KR20140123672A - Led lamp - Google Patents

Abstract

According to the present invention, there is provided an LED lamp capable of vertically and horizontally projecting light, comprising: a plate-shaped heat dissipation unit having a plurality of heat dissipation fins extended from a bottom surface of a groove in which individual LEDs are arranged in a matrix shape along a spherical outer circumferential surface; And a heat dissipating member in the form of a gourd-shaped tab that is hollow inside the assembly portion of the plate-shaped heat dissipating member, wherein the necked portion of the heat dissipating member in the form of a gourd-like hollow is connected to a heat transfer medium of the mouthpiece, Wherein the mediator is connected to an external bracket and the hollow heat radiator in the form of a gourd is installed at the center of the inside of the LED illuminating device. And a circuit board on which driving module elements are mounted so as to be positioned inside the hollow heat sink.

Description

LED lamp capable of upward and downward and leftward and rightward projecting light {LED LAMP}

The present invention relates to an LED lamp capable of vertically and horizontally projecting light, and more particularly, to an LED lamp capable of radiating heat generated from a bulb-type LED lighting apparatus in an efficient manner, .

In general, LED (light emitting diode) is composed of compound laminate structure and is manufactured by epitaxial growth method. The light of the LED is drawn out to the outside of the active layer by a spontaneous emission mechanism, and the luminescence is radiated directly or while reflecting in the laminated structure.

Unlike a light bulb, LED light is a single, relatively light-emitting narrow-band light, and its emission wavelength is determined by the compound semiconductor material. In other words, the red, green, and blue LEDs are packaged in a single package to emit white light by three-way light, or light emitted from blue or yellow LEDs to pass through yellow or blue phosphors, White light is obtained by changing to long-wavelength light, or near-ultraviolet light passes through the fluorescent material to emit white light as a fluorescent lamp. Currently, the most important materials for LED manufacturing are AlInGaP and InGaN-based semiconductors, and exhibit high efficiency red, green, blue and ultraviolet light emission effects. In addition, by using InGaN-based ultraviolet LEDs or ultraviolet LEDs and phosphors, all visible light and white light can be emitted. This is possible due to the absorption effect of light inside the LED element, and it exceeds the luminous efficiency of a general incandescent lamp or a halogen lamp.

Typically, LEDs are bulb-shaped LEDs, surface-mounted LEDs, and chip-on-board LEDs. The bullet-type LED is suitable for emitting highly directional light and has good visibility. Surface mount LEDs are superior in heat dissipation measures and can draw high light fluxes by blurring high currents. In addition, a compact LED integrated light source can be manufactured by mounting dozens of LED chips on a substrate, and a high light flux LED light source of several hundreds of millimeters or more can be manufactured.

The lifetime of the visible light LED is thought to be caused by deterioration of the electrical and optical characteristics of the LED itself. However, a lifetime of 30,000 hours or more is guaranteed for a normal operating current of 20 mA and a normal operation at room temperature.

In the LED itself, the defect density is reduced by the improvement of the crystal growth method, and the lifetime of the device itself is extended. In the case of operating at a high voltage (more than several hundred mA in blue LED and near-ultraviolet LED as in the above example), defects multiply and dark lines are observed.

The deterioration caused by the shell type LED is mostly caused by a decrease in the light emission intensity due to the discoloration of the transparent epoxy resin.

Some white LEDs are already commercialized as LED backlights. A commercially available white LED is a method of exciting a yellow light emitting phosphor with a blue LED. As for the quality of the white light for illumination by the LED, white light of high color rendering property and good uniform illuminance is required as in the case of a three-wavelength backlit fluorescent lamp.

The LED light source can be driven by DC, AC, or pulse, but the forward voltage is about 1.5 ~ 4V. Therefore, when the high voltage is applied, the LED is destroyed. Therefore, it is possible to directly drive an IC in which constant current driving is preferable.

However, if the rated current exceeds 20 mA, the temperature of the junction increases due to the heat generation, and the light emission intensity may decrease sharply. There is a unit module that integrates a large number of LEDs, but a driver circuit and heat generation measures are required.

In order to illuminate a conventional incandescent lamp of 40 to 80 W, about 70 to 80 LEDs can be replaced by 5 to 10 W of power. In order to illuminate an incandescent lamp of 100 W, 100 to 120 LEDs can be replaced with about 13 W of power.

