KR20140118418A - Bonding Member And Semiconductor Chip Bonding Apparatus Having the Same - Google Patents
Bonding Member And Semiconductor Chip Bonding Apparatus Having the Same Download PDFInfo
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- KR20140118418A KR20140118418A KR1020130034278A KR20130034278A KR20140118418A KR 20140118418 A KR20140118418 A KR 20140118418A KR 1020130034278 A KR1020130034278 A KR 1020130034278A KR 20130034278 A KR20130034278 A KR 20130034278A KR 20140118418 A KR20140118418 A KR 20140118418A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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Abstract
BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a bonding member and a semiconductor chip bonding apparatus having the bonding member capable of performing inclination inspection of a bonding head through a bonding member for picking up and bonding a semiconductor chip to be bonded.
Description
The present invention relates to a bonding member of a semiconductor chip bonding apparatus and a semiconductor chip bonding apparatus having the same. More particularly, the present invention relates to a bonding member capable of performing tilt inspection of a bonding head, inspection and correction of a load cell using a bonding member for picking up and bonding a semiconductor chip to be bonded, and a semiconductor chip bonding apparatus having the same. will be.
The semiconductor chip bonding apparatus refers to a device that picks up an individual semiconductor chip from a wafer or the like, immerses the lower surface (bump) of the picked up semiconductor chip in the flux, and bonds the semiconductor chip to the bonded substrate.
The semiconductor chip bonding apparatus may include a bonding head having a bonding member for picking up and bonding a semiconductor chip to be bonded by pneumatic pressure.
The bonding head is mounted on a transfer unit or the like, and is capable of picking up, transferring, and bonding the semiconductor chip by reciprocating the semiconductor chip supply unit and the bonded substrate in the x axis direction or the y axis direction.
Such a bonding head may cause problems such as tilting or twisting in the bonding head due to repetitive transferring process, flux immersion process, or impact (or impact) applied to the bonding head in the bonding process.
The tilting of the bonding head may refer to a tilting of the bonding head with respect to a vertical ascending direction (for example, a z-axis direction) of the bonding head.
When a tilting occurs in the bonding head, a pickup process in which the bonding head picks up the semiconductor chip, an immersion process in which the bottom surface of the semiconductor chip is immersed in the flux, and a bonding process in which the semiconductor chip is bonded to the bonding substrate, Or the amount of flux immersed in the lower surface of the semiconductor chip may become uneven during the immersion process, or an error may occur in the bonding position in the process of bonding the semiconductor chip.
Therefore, it is necessary to check whether the bonding head is tilted at a determined interval considering the starting point of the work or the characteristics of the work.
1 is a sectional view of a
The bonding
The bonding member 100 'is provided at a lower portion of the
As shown in FIG. 1, an inspection method for inspecting the inclination of a
The reason for detaching the bonding member 100 'and determining the tilting of the bonding
In recent years, since the semiconductor chip picked up and bonded by the
Therefore, the tilting of the
As shown in FIG. 1, since the inspection surface 11 'of the inspection jig 10' has a larger area than the
However, in the conventional inspection method, since the inspection jig 10 'is mounted after the bonding member 100' is detached from the
In addition, in the conventional inspection method, when inspecting not only the tilting of the bonding head but also the load cell of the bonding head, it is necessary to remove the bonding member and mount the load cell inspection member. That is, when each inspection is performed, it is troublesome to replace it with a member suitable for each use, and there is a problem that the productivity is lowered because the work must be stopped at the time of replacement. In addition, there is a problem that the inspection result is different from that in the actual operation even if the replacement is performed, and there is a problem that the precision is changed during the replacement process.
The present invention relates to a bonding member capable of performing a tilting inspection of a bonding head through a bonding member for picking up and bonding a semiconductor chip to be bonded and a semiconductor chip bonding apparatus having the bonding member. .
According to an aspect of the present invention, there is provided a bonding member of a semiconductor chip bonding apparatus for picking up or bonding a semiconductor chip, the bonding member constituting a bonding head having a pneumatic flow path and being driven to move up and down, A suction channel provided at a lower portion of the mounting portion for picking up and bonding the semiconductor chip, a suction channel communicated with the pneumatic flow passage and communicating with the mounting portion and the working portion, And a checking unit for checking the tilting of the bonding head in contact with the inspection probe provided in the bonding apparatus.
In this case, the working part is provided to protrude downward from below the center area of one plate member, and the inspection part is provided at the edge of the plate member and may include a flat inspection surface at the lower part of the edge.
