KR20150024359A - 캐리어 부착 금속박 - Google Patents

캐리어 부착 금속박 Download PDF

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Publication number
KR20150024359A
KR20150024359A KR20147037142A KR20147037142A KR20150024359A KR 20150024359 A KR20150024359 A KR 20150024359A KR 20147037142 A KR20147037142 A KR 20147037142A KR 20147037142 A KR20147037142 A KR 20147037142A KR 20150024359 A KR20150024359 A KR 20150024359A
Authority
KR
South Korea
Prior art keywords
metal foil
carrier
resin
build
plate
Prior art date
Application number
KR20147037142A
Other languages
English (en)
Korean (ko)
Inventor
미치야 고히키
데루마사 모리야마
Original Assignee
제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 filed Critical 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤
Publication of KR20150024359A publication Critical patent/KR20150024359A/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/582—Tearability
    • B32B2307/5825—Tear resistant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1536—Temporarily stacked PCBs

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR20147037142A 2012-06-04 2013-06-03 캐리어 부착 금속박 KR20150024359A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012127566 2012-06-04
JPJP-P-2012-127566 2012-06-04
PCT/JP2013/065408 WO2013183607A1 (fr) 2012-06-04 2013-06-03 Feuille métallique fixée à un support

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020177007803A Division KR20170034947A (ko) 2012-06-04 2013-06-03 캐리어 부착 금속박

Publications (1)

Publication Number Publication Date
KR20150024359A true KR20150024359A (ko) 2015-03-06

Family

ID=49711999

Family Applications (3)

Application Number Title Priority Date Filing Date
KR20147037142A KR20150024359A (ko) 2012-06-04 2013-06-03 캐리어 부착 금속박
KR1020177007803A KR20170034947A (ko) 2012-06-04 2013-06-03 캐리어 부착 금속박
KR1020197023954A KR20190099096A (ko) 2012-06-04 2013-06-03 캐리어 부착 금속박

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020177007803A KR20170034947A (ko) 2012-06-04 2013-06-03 캐리어 부착 금속박
KR1020197023954A KR20190099096A (ko) 2012-06-04 2013-06-03 캐리어 부착 금속박

Country Status (4)

Country Link
JP (1) JP6013475B2 (fr)
KR (3) KR20150024359A (fr)
TW (1) TWI565371B (fr)
WO (1) WO2013183607A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104335688B (zh) * 2012-06-04 2018-02-09 Jx日矿日石金属株式会社 多层印刷配线板的制造方法
KR20190009427A (ko) * 2012-06-04 2019-01-28 제이엑스금속주식회사 캐리어 부착 금속박
KR20170086691A (ko) * 2012-06-04 2017-07-26 제이엑스금속주식회사 캐리어 부착 금속박
JP5826322B2 (ja) * 2014-03-25 2015-12-02 Jx日鉱日石金属株式会社 表面処理銅箔、銅張積層板、プリント配線板、電子機器、半導体パッケージ用回路形成基板、半導体パッケージ及びプリント配線板の製造方法
WO2017022807A1 (fr) * 2015-08-03 2017-02-09 Ｊｘ金属株式会社 Procédé de fabrication de carte de circuit imprimé, feuille de cuivre traitée en surface, stratifié, carte de circuit imprimé, boîtier de semi-conducteur, et dispositif électronique
JP6438370B2 (ja) * 2015-08-03 2018-12-12 Ｊｘ金属株式会社 プリント配線板の製造方法、表面処理銅箔、積層体、プリント配線板、半導体パッケージ及び電子機器
JP5897755B2 (ja) * 2015-08-11 2016-03-30 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板、プリント配線板、電子機器、半導体パッケージ、プリント配線板の製造方法、電子機器の製造方法、半導体パッケージの製造方法、樹脂基材の製造方法、銅箔の表面プロファイルを樹脂基材に転写する方法
JPWO2017051897A1 (ja) * 2015-09-24 2018-08-30 Ｊｘ金属株式会社 金属箔、離型層付き金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法
JP6031624B2 (ja) * 2016-02-29 2016-11-24 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板、プリント配線板の製造方法、半導体パッケージの製造方法及び電子機器の製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4582436B2 (ja) * 2001-08-27 2010-11-17 Ｊｘ日鉱日石金属株式会社 水溶性樹脂キャリア付銅箔及び該銅箔を使用したプリント基板
JP2007055165A (ja) * 2005-08-26 2007-03-08 Shin Etsu Chem Co Ltd フレキシブル銅張積層板及びその製造方法
JP4334005B2 (ja) * 2005-12-07 2009-09-16 新光電気工業株式会社 配線基板の製造方法及び電子部品実装構造体の製造方法
JP4754402B2 (ja) * 2006-05-17 2011-08-24 三井金属鉱業株式会社 キャリア箔付銅箔、キャリア箔付銅箔の製造方法、キャリア箔付表面処理銅箔及びそのキャリア箔付表面処理銅箔を用いた銅張積層板
TW200804626A (en) * 2006-05-19 2008-01-16 Mitsui Mining & Smelting Co Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier she
EP2039716B1 (fr) * 2006-07-07 2012-02-22 Mitsubishi Gas Chemical Company, Inc. Résine polyimide
JP5713560B2 (ja) * 2007-05-23 2015-05-07 ユニチカ株式会社 ピーラブル性を有する積層体およびその製造方法
CN101803483B (zh) * 2007-09-11 2012-10-24 味之素株式会社 多层印刷电路板的制造方法
JP4973519B2 (ja) * 2008-01-18 2012-07-11 住友ベークライト株式会社 積層板、積層板の製造方法、多層プリント配線板および半導体装置
MY149431A (en) * 2008-03-26 2013-08-30 Sumitomo Bakelite Co Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device
JP4805304B2 (ja) 2008-05-12 2011-11-02 Ｊｘ日鉱日石金属株式会社 キャリヤー付き金属箔及び多層コアレス回路基板の製造方法
JP4927963B2 (ja) * 2010-01-22 2012-05-09 古河電気工業株式会社 表面処理銅箔、その製造方法及び銅張積層基板
JP2013140856A (ja) * 2011-12-28 2013-07-18 Jx Nippon Mining & Metals Corp キャリア付金属箔
JP5204908B1 (ja) * 2012-03-26 2013-06-05 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板
KR20170086691A (ko) * 2012-06-04 2017-07-26 제이엑스금속주식회사 캐리어 부착 금속박
KR20190009427A (ko) * 2012-06-04 2019-01-28 제이엑스금속주식회사 캐리어 부착 금속박
CN104335688B (zh) * 2012-06-04 2018-02-09 Jx日矿日石金属株式会社 多层印刷配线板的制造方法

Also Published As

Publication number Publication date
JPWO2013183607A1 (ja) 2016-02-01
WO2013183607A1 (fr) 2013-12-12
KR20190099096A (ko) 2019-08-23
TW201414365A (zh) 2014-04-01
CN104334345A (zh) 2015-02-04
JP6013475B2 (ja) 2016-10-25
TWI565371B (zh) 2017-01-01
KR20170034947A (ko) 2017-03-29

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