KR20150001176A - Substrate processing apparatus, deposition apparatus comprising the same, processing method of substrate, and deposition method - Google Patents

Abstract

The present invention provides a substrate processing apparatus to suppress a defect to be occurred by a foreign substance during substrate processing by mounting a mask on a substrate; a deposition apparatus comprising the same; a substrate processing method; and a deposition method. The provided substrate processing apparatus comprises: a chamber body having an entrance to which the substrate can be placed on one side; and a plurality of mask pins vertically extended having a suction nozzle therein, supporting the mask.

Description

[0001] The present invention relates to a substrate processing apparatus, a deposition apparatus having the same, a substrate processing method, and a deposition method,

The present invention relates to a substrate processing apparatus, a deposition apparatus having the same, a substrate processing method, and a deposition method. More particularly, the present invention relates to a substrate processing apparatus for mounting a mask on a substrate, Suppressing substrate processing apparatus, a deposition apparatus having the same, a substrate processing method, and a deposition method.

Generally, in order to process a substrate, a substrate and / or a mask are aligned so that the substrate and the mask are positioned at predetermined positions with respect to each other. To accomplish this, the substrate is placed on the susceptor, the substrate and the mask are aligned, and the substrate is processed after the mask is placed on the substrate.

However, in the conventional substrate processing apparatus, unnecessary impurities are present on the substrate or the like in processing the substrate, and the substrate is not properly processed. That is, in the process of aligning the mask with respect to the substrate while the substrate is seated on the susceptor, the impurities fall down onto the substrate from the mask or the like and remain on the substrate, There is a problem that it can be done.

The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a substrate processing apparatus in which a defect is prevented from occurring due to impurities when a mask is placed on a substrate to process the substrate, An object of the present invention is to provide a deposition apparatus, a substrate processing method, and a deposition method. However, these problems are exemplary and do not limit the scope of the present invention.

According to an aspect of the present invention, there is provided a substrate processing apparatus, comprising: a chamber body having an inlet through which a substrate can be injected on one side; and a plurality of mask pins extending vertically and having a recession nozzle therein, Is provided.

And a stage for moving the plurality of mask pins to adjust a position of a mask with respect to the substrate introduced through the entrance. At this time, when the stage moves the plurality of mask pins, the decay can be made to proceed through the incision nozzle. Alternatively, when the plurality of mask pins support the mask through the up-motion, the decay can be made to proceed through the incision nozzle.

The plurality of mask pins may perform an up-down motion, and a mask may be placed on the substrate through the opening through the down-motion.

Each of the plurality of mask pins may have a ball which is located at the top end of the upper portion and can be rotated.

A main pipe connected to the chamber body, a pumping unit connected to the main pipe and capable of pumping a gas in the chamber body to the outside, and an exhaust pipe branched from the main pipe and connected to the decontamination nozzle, And a circulation pipe capable of allowing the gas in the nozzle to be pumped to the outside.

At this time, a throttle valve and an on-off valve mounted on the decay pipe may be further provided. The main pipe may further include a gate valve mounted at a portion between the main pipe and the branch pipe of the decay pipe and the chamber body.

According to another aspect of the present invention, there is provided a deposition apparatus including at least one of the above-described substrate processing apparatuses and an evaporation source capable of emitting a substance to be deposited on the substrate.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: supporting a mask with a plurality of mask pins having a recession nozzle therein; seating the substrate on the susceptor; Adjusting the position of the mask with respect to the substrate through a stage that adjusts the position of the plurality of mask pins while advancing the mask pins; and placing the mask on the substrate mounted on the susceptor by lowering the plurality of mask pins A substrate processing method is provided.

The step of supporting the mask may include the step of supporting the mask by contacting the rotatable ball with the mask at the tip end of each of the plurality of mask pins.

The method may further include separating the mask from the substrate placed on the susceptor by moving up the plurality of mask pins while causing the decay through the decay nozzle in the plurality of mask pins.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: supporting a mask with a plurality of mask pins having a recession nozzle therein; seating the substrate on the susceptor; Adjusting the position of the mask with respect to the substrate through a stage that adjusts the position of the plurality of mask pins while advancing the mask pins; placing the mask on the substrate mounted on the susceptor by lowering the plurality of mask pins; Depositing material on the substrate through an opening in the mask.