In the lower surface of the plate-like member, depressed portions depressed in the upward direction may be provided inside the inspection portion and outside the operation portion.
Here, the inspection portion and the depressed portion may have a circular ring shape or a rectangular ring shape.
In this case, the inspection portion and the depressed portion may have a circular ring shape or a rectangular ring shape.
In addition, the mounting portion and the working portion may be connected by a pipe-shaped connecting portion provided with the suction passage.
In this case, the mounting portion, the connection portion, and the operation portion may be integrally formed.
Here, the working unit may include an adsorption space for distributing the suction pressure distributed by the suction passage to the upper surface of the semiconductor chip, and a supporting rib projecting downward to support the upper surface of the adsorbed semiconductor chip .
The inspection surface of the inspection unit may be disposed above the lower end of the support rib.
Here, it is preferable that at least two inspection points for judging the inclination of the bonding head due to the deviation of the elevation height of the bonding head in contact with the inspection probe among the inspection surfaces are at least two points, Can be spaced apart.
According to another aspect of the present invention, there is provided a bonding apparatus including a bonding head including the bonding member, a transfer unit for mounting the bonding head, a transfer unit for transferring the transfer unit in the X- or Y- A tilting inspection unit provided with an inspection probe projected upward in order to inspect vertical tilting of the head and a plurality of inspection points of the inspection unit of the bonding member provided on the bonding head are brought into contact with the inspection probe of the tilting inspection unit And a control unit for controlling the bonding head and the transfer unit and determining a tilting of the bonding head, wherein the control unit controls the bonding head at a point of contact between the inspection point and the inspection probe at a plurality of inspection points of the inspection unit The elevating height of the bonding head is sensed, and the elevation heights of the bonding heads are compared with each other, The semiconductor chip bonding apparatus is characterized in that it is judged that the semiconductor chip is crying.
According to another aspect of the present invention, there is provided a bonding apparatus including a bonding head including a bonding member, a transfer unit for mounting the bonding head, a transfer unit for transferring the transfer unit in the X- or Y- A tilting inspection unit having an inspection probe protruded upward to inspect the tilting in the vertical direction and a plurality of inspection points of the inspection unit of the bonding member provided on the bonding head are bonded to the inspection probe of the tilting inspection unit, And a control unit for controlling the head and the transfer unit and determining a tilting of the bonding head, wherein the bonding head is divided into an upper structure and a lower structure, Wherein the control unit is configured to be capable of relative displacement, Wherein the sensor detects the distance between the upper structure and the lower structure of the bonding head at the point of time of contact between the point and the inspection probe and compares the sensed distances to determine the tilting of the bonding head. A chip bonding apparatus can be provided.
According to another aspect of the present invention, there is provided a bonding apparatus including a bonding head including the bonding member, a bonding head, and a transfer unit for mounting a lower vision unit disposed at a predetermined distance from the one side of the bonding head, A transfer unit for transferring the transfer unit in the X-axis or Y-axis direction, an alignment comparator having a plurality of special marks for checking a position error value of the bonding head and correcting the position error value, And an alignment jig provided on the edge of the mounting portion and having protruding ribs which are in surface contact with the inspection surface of the bonding member when picked up by the bonding head, Acquiring from the lower vision unit an image in a state of being mounted on a comparator, It is possible to provide a semiconductor chip bonding apparatus including a control unit for checking and correcting the position error value of the bonding head.
In this case, when the alignment jig is picked up by the bonding head, a pressure applied through the suction path of the bonding member is distributed and applied to the entire mounting surface of the alignment jig and the inner surface of the protruding rib, A suction space may be formed between the working portion of the bonding member and the inspection portion and the mounting portion to be hermetically sealed from the outside.
The alignment jig is made of a transparent material having a plurality of special marks,
The control unit senses the alignment jig held on the alignment comparator and detects the position of the alignment mark on the X, Y, and Y axes of the bonding head through the deviation between the actual position of the special mark on the sensed image and the target position of the control signal of the transfer unit. it is possible to correct the position error value of the bonding head with respect to the? -axis direction.
Here, the alignment comparator and the alignment jig may have a plurality of differential marks arranged in a lattice pattern.
The projecting height of the projecting ribs projected from the mounting portion of the alignment jig may be greater than the projecting height of the working portion provided in the central region of the bonding member.
