KR20150047233A - Helical fin structure of heat sink for led lighting fixture - Google Patents

Abstract

Disclosed is a heat sink with a helical fin structure for an LED lamp. The heat sink for LED lamp includes a plurality of heat radiation fins which are formed on the heat sink to cool heat generated in an LED package. The heat radiation fin is formed in a helical structure of a spring shape.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a heat-

Embodiments of the present invention relate to a heat sink for LED lighting, and more particularly, to a heat sink for LED lighting that can enhance the heat radiation effect of LED light through a fin structure.

There is a tendency to replace an existing lighting apparatus with an LED lighting apparatus due to the appearance of a lighting apparatus using a light emitting diode (LED) as a light source.

Since the LED is a solid semiconductor device that emits light and heat using a pn junction structure, the junction temperature increases as the input power increases. In the case of a high power LED, The temperature is higher. The increase in the junction temperature of the light emitting diode causes a decrease in the photometric efficiency and affects the lifetime of the device and the quality of the illumination. Therefore, in order to lower the junction temperature, a heat sink is used in combination with a printed circuit board (PCB) bonded to the LED package or the LED package at the junction 300.

The heat sink of a conventional LED light is attached to the back side of a printed circuit board bonded to the LED package or the LED package as mentioned above so as not to block the light generated in the LED package and to cool the high temperature. Such a heat radiating plate is generally formed by forming a plurality of radiating fins formed by a rod-like or thin plate-like body on a body formed of a structure suitable for a purpose such as a plate or a cylinder by a mold or a junction.

The heat generated by the LED package is absorbed by the heat sink and then cooled by heat exchange with ambient air at the surface of the heat sink fin. The cooling by the heat sink is influenced by the heat transfer performance of the heat sink material, and it is necessary to widen the surface area for simultaneous heat exchange to increase the cooling efficiency. In most heat sinks, the number of heat sink fins is increased or its size is increased by increasing the surface area.

However, in the method of increasing the number of fins, the space between the fins is narrowed by the plurality of heat-radiating fins, thereby causing thermal confinement, thereby lowering the heat radiation effect. In the method of increasing the size of the radiating fins, the performance efficiency compared to the size decreases over a certain size, and the volume and the material cost increase.

As another example, Korean Patent Registration No. 10-1076106 (Oct. 17, 2011) discloses a heat dissipating structure that improves the heat radiation effect by refining the angle change of the LED illumination.

In order to increase the performance of the heat sink, a method of increasing the heat radiation effect using forced convection by using a fan is widely used. However, in case of the LED lighting apparatus, installation of the fan is limited due to the installation site and structural characteristics.

Therefore, this heat sink is not optimized for LED lighting fixtures, so it needs structural improvement and design of heat sink with high economic efficiency and productivity.

SUMMARY OF THE INVENTION It is an object of the present invention to improve the heat dissipation effect of LED lighting by making the fin structure of the heat sink plate a helical structure in the heat dissipation of the LED lighting fixture.

According to an embodiment of the present invention, a heat sink for LED illumination includes a plurality of heat dissipation fins formed on the heat dissipation plate to cool heat generated in the LED package, the heat dissipation fins having a helical structure in the form of a spring ≪ / RTI >

According to an aspect of the present invention, the helical structure may have a constant gradient from the top to the bottom of the inner radius of the radiating fin.

According to another aspect of the present invention, the helical structure may have a gradient structure in which the inner radius of the radiating fin gradually decreases or increases from the upper portion to the lower portion.

According to another aspect of the present invention, the radiating fins may be formed at regular intervals along the outer surface of the body of the heat sink.

According to another aspect, at least one of the thickness, the pitch, the height, and the space between the radiating fins of the radiating fin having the helical structure may be determined according to the heat radiation characteristics of the radiating plate.

According to the embodiment of the present invention, by applying a helical fin structure to the heat sink of the LED lighting, it is possible to improve the heat radiation effect of the heat sink, and increase the productivity and the material saving effect. In other words, since the fin structure of the LED light-emitting heat sink is formed into a helical shape, the weight of the lightweight LED lightweight panel can be widened while the surface area of the fin can be widened, thereby enhancing the heat radiation effect of the LED lightwave. At the same time, productivity can be improved.

