KR20110130895A - Cooling apparatus for led lamp and method thereof - Google Patents

Abstract

PURPOSE: An LED cooling apparatus and a manufacturing method thereof are provided to inflow or outflow an air through an opened part by exposing a part of a radiation fin to the gaps of a plurality of fixed blocks. CONSTITUTION: An LED cooling device(100) includes a fixed block(110) and a heat radiation fin(120). A plurality of fixed blocks fixes the LED lamp on a lower part and absorbs heat from an LED lamp. The heat radiation fin is placed on the top of the fixed block and emits absorbed heat into the air. The fixed block and the heat radiation fin are combined after being respectively and separately manufactured.

Description

LED cooling apparatus and its manufacturing method {COOLING APPARATUS FOR LED LAMP AND METHOD THEREOF}

The present invention relates to a LED cooling technology, and more particularly, to provide an LED cooling device and a method of manufacturing the same that can effectively release the heat generated by the LED lighting device.

Recently, LED (Light Emitting Diode) lamps have been spotlighted as light sources of various lighting devices such as street lamps, landscape lamps, security lamps, tunnel lamps, stadium lamps, fishing catch lamps, as well as indoor lamps of homes and public facilities. Such LED lamps have advantages such as low heat generation, excellent durability, and long life compared to light sources of conventional lighting devices such as incandescent and fluorescent lamps. In particular, with the emphasis on eco-friendly and green growth in Korea and around the world, LED lamps, which consume less power and do not use mercury or discharge gas, such as fluorescent lamps, have attracted much attention as a next generation lighting device. I am getting it.

LED lamps work to generate a certain amount of heat during light emission. Moreover, when an LED lamp is used in a lighting device, a great deal of heat is generated since a large number of LED lamps are usually used. By the way, since the LED lamp is made of a semiconductor, unlike the conventional lamp is susceptible to heat, the LED lighting device needs to cool the heat of the LED lamp properly through a cooling device called a heat sink or a heat sink.

1 is a view schematically showing the configuration of an LED cooling device 10 for dissipating heat generated by the LED lamp 20 in a conventional LED lighting device.

Referring to FIG. 1, the conventional LED cooling device 10 is positioned above the fixing plate 11 and the fixing plate to which the LED lamp 20 is fixed to discharge heat generated by the LED lamp 20 into the air. It consists of a plurality of heat radiation fins 12 and the like. In particular, in the conventional LED cooling device 10, the fixed plate 11 of the planar shape is formed on the entire lower portion of the heat radiation fin 12.

By the way, according to the structure of the LED cooling device 10 has a problem that the heat release efficiency of the heat dissipation fin 12, that is, the ventilation is not made properly, the heat dissipation efficiency is very low. That is, the conventional LED cooling device 10 has a structure in which the lower portion of the heat dissipation fin 12 is blocked by the fixing plate 11, so that inflow and outflow of external air to the heat dissipation fin 12 is not properly performed, and thus the heat dissipation efficiency is improved. Not good.

2 is a diagram schematically showing a flow of air around the conventional LED cooling device 10. In FIG. 2, the direction in which air flows is shown by an arrow, which is expressed in different colors depending on the temperature of the air or the cooling device 10. For example, closer to blue means lower temperature, and closer to red means higher temperature.

Referring to FIG. 2, in the conventional cooling apparatus 10, relatively low temperature inflow of external air is actively performed at the side portion of the cooling apparatus 10 denoted by A. On the other hand, in the center of the cooling device 10, that is, the center of the heat dissipation fin 12, the air is hardly introduced from the outside, only due to the high temperature of the center of the heat dissipation fin 12, the ambient air continues to rise. This is because the lower part of the heat dissipation fin 12 is blocked by the fixing plate 11 at the center of the heat dissipation fin 12, so that the inflow of external air or the outflow of internal air is blocked from the lower portion of the heat dissipation fin 12, thereby preventing proper ventilation. to be. Therefore, according to the conventional LED cooling device 10, the heat generated by the LED lamp 20 according to the conventional LED cooling device 10, as shown in FIG. It is not released efficiently.

As such, if heat emission is not properly performed in the LED lighting device, the lifespan of the LED lamp 20, which is a semiconductor device, may be drastically shortened and the wavelength of light may be changed, thereby preventing a desired lighting effect. In addition, since one LED lighting device is not provided with many LED lamps 20, more LED lighting devices must be used to obtain sufficient lighting effects, which may be problematic in that it requires a lot of cost.

