed with a primary insulating film, an organic film and a secondary insulating film in order.

A multi-layered protective film 115 is disposed on the entire surface of the TFT substrate 111 including the secondary insulating film so as to encapsulate the organic light emitting diode panel, and between the TFT substrate 111 and the protective film 115 Sensitive adhesive 114 that is transparent and has adhesive properties is interposed.

At this time, the present invention can be applied not only to the seal structure of the face seal structure but also to the Thin Film Encapsulation (TFE) structure composed of various layers such as organic and inorganic multi-layer films or inorganic and inorganic multi-layer films. The present invention is also applicable to other encapsulation structures.

The organic light emitting diode display device according to the first embodiment of the present invention is characterized in that a cover window of plastic coated with a glass or barrier layer for preventing moisture permeation is attached to the front surface of the organic light emitting diode panel In particular, the cover window is bent so as to have a small radius of curvature of 20 mm or less.

At this time, the cover window is bended so that both sides thereof have a small radius of curvature of 20 mm or less, while the cover window is firstly fastened to the organic light emitting diode panel using a half hardened adhesive, It is possible to more easily fasten the organic light emitting diode panel to the cover window bent at a small radius of curvature of 20 mm or less and at the same time to improve the defective bonding of the curved portions caused by the fastening. A method of manufacturing an organic light emitting diode display device according to an example will be described in detail.

4 is a flowchart sequentially illustrating a method of manufacturing an organic light emitting diode display device according to a first embodiment of the present invention.

5A to 5E are sectional views sequentially illustrating a method of manufacturing an organic light emitting diode display device according to a first embodiment of the present invention.

A flexible display device that is not damaged even if the display device is folded or rolled is expected to become a new technology in the field of display devices. The flexible display device is called a scroll display device. It is implemented in a thin substrate such as plastic and is not damaged even when folded or rolled like paper. It is one of the next generation display devices. Currently, LED display devices are promising.

Among such flexible display devices, a side view display technology is being developed in which a flexible organic light emitting diode panel is attached to a cover window having a curvature so that an image can be seen not only on the front surface but also on the side of the organic light emitting diode display device.

At this time, a pressure sensitive adhesive made of OCA (optical clear adhesive) may be used when the cover window with both edges bent is attached to the organic light emitting diode panel. However, when a general film type OCA is used, when the cover film is attached to the cover window, the OCA protective film is removed and the adhesive component is exposed to the front side. Therefore, A failure occurs.

Accordingly, the present invention is characterized in that a cover window is firstly fastened to an organic light emitting diode panel with a fine adhesive force using a semi-cured adhesive, and then a secondary hardening such as ultraviolet light is used to complete the fastening, The present invention provides a method of manufacturing a flexible organic light emitting diode display device that can more easily fasten a panel and improve defective adhesion of a curved portion during fastening.

To do this, a predetermined organic light emitting diode panel 110 is completed as shown in FIG. 5A (S110).

Although not shown, the organic light emitting diode panel 110 includes a TFT substrate on which an active region and a pad region are defined, and an encapsulation layer formed on the TFT substrate while covering the active region.

A polyimide substrate may be used as the TFT substrate. In this case, a back film made of polyethylene terephthalate (PET) may be attached to the back surface of the TFT substrate through the first adhesive layer. However, the present invention is not limited thereto, and a metal plate which is easy to prevent moisture permeation may be used instead of the PET backfilm.

On the TFT substrate, a multi-layered barrier layer may be formed to prevent moisture from the back surface of the TFT substrate, but the present invention is not limited thereto.

On the sealing layer, a polarizing plate for preventing reflection of light incident from outside is attached through a second adhesive layer.

At this time, pixels are arranged in a matrix form in the active region of the TFT substrate, and driving elements and other components such as a scan driver and a data driver for driving the pixels are located outside the active region.

Pad electrodes for transmitting an electric signal to the scan driver and the data driver are located in a pad region of the TFT substrate.

The sealing layer is formed on the organic light emitting diodes and the driving circuits formed on the TFT substrate to seal the organic light emitting diodes and the driving circuits from the outside.

The sealing layer will be described in more detail. On the TFT substrate on which the common electrode is formed, a primary insulating film, an organic film, and a secondary insulating film are sequentially formed by sealing means.