The step of supporting the mask may include the step of supporting the mask by contacting the rotatable ball with the mask at the tip end of each of the plurality of mask pins.

The method may further include separating the mask from the substrate placed on the susceptor by moving up the plurality of mask pins while causing the decay through the decay nozzle in the plurality of mask pins.

According to an embodiment of the present invention as described above, a substrate processing apparatus in which defects during substrate processing are suppressed by impurities when a mask is placed on a substrate to process the substrate, a deposition apparatus having the substrate processing apparatus, A processing method and a deposition method can be implemented. Of course, the scope of the present invention is not limited by these effects.

1 is a perspective view schematically showing that a part of a substrate processing apparatus according to an embodiment of the present invention is disposed on a rail.
2 is a cross-sectional view taken along line II-II in Fig.
Figs. 3 and 4 are sectional views schematically showing the operation of the substrate processing apparatus of Fig.
Fig. 5 is a cross-sectional view schematically showing a mask pin which is a part of the substrate processing apparatus of Fig. 2;
6 is a conceptual diagram schematically showing a substrate processing apparatus according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, Is provided to fully inform the user. Also, for convenience of explanation, the components may be exaggerated or reduced in size. For example, the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, and thus the present invention is not necessarily limited to those shown in the drawings.

In the following embodiments, the x-axis, the y-axis, and the z-axis are not limited to three axes on the orthogonal coordinate system, and can be interpreted in a broad sense including the three axes. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other.

On the other hand, when various elements such as layers, films, regions, plates and the like are referred to as being "on " another element, not only is it directly on another element, .

FIG. 1 is a perspective view schematically showing a part of a substrate processing apparatus according to an embodiment of the present invention disposed on a rail, and FIG. 2 is a sectional view taken along a line II-II in FIG.

The substrate processing apparatus according to this embodiment includes a chamber body (not shown) having an inlet through which a substrate can be charged, and a plurality of mask pins 220. As a matter of course, the substrate processing apparatus according to the present embodiment may further include a susceptor 100, a plurality of substrate fins 210, and a stage 300. In FIG. 1, a plurality of substrate pins 210, a plurality of mask pins 220, and the like are not shown for the sake of convenience.

The susceptor 100 can move on at least one pair of rails. In the drawing, the susceptor 100 is shown as movable in the + y direction or the -y direction. Of course, although the susceptor 100 is illustrated as moving on a pair of rails, the present invention is not limited thereto. Also, various modifications are possible, such as a rail as shown in the drawing, or a structure such as a roller and a conveyor belt that can be moved by the roller, where the susceptor 100 moves.

The susceptor 100 has a seating surface 110 on which a plate-shaped substrate 500 can be seated. Of course, the susceptor 100 may have a protruding surface 120 and an inner surface 130 in addition to the seating surface 110. When the substrate 500 is mounted on the seating surface 110, the upper surface of the substrate 500 may not protrude to the outside, that is, the upper surface of the protruding surface 120, if necessary.

A flat plate-shaped substrate 500 may be seated on the seating surface 110. Here, the substrate 500 refers to an object to which a deposition material is deposited, and may be a glass material, a ceramic material, a plastic material, or a metal material.

After the substrate 500 is seated on the seating surface 110, the mask 400 may be seated on the substrate 500. In this case, the seating surface 110 may have a mask seating surface 110a and a mask seating surface 110b surrounding the substrate seating surface 110a. The substrate seating surface 110a is where the substrate 500 can be seated and the mask seating surface 110b is where at least a portion of the mask 400 can be seated.

The mask 400 may have a frame 410 having an opening and a sheet 420 that is combined with the frame 410 to shield the opening of the frame 410 and has one or more patterned openings. That is, the mask 400 means a combination of the frame 410 and the sheet 420. The sheet 420 may have a relatively thin thickness relative to the frame 410. [

The mask seating surface 110b is formed to have a recessed shape downward (-z direction) from the substrate seating surface 110a, that is, a downward motion direction of a plurality of substrate fins 210 (-z direction). This allows the frame 410 to be seated on the mask seating surface 110b (as shown in FIG. 4) at least a portion of the mask 400 thicker than the substrate 500. As a result, the substrate 500, which is thinner than the thickness of the frame 410 of the mask 400, can be arranged closely to the sheet 420 of the mask 400.