In order to replace such a bulb type incandescent bulb, the number of LEDs is increased and a lot of heat is generated, which not only deteriorates the luminescence characteristics of the LED but also shortens the lifetime of the LED.

Therefore, in order to utilize the LED illumination effectively, a heat dissipation structure must be provided.

In order to solve this problem, there is a method of reducing the amount of current supplied to the LED itself. However, since the LED brightness is directly lowered, the value as a light source is lowered and it can not serve as a lighting device.

1 and 2, the PCB includes a light source unit having a plurality of LEDs mounted on a PCB, a heat dissipation unit connected to the PCB, and a housing accommodating the light source unit and the heat dissipation unit, And a power connection for connecting the power source.

In order to expand the heat dissipation area, the heat dissipating unit has protrusion-shaped heat dissipating fins protruding from the periphery at regular intervals and made of aluminum material having a high heat transfer coefficient, and thus it can be seen that the heat dissipating unit is a heat dissipating structure through thermal conduction and convection.

However, in such a structure, there is a limit in quickly transferring the heat of the PCB to which the LEDs are bonded, and there is residual heat in the connection connection terminal portion L4 for applying a voltage to the LED, And the electrical resistance increases due to the thermal resistance of the connection connection terminal portion L2, leading to a decrease in electrical efficiency. There is also a method of using PCB as a metal material for this purpose.

The metal circuit board for heat transfer can efficiently dissipate heat in a form that is diverted to the outside through conduction and convection, but there is a problem in the method of insulating the current from the current applied to the LED element due to the characteristics of the metal. That is, it is necessary to have the boundary conditions of the adhesive layer of the PCB and to follow the processing characteristics of various types of interfaces.

In the present invention, since the shape of a pen-shaped mouthpiece that can be seen in the surroundings is continuously utilized, it is necessary to understand a conventional illumination device of a similar type.

1 is a front view showing a structure of a conventional lighting apparatus.

(a) and (b) show an incandescent lamp and a three-wavelength lamp, respectively, which are conventional lighting devices, and (c) a conventional bulb-type LED lighting fixture. The incandescent lamp (a) is a simple structure in which a filament is inserted into a round glass bulb, and a filament is made of a thin tungsten wire as a single coil or a double coil. The inner lead wire is copper or copper wire which is nickel- Jumet wire whose thermal expansion coefficient is close to that of glass is used as the sealing part. The glass bulb is soda lime glass, and the frosted glass bulb is coated with white powder such as silica so that the filament with high latitude can not be seen. In the glass bulb, a mixed gas of argon and nitrogen is sealed so as to be at atmospheric pressure during lighting. The main purpose of this inclusion gas is to reduce evaporation of tungsten from the filament and to prolong the life of the bulb. The inclusion of krypton with high atomic mass suppresses the evaporation rate and improves the properties. The three-wavelength lamp (b) is also used for the energy saving by replacing the bulb with the bulb type in which the bulb type is used in the vicinity of the incandescent bulb, and in particular, the bulb type lamp is built in the lamp itself, It can also be used in incandescent lamp lighting equipment. Since the bulb-type bulb has a built-in bulb circuit, it can not be categorized into one type, but the bulb bulb is often turned on by high-frequency lighting or non-bulb lighting. Such a fluorescent lamp has an advantage in that it can obtain luminescence having various spectral energy distributions by changing the type of phosphor or combining various kinds of phosphors.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. The bulb-type LED lamp (c) shown in Fig. 1 has few troubles and is resistant to impacts because it has no gas or filament. That is, since it is not a thermally dischargeable light, it does not require a preheating time, and the speed for lighting and light-off is fast, and a mechanism such as a lighting circuit driving device can be simplified. However, when inserting a power type or high-speed LED, it is necessary to have an optimal tropical book, and since it has a strong linearity and high latitude, white powder is applied to the glass bulb like an incandescent lamp to reduce glare.

2 is a perspective view showing a structure of a conventional LED module. In DH (double heterostructure) structure LED of general LED module structure, it goes out to all directions (six components) through emission of surface, cross-section, and backside radiation generated in the active layer. In the structure of the LED element L6, electrons and electrons are injected into the active layer when the forward current flows to the pn junction, and the LED element L6 emits light by recombination. The backlight reflection plate L5, the connection terminal L4, A heat conductor L2 for dissipating heat, and a heat insulator L1 between the connection terminal and the heat conductor.