A multi-layered protective film is placed on the entire surface of the TFT substrate including the secondary insulating film so as to encapsulate the organic light emitting diode panel, and a transparent adhesive having adhesive properties is interposed between the TFT substrate and the protective film.

At this time, the present invention can be applied not only to the seal structure of the above-described face seal structure but also to other encapsulation structures such as an organic and inorganic multilayer film or a thin film encapsulation (TFE) structure composed of inorganic layers and inorganic multilayer films Do.

Next, a semi-cured adhesive 119 is attached on the organic light emitting diode panel 110 according to the first embodiment of the present invention (S120).

The semi-cured adhesive 119 is laminated on the organic light emitting diode panel 110 in a laminated manner using a roller (not shown) in a state where the organic light emitting diode panel 110 is loaded on a predetermined table 130 can do. However, the present invention is not limited thereto.

The semi-cured adhesive 119 may be a film type adhesive as an adhesive for attaching the organic light emitting diode panel 110 to a cover window, wherein the surface attached to the cover window is a semi-cured OCA And a control unit.

The OCA in the semi-cured state maintains only fine adhesion at the initial stage, but is completely cured when irradiated with light such as ultraviolet rays.

Next, as shown in FIG. 5B, the organic light emitting diode panel 110 to which the semi-cured adhesive 119 is attached is loaded on a jig 170 (S130).

Then, the cover window 140 bent at a small radius of curvature of 20 mm or less is placed on the jig 170 on which the organic light emitting diode panel 110 is loaded.

The cover window 140 may be made of plastic coated with a reinforcing glass or a barrier layer.

At this time, the cover window 140 is bent in both the short axis direction and the long axis direction in order to bend the organic light emitting diode panel 110, and a structure in which the organic light emitting diode panel 110 is fastened The bending region may include an active region.

At this time, both sides of the jig 170 may extend outward to form a support 170a on which the both ends of the bare organic light emitting diode panel 110 and the cover window 140 are placed.

If the protective film is attached to the surface of the semi-cured adhesive 119, the protective film may be removed from the surface of the semi-cured adhesive 119.

5C, after aligning the organic light emitting diode panel 110 and the cover window 140, the cover window 140 is pressed on the organic light emitting diode panel 110 and the cover window 140, The window 140 is attached (S140).

The lower jig 170 may be formed with a curvature radius smaller than the radius of curvature to be applied to the actual product, that is, the cover window 140, You may. For example, in order to manufacture a product having a radius of curvature of 5 mm, both sides of the jig 170 may have a radius of curvature of 5 mm or less. However, the present invention is not limited thereto, and the shape of the organic light emitting diode panel 110 may include various shapes according to a desired final product shape. Even if the product is not a desired shape, It can be machined into various shapes that facilitate equipment and process access.

In addition, various types of jigs 170, stages, and the like can be used, and other mechanical processing methods other than the above-described methods can be applied.

At this time, a heating block capable of applying a temperature of about 150 ° C to about 150 ° C may be installed in the jig 170 when compressed.

Next, as shown in FIG. 5D, the semi-cured adhesive 119 is cured by irradiating ultraviolet light or the like through a predetermined irradiation device 180 in a state where the cover window 140 is squeezed from the top, The connection between the diode panel 110 and the cover window 140 is completed (S150).

5E, the organic light emitting diode panel 110 in which the cover window 140 is fastened is separated from the jig 170 (S160).

Meanwhile, in addition to the above-described jig structure, it is possible to form a cushion of a rubber material such as urethane on the surface of the jig, or to tightly close the curved surface of the cover window using a fluid such as an air bag or a water bag Which will be described in detail with reference to the following drawings.

6A and 6B are cross-sectional views illustrating another example of the jig structure according to the present invention.

Referring to FIG. 6A, another example of the jig structure according to the present invention includes a cushioning portion 270c made of a rubber material such as urethane on the surface of the jig 270, The cushioning portion 270c serves as a cushion so that the cushioning can be performed without bubbles up to the curvature portion and the organic light emitting diode panel can be fixed without moving due to the frictional force of the rubber material.

At this time, both sides of the jig 270 may form an organic light emitting diode panel that is bent and extended outward, and a support 270a on which both ends of the cover window are placed.

In addition, by forming the alignment guide 270b at both sides of the jig 270, that is, at the edge of the supporter 270a, the organic light emitting diode panel can be guided to be positioned at the center of the cover window.