The present invention has been devised to solve the above problems, and provides an LED cooling device and a manufacturing method of which the structure is improved, the manufacturing is simple, and the weight is reduced to efficiently cool the heat generated in the LED lighting device. It aims to do it.

Other objects and advantages of the present invention can be understood by the following description, and will be more clearly understood by the embodiments of the present invention. Also, it will be readily appreciated that the objects and advantages of the present invention may be realized by the means and combinations thereof indicated in the claims.

LED cooling device according to the present invention for achieving the above object, a plurality of fixed blocks for absorbing the heat generated from the LED lamp is fixed to the LED lamp at the bottom; And a heat dissipation fin positioned at an upper portion of the fixed block and dissipating heat absorbed by the fixed block into the air, wherein the fixed block and the heat dissipation fin are separately manufactured and combined, and viewed from the bottom, the fixed block. Since the area of the heat sink fin is smaller than the area of the heat radiation fin is exposed by the portion between the plurality of fixing blocks open to the air through the open portion to the heat radiation fin through the open portion is possible.

Preferably, the heat dissipation fin is manufactured by a press working method.

More preferably, the fixing block and the heat dissipation fins are coupled in a manner of being attached by soldering or thermally conductive adhesive. Alternatively, the fixing block and the heat dissipation fins are coupled in such a manner as to form a groove on one surface of the fixing block and to place the heat dissipation fin in the groove.

Also preferably, the plurality of fixing blocks may be formed in a band shape, and the plurality of fixing blocks may be spaced apart from each other in parallel when viewed from the bottom, so that a part of the heat radiation fins may be exposed between the fixing blocks on the band and open.

Also preferably, the plurality of fixing blocks are formed in a circular shape with different radii, and the fixed blocks having a small radius as viewed from the bottom are disposed in such a manner as to be spaced apart from the inside of the fixing block having a large radius, thereby providing the heat radiation fin. A portion of the circular fixed block is exposed and opened.

LED lighting device according to the present invention for achieving the above object includes the above-described LED cooling device.

LED cooling device manufacturing method according to the present invention for achieving the above object is a plurality of fixed blocks and the heat absorbed by the fixed block and the LED lamp is fixed to one side to absorb the heat generated from the LED lamp. Manufacturing each of the heat radiation fins released into the air; And coupling the heat dissipation fins to the other surface opposite to one surface to which the LED lamp is fixed in the fixing block, and when viewed from the bottom, an area of the fixing block is narrower than an arrangement area of the heat dissipation fins. Exposed and open between the plurality of fixing blocks to allow the outflow or inflow of air to the heat radiation fin through the open portion.

Preferably, the heat radiation fin manufacturing step is performed by a press working method.

More preferably, the fixing block and the heat radiation fin coupling step is performed by a soldering method or a method of attaching by heat conductive adhesive. Alternatively, the fixing block and the radiating fin coupling step may be performed by forming a groove on the other surface of the fixing block and pressing the radiating fin to place the radiating fin in the groove.

According to the present invention, the ventilation environment of the LED cooling device used in the LED lighting device is improved, so that the outflow or inflow of air can be made more active between the LED cooling device and the outside thereof. In particular, by allowing air to flow in and out of the central portion as well as the side of the LED cooling device, heat dissipation can be efficiently performed as a whole of the LED cooling device.

Therefore, by lowering the temperature of the LED lighting device, the life of the LED lighting device can be greatly improved, and the wavelength of the light can be made constant to sufficiently obtain the desired lighting effect.

In addition, since the cooling efficiency is improved, more LED lamps may be provided in one LED lighting device, thereby reducing the number of LED lighting devices installed in the same area. Therefore, the cost for installing the LED lighting device can be greatly reduced.

In addition, according to the present invention, by separately manufacturing the fixed block and the heat sink fins can simplify the production and reduce the thickness of the heat sink fins. Therefore, the weight of the whole LED lighting apparatus can be reduced and heat dissipation area can be largely enlarged.