According to another aspect of the present invention, there is provided a semiconductor device including a bonding head including the bonding member, a transfer unit for mounting the bonding head, a transfer unit for transferring the transfer unit in the X axis direction or the Y axis direction, A load cell inspection jig picked up on the bonding head, and a load cell inspection jig picked up on the bonding head are mounted on a load cell of the load cell inspection unit. The load cell inspection unit includes a load cell inspection unit having a load cell probe protruded upward to inspect a load applied to the load cell, And a control unit for controlling the bonding head and the transfer unit to make contact with the probe and determining a pressure of the bonding head, wherein the control unit elevates and drives the bonding head, from which the load cell inspection sheet is picked up, By measuring the load applied to the probe in contact with the load cell probe, And determining a pressure of the semiconductor chip.
According to the bonding member of the present invention, the tilting test of the bonding head can be performed without using a separate inspection jig or the like.
In addition, according to the bonding member of the present invention, the inspection part performing the role of the inspection jig and the work part performing the role of the bonding member are integrally formed without using a separate inspection jig and the like, It is possible to carry out load inspection and to eliminate the problem that the degree of tilting can be changed during the replacement process.
In addition, it is possible to omit the replacement work of each test paper gauge for the tilting inspection of the bonding head, the load cell inspection, the material alignment status check, etc., thereby minimizing the interruption of the semiconductor chip bonding process and improving the process efficiency (UPH) have.
In addition, the error of the bonding position can be predicted through the bonding member and the alignment inspection unit according to the present invention, and the error in the bonding position predicted in the actual bonding process can be compensated for, thereby minimizing the failure of the semiconductor chip bonding process.
Even though the inspection part and the work part of the bonding member are integrally formed, due to the structure in which the work part of the bonding member is protruded, the inspection part interferes with or collides with another semiconductor chip or substrate, There is an effect that it can be prevented from occurring in advance.
In addition, when the bonding member of the present invention is applied to the alignment jig used for correcting the bonding or the work position error, the protrusion rib is provided so as to be brought into contact with the inspection surface of the bonding member, It is also possible to use the bonding member of the present invention for correcting the alignment operation.
According to the present invention, since it is possible to perform all of the material pick-up, tilting inspection of the bonding head, inspection of the load cell, and material alignment status using one bonding member, there is no hassle of replacement, It is possible to obtain a reliable inspection result.
1 is a cross-sectional view of a bonding head of a conventional semiconductor chip bonding apparatus and a side view of a test jig for inspecting a tilting of a bonding head.
FIG. 2 illustrates a tilting inspection process of a conventional semiconductor chip bonding apparatus.
3 illustrates a bonding head having a bonding member according to the present invention.
4 shows a bonding member according to the present invention.
FIG. 5 illustrates a process of performing inclination checking of a bonding head of a bonding apparatus according to the present invention.
6 shows a main part of a bonding apparatus according to the present invention.
FIG. 7 shows several examples of the alignment jig provided in the bonding apparatus according to the present invention.
FIG. 8 illustrates a process in which a bonding head picks up an alignment jig for alignment inspection of a semiconductor chip of a bonding apparatus according to the present invention.
Fig. 9 shows an example of an image picked up by the lower vision unit to perform alignment inspection by the semiconductor chip bonding apparatus according to the present invention.
FIG. 10 illustrates a load cell inspection process performed by a load cell inspection unit included in the semiconductor chip bonding apparatus according to the present invention.
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like reference numerals designate like elements throughout the specification.