The present invention provides a structure in which a heat radiator of a hollow heat transfer material is formed in a spherical shape different from a conventional heat dissipation means and inserted into a central portion of the LED illuminator and transfers heat to the inside thereof, And an LED lamp capable of vertically and horizontally projecting light so as to allow efficient heat dissipation.

In order to achieve the above object, a heat dissipating device (10) for an LED lighting device according to the present invention is characterized in that a plurality of LEDs are arranged from the bottom of a groove (h) in which individual LEDs are arranged in the form of a matrix along the outer circumferential surface of the spherical heat insulating member A plate-shaped heat discharger ee formed by extending a heat dissipation fin e; And a hollow body (b) in the form of a gourd-like vessel having a hollow (v) inside the assembly (ee) of the plate-like heat dissipation part, wherein the neck of the hollow body (b) (B) is connected to the heat transfer medium (b1) of the mouthpiece, the heat transfer medium (b1) is connected to the outer bracket (br), and the hollow body And is installed at the center of the interior of the LED lighting apparatus.

The present invention provides an effect of high heat radiation efficiency and excellent light distribution characteristics of heat transmitted from an LED in a high-intensity LED lighting apparatus.

1 is a front view showing a structure of a conventional lighting apparatus.
2 is a perspective view showing a structure of a conventional LED module.
FIGS. 3 and 4 show a front view and a cross-sectional view of a spherical LED lighting apparatus according to an embodiment of the present invention.
5 is a cross-sectional view showing a convection flow of the bulb-type LED lighting apparatus of Fig.
6 is a cross-sectional view showing radiant heat and heat conduction flow of the bulb-type LED lighting apparatus of FIG.
7 is a front view showing a circuit line of the bulb-type LED lighting apparatus of Fig.
Fig. 8 is a front view and a bottom view showing holes for convective flow of the bulb-type LED lighting apparatus of Fig. 3; Fig.
FIG. 9 is a cross-sectional view showing that a circuit board including a driving circuit module is inserted into a gourd-shaped hollow structure when applying a commercial alternating current to the bulb-type LED lighting apparatus of FIG.
10 is a positional view showing the assembly of the bulb-type LED lighting apparatus of Fig.
11 is a front view showing an installation example of the bulb-type LED lighting apparatus of Fig.
FIG. 12 is a perspective view showing an example of installation of the bulb-type LED lighting apparatus of FIG. 9 using a reflector.
13 is a cross-sectional view showing a tubular heat insulator and a tubular hollow body of a bulb-type LED lighting apparatus.
14 is an external view of the bulb-type LED lighting apparatus of Fig.
Fig. 15 shows an example in which the bulb-type LED lighting apparatus of Fig. 9 is installed using a streetlight mechanism.
Fig. 16 shows an example in which the bulb-type LED lighting apparatus shown in Fig. 13 is installed using a tunnel luminaire.

Hereinafter, the structure of an LED lamp capable of vertically and horizontally projecting light according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. Note that, in the drawings, the same components are denoted by the same reference symbols as possible. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention. For the same reason, some of the components in the drawings are exaggerated, omitted, or schematically illustrated.

3 and 4 illustrate a spherical LED lighting apparatus according to an embodiment of the present invention. In the present invention, the shape of the incandescent lamp is inherited. So that the characteristics of the conventional incandescent lamp can be utilized and the total reflection can be made possible. As shown in FIG. 1, a conventional general-type LED lamp includes a driving module terminal mo and an LED module (LED) on a circuit board pcb, and a glass for preventing glare The heat dissipation structure of the present invention is not exposed to the outside. (A) instead of the glass bulb of the incandescent lamp, and the circuit wire (w) is coated on the inside of the bulbous insulator (a), and the surface of the bulb- The hemispherical grooves h are arranged in a matrix array and the LED module (LED) is mounted on the hemispherical groove h and connected to the circuit line w.

The heat dissipating fin assembly (ee) is contained in the inside of the heat insulating member (a), and the heat dissipating fin assembly (ee) in the inner part includes the gruel type hollow body (b) The connector co is connected to the connector co that transmits heat and the connector co connected to the thermally conductive cap b1 is connected to a bra bra which fixes the socket b2, Is transmitted sequentially.