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate preferred embodiments of the invention and, together with the description of the invention given below, serve to further the understanding of the technical idea of the invention, And should not be construed as limiting.
1 is a diagram schematically showing the configuration of an LED cooling device for dissipating heat generated by an LED lamp in a conventional LED lighting device.
FIG. 2 is a diagram visually illustrating a flow of air around a conventional LED cooling device. FIG.
3 is a view schematically showing the configuration of the LED cooling device provided in the LED lighting device according to an embodiment of the present invention.
4 is a view showing a configuration in which the fixed block and the heat dissipation fins are coupled using solder or a thermally conductive adhesive according to an embodiment of the present invention.
FIG. 5 is a partially enlarged cross-sectional view taken along line CC ′ in the embodiment of FIG. 4.
6 is a cross-sectional view showing a configuration in which the fixing block and the heat dissipation fins are coupled using a groove formed on one surface of the fixing block according to an embodiment of the present invention.
7 is a view showing an example of a method of reducing the size of the groove of the fixed block in order to increase the coupling force of the heat radiation fin and the fixed block in the embodiment of FIG.
8 is a diagram schematically showing the flow of air around the LED cooling device according to an embodiment of the present invention.
9 is a view showing a comparison between the conventional LED cooling device and the cooling effect by the LED cooling device according to an embodiment of the present invention.
FIG. 10 is a diagram schematically showing a configuration of an LED lighting device including an LED cooling device according to an embodiment of the present invention.
11 is a diagram schematically showing a configuration of an LED lighting device including an LED cooling device according to another embodiment of the present invention.
12 is a flowchart schematically illustrating a method of manufacturing an LED cooling device according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the specification and claims should not be construed as having a conventional or dictionary meaning, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

Therefore, the embodiments described in the present specification and the configurations shown in the drawings are only the most preferred embodiments of the present invention and do not represent all the technical ideas of the present invention. Therefore, It is to be understood that equivalents and modifications are possible.

3 is a view schematically showing the configuration of the LED cooling device 100 provided in the LED lighting device according to an embodiment of the present invention. Referring to FIG. 3, the LED cooling device 100 according to the present invention includes a fixing block 110 and a heat dissipation fin 120.

The fixing block 110, the LED lamp 200 is fixed to the lower portion, and absorbs the heat generated by the LED lamp 200 when it is emitted. The fixing block 110 is provided in plurality in the LED cooling device 100 according to the present invention.

The heat dissipation fin 120 is located above the fixing block 110 to release heat absorbed by the fixing block 110 into the air.

In the LED cooling device 100 according to the present invention, the fixing block 110 and the heat dissipation fins 120 are each manufactured separately and then combined.

Here, the heat dissipation fin 120 is preferably manufactured by a press working method. Using the press working method as described above has an advantage that a thinner heat dissipation fin 120 can be obtained than other manufacturing methods. Therefore, when the heat radiation fins 120 are manufactured by the press working method, the weight of the LED lighting device can be reduced, and the overall heat dissipation area can be widened. On the other hand, if the heat dissipation fins 120 are manufactured using other processing methods, such as die casting or extrusion, the thickness of the heat dissipation fins 120 may be very thick, thereby increasing the weight of the LED lighting device. There may also be difficulties in directing the LED lamps for proper light distribution.

The fixed block 110 may be manufactured through various methods such as die casting or extrusion. In particular, the fixing block 110 may be made of a metal material, typically, aluminum may be used as the material of the fixing block 110.

As described above, the fixing blocks 110 and the heat dissipation fins 120, which are separately manufactured, are assembled to each other, that is, combined to form the LED cooling device 100 according to the present invention.

In this case, various methods may be used to couple the fixing block 110 and the heat dissipation fin 120.

Preferably, the fixing block 110 and the heat dissipation fins 120 may be coupled in a soldering manner. The soldering method is a method in which the fixed block 110 and the heat dissipation fin 120 are bonded to each other by using a solder, also called solder.

Alternatively, the fixing block 110 and the heat dissipation fins 120 may be coupled in a manner of being attached using a thermally conductive adhesive. At this time, the present invention is not limited by the specific type of the thermally conductive adhesive, various thermally conductive adhesives known at the time of filing the present invention may be employed in the present invention.

4 is a view showing a configuration in which the fixing block 110 and the heat dissipation fin 120 is coupled using a solder or a thermally conductive adhesive according to an embodiment of the present invention, Figure 5 is a C-C in the embodiment of Figure 4 Figure is a partially enlarged cross-sectional view along the line.