FIG. 3 shows a
The present invention relates to a
More specifically, the present invention relates to a method of manufacturing a semiconductor device, including a mounting
In the
The
Accordingly, in the
The mounting
Accordingly, the
The
The
The mounting
The
In the conventional bonding apparatus, in order to inspect the tilting of the
However, the
It is easy to perform the tilting inspection of the
In order to inspect the inclination of the
As shown in FIGS. 3 and 4, the
The working
The upper portion of the
The working
An operation of picking up the semiconductor chip to be bonded and bonding it to the bonding substrate can be performed by the working
The working
The working
The
The
However, in the state where the
As shown in FIG. 4, the
The tilting inspection of the
So that the inclination direction of the
It is preferable that a plurality of inspection points are uniformly distributed on the
The
3 and 4, the working
Therefore, the increase in the load of the
The
The
The shape of the
If the shape of the
As a result, the overall shape of the
Generally, since the shape of the working part 111 (or the
The lower end of the working
3 and 4 (b), the lower end of the
The
3, the mounting
The
The
When the method of measuring the distance between the
3, the
A sensing unit (not shown) for sensing a separation distance between the
Therefore, in the control unit of the semiconductor chip bonding apparatus according to the present invention, a plurality of inspection points of the
As described above, the
However, it is possible to detect the height of each
FIG. 5 illustrates a process of performing inclination checking of a
5 (a) shows a state in which the
5 (a), the
Therefore, by comparing the deviation G-G 'between the separation distances at the plurality of inspection points P, it is possible to determine the deviation of the lift distance of the
5, the semiconductor chip bonding apparatus according to the present invention includes a
The tilting
Fig. 6 shows a main part of a semiconductor chip bonding apparatus according to the present invention, and Fig. 7 shows several examples of the
The semiconductor chip bonding apparatus according to the present invention includes a
The semiconductor chip bonding apparatus according to the present invention may include a transfer unit for transferring the
The transfer unit includes a
The
The
The
The control unit senses the height of the
In this case, the method of determining the vertical height of the
The
Therefore, as a method for correcting such a bonding position error, an
The
The
That is, the
As shown in FIGS. 6 and 7, in addition to the
The reason why the number of the special marks fm on the
The
The position of the special mark Fm of the
7, the
Fig. 7 (a) shows an
Even if the shape of the
The alignment inspection through the
The semiconductor chip bonding apparatus according to the present invention may include a
In addition, the
An upper vision unit for picking up the lower surface of the picked-up semiconductor chip may be provided on a path where the
This is because the upper vision unit must be placed on the transfer path of the
8 illustrates a process in which the
7 and 8, a protruding
A pressure applied through the
The pneumatic or suction pressure provided in the
The pneumatic pressure applied through the suction passage of the
The protrusion height tg of the protruding
The height tg of the
The height tg of the
8 (b), after the
The thickness of the actual semiconductor chip picked up in the working
If the
9 is a schematic view of a semiconductor wafer bonding apparatus according to an embodiment of the present invention. The semiconductor wafer bonding apparatus according to the present invention includes a
9, only the special marks of the
9A is a state in which the
This is because the control unit of the semiconductor chip bonding apparatus is provided with a transfer unit for transferring the
The generation of such an error means that the semiconductor chip can be picked up by the
Therefore, when the control unit of the semiconductor chip bonding apparatus according to the present invention controls the transfer unit to transfer the
In addition to the shift error on the simple x-y plane, such an error in the bonding position may also cause an error due to twisting around the z-axis.
The example shown in Fig. 9 (b) shows a case where the
Therefore, when the control unit of the semiconductor chip bonding apparatus according to the present invention controls the transfer unit to transfer the
Each of the errors shown in Figs. 9 (a) and 9 (b) has a shift error (position error of the bonding head in the X-axis and Y-axis directions) on the xy plane and a torsional error A shift error on the xy plane and a torsional error around the z axis can be generated together and the control unit of the bonding apparatus can control the transfer unit or the bonding head The control of the
Therefore, when an error is generated as shown in Fig. 9, the control unit picks up the
For example, the position error value (X, Y,?) Of the bonding head can be modified by the following method or the like. The operation part of the bonding head picks up the alignment jig (or semiconductor chip), places it on the alignment comparator, captures the alignment jig and alignment comparator using a downward vision unit arranged at a predetermined distance from one side of the bonding head, A process of acquiring an image of the alignment jig placed on the stage can be performed.
The process of picking up the alignment jig (or the semiconductor chip) again by the work unit of the bonding head, correcting the position error value (X, Y,?) Based on the input position value, The position error of the bonding head may be corrected through the positional relationship between the bonding head and the lower vision unit.
Alternatively, the position error value of the bonding head may be corrected using the positional relationship between the bonding head, the downward vision unit, and the upward vision unit by additionally using an upward vision unit fixedly provided for imaging the bottom surface of the semiconductor chip .
Since the bonding head according to the present invention is rotatably provided for correcting the position error values, the bonding jig or the semiconductor chip is rotated at predetermined angles such as 90 deg., 180 deg., 270 deg., 360 deg. And the center axis of the bonding head can be obtained by picking up the picked-up chip by the downward vision unit by rotating the picked-up chip on the alignment comparator, thereby correcting the position error value more accurately.
Accordingly, the bonding head or the bonding member according to the present invention can be rotatably installed in the bonding apparatus or the bonding head.