1 is a top view of a helical fin structure of a heat sink for LED illumination according to an embodiment of the present invention.
Fig. 2 shows a front view of a helical fin structure of a heat sink for LED illumination, according to an embodiment of the present invention.
3 illustrates an application form of a helical fin structure of a heat sink for LED illumination according to another embodiment of the present invention.
4 is a perspective view of a heat sink for LED lighting having a pin structure of a helical shape in an embodiment of the present invention.
FIG. 5 illustrates a top view of a heat sink for LED lighting having a pin structure of a helical shape, according to an embodiment of the present invention.
6 shows a simulation result of a heating characteristic of a conventional heat sink for LED lighting.
FIG. 7 illustrates a simulation result of heat generation characteristics of a heat sink for LED lighting having a pin structure of a helical shape in an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The present invention relates to a heat sink for LED lighting, and in particular, the present invention proposes a heat sink fin structure capable of maximizing the heat radiation effect of LED lighting, which can be applied to an LED lighting device and the like.

The light source used in LED lighting usually uses high-power LEDs. In the case of high-output LEDs, the amount of heat generated is very high, and this heat can cause serious damage to semiconductor devices.

Accordingly, in the case of a lighting device using a light emitting device, heat dissipation technology is the most important issue. To this end, the present invention proposes a pin structure of a heat sink for LED lighting as a helical structure in order to increase heat dissipation performance.

Fig. 1 shows the structure of the radiating fin 100 proposed by the present invention. 1 shows a top view of a fin 100 structure of a heat sink for LED illumination.

In the present invention, the structure of the fin 100 of the heat sink for LED illumination is formed into a helical shape (hereinafter, the heat sink fins of the LED lighting device will be referred to as 'helical pins'). At this time, the inner radius (102) and the thickness (101) of the helical pin (100) may vary depending on the heat radiation characteristics of the LED lighting apparatus.

2 is a front view of the helical fin structure of the heat sink for LED illumination.

The helical pins are fixed at regular intervals along the outer surface of the heat sink for LED illumination. At this time, the gap 107 between the helical pins and the height 105 of the helical fin, the spacing (pitch) 103 between the spiral upper and lower spiral of the helical pin, and the gradient structure 104 of the helical pin, It may vary depending on the structure of the heat sink body.

In the present invention, the helical fin 100 structure may be applied to the heat sink to improve the heat radiation effect of the LED lighting device.

The pin structure proposed in the present invention is a helical structure 100 in the form of a spring as shown in Figs. 1 and 2, and has a thickness 101, a vertical distance 103, a height 105 The heat dissipation characteristics can be optimized.

The inner radius 102 of the helical structure may include a gradient structure 104 that is constant from top to bottom in the vertical direction of the fin or gradually decreases or increases as it goes down to reduce unwanted portions of the heat dissipation effect.

The structure of the helical fin applied to the heat sink for LED illumination is not limited to the shape and structure of FIG. 1 and FIG. 2, and can be changed as much as possible according to the heat dissipation characteristics of the LED illumination device and the body structure of the heat sink.

Further, the helical fin structure has a significantly increased surface area compared to a general fin structure, and is excellent in heat dissipation effect. The helical structure allows a space 106 to be formed in the fin and a material reduction due to the fin internal space 106 It is possible to secure high economic efficiency and productivity.

3 illustrates an application form of a helical fin structure of a heat sink for LED illumination according to another embodiment of the present invention. 3 (a), 3 (b) and 3 (c) illustrate other structures that can be applied to the structure other than the helical structure described with reference to FIG.

The helical structure applicable to the heat sink for LED illumination is not limited to the circular shape as described above, but may be modified into various shapes depending on the situation as shown in FIG.

The pins proposed in the present invention generally have a thickness within a few millimeters, an up-and-down spacing, an inner radius, and a height within a few centimeters, but are not limited thereto.