4 and 5, a plurality of thin heat dissipation fins 120 and a plurality of fixing blocks 110 are separately manufactured and combined. That is, as shown in FIG. 4, the plurality of fixing blocks 110 may be moved and attached to predetermined positions of the heat dissipation fins 120, respectively. At this time, as shown in Figure 4 and 5, a portion of the lower portion of the heat radiation fin 120 may be bent at a certain angle, such as vertical to form an attachment portion 121 for attachment with the fixing block 110. In addition, the heat dissipation fin 120 and the fixing block 110 may be attached to each other through the attachment material 130 between the attachment portion 121 and the fixing block 110 of the heat dissipation fin 120. Here, the attachment material 130 interposed between the heat dissipation fin 120 and the fixing block 110 may be a solder or a thermally conductive adhesive. That is, the heat dissipation fin 120 and the fixing block 110 may be coupled by soldering using solder, or the heat dissipation fin 120 and the fixing block 110 may be bonded by bonding using a heat conductive adhesive.

Alternatively, the fixing block 110 and the heat dissipation fins 120 may be coupled in a manner of forming a groove on one surface of the fixing block 110 and placing the heat dissipation fin 120 in the groove.

6 is a cross-sectional view illustrating a configuration in which the fixing block 110 and the heat dissipation fin 120 are coupled using the groove 111 formed on one surface of the fixing block 110 according to the exemplary embodiment of the present invention.

Referring to FIG. 6, a groove 111 is formed on one surface of the fixed block 110. The heat dissipation fin 120 is positioned in the groove 111 of the fixing block 110 to press the heat dissipation fin 120 in the direction of the arrow. Then, the heat radiation fin 120 is forcedly press-fitted or fitted into the groove 111 of the fixed block 110, the heat radiation fin 120 and the fixed block 110 may be coupled.

At this time, after the heat radiation fins 120 are coupled to the grooves 111 of the fixed block 110, the size of the grooves 111 of the fixed block 110 is reduced to further increase the coupling force of the heat radiation fins 120 and the fixed block 110. The method can be used.

7 is a view showing an example of a method of reducing the size of the groove 111 of the fixed block 110 in order to increase the coupling force of the heat radiation fin 120 and the fixed block 110 in the embodiment of FIG.

Referring to FIG. 7, the size of the groove 111 of the fixing block 110, that is, the groove 111 using the deformation tool 400 having a hardness higher than that of the fixing block 110 and having a sharp tip in the shape of an horn. ) Diameter can be reduced. According to this method, first, as shown in (a) of FIG. 7, the sharp horn portion of the deformation tool 400 is positioned between the grooves 111 of the heat dissipation fin 120, and the deformation tool 400 in the direction of the arrow. To exert strength. Then, as shown in Figure 7 (b), the pointed horn portion of the deformation tool 400 is penetrated between the groove 111 and the groove 111 of the fixed block 110, the shape of the fixed block 110 The force is applied in the direction of the arrow while deforming. Therefore, the groove 111 of the fixed block 110 is subjected to a force on both sides so that the groove 111 and the heat dissipation fin 120 of the fixed block 110 is more tightly tightened. Then, as shown in Figure 7 (c), even if the deformation tool 400 is removed in the upper direction, since the shape of the fixed block 110 is maintained in a deformed state, the fixed block 110 and the heat radiation fins Coupling of 120 may remain strong.

In addition, when viewed from the bottom of the LED cooling device 100 according to the present invention, the area of the fixed block 110 is narrower than the arrangement area of the heat radiation fins 120, so that a part of the heat radiation fins 120 between the plurality of fixed blocks (110). Exposed and open. That is, the LED cooling device 100 according to the present invention, like the conventional LED cooling device 10 of FIG. 2, the fixing plate 11 for fixing the LED lamp 20 to the entire lower portion of the heat radiation fin 12 is Instead of being formed, as shown in FIG. 3, only a part of the lower portion of the heat dissipation fin 120 is provided with the fixing block 110. Therefore, the LED cooling device 100 according to the present invention has a structure in which an open portion 115 to which the fixing block 110 is not coupled is formed at a part of the lower portion of the heat dissipation fin 120. In particular, in the LED cooling device 100 according to the present invention, an open portion 115 is formed between the fixed block 110 and the fixed block 110.

