KR20150046218A - 플렉시블 유리 기판 가공 방법 - Google Patents

플렉시블 유리 기판 가공 방법 Download PDF

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Publication number
KR20150046218A
KR20150046218A KR20157007085A KR20157007085A KR20150046218A KR 20150046218 A KR20150046218 A KR 20150046218A KR 20157007085 A KR20157007085 A KR 20157007085A KR 20157007085 A KR20157007085 A KR 20157007085A KR 20150046218 A KR20150046218 A KR 20150046218A
Authority
KR
South Korea
Prior art keywords
substrate
bonding layer
flexible glass
glass substrate
carrier substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR20157007085A
Other languages
English (en)
Korean (ko)
Inventor
션 매튜 가너
로버트 조지 맨리
Original Assignee
코닝 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 코닝 인코포레이티드 filed Critical 코닝 인코포레이티드
Publication of KR20150046218A publication Critical patent/KR20150046218A/ko
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/021—Manufacture or treatment of multiple TFTs
    • H10D86/0214—Manufacture or treatment of multiple TFTs using temporary substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/542—Shear strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/702—Amorphous
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202—LCD, i.e. liquid crystal displays

Landscapes

  • Joining Of Glass To Other Materials (AREA)
  • Laminated Bodies (AREA)
KR20157007085A 2012-08-22 2013-08-12 플렉시블 유리 기판 가공 방법 Withdrawn KR20150046218A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261691904P 2012-08-22 2012-08-22
US61/691,904 2012-08-22
PCT/US2013/054473 WO2014031372A1 (en) 2012-08-22 2013-08-12 Processing flexible glass substrates

Publications (1)

Publication Number Publication Date
KR20150046218A true KR20150046218A (ko) 2015-04-29

Family

ID=49034218

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20157007085A Withdrawn KR20150046218A (ko) 2012-08-22 2013-08-12 플렉시블 유리 기판 가공 방법

Country Status (5)

Country Link
JP (1) JP2015532004A (enrdf_load_stackoverflow)
KR (1) KR20150046218A (enrdf_load_stackoverflow)
CN (1) CN104685627B (enrdf_load_stackoverflow)
TW (1) TWI589443B (enrdf_load_stackoverflow)
WO (1) WO2014031372A1 (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9919951B2 (en) * 2014-10-31 2018-03-20 Corning Incorporated Dimensionally stable fast etching glasses
CN104992944B (zh) * 2015-05-26 2018-09-11 京东方科技集团股份有限公司 一种柔性显示母板及柔性显示面板的制作方法
JP7091121B2 (ja) 2018-04-18 2022-06-27 信越石英株式会社 石英ガラス板
CN108962028B (zh) * 2018-07-10 2020-03-31 云谷（固安）科技有限公司 柔性显示屏盖板、柔性显示模组和柔性显示装置
CN112297546A (zh) * 2019-07-24 2021-02-02 东旭光电科技股份有限公司 显示面板的制备方法
CN111393032B (zh) * 2020-04-13 2022-07-08 Oppo广东移动通信有限公司 微晶玻璃盖板、柔性屏组件、电子设备及微晶玻璃盖板加工方法
CN112582576A (zh) * 2020-12-10 2021-03-30 深圳市华星光电半导体显示技术有限公司 柔性基板制备方法及显示面板

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5281560A (en) * 1993-06-21 1994-01-25 Corning Incorporated Non-lead sealing glasses
DE69739368D1 (de) * 1996-08-27 2009-05-28 Seiko Epson Corp Trennverfahren und Verfahren zur Übertragung eines Dünnfilmbauelements
JP2000252342A (ja) * 1999-03-01 2000-09-14 Seiko Epson Corp 薄板の搬送方法および液晶パネルの製造方法
JP2004186201A (ja) * 2002-11-29 2004-07-02 Sekisui Chem Co Ltd 薄層ガラスパネルの取扱い方法
US20060207967A1 (en) * 2003-07-03 2006-09-21 Bocko Peter L Porous processing carrier for flexible substrates
JP2007036074A (ja) * 2005-07-29 2007-02-08 Toshiba Corp 半導体装置の製造方法
JP2006152308A (ja) * 2005-12-28 2006-06-15 Nitto Denko Corp 電子部品の切断方法
KR100820170B1 (ko) * 2006-08-30 2008-04-10 한국전자통신연구원 플렉시블 기판의 적층 방법
CN102007524B (zh) * 2008-04-17 2013-07-31 旭硝子株式会社 玻璃层叠体、带支撑体的显示装置用面板及它们的制造方法
KR101458901B1 (ko) * 2008-04-29 2014-11-10 삼성디스플레이 주식회사 가요성 표시 장치의 제조 방법
CN102197005B (zh) * 2008-10-23 2014-06-25 旭硝子株式会社 玻璃基板层叠装置及层叠玻璃基板的制造方法
US9063605B2 (en) * 2009-01-09 2015-06-23 Apple Inc. Thin glass processing using a carrier
JP2011003668A (ja) * 2009-06-17 2011-01-06 Seiko Epson Corp 素子の転写方法および電子機器の製造方法
JP2012064710A (ja) * 2010-09-15 2012-03-29 Asahi Glass Co Ltd 半導体素子の製造方法
JP2012109538A (ja) * 2010-10-29 2012-06-07 Tokyo Ohka Kogyo Co Ltd 積層体、およびその積層体の分離方法

Also Published As

Publication number Publication date
JP2015532004A (ja) 2015-11-05
WO2014031372A1 (en) 2014-02-27
CN104685627B (zh) 2017-12-05
TWI589443B (zh) 2017-07-01
TW201410474A (zh) 2014-03-16
CN104685627A (zh) 2015-06-03

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20150320

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid