KR20150042587A

KR20150042587A - Touch sensor module and manufacturing method thereof

Info

Publication number: KR20150042587A
Application number: KR20130121436A
Authority: KR
Inventors: 양시영
Original assignee: 삼성전기주식회사
Priority date: 2013-10-11
Filing date: 2013-10-11
Publication date: 2015-04-21

Abstract

According to an embodiment of the present invention, a touch sensor module includes: a window substrate; a base substrate facing the window substrate, having one surface where a first wire connected to a first electrode pattern is formed, and having the other surface where a second wire connected to a second electrode pattern is formed; a via hole formed to be connected to the first wire, and formed to pass through to the other surface of the base substrate to transmit an electrical signal; and a flexible cable formed to be coupled to the base substrate such that the second wire and the via hole can be electrically connected to each other.

Description

TECHNICAL FIELD [0001] The present invention relates to a touch sensor module,

The present invention relates to a touch sensor module and a manufacturing method thereof.

With the development of computers using digital technology, auxiliary devices of computers are being developed together. Personal computers, portable transmission devices, and other personal information processing devices use various input devices such as a keyboard and a mouse And performs text and graphics processing.

However, as the use of computers is gradually increasing due to the rapid progress of the information society, there is a problem that it is difficult to efficiently operate a product by using only a keyboard and a mouse which are currently playing an input device. Therefore, there is an increasing need for a device that is simple and less error-prone, and that allows anyone to easily input information.

In addition, the technology related to the input device is shifting beyond the level that satisfies the general functions, such as high reliability, durability, innovation, design and processing related technology, etc. In order to achieve this purpose, As a possible input device, a touch sensor has been developed.

Such a touch sensor can be applied to a flat display device such as an electronic organizer, a liquid crystal display device (LCD), a plasma display panel (PDP), and an electroluminescence display device, and a display device such as a CRT (Cathode Ray Tube) And is a tool used to allow the user to select desired information while viewing the display.

The types of touch sensors include Resistive Type, Capacitive Type, Electro-Magnetic Type, SAW (Surface Acoustic Wave Type) and Infrared Type).

These various types of touch sensors are employed in electronic products in consideration of problems of signal amplification, difference in resolution, difficulty in design and processing technology, optical characteristics, electrical characteristics, mechanical characteristics, environmental characteristics, input characteristics, durability and economical efficiency Currently, the most widely used methods are resistive touch sensors and capacitive touch sensors.

As one specific example of the touch sensor according to the related art, there is an example of a touch sensor disclosed in Korean Patent Laid-open No. 10-2011-0107590.

The structure of the touch sensor disclosed in the above description of the prior art includes a substrate, electrodes formed on the substrate, electrode wirings extending from the electrodes and gathered to one end of the substrate, And a controller IC (Integrated Circuit) connected through a flexible printed circuit board (hereinafter referred to as a flexible cable).

Here, the flexible cable transmits a signal generated by the electrode to the control unit via the electrode wiring. At this time, when the flexible cable and the touch sensor are connected, the both ends of the sensor (the sensing part and the driving part) are directly connected to transmit signals to the outside. As a result, the process becomes complicated and productivity is low, and the touch sensor can not be mass produced.

KR 10-2011-0107590 A

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the related art, and it is an object of the present invention to provide a touch sensor module which can be connected to one side of a flexible cable connected to an electrode wiring and can be manufactured in a roll-to-roll system.

A touch sensor module according to an embodiment of the present invention includes a window substrate; A base substrate having a first wiring connected to the first electrode pattern on one surface thereof and a second wiring connected to the second electrode pattern on the other surface while facing the window substrate; A via hole formed to be connected to the first wiring and penetrating through the other surface of the base substrate to transmit an electrical signal, and a flexible cable formed by coupling the second wiring and the via hole to be electrically connected to each other.

A touch sensor module according to an embodiment of the present invention includes: a first electrode pad formed on the other surface of the base substrate, the first electrode pad being electrically connected to the via hole and connected to the flexible cable; And a second electrode pad formed on the other surface of the base substrate and connected to the second wiring while being connected to the flexible cable.

In the touch sensor module according to an embodiment of the present invention, a conductive material is filled in the via hole.

The touch sensor module according to an embodiment of the present invention includes a passivation layer formed on a surface of the second electrode pattern and preventing moisture and external impact, and a protective film.

The touch sensor module according to an embodiment of the present invention includes a molding part formed along an interface between the flexible cable and the passivation layer and the protective film and preventing moisture penetrating along the interface.

A method of manufacturing a touch sensor module according to an embodiment of the present invention includes: preparing a window substrate; Preparing a base substrate on which a first wiring of the first electrode pattern and a second wiring of the second electrode pattern are formed; Forming a through via hole so that the first wiring is connected to the other surface of the base substrate; Coupling the window substrate and the base substrate, and connecting the via hole and the second wiring to the flexible cable.

The method of manufacturing a touch sensor module according to an embodiment of the present invention includes a step of coating a surface of the other surface of the base substrate with a passivation layer and a protective film after preparing a base substrate having a second wiring do.

The method of manufacturing a touch sensor module according to an embodiment of the present invention includes filling the inside of the via hole with a conductive material after the step of joining the window substrate and the base substrate.

A method of fabricating a touch sensor module according to an embodiment of the present invention includes: combining the window substrate and the base substrate; And bonding the window substrate and the base substrate using a transparent double-sided adhesive (OCA).

The manufacturing method of a touch sensor module according to an embodiment of the present invention is characterized in that after the step of connecting the via hole and the second wiring with the flexible cable, the molding process is performed along the outer peripheral surface of the interface, in which the flexible cable, .

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to that, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may properly define the concept of the term in order to best explain its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

According to the present invention, it is possible to provide a touch sensor module capable of mass production by forming a flexible cable on one surface, which is connected to the electrode wiring.

Further, there is an effect of providing a touch sensor module capable of producing a roll-to-roll process by forming a flexible cable on one surface, which is connected to the electrode wiring.

Further, by providing the flexible cable connected to the electrode wiring on one surface, it is possible to provide a touch sensor module that can be sealed only in one direction.

Further, by forming the flexible cable connected to the electrode wiring on one surface, there is an effect of providing a touch sensor module in which an article is produced by stacking in one direction.

1 is a partial cross-sectional view of a touch sensor module according to an embodiment of the present invention,
Figure 2 is a top view of the base substrate of Figure 1,
Fig. 3 is a modification of Fig. 2, and Fig.
4 to 9 are views showing the degree of assembly of the touch sensing module according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The objectives, specific advantages and novel features of the invention will become more apparent from the following detailed description and examples taken in conjunction with the accompanying drawings. It should be noted that, in the present specification, the reference numerals are added to the constituent elements of the drawings, and the same constituent elements are assigned the same number as much as possible even if they are displayed on different drawings. Also, the terms "one side,"" first, ""first,"" second, "and the like are used to distinguish one element from another, no. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following description of the present invention, detailed description of related arts which may unnecessarily obscure the gist of the present invention will be omitted.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. 1 is a partial cross-sectional view of a touch sensor module according to an embodiment of the present invention, Fig. 2 is a plan view of a base substrate for Fig. 1, Fig. 3 is a modification of Fig. 2, and Figs. The degree of assembly of the touch sensing module according to one embodiment.

The term " touch " as used throughout this specification is intended to be broadly interpreted to mean not only direct contact with the contact receiving surface, but also means that the input means is proximate a considerable distance from the contact receiving surface.

The touch sensor module 1 according to an embodiment of the present invention includes a window substrate 200; A first wiring 121 connected to the first electrode pattern 120 is formed on one surface of the window substrate 200 and a second wiring 131 connected to the second electrode pattern 130 is formed on the other surface of the base substrate 200, A via hole 123 formed to be connected to the first wiring line 121 and the second wiring line 131 and to be electrically connected to the second wiring line 131 and the via hole 123 And a flexible cable 400 formed to be electrically connected to each other.

Referring to FIG. 1, the window substrate 200 is divided into an active area and a bezel area. The active area is formed so that the input unit can recognize the touch. The bezel area is a part that does not recognize the touch even if you touch it. The bezel region is provided at the edge of the active region. At this time, the window substrate 200 has a supporting force capable of supporting a base substrate 100 to be described later.

The window substrate 200 is formed in a direction in which the user's touch is input at the outermost portion and serves as a protective layer for protecting the base substrate 100 by using tempered glass or the like having a predetermined strength or more. Considering the above-mentioned support force and transparency, the window substrate 200 is formed of a transparent resin such as polyethylene terephthalate (PET), polycarbonate (PC), polymethylmethacrylate (PMMA), polyethylene naphthalate (PEN) (PES), a cyclic olefin polymer (COC), a TAC (triacetylcellulose) film, a polyvinyl alcohol (PVA) film, a polyimide (PI) film, a polystyrene (PS), a biaxially oriented polystyrene K resin-containing biaxially oriented PS (BOPS).

1 and 2, the base substrate 100 has electrode patterns 120 and 130 and electrode wirings 121 and 131 formed on both surfaces thereof. The base substrate 100 should have transparency to allow the user to recognize the supporting force capable of supporting the electrode patterns 120 and 130 and the electrode wirings 121 and 131 and the image provided by the image display device (not shown). The base substrate 100 may be made of the same material as the window substrate described above. The electrode patterns 120 and 130 serve to allow the input means to generate a signal when touching so that the controller can recognize the touch coordinates. The electrode patterns 120 and 130 are formed on both sides of the base substrate 100. The electrode pattern formed in the X axis direction of the base substrate 100 may be referred to as a first electrode pattern 120 and the electrode pattern formed in the Y axis direction of the base substrate 100 may be referred to as a second electrode pattern 120. [ Quot; pattern 130 ".

A first electrode pattern 120 is formed on one surface of the base substrate 100. A second electrode pattern 130 is formed on the other surface of the base substrate 100. The first electrode pattern 120 is formed to face the window substrate 200. A via hole 123 is formed in the base substrate 100 to connect a signal of the first electrode pattern 120 with another surface.

The first electrode pattern 120 and the second electrode pattern 130 may be formed by a plating process or a deposition process using a sputtering process. The first electrode pattern 120 and the second electrode pattern 130 may be formed of a metal formed by exposing / developing a silver salt emulsion layer, and may be formed of various kinds of materials capable of forming a mesh pattern with a conductive metal Can be selected by those skilled in the art. The first electrode pattern 120 and the second electrode pattern 130 may be formed in any pattern known in the art such as a rhombic pattern, a square pattern, a triangular pattern, and a circular pattern.

The first electrode pattern 120 and the second electrode pattern 130 are mutual type touch sensors that form a bar pattern orthogonal to one directional bar pattern on a separate base substrate and couple them to each other. Driving may be possible. In addition, the base substrate 100 may have a structure in which a first electrode pattern 120 and a second electrode pattern 120 are formed on one base substrate 100 by arranging crossing patterns of diamond or the like perpendicular to each other using a bridge, It is also possible to form the touch sensor module 130 to form the touch sensor module 1.

The touch sensor module 1 according to an embodiment of the present invention is for electrically connecting the electrode patterns 120 and 130 formed on both sides with the flexible cable 400 on one side. Provided is a touch sensor module in which production efficiency due to a roll-to-roll process is improved by electrically connecting electrode patterns (120, 130) signals from a surface of a base substrate (100) to a flexible cable (400).

The electrode wirings 121 and 131 electrically connect the first electrode pattern 120 and the second electrode pattern 130 to the flexible cable 400. The electrode wirings 121 and 131 may be formed on the base substrate 100 by a variety of printing methods such as a silk screen method, a lybia printing method, or an inkjet printing method. As the material of the electrode wirings 121 and 131, copper (Cu), aluminum (Al), gold (Au), silver (Ag), titanium (Ti), palladium (Pd), and chromium (Cr) As the electrode wirings 121 and 131, silver paste or organic silver having excellent electrical conductivity may be used. However, the present invention is not limited to this example, and may be made of a low-resistance metal material such as a conductive polymer, carbon black (including CNT), metal oxides such as ITO, and metals.

3, the electrode wirings 121 and 131 are referred to as a first electrode wirings 121 that are electrically connected to the first electrode patterns 120 and the first electrode wirings 121 are electrically connected to the second electrode patterns 130. [ And is referred to as a two-electrode wiring 131. The first electrode wiring 121 and the second electrode wiring 131 are formed at one end of the first electrode pattern 120 and the second electrode pattern 130, respectively, according to the touch sensor module 1 method. A via hole 123 connected to the first electrode wiring 121 is formed. The via hole 123 is formed to correspond to the first electrode wiring 121. That is, a plurality of via holes 123 may be formed on the first electrode wiring 121.

The via hole 123 is formed in the bezel region described above and is formed to penetrate the base substrate 100. The via hole 123 connects the signal of the first electrode pattern 120 formed on one surface of the base substrate 100 with a flexible cable 400 connected to the other surface of the base substrate 100. That is, the via hole 123 serves as a path for electrically connecting the first electrode pattern 120 and the flexible cable 400. Accordingly, one surface of the via hole 123 is connected to the first electrode wiring 121, and the other surface is electrically connected to the first electrode pad 125, which will be described later.

The via hole 123 is filled with a conductive material for electrical energization. At this time, the inside of the via hole 123 may be a silver paste or an organic silver having a high conductivity, which is a conductive material. However, the present invention is not limited to this example, and a low resistance metal material such as a conductive polymer, carbon black (including CNT), metal oxide such as ITO, or metal may be used. The via hole 123 may be filled with a conductive material by a printing method, an injection method, or the like.

The electrode pads 125 and 133, which are electrically connected to the flexible cable 400, are disposed at the distal end portions of the first electrode wiring 121 and the second electrode wiring 131. In other words, the electrode pads 125 and 133 are formed on a part of the electrode wirings 121 and 131 and are electrically connected to the flexible cable 400.

3, one surface of the via hole 123 may be connected to the first electrode wiring 121, and the other surface may be directly connected to the flexible cable 400. In this case, The height of the via hole 123 is made equal to the height of the second electrode pad 133. This is to prevent a phenomenon in which the flexible cable 400 is tilted in one direction due to the pressurization when the via hole 123 and the flexible cable 400 are connected.

The electrode pads 125 and 133 are formed on the base substrate 100 by being connected to the first electrode wiring 121 and the second electrode wiring 131, respectively. The electrode pad connected to the first electrode wiring 121 is referred to as a first electrode pad 125 and the electrode pad connected to the second electrode wiring 131 is referred to as a second electrode pad 133.

The first electrode pad 125 and the second electrode pad 133 are formed so as not to invade the active area of the flexible cable 400 and the base substrate 100, The first electrode pad 125 and the second electrode pad 133 are located at one end of the base substrate 100 and are connected to the first electrode wiring 121 and the second electrode wiring 131, respectively. The first electrode pad 125 is electrically connected to the via hole 123. The first electrode pad 125 is formed on the other surface of the base substrate 100. The first electrode pad 125 electrically connects the signal generated in the first electrode pattern 120 with the flexible cable 400. That is, the first electrode pad 125 is formed on the opposite side of the first electrode pattern 120.

The second electrode pad 133 is formed on the other surface of the base substrate 100. The second electrode pad 133 electrically connects the signal generated in the second electrode pattern 130 with the flexible cable 400. The first electrode pad 125 and the second electrode pad 133 are formed to contact the conductive layer 300 and to conduct electricity through the flexible cable 400, respectively.

The first electrode pad 125 and the second electrode pad 133 are pressed and coupled with the conductive layer 300 and the flexible cable 400. At this time, the first electrode pad 125 and the second electrode pad 133 are coupled to the conductive layer 300 formed on the other surface of the base substrate 100. The first electrode pad 125 and the second electrode pad 133 are formed in contact with the conductive balls of the conductive layer 300. The contact surface is formed to be larger than the diameter of the conductive ball.

A plurality of first electrode pads 125 and second electrode pads 133 are formed on one end of the other surface of the base substrate 100. At this time, the first electrode pad 125 and the second electrode pad 133 are spaced apart from each other by a distance that does not cause electrical interference between adjacent electrode pads.

It is appropriate that the passivation layer and the protective film 140 are formed on one or both surfaces of the base substrate 100. The passivation layer and the protective film 140 prevent moisture from permeating into the electrode patterns 120 and 130, the electrode wirings 121 and 131, and the electrode pads 125 and 133. The passivation layer and the protective film 140 may be an insulating film made of silicon dioxide (SiO2) or silicon nitride (SiN), or a composite structure containing them, or may be made of a material such as polyimide or epoxy. The passivation layer and the protective film 140 are formed to have a height of 1 mu m to 8 mu m higher than the surface of the electrode pads 125 and 133 in consideration of the curing rate of the conductive layer 300. [ That is, external moisture is prevented from permeating the interface between the flexible cable 400 and the conductive layer 300, thereby protecting the electrode pads 125 and 133.

The passivation layer and the protective film 140 prevent the moisture from penetrating the surface by applying the electrode patterns 120 and 130, the electrode wirings 121 and 131 and the electrode pads 125 and 133. Therefore, the passivation layer and the protective film 140 have an effect of blocking water penetrating along the interface between the flexible cable 400 and the conductive layer 300 while preventing the surfaces of the electrode patterns 120 and 130 and the wirings 121 and 131 have. The passivation layer and the protective film 140 block moisture penetrating into the via hole. The passivation layer and the protective film 140 also have an effect of improving electrical signals of the electrode patterns 120 and 130. The via hole is formed by gluing the passivation layer and the protective film 140.

The conductive layer 300 is in contact with and electrically connected to the electrode pads 125 and 133, respectively. The conductive layer 300 is provided with a conductive ball having conductivity when it is pressurized or adhered by pressure. The conductive balls electrically connect the electrode pads 125 and 133 and the terminal portions (not shown) in one direction while being pressurized while being joined. The lower end surface of the conductive layer 300 is connected to the electrode pads 125 and 133, and the upper end surface of the conductive layer 300 is bonded to the terminal portions. That is, one surface of the conductive ball inside the conductive layer 300 is bonded to the electrode pads 125 and 133, and the other surface is bonded to the terminal portion. This is not intended to limit the manner in which the conductive layer 300 is bonded to the electrode pads 125 and 133 and the terminal portions. The conductive layer 300 presses and bonds the via hole 123.

The conductive layer 300 is preferably formed of an anisotropic conductive film (ACF). In some cases, it may be made of a conductive material such as an anisotropic conductive adhesive (ACA) or the like.

The flexible cable 400 includes a terminal portion that contacts the conductive layer 300. The flexible cable 400 is electrically connected to the electrode pads 125 and 133 to electrically connect the electrode patterns 120 and 130 and a control unit (not shown). The terminal portion (not shown) is electrically connected to the conductive ball. The terminal portions are formed corresponding to the plurality of electrode pads 125 and 133. The terminal portions are joined to the electrode pads 125 and 133 by pressurization when they are coupled with the conductive layer 300. The molding part 141 is formed along the interface between the flexible cable 400 and the passivation layer and the protective film 140. The molding part 141 prevents moisture penetrating through the interface and one end of the flexible cable 140. The molding part 141 has an effect of preventing the conductive ball from being released to the outside when the conductive layer is pressed.

FIGS. 4 to 10 illustrate the degree of assembly of the touch sensing module according to an exemplary embodiment of the present invention.

A method of processing a touch sensor module (1) according to an embodiment of the present invention includes: preparing a window substrate; Preparing a base substrate on which a first wiring of the first electrode pattern and a second wiring of the second electrode pattern are formed; Forming a through via hole so that the first wiring is connected to the other surface of the base substrate; Coupling the window substrate and the base substrate, and connecting the via hole and the second wiring to the flexible cable.

4 and 5 are views for preparing a window substrate and a base substrate. The window substrate 200 and the base substrate 100 are prepared. At this time, the first electrode pattern 120 and the second electrode pattern 130 are formed on both sides of the base substrate 100. The other surface of the base substrate 100 is coated with the passivation layer and the protective film 141. At this time, the passivation layer and the protective film 141 are applied by a height of 1 μm to 8 μm higher than the surface of the second electrode pattern 130.

The other surface of the base substrate 100 is cured by the passivation layer and the protective film 141. And the via hole 123 is formed through the hardened base substrate 100. At this time, the first electrode pattern 120 and the first electrode pad 125 are electrically connected when the base substrate 100 is penetrated. That is, one surface of the via hole 123 is connected to the first electrode wiring 121 and the other surface is connected to the first electrode pad 125.

6 is a view showing the base substrate on which the via hole is formed and the window substrate. The base substrate 100 and the window substrate 200 are bonded together using an adhesive. The adhesive may be a double-sided adhesive (OCA).

7 is a view for filling the via hole 123 conductive material. The via hole 123 is filled with a conductive material. The conductive material protrudes to the via hole 123 surface in the range of 5 mu m to 15 mu m so as to be cured.

8 is a view showing a conductive layer and a flexible cable competing with each other. The flexible cable 400 is pressed to cure the conductive material of the via hole 123 into the inside. At this time, the conductive layer 300 attached to the flexible cable 400 presses the inside of the via hole 123.

Fig. 9 shows a molded part formed along the rim of the flexible cable. The molding part 141 is formed along the rim of the flexible cable 400. The molding part 141 prevents the conductive ball from flowing out to the outside when the flexible cable 400 presses the conductive layer 300. The molding part 141 is formed along the outer circumferential surface of the interface between the flexible cable 400 and the passivation layer and the protective film 140. The molding part 141 prevents moisture and foreign matter from penetrating along the interface of the flexible cable 400 from the outside.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It will be apparent that modifications and improvements can be made by those skilled in the art.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

1: Touch sensor
100: base substrate 120: electrode pattern (first electrode pattern)
121: first electrode wiring 123: via hole
125: electrode pad (first electrode pad) 130: second electrode pattern
131: second electrode wiring 133: second electrode pad
140: Passivation layer and protective film
141: molding part 200: window substrate
300: conductive layer (ACF) 400: flexible cable

Claims

A window substrate;
A base substrate having a first wiring connected to the first electrode pattern on one surface thereof and a second wiring connected to the second electrode pattern on the other surface while facing the window substrate;
A via hole formed to be connected to the first wiring and penetrate through the other surface of the base substrate to transmit an electrical signal,
And a flexible cable coupled to the second wiring and the via hole so as to be electrically connected to each other.

The method according to claim 1,
A first electrode pad formed on the other surface of the base substrate, the first electrode pad being electrically connected to the via hole and connected to the flexible cable;
And a second electrode pad formed on the other surface of the base substrate and connected to the second wiring while being connected to the flexible cable.

The method according to claim 1,
And a conductive material is filled in the via hole.

The method according to claim 1,
And a passivation layer formed on a surface of the second electrode pattern and preventing moisture and an external impact, and a protective film.

The method of claim 4,
The touch sensor module is formed along an interface between the flexible cable and the passivation layer and the protective film, and has a molding part for preventing moisture from penetrating along the interface.

Preparing the window substrate
Preparing a base substrate on which a first wiring of the first electrode pattern and a second wiring of the second electrode pattern are formed;
Forming a through via hole so that the first wiring is connected to the other surface of the base substrate
Combining the window substrate and the base substrate
And connecting the via hole and the second wiring to the flexible cable.

The method of claim 6,
After the step of preparing the base substrate on which the second wiring is formed,
And coating the other surface of the base substrate with the passivation layer and the protective film.

The method of claim 7,
After the step of joining the window substrate and the base substrate,
And filling the inside of the via hole with a conductive material.

The method of claim 6,
At the step of combining the window substrate and the base substrate;
And bonding the window substrate and the base substrate using a transparent double-sided adhesive (OCA).

The method of claim 7,
After connecting the via hole and the second wiring to the flexible cable,
And a molding part is formed along an outer circumferential surface of an interface between the flexible cable and the passivation layer and the protective film.