As such, the LED cooling device 100 according to the present invention has an open portion 115 between the lower portion of the heat dissipation fin 120, in particular, between the fixed block 110 and the fixed block 110, such an open portion 115. Through the heat dissipation fin 120 and the outside it is possible to outflow or inflow of air. Therefore, convection of air passing through the heat radiating fins 120 is actively performed not only at the side portions of the heat radiating fins 120 but also at the center thereof, thereby improving the heat radiating effect of the entire heat radiating fins 120.

On the other hand, the fixing block 110 located below the heat dissipation fin 120 may have only a minimum area for fixing the LED lamp 200. In other words, the remaining portion of the lower portion of the heat dissipation fin 120, that is, the open portion 115 may have a large area as much as possible. This is because the wider the open portion 115 in the lower portion of the heat dissipation fin 120, the more active air flows in and out of the heat dissipation fin 120, thereby further improving the heat dissipation effect of the heat dissipation fin 120.

8 is a diagram schematically showing the flow of air around the LED cooling device 100 according to an embodiment of the present invention. In FIG. 8, as in FIG. 2, the direction in which air flows is illustrated by an arrow, and the cooling device 100 and the surrounding air are expressed in different colors according to temperature. For example, as the cooling device 100 or the ambient air gets closer to blue, it means a lower temperature, and closer to red means a higher temperature.

Referring to FIG. 8, in the LED cooling device 100 according to the present invention, a plurality of fixing blocks 110 to which the LED lamps 200 are fixed are not coupled to the whole of the lower portion of the LED cooling device 100, but only to a part thereof. Thus, there is an open portion 115 of the lower portion of the LED cooling device 100, in particular between the fixed block 110 and the fixed block 110. Therefore, unlike the conventional LED cooling device 10 of FIG. 2, in the LED cooling device 100 according to the present invention, it is possible to flow in and out of the outside air through such an open portion 115 of the lower, LED cooling device ( Cool air from the outside may be sufficiently introduced into the center portion as well as the side portion of 100). Therefore, the heat dissipation of the LED cooling device 100 as a whole is well achieved, and the cooling effect of the cooling device 100 can be greatly improved. This effect can also be confirmed through the temperature distribution of the cooling device 100 and ambient air in FIG. 8. That is, referring to FIG. 8, not only the cooling device 100 itself but also the ambient air has a color distribution close to blue, which is the temperature of the LED cooling device 100 and the ambient air in the conventional LED cooling device 10. ) And very low compared to the temperature of the surrounding air. In addition, this means that the cooling effect of the LED cooling device 100 according to the present invention is very excellent compared to the cooling effect of the conventional LED cooling device 10.

9 is a view showing a comparison of the cooling effect by the conventional LED cooling device 10 and the LED cooling device 100 according to an embodiment of the present invention. FIG. 9 is a view as viewed from the top of each LED cooling device (10, 100), in FIG. 9, the cooling device (10, 100) and the air is shown in different colors depending on the temperature as shown in FIG. In addition, the flow direction of air is shown by an arrow.

Referring to FIG. 9A, since the lower part of the heat dissipation fin 12 is blocked by the fixing plate 11 in the conventional LED cooling device 10, the external cool air is an end portion of the cooling device 10. Directly reach only the heat radiation fins 12 that are present at, and do not directly reach the heat radiation fins 12 that are present in the center of the cooling device (10). In addition, in order for external air to reach the heat dissipation fin 12 in the center, the air must pass through the heat dissipation fin 12 at the periphery. In this process, the temperature of the external air is gradually increased by heat emitted from the heat dissipation fin 12 at the periphery. . Therefore, when the outside air reaches the heat radiation fins 12 at the center, the temperature is considerably high, so the effect of cooling the heat radiation fins 12 is not good. As described above, the fact that the cooling effect is not large in the conventional LED cooling device 10 can be easily seen from the red color of the LED cooling device 10 as a whole in FIG. Furthermore, when the red color becomes deeper toward the center of the LED cooling device 10 in FIG. 9 (a), according to the conventional LED cooling device 10, external cold air is provided at the center of the cooling device 10. It can be seen that the cooling efficiency is much lowered due to poor inflow.

On the other hand, referring to Figure 9 (b), the LED cooling device 100 according to an embodiment of the present invention is formed with an open portion 115, the fixing block 110 is not coupled to the bottom of the heat radiation fin, External cool air may be actively introduced through the open portion 115. Therefore, since the heat dissipation fin 120 can be more easily cooled by the direct arrival of the external air, the cooling effect of the LED cooling device 100 as a whole is improved. As described above, according to the present invention, the cooling effect of the LED cooling device 100 is improved through the fact that the LED cooling device 100 and the surrounding air are generally displayed in blue or green in FIG. 9B. It can be easily identified.