In other words, the control unit of the semiconductor chip bonding apparatus according to the present invention picks up the
FIG. 10 illustrates a load cell inspection process performed by a load cell inspection unit included in the semiconductor chip bonding apparatus according to the present invention. 10 (b) shows a process of inspecting the load cell inspection jig by bringing the load cell inspection jig into contact with the bonding member, FIG. 10 (b) To perform a load cell inspection.
The semiconductor chip bonding apparatus according to the present invention may further include a load
The load
10 (a), the control unit of the semiconductor chip bonding apparatus controls the transfer unit so that the
Specifically, as shown in FIG. 10 (b), a separate load
10B shows a state in which the load
Conventionally, in order to inspect the load, the
However, as shown in FIG. 10, since the
In the load cell inspection process shown in FIG. 10, the load cell (or load) may be measured through a weight sensor or a pressure sensor provided in the load
While the present invention has been particularly shown and described with reference to preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the following claims. . It is therefore to be understood that the modified embodiments are included in the technical scope of the present invention if they basically include elements of the claims of the present invention.
1: bonding device
1000: bonding head
100: bonding member
500: Tilt Inspection Unit
600: alignment inspection unit
700: Load cell inspection unit
900: Upward vision unit
1100, 1300: transfer unit
1200: downward vision unit
Claims (17)
A mounting portion detachably mounted on the mounting member of the bonding head;
An operation unit provided at a lower portion of the mounting unit and picking up and bonding the semiconductor chip;
A suction flow path communicating with the pneumatic flow path and communicating the mounting portion and the working portion; And
And an inspection unit provided around the operation unit and contacting the inspection probe provided in the bonding apparatus to determine the tilting of the bonding head.
Wherein the operation part is provided to protrude downward from below the center area of one plate member and the inspection part is provided at the edge of the plate member and includes a flat inspection surface at the lower part of the edge.
And a recessed portion that is recessed upward is formed on the inner side of the inspection portion and the outer side of the operation portion of the lower surface of the plate-like member.
Wherein the inspection portion and the depressed portion have a circular ring shape or a rectangular ring shape.
Wherein the mounting portion and the working portion are connected by a pipe-shaped connecting portion provided with the suction passage.
Wherein the mounting portion, the connection portion, and the operation portion are integrally formed.
The working unit includes an adsorption space for distributing the suction pressure distributed by the suction passage to the upper surface of the semiconductor chip and a supporting rib projecting downward to support the upper surface of the semiconductor chip to be adsorbed by the adsorption space. .
Wherein the inspection surface of the inspection unit is disposed above the lower end of the support rib.
Wherein the inspection points of the inspection surface contacting the inspection probe to determine the tilting of the bonding head through a deviation of the elevation height of the bonding head are two or more points, And wherein the bonding member is located at a predetermined position.
A transfer unit having a transfer unit to which the bonding head is mounted, the transfer unit transferring the transfer unit in the X-axis or Y-axis direction;
An inclination checking unit having an inspection probe protruded upward to inspect a vertical inclination of the bonding head; And
And a control unit for controlling the bonding head and the transfer unit so that a plurality of inspection points of the inspection unit of the bonding head provided in the bonding head are in contact with the inspection probes of the tilt inspection unit and determining a tilting of the bonding head In addition,
Wherein the control unit senses the height of the bonding head at the point of contact between the inspection point and the inspection point at a plurality of inspection points of the inspection unit and compares the detected height of each of the bonding heads to judge the inclination of the bonding head And the semiconductor chip bonding apparatus.
A transfer unit having a transfer unit to which the bonding head is mounted, the transfer unit transferring the transfer unit in the X-axis or Y-axis direction;
An inclination checking unit having an inspection probe protruded upward to inspect a vertical inclination of the bonding head; And
And a control unit for controlling the bonding head and the transfer unit so that a plurality of inspection points of the inspection unit of the bonding head provided in the bonding head are in contact with the inspection probes of the tilt inspection unit and determining a tilting of the bonding head In addition,
Wherein the bonding head is divided into an upper structure and a lower structure, and the upper structure and the lower structure are configured to be relatively displaced so as to vary the spacing distance, and the control unit controls the bonding points between the inspection points at the plurality of inspection points Wherein the semiconductor chip bonding is performed by sensing a separation distance between the upper structure and the lower structure of the bonding head at a contact time of the inspection probe and comparing the sensed distances to determine the tilting of the bonding head Device.
