KR20150042992A - Chamber of substrate processing apparatus - Google Patents

Chamber of substrate processing apparatus Download PDF

Info

Publication number
KR20150042992A
KR20150042992A KR20130121895A KR20130121895A KR20150042992A KR 20150042992 A KR20150042992 A KR 20150042992A KR 20130121895 A KR20130121895 A KR 20130121895A KR 20130121895 A KR20130121895 A KR 20130121895A KR 20150042992 A KR20150042992 A KR 20150042992A
Authority
KR
South Korea
Prior art keywords
blowing
chamber
space
air
accommodating space
Prior art date
Application number
KR20130121895A
Other languages
Korean (ko)
Inventor
안경준
배정운
백주열
최상대
정성훈
Original Assignee
(주)에스엔텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)에스엔텍 filed Critical (주)에스엔텍
Priority to KR20130121895A priority Critical patent/KR20150042992A/en
Publication of KR20150042992A publication Critical patent/KR20150042992A/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers

Abstract

The present invention relates to a chamber of a substrate processing system, and more particularly, to a chamber of a substrate processing system, comprising: a chamber main body having a substrate accommodating space formed therein at one side thereof with a blowing space having an area corresponding to the entire one side of the substrate accommodating space; A filter disposed entirely between the air blowing space and the substrate accommodating space to filter out foreign matter; And a plurality of blowing fans installed in the blowing space and spaced apart from each other with respect to the entire area of the blowing space to blow air into the substrate accommodating space.
Thereby, there is provided a chamber of a substrate processing system in which the air to be blown can maintain a uniform air flow rate throughout the chamber without any restrictions on the design and manufacture of the chamber.
Further, a chamber of a substrate processing system in which the installation and maintenance of the blowing fan is easy is provided.

Description

[0001] The present invention relates to a chamber of a substrate processing system,

The present invention relates to a chamber of a substrate processing system, and more particularly, to a chamber of a substrate processing system in which an air blowing fan installation structure for blowing air into a chamber is improved.

Generally, in a planar device manufacturing process such as a semiconductor, a display, and a solar cell, a process such as a deposition process, an etching process, a developing process, and an ashing process is performed on a substrate, A chemical cleaning process or a wet cleaning process using deionized water may be added as a process for removing various contaminants adhering to a substrate in a process of performing various processes.

These processes are connected to form a single substrate processing system. Each process must be performed in a process chamber having an optimal environment for the progress of the process, and the substrate is transferred or conveyed to each of the process chambers Is provided.

Such a substrate processing system can be divided into a cluster type and an in-line type depending on the type of connection of a plurality of process chambers. In recent years, according to the increasing trend of the substrate size, The system is in the spotlight.

The substrate processing system includes a process chamber in which a substantial series of processes as described above are performed, a substantial series of processes such as loading and unloading chambers and buffer chambers for supplying, moving, There are chambers in which the substrate is passed without being supported.

These chambers must be kept clean inside to prevent contamination of the substrate by foreign substances.

1 and 2, the chamber 101 of the general substrate processing system includes an air blowing unit 120 for blowing air from the opposite side of the chamber 101 to the opposite side, And a circulating duct 130 for circulating the air discharged from the air blowing unit 120 toward the blowing unit 120.

It is preferable that the air blowing unit 120 is provided at the upper part of the chamber 101 to blow air to the lower part of the chamber 101. This is because the foreign substance is sucked downward .

The air blowing unit 120 has a fan housing 121 having an air inlet and a blowing hole 123 formed in the upper and lower sides thereof and air introduced through the inlet port inside the fan housing 121 to blow air into the chamber through the air outlet 123 A blowing fan 125 and a filter 127 provided at a blowing port 123 of the fan housing 121 to filter out foreign substances contained in the air blown. In this case, a plurality of blowing units 120 are provided to be installed on the entire upper surface of the chamber 101, so that the air volume of the air directed downward from the upper part of the chamber 101 is uniformly formed in the entire space inside the chamber 101 It is for this reason.

If the air flow rate of the blown air is made nonuniform in the space inside the chamber 101, a vortex phenomenon occurs in the chamber 101, and this vortex phenomenon is caused by the fact that the foreign substances contained in the air are not discharged smoothly to the lower portion of the chamber . The foreign substance existing in the chamber 101 adversely affects the substrate accommodated in the chamber 101.

The air blowing unit 120 includes a fan housing 121 and an air blowing fan 125 installed in the fan housing 121 and a filter (not shown) provided on the air blowing opening 123 side of the fan housing 121, 127 are purchased in the form of a set, and are installed in the chamber 101 after they are purchased as separate ready-made products. To this end, a blowing space 110 is formed in the upper part of the chamber 101 as a space for connecting the blowing units 120 to the circulating duct 130.