FIG. 4 is a perspective view illustrating a heat sink for LED lighting to which the circular helical fin structure described with reference to FIGS. 1 and 2 is applied.

4, a high power LED bonding surface 300 for bonding an LED package is formed on the body 200 of the heat sink for LED illumination, and a plurality of helical pins 100 are formed on the outer surface of the body 200 Can be fixed.

At this time, the helical pins 100 may be fixedly installed at regular intervals along the outer surface of the heat sink body 200. The helical pin 100 may be bonded to the body 200 of the heat sink for LED illumination by welding or an adhesive material having high thermal conductivity, or it may be manufactured by a conventional method.

FIG. 5 is a top view of a heat sink for LED lighting using the circular helical fin structure described with reference to FIGS. 1 and 2. FIG.

One of the characteristics of the structure of the helical pin 100 is that it is possible to reduce the volume by reducing the volume due to the pin inner space 106, and convection of air into the inner space 106 can be performed to enhance the heat radiation effect.

In order to increase the performance of the heat sink for LED lighting, generally, the number of pins or the plate area of the pins is widened. On the other hand, in the present invention, the structure and size of the conventional heat sink and the body are the same, and only the shape of the pin is changed to a helical structure.

FIG. 6 is a diagram illustrating a simulation result of a heating characteristic of a heat sink for LED lighting of a conventional structure, and FIG. 7 is a diagram illustrating a simulation result of heating characteristics of a heat sink for LED lighting having a helical fin structure according to the present invention.

Referring to FIGS. 6 and 7, when the result of the transfer simulation is compared in a natural convection environment under a thermal environment condition, the maximum temperature of the general heat sink is 59.6 ° C., whereas in the structure proposed in the present invention, the LED temperature is 56.4 ° C., Or more.

In addition, due to the helical shape, since the fin internal space 106 of the heat sink is formed, the volume is reduced by about 15% or more compared to the conventional heat sink, and the material saving effect is superior to the conventional one.

As described above, according to the embodiment of the present invention, by applying a helical fin structure to the heat sink of the LED illumination, it is possible to improve the heat radiation effect of the heat sink and increase the productivity and the material saving effect.

In other words, the heat sink for LED lighting according to the present invention can form a pin structure in a helical shape, thereby making it possible to increase the surface area of the fin while reducing the weight of the conventional structure, thereby enhancing the heat radiation effect of the LED lighting, The effect can be obtained and the productivity can be improved.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. For example, it is to be understood that the techniques described may be performed in a different order than the described methods, and / or that components of the described systems, structures, devices, circuits, Lt; / RTI > or equivalents, even if it is replaced or replaced.

Therefore, other implementations, other embodiments, and equivalents to the claims are also within the scope of the following claims.

100: Helical pin
101: Fin thickness
102: Inner radius of the pin
103: Pin up and down interval
104: Pin Grade Structure
105: Pin height
106: Pin inner space
107: Distance between pins
200: Heat sink body
300: High power LED junction

Claims (5)

In a heat sink of an LED lighting fixture,
And a plurality of heat dissipation fins formed on the heat dissipation plate for cooling heat generated in the LED package,
The radiating fin may be a helical structure in the form of a spring
And a heat sink for LED illumination. The method according to claim 1,
Wherein the helical structure has a gradient structure in which the inner radius of the radiating fin is constant from the upper portion to the lower portion
And a heat sink for LED illumination. The method according to claim 1,
Wherein the helical structure has a gradient structure in which the inner radius of the radiating fin gradually decreases or increases as it goes from the upper portion to the lower portion
And a heat sink for LED illumination. The method according to claim 1,
And the radiating fins are formed at regular intervals along the outer surface of the body of the heat sink
And a heat sink for LED illumination. The method according to claim 1,
At least one of the thickness, the pitch, the height, and the space between the radiating fins of the radiating fin having the helical structure is determined according to the radiating characteristic of the radiating plate
And a heat sink for LED illumination.

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