6B, another example of the jig structure according to the present invention includes a bag 375 filled with a fluid such as air or water on the surface of the lower jig 370, so that when the pressure is applied to the cover window, The bubble defect can be eliminated.

The jigs 270 and 370 according to another embodiment of the present invention may be provided with a heating block capable of applying a temperature of about 150 ° C to about 150 ° C.

7A to 7F are cross-sectional views sequentially illustrating a method of manufacturing an organic light emitting diode display device according to a second embodiment of the present invention.

8A to 8F are perspective views sequentially illustrating a method of manufacturing an organic light emitting diode display device according to a second embodiment of the present invention.

First, as shown in FIGS. 7A and 8A, a predetermined organic light emitting diode panel 210 is completed.

A semi-cured adhesive 219 is attached on the organic light emitting diode panel 210 according to the second embodiment of the present invention.

The semi-cured adhesive 219 is attached to the upper part of the organic light emitting diode panel 210 in a laminated manner using a roller (not shown) in a state where the organic light emitting diode panel 210 is loaded on a table 230. can do. However, the present invention is not limited thereto.

The semi-cured adhesive 219 may be a film type as an adhesive for attaching the organic light emitting diode panel 210 to a cover window, wherein the surface attached to the cover window includes semi-cured OCA .

As described above, the semi-cured OCA maintains only fine adhesion at the beginning, but is completely cured when irradiated with light such as ultraviolet rays.

Next, as shown in FIGS. 7B and 8B, a predetermined jig 270 is prepared.

At this time, the jig 270 according to the second embodiment of the present invention is formed with a cushioning portion 270c made of a rubber material such as urethane on its surface, and both sides of the jig 270 are bent The light emitting diode panel 210 and the support table 270a on which both ends of the cover window are placed can be formed.

The organic light emitting diode panel 210 may be guided so as to be positioned at the center of the cover window by forming an alignment guide 270b along both sides of the jig 270, .

Next, as shown in FIGS. 7C and 8C, the organic light emitting diode panel 210 to which the semi-cured adhesive 219 is attached is loaded on the jig 270 described above.

Then, the cover window 240 bent at a small radius of curvature of 20 mm or less is placed on the jig 270 on which the organic light emitting diode panel 210 is loaded.

The jig 270 according to the second embodiment of the present invention is provided with an alignment guide 270b so that the organic light emitting diode panel 210 is guided to be positioned at the center of the cover window 240. [

The cover window 240 may be made of plastics coated with a reinforcing glass or a barrier layer.

In order to bend the organic light emitting diode panel 210, the cover window 240 is bent in both the short axis direction and the long axis direction, and the organic light emitting diode panel 210 is fastened to the cover window 240 The bending region may include an active region.

If a protective film is attached to the surface of the semi-cured pressure-sensitive adhesive 219, the protective film may be removed from the surface of the semi-cured pressure-sensitive adhesive 219.

7D and 8D, after aligning the organic light emitting diode panel 210 and the cover window 240, the cover window 240 is pressed on the organic light emitting diode panel 210 And the cover window 240 are attached to each other (S140).

As described above, the lower jig 270 may apply a radius of curvature as it is, or a radius of curvature smaller than the radius of curvature to be applied to the actual product, that is, the cover window 240. However, the present invention is not limited thereto, and the shape of the organic light emitting diode panel 210 may include various shapes according to a desired final product shape. Even if the product is not a desired shape, It can be machined into various shapes that facilitate equipment and process access.

In addition, various types of jigs 270, stages, or the like may be used, and other mechanical processing methods other than the above-described methods may be applied.

At this time, a heating block capable of applying a temperature of about 150 ° C to about 150 ° C may be installed in the jig 270 during the compression.

The jig 270 according to the second embodiment of the present invention is formed with a cushioning portion 270c made of a rubber material such as urethane on the surface thereof so that even if the cover window 240 applies a sufficient pressure, The cushioning portion 270c of the organic light emitting diode panel 210 serves as a cushion so that the organic light emitting diode panel 210 can be fixed without moving due to frictional force of the rubber material.

Next, as shown in FIGS. 7E and 8E, the semi-cured pressure-sensitive adhesive 219 is cured by irradiating ultraviolet light or the like through the predetermined irradiation device 280 while the cover window 240 is being squeezed from the upper side The connection between the organic light emitting diode panel 210 and the cover window 240 is completed.