The protruding surface 120 protrudes in the first direction (+ z direction) from the seating surface 110 in the periphery of the seating surface 110. That is, the protruding surface 120 is surrounded by the seating surface 110 and protrudes in the up-direction (+ z direction) of a plurality of substrate fins 210 to be described later. Of course, it can be understood that a recess is formed in the susceptor 100 and the bottom surface of the recess is the seating surface 110. The inner side surface 130 connects the seating surface 110 and the projecting surface 120.

The plurality of substrate fins 210 have a shape extending up and down (z-axis direction) and can perform up-down motion in a direction (z-axis direction) intersecting with the seating surface 110. In the up- After the substrate 500 is seated on the pins 210, the substrate 500 may be seated on the seating surface 110 through the down motion. The plurality of mask pins 220 also have a shape extending vertically (z-axis direction) and can perform up-down motion in a direction (z-axis direction) intersecting with the seating surface 110, 400 may be seated on the seating surface 110 or the substrate 500 seated on the seating surface 110.

The substrate pins 210 and the mask pins 220 may pass through the holes formed in the susceptor 100 such that the substrate pins 210 may move to the substrate seating surface 110a of the susceptor 100 And the mask pins 220 can be moved upward through the mask holes 110b 'formed on the mask seating surface 110b of the susceptor 100. The mask holes 110b' To the top of the mask seating surface 110b.

The stage 300 is coupled to a plurality of substrate pins 210 and a plurality of mask pins 220. Of course, unlike the illustrated example, a plurality of substrate pins 210 are not connected to the stage 300, but only a plurality of mask pins 220 may be connected to the stage 300.

When the stage 300 is moved, the positions of the plurality of substrate pins 210 and / or the plurality of mask pins 220 are adjusted accordingly. When the stage 300 is moved in a plane (xy plane) parallel to the seating surface 110, a plurality of substrate pins 210 and / or a plurality of mask pins 220 The position in the plane (xy plane) can be adjusted.

When the stage 300 is moved to adjust the position of the plurality of substrate pins 210, the position of the substrate 500 relative to the seating surface 110 of the substrate 500 disposed on the plurality of substrate pins 210 is adjusted. Similarly, when the stage 300 is moved to adjust the positions of the plurality of mask pins 220, the relative position of the mask 400 disposed on the plurality of mask pins 220 with respect to the seating surface 110 is adjusted.

When the stage 300 is coupled to both the plurality of substrate pins 210 and the plurality of mask pins 220, the stage 300 is moved to adjust the position of the plurality of substrate pins 210 The positions of the plurality of mask pins 220 are also adjusted. In order to individually adjust the position of the mask 400 disposed on the substrate 500 and the plurality of mask pins 220 disposed on the plurality of substrate pins 210, Such as adjusting the position of the mask 400 and placing the substrate 500 on the seating surface 110 and then adjusting the position of the mask 400. Of course, if the stage 300 is coupled only to the plurality of mask pins 220 and the position of the plurality of substrate pins 210 in the xy plane is not adjusted, the substrate 500 may be placed on the seating surface 110 Only the position of the rear mask 400 is adjusted.

Although not shown, a measurement unit (not shown) including an image pickup device such as a CCD or a CMOS may also be provided in the substrate processing apparatus according to this embodiment. Such a measurement unit can confirm the position of the substrate 500 and / or the mask 400 by checking the substrate key formed on the substrate 500 and / or the mask mark formed on the mask 400. [

Hereinafter, the operation of the substrate processing apparatus according to the present embodiment as described above will be described in detail with reference to the drawings. Figs. 3 and 4 are sectional views schematically showing the operation of the substrate processing apparatus of Fig.

2, a substrate 500 is disposed on a plurality of substrate fins 210, and a mask 400 is disposed on a plurality of mask fins 220. Of course, the mask 400 may not be changed every time when each substrate 500 is processed, but may be repeatedly used when processing a plurality of substrates 500. Therefore, the mask 400 may be disposed on the plurality of mask pins 220 before the substrate 500 is disposed on the plurality of substrate pins 210.