Fig. 5 shows the convective flow of the bulb-type LED lighting device of Fig. In the present invention, since the radiating fin assembly (ee) and the hollow body (b) in the form of a gourd are located inside the bulb-type heat insulator (a), they flow through the holes of the bulb- Air is introduced and heat flows along the space between the heat-radiating fin assemblies (ee) to the holes of the thermally conductive tip b1.

Conversely, as shown in FIG. 11, when a bulb-type LED assembly 10 having a highly efficient heat dissipating structure is installed on the floor, air is introduced into the holes of the thermally conductive cap b1 and the space between the fins So that the heat flows to the hole ho of the spherical heat insulating member (a).

As a result, the air convection is caused by warm air flowing in the direction of the cold air, so that the warm air inside the LED assembly 10 having the high efficiency heat dissipating structure is guided to the outside in the direction of the cool air, .

Fig. 6 shows radiant heat and heat conduction flow of the spherical LED lighting device of Fig. Generally, radiant heat of a light source is transmitted in the direction of light. Since the light emitting direction of the light source of the LED module is perpendicular to the surface area of the bulb-type heat insulator (a) and the LED module is inserted into the bottom of the groove (h) .

Fig. 7 shows a circuit line w of the bulb-type LED lighting apparatus of Fig. The LEDs are arranged in a matrix at regular intervals. The plus lead line is connected to the LED module in the vertical direction, and the negative lead line is connected to the LED module in the lateral direction. Each LED module has two positive connection terminals and two negative connection terminals. Thus, due to the matrix circuit structure, a current can be applied to the LED module with a parallel connection structure. At this time, the circuit line is inserted into the space away from the surface layer of the heat insulating member (a) and can not be seen by the naked eye but must be connected to the LED module located in the hole (h). It is to be noted that the circuit line is protected from heat owing to the material characteristics of the bulb-type heat insulating material (a) and minimizes the thermal resistance so as not to interfere with the current flow.

Fig. 8 shows a front view (a) and a bottom view (b) showing holes for convective flow of the bulb-type LED lighting apparatus of Fig. The hole ho is drilled in the lower part of the glass bulb shape and the hole is bi-directionally opened in the part of the thermally conductive body (b1). As the number of holes increases, the number of holes increases, and the number of holes increases so that the manufacturing process becomes complicated and the rate of defects increases. Therefore, the number of holes is selected to optimize heat convection.

9 is a cross-sectional view showing a circuit board pcb including a drive module terminal mo inserted into a hollow structure b in the form of a gourd hole when a commercial alternating current is applied to the bulb-type LED lighting apparatus of Fig. Respectively. In the present invention, since the LED module is separated from the circuit board pcb including the driving module terminal mo, it is necessary to mount the circuit board on the circuit board pcb in order to incorporate the circuit board into the LED assembly 10 of the bulb type having a highly efficient heat- The circuit board (pcb) was placed inside the hollow body (b) in the form of a gourd so that heat transfer would not occur. The inner v of the hollow body b in the form of a gourd is vacuumed so that there is no heat transfer medium and the commercial alternating current applied through the connection terminal p1 and the connection terminal m1 flows through the center vertex p, And is supplied to the circuit board pcb via the AC current supply line w1. On the circuit board (pcb), the contact pressure of DC for emitting the LED is supplied to the LED module through w (circuit line). In this way, as an example shown in FIG. 9, heat transfer can be minimized on the circuit board pcb, and the circuit board pcb is not exposed to the outside, so that it is not affected by moisture or external stimuli.

Fig. 10 shows a positional view showing the assembly of the bulb-type LED lighting apparatus of Fig. In order to facilitate the assembly of the present invention, the bulb-type heat insulator (a) must be divided into two halves to be manufactured. The heat-radiating fin assembly (ee) is included inside the bulb-type heat insulator the hollow body b is connected to the connector co and the connector co is connected to the thermally conductive tip b1, And the socket b2 connected to the mouthpiece b1 is connected to the bracket br to transmit heat. At this time, the mouthpiece (b1) and the mouthpiece (m) for allowing the current to flow are connected to each other in a socket shape so that the mouthpiece of the present invention is inserted into the socket (b2). The gasket (g) must be inserted between the thermally conductive cap (b1) so that the heat of the thermally conductive cap (b1) is not transferred to the cap (m) through which the current flows.