At this time, a fixing pin 275 is fastened to the upper and lower ends of the cover window 240 where the cover window 240 is located, and both ends of the cover window 240, that is, the circuit part 290 formed on the organic light emitting diode panel 210, The organic light emitting diode panel 210 and the cover window 240 can be fixed to each other. When the cover window 240 is fixed by the fixing pin 275, the adhesive force of the semi-cured adhesive 219 cured by the ultraviolet rays can be increased.

7F and 8F, the organic light emitting diode panel 210, to which the cover window 240 is coupled, is removed from the jig 270, as shown in FIGS. 7F and 8F, Separate.

As described above, according to the present invention, the cover window is firstly fastened to the organic light emitting diode panel using the semi-cured adhesive, and the fastening is completed through curing, so that the organic light emitting diode panel is attached to the cover window bent with a small radius of curvature of 20 mm or less It is possible to improve the defects that may occur during the fastening process as a whole.

As a result, it is possible to acquire the structural source technology of flexible products with a radius of curvature of 20 mm or less, which was difficult to approach due to equipment or process conditions, and secure the mass production and source production technology of flexible products.

The product group applied to the present invention can be a small to large flexible display from a cell phone to a television, and the present invention can be applied to a product appearance case for assembling a product without a cover window.

Also, the structure of the cover window according to the present invention can be applied to all product models having a radius of curvature of 20 mm or less. The shape of the curvature can be an elliptical shape instead of a circular shape, and an angle of curvature can be varied from 30 to 180 degrees. Applicable.

While a great many are described in the foregoing description, it should be construed as an example of preferred embodiments rather than limiting the scope of the invention. Therefore, the invention should not be construed as limited to the embodiments described, but should be determined by equivalents to the appended claims and the claims.

110, 210: organic light emitting diode panel 119, 219:
140, 240: cover window 170, 270: jig
170a, 270a: Supporting stand 270b: Aligning guide
270c:

Claims (11)

Preparing an organic light emitting diode panel;
Attaching a semi-hardened adhesive onto the organic light emitting diode panel;
Loading the organic light emitting diode panel having the semi-cured adhesive on a jig;
Placing a cover window on both sides of the jig on which the organic light emitting diode panel is loaded;
Attaching the organic light emitting diode panel and the cover window using the semi-cured adhesive;
Completing the coupling of the organic light emitting diode panel and the cover window by curing the semi-cured adhesive agent by irradiating ultraviolet rays while the organic light emitting diode panel and the cover window are attached to each other; And
And separating the clamped organic light emitting diode panel from the jig. The method according to claim 1, wherein the semi-cured adhesive includes an OCA (optical clear adhesive) having a semi-cured side attached to the cover window. The manufacturing method of a flexible organic light emitting diode display device according to claim 1, wherein a buffer portion of a rubber material containing urethane is formed on the surface of the jig. The method according to claim 1, wherein both sides of the jig extend outward to form a support on which both ends of the organic light emitting diode panel and the cover window to be bent are placed. The flexible organic light emitting diode according to claim 4, wherein the jig further comprises an alignment guide formed along an edge of the support and guiding the organic light emitting diode panel to be positioned at the center of the cover window. A method of manufacturing a display device. The method according to claim 1, wherein the cover window is made of plastic coated with a reinforcing glass or a barrier layer. The method as claimed in claim 1, wherein the cover window is bent at a small radius of curvature of 20 mm or less on both sides in the minor axis or major axis direction for bending the organic light emitting diode panel. The flexible organic light emitting diode display device according to claim 1, further comprising a step of removing the protective film from the surface of the semi-cured adhesive when the protective film is attached to the surface of the semi-cured adhesive. . The manufacturing method of a flexible organic light emitting diode display device according to claim 1, wherein the organic light emitting diode panel and the cover window are aligned by pressing the cover window at the upper portion after aligning the organic light emitting diode panel and the cover window. . The manufacturing method of a flexible organic light emitting diode display device according to claim 1, wherein a heating block capable of applying a temperature ranging from a room temperature to 150 ° C is provided in the jig. The manufacturing method of a flexible organic light emitting diode display device according to claim 1, wherein the jig has a bag filled with a fluid containing air or water on its surface.

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