The LED lighting device according to the present invention includes the LED cooling device 100 described above.

For example, the LED lighting device according to the present invention, the LED lamp 200, a plurality of fixing blocks 110 and fixed to the LED lamp 200 is fixed to the bottom to absorb the heat generated from the LED lamp 200. Located at the top of the block 110 includes a heat radiation fin 120 for dissipating heat absorbed by the fixed block 110 into the air, the fixed block 110 and the heat dissipation fin 120 are each manufactured separately When coupled and viewed from the bottom, the area of the fixing block 110 is narrower than the arrangement area of the heat dissipation fin 120, so that a part of the heat dissipation fin 120 is exposed between the plurality of fixing blocks 110 and opened to open the opening. The inlet 115 may allow inflow or outflow of air to the heat dissipation fin 120.

FIG. 10 is a diagram schematically showing the configuration of an LED lighting device including the LED cooling device 100 according to an embodiment of the present invention.

Referring to FIG. 10, the LED lighting device has a rectangular structure as a whole, and includes an LED cooling device 100 and an LED lamp 200. In particular, the LED cooling device 100 is provided with a plurality of fixing blocks 110 in the form of a band, the plurality of fixing blocks 110 provided in this way, when viewed from the bottom and spaced apart from each other in parallel to the heat dissipation fin ( A portion of the 120 is exposed between the fixing block 110 on the belt to open. At this time, the cooling effect of the LED cooling device 100 is improved by the opening portion 115 as described above.

In addition, as shown in FIG. 10, the LED lighting apparatus according to the present invention may further include an LED lamp protection cover 300. The LED lamp protective cover 300 protects the LED lamp 200 from physical shock, prevents moisture from penetrating easily into the LED lamp 200 by rain or snow, and prevents the inflow of various other foreign substances. In addition, it may serve to evenly distribute the light generated from the LED lamp 200. LED lamp protective cover 300 may be made to have a variety of transmission according to the use of the LED lighting device.

11 is a diagram schematically showing the configuration of an LED lighting device including the LED cooling device 100 according to another embodiment of the present invention.

Referring to FIG. 11, the LED lighting device has a circular structure as a whole, and includes an LED cooling device 100, an LED lamp 200, and an LED lamp protection cover 300. At this time, the LED cooling device 100, the plurality of fixed block 110 is made of a circle with a different radius, when viewed from the bottom of the fixed block 110 is a small radius of the fixed block 110 inside the large fixed block 110 It is disposed in the form of being spaced apart from a certain distance. Thus, a portion of the heat radiation fin 120 is exposed between the circular fixed block 110 to form an open portion 115.

Meanwhile, in FIG. 11, a plurality of circular fixing blocks 110 having different radii are provided under the heat dissipation fins 120 so that the fixing blocks 110 having a small radius are spaced apart from the inside of the fixing block 110 having a large radius. Although shown to be, but this is only one embodiment, the present invention is not limited by the specific shape or arrangement of the fixed block (110). For example, the plurality of circular fixing blocks 110 having the same radius may be present in the lower portion of the heat dissipation fin 120 in a form spaced apart from each other by a predetermined distance.

10 and 11 illustrate rectangular and circular LED lighting devices, the present invention is not limited by the shape of the LED lighting device, and it is apparent to those skilled in the art that the present invention can exist in various forms. Do.

12 is a flowchart schematically illustrating a method of manufacturing the LED cooling device 100 according to an embodiment of the present invention.

Referring to FIG. 12, first, the LED lamp 200 is fixed to emit heat absorbed by the plurality of fixing blocks 110 and the fixing block 110 into the air to absorb heat generated from the LED lamp 200. Producing a heat radiation fin 120, respectively (S110). Here, the heat dissipation fin 120 is preferably manufactured by a press working method. Then, after the fixing block 110 and the heat dissipation fins 120 are manufactured separately, the heat dissipation fins 120 are coupled to the other side of the fixing block 110 and the other side to which the LED lamp 200 is fixed in the fixing block 110 ( S120). Here, when viewed from the bottom, the area of the fixed block 110 is narrower than the arrangement area of the heat radiation fins 120, so that a part of the heat radiation fins 120 is exposed between the plurality of fixed blocks 110 to open, thereby opening this portion 115 Air is introduced into the heat dissipation fins 120 through) or air is allowed to flow out from the heat dissipation fins 120.