In order to uniformly blow air into the chamber 101 in the chamber 101 of the conventional substrate processing system, the blowing unit 120 is spaced at a uniform interval over the entire upper blowing space 110 of the chamber 101 The shape of the chamber 101 must be influenced by the structure of the fan housing 121 of the blowing unit 120. [

For example, when the flat cross-sectional shape of the chamber 101 is a shape or size of a pentagon or a hexagon instead of a quadrangle, the ventilating unit 120, which is a ready-made product up to the corner area of the chamber 101 You will not be able to install it. There is a problem that the design and manufacture of the chamber 101 are restricted.

Particularly, when the chamber P is formed in the shape and size of the mold, the blowing operation can not be performed in the corner area where the blowing unit can not be installed, and the air blown from the upper part of the chamber to the lower part There arises a problem that a vortex phenomenon occurs while moving.

Further, in maintenance such as installation, repair and replacement of the air blowing unit, the entire air blowing unit must be separated from the chamber, so that there arises a problem that installation and maintenance are inconvenient.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a chamber of a substrate processing system in which the air to be blown can maintain a uniform air flow rate throughout the chamber without any restrictions on the design and manufacture of the chamber.

Further, it is an object of the present invention to provide a chamber of a substrate processing system that facilitates the installation and maintenance of a blowing fan.

According to the present invention, there is provided a chamber of a substrate processing system, comprising: a chamber main body having a substrate accommodating space formed therein and having a blowing space having an area corresponding to the entire one side of the substrate accommodating space; A filter disposed entirely between the air blowing space and the substrate accommodating space to filter out foreign matter; And a plurality of blowing fans installed in the blowing space and arranged to be spaced apart from each other with respect to the entire area of the blowing space to blow air into the substrate accommodating space. do.

Preferably, the blowing space is provided in an upper region of the chamber body, and the blowing space is provided with a blowing fan mounting portion corresponding to the position of the blowing fans.

And an opening / closing cover is provided on the upper portion of the chamber body corresponding to each of the blowing fan mounting portions.

In addition, it is effective that the blowing space is integrally formed on the upper part of the chamber body.

In addition, a discharge portion having a discharge space through which air in the substrate accommodating space is discharged is formed in a lower portion of the chamber body; And a blowing duct is formed around the chamber body to form the circulation flow path by connecting the discharge portion and the blowing space.

At this time, it is effective that the porous surface is formed on the entire surface between the substrate accommodating space and the discharge space.

According to the present invention, there is provided a chamber for a substrate processing system in which air to be blown can maintain a uniform air flow rate throughout the chamber without restrictions on the design and manufacture of the chamber.

Further, a chamber of a substrate processing system in which the installation and maintenance of the blowing fan is easy is provided.

1 is a perspective view showing a part of a chamber arrangement state of a substrate processing system,
Figures 2 and 3 are a chamber perspective view and a cross-sectional view of a conventional substrate processing system,
4 is a chamber cross-sectional view of a substrate processing system according to the present invention,
Fig. 5 is a simplified enlarged cross-sectional view of the ventilation fan installation area of Fig. 4;

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 ') of the substrate processing system according to the present invention includes a chamber main body 10 forming a substrate receiving space 15, a chamber main body 10, A filter 30 for filtering the foreign substances contained in the air blown from the blowing fan 20 and a filter 30 for filtering the foreign substances contained in the air blown from the inside of the substrate accommodating space 15 of the chamber main body 10 A discharge unit 40 for discharging air and at least one circulation duct 50 for forming a circulation flow path between the discharge unit 40 and the blowing fan 20.

The chamber body 10 can be manufactured to have an appropriate internal space and appearance by using a frame or a plate material such as a metal or alloy having excellent durability. For example, the chamber body 10 may be formed in a shape having a polygonal plane as viewed in plan, and may be formed in a shape having a curved portion or a circular flat cross-section as the case may be. As an embodiment of the present invention, the chamber body 10 will be described taking an example in which the plane is a hexagonal plane as in the example of Fig.

The entire upper portion of the chamber main body 10 is provided with a substrate accommodating space 15 and an air space 11 partitioned by the space accommodating the air blowing fan 20 while receiving the air from the circulating duct 50 have. In the air blowing space 11, a plurality of blowing fan mounting portions 13 are preferably formed at regular intervals.

The upper surface of the air blowing space 11 may be formed as an upper surface of the chamber and the air blowing fan 20 may be installed and maintained in a region corresponding to the blowing fans 20 installed in the respective blowing fan mounting portions 13. [ Opening and closing covers 17 are provided for management.

The blowing fans 20 installed in the blowing fan mounting portion 13 blow air moving into the blowing space 11 into the substrate accommodating space 15 of the chamber main body 10. For this purpose, the blowing fan mounting portion 13 may be formed in the form of a blowing hole penetrating the inside of the chamber body 10.

Here, the blowing fan mounting portions 13 are formed in a region corresponding to the central region of the chamber main body 10 and the corner region of the chamber main body 10 when the flat cross-section of the chamber main body 10 is polygonal, Are formed at regular intervals from each other in the region. Thus, when the blowing fan 20 is installed in each of the blowing fan mounting portions 13, the air blown from the blowing fan 20 is uniformly blown into the entire region of the inside of the substrate accommodating space 15 of the chamber body 10 .

The filter 30 is disposed entirely between the air blowing space 11 of the chamber body 10 and the substrate accommodating space 15 to filter foreign substances contained in the air blown from the blowing fans 20. In this case, the filter 30 is preferably detachably installed, and may be divided into a plurality of filters 30 or a single filter 30, as the case may be.

The filter (30) forms the air volume of the air blown from the blowing fan (20) with a constant air volume. The blowing fan 20 is installed at a position corresponding to a central region of the chamber body 10 and at an edge of the chamber body 10, And in this case, the air volume of the air blown from the blowing fans 20 of the same specification may be different. Accordingly, the air blowing force of the blowing fan 20 can be adjusted, the thickness of the filter 30 can be adjusted, and the air blown into the chamber body 10 can be adjusted to be uniform as a whole. At this time, the amount of air blown into the chamber body 10 is preferably 0.3 to 0.5 m / sec.

The blowing fans 20 are respectively installed in the blowing fan mounting portions 13 formed in the air blowing space 11 to blow air downward into the substrate receiving space 15 of the chamber body 10 as described above.

Unlike the conventional air blowing unit, these blowing fans 20 are preferably made of only the blowing fan 20 so that the wind power can be adjusted. When the opening and closing cover 17 is provided on the chamber body 10 as described above, So that the blower fans 20 can be easily installed and maintained.

The discharge unit 40 includes a discharge space 41 formed in the lower portion of the substrate receiving space 15 of the chamber body 10 and a discharge space 41 formed in the discharge space 41 and connected to the inflow side of the circulating duct 50 And may have a duct connecting space 43 formed therein.

It is preferable that pores 42 are formed on the entire surface of the plate surface separating the discharge space 41 and the substrate accommodating space 15 of the chamber body 10. [ This is for the purpose of stably discharging air while preventing abnormal flow such as vapors when the air inside the chamber body 10 is discharged. A partition wall on the perforated plate is formed at a peripheral area of the discharge space 41 with an interval from the peripheral wall of the chamber main body 10. A duct connecting space 43 is formed between the partition wall and the peripheral wall of the chamber main body 10 and a duct connecting space 43 corresponding to a lower portion of the duct mounting area which may be provided in an edge area of the chamber main body 10, Is connected to the inflow side of the circulating duct (50).

The circulation duct 50 has a hollow shape in which the inside of the circulation duct 50 is formed by a circulation path of air and has a discharge opening 51 connected to the air blowing space 11 of the chamber body 10 at an upper portion thereof, An inlet opening 53 connected to the duct connecting space 43 of the duct 40 is formed.

At this time, the circulating duct 50 may be detachably coupled to the chamber main body 10 by using fastening parts in consideration of maintenance management such as repairing. Of course, the circulating duct 50 may be formed integrally with the chamber body 10 by welding or the like.

The air circulation flow of the chamber 1 of the substrate processing system according to the present invention having such a configuration will be briefly described. The air in the substrate accommodating space 15 of the chamber main body 10 is discharged to the discharge space 41 of the lower discharge portion 40 of the chamber body 10 through the duct connection And then flows into the circulating duct 50 through the space 43.

The air introduced into the circulation duct 50 is transferred to the air blowing space 11 in the upper portion of the chamber body 10 through the discharge opening 51 of the circulation duct 50 And is blown into the substrate accommodating space 15 through the filter 30. At this time, foreign substances such as particles contained in the air are filtered by the filter 30, and air is circulated through the process of blowing clean air into the substrate accommodating space 15. [ As a result, the cleanliness of the inside of the chamber can be maintained at the optimum level.

Here, the area where the blowing fan 20 is installed may be the same as that of the blowing fan 20 in the region corresponding to the central region of the chamber body 10, as described above, when the flat cross- 20 and the installation position of the blowing fan 20 in the region corresponding to the edge region of the chamber main body 10 are different and the planar shape of the space through which the air blown from each blowing fan 20 is transmitted is different.

However, since the air blowing fans 20 are installed at a predetermined distance from each other in the entire area of the air blowing space 11, the air blown from each of the air blowing fans 20 is uniformly blown .

The air flow rate of the air blown into the substrate accommodating space 15 of the chamber body 10 becomes even more uniform by regulating the blowing force of the blowing fan 20 or adjusting the thickness of the filter 30. [

Thus, even if the chamber main body 10 is formed in a deformed flat cross-section such as a hexagonal shape, a vortex phenomenon does not occur in an edge area or the like inside the substrate accommodating space 15 of the chamber main body 10. Therefore, the foreign matter is smoothly discharged to the discharge portion 40, and the foreign matter does not stay in the chamber body 10.

In this case, even if the chamber main body 10 has various cross-sectional shapes other than a hexagonal shape, the arrangement of the blower fan mounting portion 13 for installing the blower fan 20 in the process of designing the chamber main body 10 may be appropriately It is very easy to design. Thereby, there is no restriction on the design and manufacture of the chamber.

On the other hand, in the process of installing and maintaining the blowing fan 20, the opening / closing cover 17 on the upper portion of the main body 10 can be opened and can be installed and maintained very easily, as described above.

In the above-described embodiments, the blowing fan is installed above the chamber body to blow air to the lower portion. However, according to the present invention, the blowing fan may blow air from one side of the chamber body to the other side. At this time, the structure and structure other than the filter can be appropriately changed according to the installation position of the blowing fan.

As described above, the chamber of the substrate processing system according to the present invention is not limited in design and manufacture, and air blown from the blowing fan can be blown in a uniform air volume throughout the chamber. In addition, the installation and maintenance of the ventilation fan is very easy.

10: chamber body 11: air blowing space
15: substrate accommodating space 20: blowing fan
30: filter 40:
50: Circular duct

Claims (6)

In a chamber of a substrate processing system,
A chamber main body forming a substrate accommodating space and having a blowing space having an area corresponding to the entire one side of the substrate accommodating space on one side thereof;
A filter disposed entirely between the air blowing space and the substrate accommodating space to filter out foreign matter;
And a plurality of blowing fans installed in the blowing space and spaced apart from each other with respect to an entire area of the blowing space to blow air into the substrate accommodating space. The method according to claim 1,
Wherein the blowing space is provided in an upper region of the chamber body, and the blowing space is provided with a blowing fan mounting portion corresponding to the position of the blowing fans. 3. The method of claim 2,
Wherein a cover is provided on an upper portion of the chamber body corresponding to each of the blowing fan mounting portions. 4. The method according to any one of claims 1 to 3,
Wherein the blowing space is integrally formed on the upper portion of the chamber body. 5. The method of claim 4,
A discharge portion having a discharge space through which air in the substrate accommodating space is discharged is formed in a lower portion of the chamber body;
And a blowing duct is formed around the chamber body to connect the discharge unit and the blowing space to form a circulation flow path. 6. The method of claim 5,
Wherein a porous surface is formed on the entire surface between the substrate accommodating space and the discharge space.
KR20130121895A 2013-10-14 2013-10-14 Chamber of substrate processing apparatus KR20150042992A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR20130121895A KR20150042992A (en) 2013-10-14 2013-10-14 Chamber of substrate processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20130121895A KR20150042992A (en) 2013-10-14 2013-10-14 Chamber of substrate processing apparatus

Publications (1)

Publication Number Publication Date
KR20150042992A true KR20150042992A (en) 2015-04-22

Family

ID=53035874

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20130121895A KR20150042992A (en) 2013-10-14 2013-10-14 Chamber of substrate processing apparatus

Country Status (1)

Country Link
KR (1) KR20150042992A (en)

Similar Documents

Publication Publication Date Title
US10340157B2 (en) Mini-environment apparatus
KR101278334B1 (en) Separation type Chemical Filter
KR20170051174A (en) apparatus for both humidification and air cleaning
KR20140021915A (en) Clean room system
KR20180049289A (en) Substrate transferring apparatus
KR101916886B1 (en) Humidifier
KR101475866B1 (en) Dust collecting apparatus using bag filter
JP2015146348A (en) EFEM system
JP2008296069A (en) Air cleaner for eliminating fine particle or fine particle and harmful gas in sheet-like object manufacturing apparatus
TWI382870B (en) Dust-removing apparatus and dust-removing system
KR20150042992A (en) Chamber of substrate processing apparatus
KR101017910B1 (en) Clean room system
KR101856979B1 (en) Air cleaner
KR101881057B1 (en) Module type assembly panner for clean room ceiling
KR20120094731A (en) Air cleaner
KR100996702B1 (en) Apparatus for cooling a substrate and method thereof
KR20150042991A (en) Chamber of substrate processing apparatus
JP2014196852A (en) Fan filter unit and clean room using the same
JP2001056140A (en) Clean room
JP4509613B2 (en) Substrate processing equipment
US8262988B2 (en) Antigen supply device
KR200381115Y1 (en) Assembled HEPA-filter box
KR102633779B1 (en) Apparatus for supplying air into chamber for semiconductor fabrication
CN212900958U (en) Nitrogen gas circulation system
JP6741302B2 (en) Cultivation equipment

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application