KR20140120584A - 표시 패널용 절단 장치 및 이를 이용한 표시 장치의 제조 방법 - Google Patents

표시 패널용 절단 장치 및 이를 이용한 표시 장치의 제조 방법 Download PDF

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Publication number
KR20140120584A
KR20140120584A KR1020130036535A KR20130036535A KR20140120584A KR 20140120584 A KR20140120584 A KR 20140120584A KR 1020130036535 A KR1020130036535 A KR 1020130036535A KR 20130036535 A KR20130036535 A KR 20130036535A KR 20140120584 A KR20140120584 A KR 20140120584A
Authority
KR
South Korea
Prior art keywords
display panel
stage
cutting
unit
moving
Prior art date
Application number
KR1020130036535A
Other languages
English (en)
Korean (ko)
Inventor
김민수
프루신스키 발레리
Original Assignee
삼성디스플레이 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성디스플레이 주식회사 filed Critical 삼성디스플레이 주식회사
Priority to KR1020130036535A priority Critical patent/KR20140120584A/ko
Priority to CN201310339161.9A priority patent/CN104098260B/zh
Priority to TW102128420A priority patent/TWI602289B/zh
Publication of KR20140120584A publication Critical patent/KR20140120584A/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/04—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member
    • B26D1/045—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member for thin material, e.g. for sheets, strips or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work
    • B26D7/015—Means for holding or positioning work for sheet material or piles of sheets
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Forests & Forestry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020130036535A 2013-04-03 2013-04-03 표시 패널용 절단 장치 및 이를 이용한 표시 장치의 제조 방법 KR20140120584A (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020130036535A KR20140120584A (ko) 2013-04-03 2013-04-03 표시 패널용 절단 장치 및 이를 이용한 표시 장치의 제조 방법
CN201310339161.9A CN104098260B (zh) 2013-04-03 2013-08-06 显示面板用切割设备和使用切割设备制造显示设备的方法
TW102128420A TWI602289B (zh) 2013-04-03 2013-08-08 用於顯示面板之切割裝置及使用其製造顯示裝置之方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130036535A KR20140120584A (ko) 2013-04-03 2013-04-03 표시 패널용 절단 장치 및 이를 이용한 표시 장치의 제조 방법

Publications (1)

Publication Number Publication Date
KR20140120584A true KR20140120584A (ko) 2014-10-14

Family

ID=51666855

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130036535A KR20140120584A (ko) 2013-04-03 2013-04-03 표시 패널용 절단 장치 및 이를 이용한 표시 장치의 제조 방법

Country Status (3)

Country Link
KR (1) KR20140120584A (zh)
CN (1) CN104098260B (zh)
TW (1) TWI602289B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170018195A (ko) * 2015-08-06 2017-02-16 삼성디스플레이 주식회사 기판 절단장치 및 이를 이용한 디스플레이 장치의 제조방법

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106995274A (zh) * 2016-09-23 2017-08-01 广州市科卡通信科技有限公司 一种新式玻璃画线装置
CN106353902B (zh) * 2016-11-08 2019-03-22 武汉华星光电技术有限公司 一种液晶面板移载装置及液晶面板切割系统
JP2022184119A (ja) * 2021-05-31 2022-12-13 株式会社ディスコ シート貼着装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100789454B1 (ko) * 2002-02-09 2007-12-31 엘지.필립스 엘시디 주식회사 액정 패널의 절단 장치 및 그 방법
KR100741902B1 (ko) * 2002-05-30 2007-07-24 엘지.필립스 엘시디 주식회사 액정표시장치를 제조하기 위한 시스템 및 이를 이용한액정표시장치의 제조 방법
JP4748986B2 (ja) * 2002-11-01 2011-08-17 株式会社半導体エネルギー研究所 半導体装置の作製方法
KR100689314B1 (ko) * 2003-11-29 2007-03-08 엘지.필립스 엘시디 주식회사 액정표시패널의 절단방법
CN100546004C (zh) * 2005-01-05 2009-09-30 Thk株式会社 工件的截断方法和装置、划线和截断方法、以及带截断功能的划线装置
JP2006199553A (ja) * 2005-01-24 2006-08-03 Sharp Corp 基板分断装置及び基板分断方法
KR20070013134A (ko) * 2005-07-25 2007-01-30 삼성전자주식회사 표시장치용 기판의 제조장치 및 제조방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170018195A (ko) * 2015-08-06 2017-02-16 삼성디스플레이 주식회사 기판 절단장치 및 이를 이용한 디스플레이 장치의 제조방법

Also Published As

Publication number Publication date
CN104098260B (zh) 2019-09-13
CN104098260A (zh) 2014-10-15
TW201440214A (zh) 2014-10-16
TWI602289B (zh) 2017-10-11

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E902 Notification of reason for refusal
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