A transfer unit for transferring the transfer unit in the X-axis direction or the Y-axis direction, the transfer unit including a transfer unit for mounting a lower vision unit disposed at a predetermined distance from a side of the bonding head and the bonding head;
An alignment comparator having a plurality of special marks for checking a position error value of the bonding head and correcting the position error value;
An aligning jig having a plate-like mounting part mounted on an upper surface of the alignment comparator and protruding ribs protruding from a rim of the mounting part and having a surface contact with an inspection surface of the bonding member when picked up by the bonding head; And
And a control unit which obtains an image in a state where the alignment jig is placed on the alignment comparator from the downward vision unit and inspects and corrects a position error value of the bonding head through the obtained image, Device.
Wherein when the alignment jig is picked up by the bonding head, a pressure applied through the suction channel of the bonding member is distributed and applied to the entire mounting surface of the alignment jig and the inner surface of the protruding rib, Wherein a suction space is formed between the working part, the inspection part, and the mounting part, the suction space being sealed with the outside.
Wherein the alignment jig is made of a transparent material having a plurality of special marks,
The control unit senses the alignment jig held on the alignment comparator and detects the position of the alignment mark on the X, Y, and Y axes of the bonding head through the deviation between the actual position of the special mark on the sensed image and the target position of the control signal of the transfer unit. and corrects the position error value of the bonding head with respect to the? -axis direction.
Wherein the alignment comparator and the alignment jig are provided with a plurality of spacer marks arranged in a lattice pattern.
Wherein the projecting height of the projecting ribs protruded from the mounting portion of the alignment jig is greater than the projecting height of the working portion provided in the central region of the bonding member.
A transfer unit having a transfer unit to which the bonding head is mounted, the transfer unit transferring the transfer unit in the X-axis or Y-axis direction;
A load cell inspection unit having a load cell probe protruded upward to inspect a pressure applied to the semiconductor chip per unit area;
A load cell inspection jig picked up on the bonding head; And
And a control unit for controlling the bonding head and the transfer unit so that the load cell inspection sheet picked up by the bonding head contacts the load cell probe of the load cell inspection unit and determines the pressure of the bonding head,
Wherein the control unit determines the pressure per unit area of the bonding head by driving the bonding head picked up by the load cell inspection sheet by a first inputted value and measuring a load applied to the load cell probe, .
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| KR1020130034278A KR101543317B1 (en) | 2013-03-29 | 2013-03-29 | Bonding Member And Semiconductor Chip Bonding Apparatus Having the Same |
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| KR1020130034278A KR101543317B1 (en) | 2013-03-29 | 2013-03-29 | Bonding Member And Semiconductor Chip Bonding Apparatus Having the Same |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20200001193A (en) * | 2018-06-27 | 2020-01-06 | 세메스 주식회사 | Module for aligning bonding tool and die bonding apparatus having the same |
| KR102096567B1 (en) * | 2018-10-15 | 2020-04-02 | 세메스 주식회사 | Apparatus for picking up semiconductor devices |
| KR20200065621A (en) * | 2018-11-30 | 2020-06-09 | 세메스 주식회사 | Apparatus for picking up semiconductor devices and method of controlling operations of the same |
| KR20200135268A (en) * | 2018-06-27 | 2020-12-02 | 세메스 주식회사 | Module for aligning bonding tool and die bonding apparatus having the same |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR102708431B1 (en) | 2018-11-28 | 2024-09-25 | 삼성디스플레이 주식회사 | Bonding apparatus and bonding method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4761672B2 (en) * | 2001-09-05 | 2011-08-31 | 株式会社東芝 | Bonding method and bonding apparatus |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200001193A (en) * | 2018-06-27 | 2020-01-06 | 세메스 주식회사 | Module for aligning bonding tool and die bonding apparatus having the same |
| KR20200135268A (en) * | 2018-06-27 | 2020-12-02 | 세메스 주식회사 | Module for aligning bonding tool and die bonding apparatus having the same |
| KR102096567B1 (en) * | 2018-10-15 | 2020-04-02 | 세메스 주식회사 | Apparatus for picking up semiconductor devices |
| KR20200065621A (en) * | 2018-11-30 | 2020-06-09 | 세메스 주식회사 | Apparatus for picking up semiconductor devices and method of controlling operations of the same |
| KR102202080B1 (en) * | 2019-07-02 | 2021-01-12 | 세메스 주식회사 | Collet exchange method, die transfer method and die bonding method |
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| KR101543317B1 (en) | 2015-08-11 |
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