The substrate 500 is supplied by the transfer robot having the end effector and the substrate 500 is disposed on the plurality of substrate fins 210. The substrate 500 is transferred to the substrate 500 through the pre- You can change the location. Each of the prealigners may have, for example, a first portion extending in one direction and pivotable about a pivot axis, and a contact portion positioned at the end of the bar and capable of contacting the substrate 500. When the substrate 700 is placed on the plurality of substrate pins 210, the pre-aligners are positioned in the diagonal direction with respect to the substrate 500. When the substrate 700 is rotated about the rotation axis, So that the positional relationship of the substrate 500 with respect to the susceptor 100 becomes a predetermined positional relationship. Of course, be separated from the edge of the substrate 500.

When the substrate 500 is supplied by the substrate transfer robot or the like to be disposed on the plurality of substrate pins 210, the positional relationship of the substrate 500 with respect to the susceptor 100 may be mechanically roughly So that the substrate 500 can be positioned at a predetermined position.

Thereafter, the plurality of substrate pins 210 take down motion through the substrate pin driving unit 210 'so that the substrate 500 is mounted on the seating surface 110 of the susceptor 100 as shown in FIG. Lt; / RTI > Of course, if necessary, the position of the substrate 500 disposed on the plurality of substrate fins 210 may be finely adjusted by moving the stage 300 to adjust the positions of the plurality of substrate fins 210. FIG.

After the substrate 500 is seated on the seating surface 110 of the susceptor 100, the position of the plurality of mask pins 220 is adjusted by moving the stage 300, So that the mask 400 disposed on the substrate 500 is positioned at a predetermined position with respect to the substrate 500. For this purpose, the position of the mask 400 may be adjusted via the stage 300, while confirming the position of the mask mark on the mask 400 relative to the substrate key on the substrate 500 with a measurement unit (not shown).

After the mask 400 is aligned, the plurality of mask pins 220 are moved down through the mask pin driving unit 220 'so that the mask 400 is moved to the substrate 500 as shown in FIG. As shown in FIG.

In the case of the substrate processing apparatus according to the present embodiment, it is possible to effectively prevent or suppress that the impurities are separated from the mask 400 in the alignment process of the mask 400 and are located on the substrate 500. For example, when the stage 300 is moved to adjust the positions of the plurality of mask pins 220, a contact between the mask pins 220 and the mask 400, Particles can be generated. At this time, these particles can be seated on the substrate 500 located at the bottom, which may cause defects when the substrate 500 is processed later.

However, in the case of the substrate processing apparatus according to the present embodiment, occurrence of such defects can be prevented or suppressed in advance. To this end, each of the plurality of mask fins 220 of the substrate processing apparatus according to the present embodiment has a burning nozzle 222 therein, as shown in FIG. When the impurities such as particles are generated in the vicinity of the tip of each of the plurality of mask pins 220 in the direction of the mask 400, the impurities can be moved into the incision nozzle 222 through the incision nozzle 222. Through this, it is possible to effectively prevent the impurities from moving onto the substrate 500.

The impurities may be separated from the mask 400 and positioned on the substrate 500 in the alignment process of the mask 400, as described above. Therefore, when the stage 300 moves the plurality of mask pins 22, the decay can be performed through the decontamination nozzle 222.

As shown in FIG. 5, each of the plurality of mask fins 220 may have a ball 224 that is rotatable and positioned at the top of the (+ z) direction. Of course, bearings 226, which are in contact with the balls 224, may be positioned at the tip of the upper portion of each of the plurality of mask pins 220 in the (+ z direction) so as to smoothly rotate the balls 224 have.