Preferably, the step S120 may be performed by attaching by soldering or thermally conductive adhesive. Alternatively, the step S120 may be performed by forming a groove 111 on the other surface of the fixing block 110 and placing the heat radiation fin 120 on the groove 111 to pressurize it.

On the other hand, in the above-described embodiments have been described on the premise that the heat sink fin 120, the fixing block 110 and the LED lamp 200 in the order from the top in the LED lighting device, but the present invention is necessarily limited by this order It doesn't happen. For example, the LED lighting device may be configured in the order of the LED lamp 200, the fixing block 110 and the heat dissipation fin 120 from the top. In this case, the above description of the position of the heat dissipation fin 120, the fixed block 110, the LED lamp 200 may be applied upside down.

As described above, although the present invention has been described by way of limited embodiments and drawings, the present invention is not limited thereto and is intended by those skilled in the art to which the present invention pertains. Of course, various modifications and variations are possible within the scope of equivalents of the claims to be described.

100: LED cooling system
110: fixed block
115: opening part
120: heat sink fin
200: LED lamp

Claims (14)

A plurality of fixing blocks fixed to the lower part of the LED lamp to absorb heat generated from the LED lamp; And
Located on top of the fixed block includes a heat radiation fin for dissipating heat absorbed by the fixed block into the air,
The fixing block and the heat dissipation fins are separately manufactured and then combined,
When viewed from the bottom, the area of the fixed block is narrower than the arrangement area of the heat radiation fins so that a part of the heat radiation fins is exposed between the plurality of fixed blocks to open, thereby allowing air to flow out or inflow into the heat radiation fins through the open portions. LED cooling device, characterized in that. The method of claim 1,
The heat dissipation fin is an LED cooling device, characterized in that produced by the press working method. The method of claim 2,
LED fixing device, characterized in that the fixing block and the heat dissipation fin is coupled in a soldering method. The method of claim 2,
LED fixing device, characterized in that the fixing block and the heat dissipation fin are coupled in a manner that is attached by a thermal conductive adhesive. The method of claim 2,
The fixing block and the heat dissipation fins, LED cooling apparatus, characterized in that the coupling is formed in a manner to form a groove on one surface of the fixing block and to place the heat radiation fins in the groove. The method of claim 1,
The plurality of fixing blocks are made in a band shape, and when viewed from the bottom spaced apart from each other in parallel to the LED cooling device, characterized in that a portion of the heat radiation fin is exposed between the fixing blocks on the band open. The method of claim 1,
The plurality of fixed blocks are formed in a circular shape with a different radius, and the fixed block having a small radius as viewed from the bottom is arranged in such a manner as to be spaced apart from the inside of the fixed block having a large radius, so that a part of the heat sink fin is LED cooling device, characterized in that the opening is exposed between the fixed block. An LED lighting device comprising the LED cooling device according to claim 1. The method of claim 8,
LED lighting device further comprises a cover for protecting the LED lamp. Manufacturing a plurality of fixed blocks for absorbing heat generated from the LED lamps and fixing heat radiation fins for dissipating heat absorbed by the fixed blocks into air; And
Including the step of coupling the heat dissipation fins on the other side of the other side and the other side is fixed to the LED lamp in the fixing block,
When viewed from the bottom, the area of the fixing block is narrower than the arrangement area of the heat dissipation fins, so that a part of the heat dissipation fins is exposed between the plurality of fixing blocks to open, thereby allowing air to flow out or inflow into the heat dissipation fins through the open portions. LED cooling apparatus manufacturing method characterized in that. The method of claim 10,
The radiating fin manufacturing step, LED cooling device manufacturing method characterized in that it is carried out by a press working method. The method of claim 11,
The fixing block and the heat radiation fin coupling step, LED cooling device manufacturing method characterized in that it is performed by a soldering method. The method of claim 11,
The fixing block and the heat dissipation fin coupling step, LED cooling device manufacturing method characterized in that it is carried out in a manner of attaching by a heat conductive adhesive. The method of claim 11,
The fixing block and the heat dissipation fin coupling step, the groove is formed on the other surface of the fixed block and the heat dissipation fin is placed in the groove in a manner that is carried out by pressing the method.

Images