11 is a front view showing an installation example of the bulb-type LED lighting apparatus of Fig. In the present invention, as in the conventional incandescent bulb, since it is designed to be able to perform total reflection by allowing the lamp to extend in the vertical direction with respect to the surface of the bulb-type heat insulator without the glove coated with powder, (c), and various mounting positions are possible.

Fig. 12 shows a perspective view showing an example in which the spherical LED lighting apparatus of Fig. 9 is installed using a reflector. Fig. It is preferable to use a conventional reflector in order to use it for projecting light. Conventionally, LED light fixtures for floodlight use a chip-on-board type LED as a high-speed LED or a compact multi-point light circle. In order to maintain a high luminous flux, it is difficult to increase the size of the heat dissipation body and the use of the reflector is limited due to the inconvenience of using the reflector.

 However, according to the present invention, the conventional socket can be inserted and the heat dissipation structure can not be drawn out to the conventional reflector. When such a reflector is used, the shape of the reflector can be changed so as to become a focused light, and the existing reflector can be utilized as it is, thereby enhancing the possibility of use for various purposes.

13 and 14 show tubular heat insulators and tubular hollow bodies of a bulb-type LED lighting device. In the present invention, instead of the spherical heat insulator (a), a tubular heat insulator (aa) may be included and a tubular hollow body (bb) may be included instead of the gourd type hollow body (b). When the tubular heat insulator (aa) and the tubular hollow body (bb) are used, the same structure as that of a conventional fluorescent lamp is used.

Fig. 15 shows an example in which the bulb-type LED lighting apparatus of Fig. 9 is installed using a reflector for a streetlight mechanism. In the conventional LED lamp for street lamp, it is inconvenient to change the module of the LED itself. However, it is easy to replace by using the apparatus of the present invention, and the reflector for the conventional street lamp apparatus is used as it is, Enables investigation.

Fig. 16 shows an example in which the bulb-type LED lighting apparatus of Fig. 13 is installed using a tunnel luminaire. It is preferable that the entrance, the intermediate point and the exit of the tunnel are totally reflected to conform to the cross-sectional shape of the tunnel as shown in the figure. Since the tunnel is mainly traffic passing through the vehicle, it is necessary to reduce the glare so as not to interfere with the driver's view.

LED; LED module,
L1; Insulation used in LED module,
L2; Thermal conductors used in LED modules,
L4; Connection terminal used in LED module,
L5; Backside of LED module Reflector,
L6; An LED element that emits the surface of the LED module,
a; A spherical heat insulator,
a1; A half spherical insulator,
a2; Other full spherical heat insulators divided in half,
aa; A tubular heat insulator,
w; Circuit lines,
w1; AC current lead,
h; a hemispherical groove arranged in a matrix form in a,
b; Gourd type hollow body,
bb; Tubular hollow body,
b1; Thermally conductive,
b2; socket connected to b1,
m; A current that flows through the mouthpiece,
m1; m,
g; Gaskets for insulating action,
g1; Insulated socket,
p; While the current is flowing,
p1; a connection terminal connected to p,
br; bracket for fixing b2,
v; the hollow portion of b1,
e; Heating pins,
ee; An assembly of the plate-
v1; a hollow portion between a and b,
ho; hole,
pcb; Circuit board,
mo; Drive module terminal,
co; a connector that is connected to b1 to transmit heat,
reflector; Reflection shade,
10; A light bulb type LED assembly having a highly efficient heat dissipating structure,

Claims (1)

A plurality of hemispherical grooves h formed in a hollow shape and arranged in a matrix form along an outer circumferential surface and a plurality of circuit lines electrically connecting the plurality of hemispherical grooves to adjacent hemispherical grooves, (a);
A plurality of LED modules (LEDs) arranged in each of the plurality of hemispherical grooves and receiving a voltage through the plurality of circuit lines;
And a plurality of heat sinks (ee) arranged in the matrix form and arranged in one of the rows or rows of the plurality of grooves (h) to contact the bottom surface of the grooves (h);
A heat dissipating member (b) inserted into the plate-like heat dissipating unit (ee) in the hollow shape; And
A thermally conductive cap (2) having a structure that is coupled to one side of the heat discharging body (b) and discharges heat transmitted through the plate heat dissipating unit (ee) and the heat discharging body to the outside and is fastened to an external bracket to which power is supplied b1); Lt; / RTI >
Wherein the heat insulating member (a), the heat discharging member (b), and the thermally conductive member (b1) are formed in a tube shape.

Images