4, when the mask 400 and the substrate 500 are in close contact with each other and the substrate processing such as deposition is completed, the plurality of mask pins 220 are up-moved in the + z direction, The mask 400 is moved in the + z direction to be separated from the substrate 500 as shown in FIG. In this process, in order to make a plurality of mask pins 220 contact with a certain portion of the mask 400 when the tip of the plurality of mask pins 220 in the + z direction makes contact with the mask 400, The grooves 412 are formed in the lower surface of the frame 410 in the -z direction and the tip ends of the plurality of mask pins 220 are brought into contact with the grooves 412. The plurality of mask pins 220 can be brought into contact with a predetermined portion of the mask 400 when the leading end of the plurality of mask pins 220 contacts the mask 400. [

The positions of the plurality of mask pins 220 when the tip ends in the + z direction of the plurality of mask pins 220 are in contact with the mask 400 correspond to the positions of the grooves 412 of the frame 410 of the mask 400 It may be tweaked slightly. However, in the case of the substrate processing apparatus according to the present embodiment, each of the plurality of mask pins 220 has a ball 224 rotatable at the tip portion in the (+ z direction) a plurality of mask pins 220 are naturally moved through the rotation of the balls 224 when the tip of the + z direction is in contact with the mask 400 and the grooves 412 of the frame 410 of the mask 400 As shown in FIG. Of course, in such a contact process and / or when a plurality of mask pins 220 support the mask 400 through the up motion, impurities such as particles, which are generated, may be trapped in the plurality of mask pins 220, It is possible to prevent or effectively prevent the impurities from migrating onto the substrate 500. [0064]

The incision nozzles 222 of each of the plurality of mask pins 220 may be connected to the incision tube 228. Such a decay tube 228 may be connected to a formation module 5 installed in the chamber body 1 as shown in FIG. 6, which is a conceptual diagram schematically showing a substrate processing apparatus according to another embodiment of the present invention. The formation tubes 228 connected to the formation nozzles 222 of the plurality of mask pins 220 may be connected to the formation module 5.

Meanwhile, the main pipe 2 for controlling the air pressure or the degree of vacuum in the chamber body 1 may be connected to the chamber body 1. In this case, the pumping section 3 is connected to the main pipe 2, and the gas in the chamber body 1 can be pumped out. At this time, the decay pipe 4 may be branched from the main pipe 2 and connected to the decontamination nozzles 222 of the plurality of mask pins 220 through the decontamination module 5.

In general, in the case of a substrate processing apparatus, that is, a deposition apparatus, in which deposition is performed such as chemical vapor deposition, a pumping section 3 and a main piping 2 are generally provided to make the interior of the chamber body 1 highly vacuum. Accordingly, by using such a pumping unit 3 or the like to cause the deterioration of the plurality of mask pins 220 through the decay nozzles 222, it is possible to effectively remove the impurities while using the structure of the existing substrate processing apparatus have.

Of course, by arranging the throttle valve 7 and the on-off valve 6 in the decay pipe 4, the on / off of the decay through the decontamination nozzles 222 of the plurality of mask pins 220 is controlled, And the degree of decay of the blood vessel. The gate valve 8 and the other valve 9 may be arranged in the main pipe 2. In this case, in the case of the gate valve 8, the branch point between the main pipe 2 and the return pipe 4 Can be mounted on the main piping (2) portion between the chamber bodies (1).

The substrate processing apparatus described so far can be part of a deposition apparatus, for example. In this case, the deposition apparatus may include the substrate processing apparatus described so far and an evaporation source capable of emitting a substance to be deposited on the substrate 500.

Although the substrate processing apparatus and the deposition apparatus have been described above, the present invention is not limited thereto. For example, the substrate processing method and the deposition method are also within the scope of the present invention.

In the case of the substrate processing method according to an embodiment of the present invention, after the step of supporting the mask 400 with the plurality of mask pins 220 having the recession nozzles 222 therein, 210) to seat the substrate 500 on the susceptor 100. Thereafter, a mask 400 (not shown) is formed on the substrate 500 through a stage 300 for adjusting the positions of the plurality of mask pins 220 while the decay is performed through the decay nozzles 222 inside the plurality of mask pins 220 ) Of the image. Impurities that may be generated in this process may be removed through the incision nozzles 222 in the plurality of mask pins 220. Thereafter, a plurality of mask pins 220 may be lowered to place the mask 400 on the substrate 500 mounted on the susceptor 100.

The step of supporting the mask 400 may be performed by contacting a rotatable ball 224 located at the top end of each of the plurality of mask pins 220 with the frame 410 of the mask 400, And the like. In this case, the contact portion of the frame 410 of the mask 400 may have a conical groove 412 formed therein.

When the mask 400 is lifted up from the substrate 500 mounted on the susceptor 100 by lifting up the plurality of mask pins 220, ) Can be separated while proceeding with the decay. Impurities such as particles that may be generated while the mask 410 and the mask 400 are in contact with each other and / or the mask 400 is separated from the substrate 500 may be transferred to the incision nozzle 222 To remove it.

In the case of the deposition method according to another embodiment of the present invention, after the mask 400 is placed on the substrate 500 placed on the susceptor 100, the opening of the sheet 420 of the mask 400 And then depositing a material on the substrate 500 through the substrate.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

1: chamber body 2: main piping
3: pumping section 4: rotation piping
5: Turning Module 6: On-Off Valve
7: throttle valve 8: gate valve
9: Other valves 100: Susceptor
210: substrate pin 220: mask pin
222: incinerator nozzle 224: ball
226: Bearing 228:
300: stage 400: mask
500: substrate

Claims (16)

A chamber body having an inlet through which a substrate can be injected at one side; And
A plurality of mask fins extending upward and downward and having a recession nozzle therein and capable of supporting a mask;
A substrate processing apparatus; The method according to claim 1,
Further comprising a stage capable of moving the plurality of mask pins to adjust the position of the mask with respect to the substrate introduced through the entrance. 3. The method of claim 2,
Wherein when the stage moves the plurality of mask pins, the decay proceeds through the decontamination nozzle. 4. The method according to any one of claims 1 to 3,
Wherein when the plurality of mask pins support the mask through the up-motion, the decay proceeds through the decay nozzle. 4. The method according to any one of claims 1 to 3,
Wherein the plurality of mask pins are capable of performing an up-down motion and allowing the mask to be placed on the substrate through the opening through the down-motion. 4. The method according to any one of claims 1 to 3,
Wherein each of the plurality of mask pins has a ball that is rotatable and positioned at an upper end of the upper portion. 4. The method according to any one of claims 1 to 3,
A main pipe connected to the chamber body;
A pumping unit connected to the main pipe and capable of pumping gas in the chamber body to the outside; And
A return pipe branching from the main pipe to be connected to the returning nozzle so that gas in the returning nozzle can be pumped to the outside by the pumping unit;
The substrate processing apparatus further comprising: 8. The method of claim 7,
Further comprising a throttle valve and an on-off valve mounted on the decay pipe. 8. The method of claim 7,
Further comprising a gate valve mounted at a portion between the main pipe and the branch pipe of the main pipe and between the branch pipe and the chamber body. A substrate processing apparatus according to any one of claims 1 to 3; And
An evaporation source capable of emitting a substance to be deposited on a substrate;
And a deposition apparatus. Supporting the mask with a plurality of mask pins having a recession nozzle therein;
Placing the substrate on the susceptor;
Adjusting a position of a mask with respect to a substrate through a stage for adjusting the position of a plurality of mask pins while causing a decay through a decay nozzle in a plurality of mask pins; And
Placing a plurality of mask pins down to seat the mask on a substrate mounted on the susceptor;
Wherein the substrate is a substrate. 12. The method of claim 11,
Wherein the step of supporting the mask is a step of supporting the mask by contacting the rotatable ball with the mask at the tip end of each of the plurality of mask pins. 12. The method of claim 11,
Further comprising the step of raising the plurality of mask pins while separating the substrate from the substrate placed on the susceptor while the decay is carried out through the decay nozzle in the plurality of mask pins. Supporting the mask with a plurality of mask pins having a recession nozzle therein;
Placing the substrate on the susceptor;
Adjusting a position of a mask with respect to a substrate through a stage for adjusting the position of a plurality of mask pins while causing a decay through a decay nozzle in a plurality of mask pins;
Placing a plurality of mask pins down to seat the mask on a substrate mounted on the susceptor; And
Depositing a material on the substrate through an opening in the mask;
≪ / RTI > 15. The method of claim 14,
Wherein the step of supporting the mask is a step of supporting the mask by contacting the rotatable balls to the mask at the tip end of each of the plurality of mask pins. 15. The method of claim 14,
Further comprising the step of raising the plurality of mask pins while separating the substrate from the substrate mounted on the susceptor by causing the mask pin to move up through the decontamination nozzle in the plurality of mask pins.

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