KR20140115766A - Optical semiconductor illuminating apparatus - Google Patents

Optical semiconductor illuminating apparatus Download PDF

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Publication number
KR20140115766A
KR20140115766A KR1020130030813A KR20130030813A KR20140115766A KR 20140115766 A KR20140115766 A KR 20140115766A KR 1020130030813 A KR1020130030813 A KR 1020130030813A KR 20130030813 A KR20130030813 A KR 20130030813A KR 20140115766 A KR20140115766 A KR 20140115766A
Authority
KR
South Korea
Prior art keywords
heat dissipation
connection housing
light emitting
emitting module
dissipation base
Prior art date
Application number
KR1020130030813A
Other languages
Korean (ko)
Inventor
이수운
박일
Original Assignee
주식회사 포스코엘이디
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 포스코엘이디 filed Critical 주식회사 포스코엘이디
Priority to KR1020130030813A priority Critical patent/KR20140115766A/en
Priority to EP13825943.7A priority patent/EP2881659A4/en
Priority to CN201380041092.1A priority patent/CN104520642A/en
Priority to PCT/KR2013/005357 priority patent/WO2014021550A1/en
Priority to US13/921,526 priority patent/US9115874B2/en
Priority to TW102122882A priority patent/TW201407082A/en
Publication of KR20140115766A publication Critical patent/KR20140115766A/en
Priority to US14/790,366 priority patent/US20150300623A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The present invention relates to a heat dissipation base, A light emitting module including at least one semiconductor optical device and mounted on a bottom surface of the heat dissipation base; A first radiating fin formed at both ends of the upper surface of the heat dissipating base; A plurality of second radiating fins formed on an upper surface of the radiating base and having a height protruding from an upper surface of the radiating base smaller than the first radiating fins and disposed between the first radiating fins; And a connection portion formed on an upper surface of the heat dissipation base and through which a wiring electrically connected to the light emitting module passes, wherein both side edges of the first and second heat dissipation fins protrude from both side edges of the heat dissipation base So that various types of wiring can be connected in different countries as one module, and heat radiation performance and airtightness can be maintained.

Description

[0001] OPTICAL SEMICONDUCTOR ILLUMINATION APPARATUS [0002]

The present invention relates to an optical semiconductor lighting apparatus, and more particularly, to an optical semiconductor lighting apparatus capable of connecting various kinds of wiring in different countries as one module and improving heat radiation performance.

Optical semiconductor such as LED or ELD has a lower power consumption than an incandescent lamp and a fluorescent lamp, has a long service life, is excellent in durability, and is one of components widely used for lighting in recent years due to its much higher luminance.

An illumination device using such a semiconductor optical device as a light source is accompanied by a lot of heat during a light emitting operation of a light emitting module including a semiconductor optical device.

Further, such an illumination apparatus is constructed by assembling one or more light emitting modules including a heat sink to a housing structure.

The light emitting module is provided with a printed circuit board (PCB) on a front surface of a heat sink having a plurality of heat dissipating fins on the back surface thereof, and semiconductor optical devices having optical semiconductor therein are mounted on the printed circuit board.

However, the lighting apparatus including such a light emitting module has a problem in that it can not cope with a wide range of different authentication conditions in each country.

Also, since such a lighting apparatus requires a heat transfer area of a certain degree in order to exhibit a certain degree of heat radiation performance, there is a problem that the heat sink including the heat radiation fin becomes bulky and heavy.

Patent Application No. 10-2010-0082588 Patent Application No. 10-2011-0091173

The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a module capable of connecting various kinds of wiring in different countries and improving heat dissipation performance, So that it is possible to sufficiently provide a mounting space for the optical semiconductor lighting device.

To achieve these and other advantages and in accordance with the purpose of the present invention, as embodied and broadly described herein, A light emitting module including at least one semiconductor optical device and mounted on a bottom surface of the heat dissipation base; A first radiating fin formed at both ends of the upper surface of the heat dissipating base; A plurality of second radiating fins formed on an upper surface of the radiating base and having a height protruding from an upper surface of the radiating base smaller than the first radiating fins and disposed between the first radiating fins; And a connection portion formed on an upper surface of the heat dissipation base and through which a wiring electrically connected to the light emitting module passes, wherein both side edges of the first and second heat dissipation fins protrude from both side edges of the heat dissipation base The optical semiconductor lighting device can be provided.

The connection unit includes a connection housing protruding from an upper surface of the heat dissipation base, and a ring cover coupled to an open top of the connection housing, the connection unit including an inner space communicating with the light emitting module.

In this case, the light emitting module is connected to a power supply part through a wiring penetrating a center part of the ring cover.

The connection unit may include a connection housing protruding from an upper surface of the heat dissipation base to form an inner space communicating with the light emitting module and a connection member formed along an outer circumferential surface of the connection housing from an upper surface of the heat dissipation base, And a ring cover coupled to the open upper portion of the connection housing and the upper end of the connection rib.

The light emitting module is connected to a power supply unit through wires passing through the center of the ring cover.

The connection unit includes a connection housing protruding from an upper surface of the heat dissipation base and forming an inner space communicating with the light emitting module, and a ring step formed on the inner lower part of the connection housing, And a sealing member that is seated on the ring edge and received in the connection housing.

The light emitting module is connected to a power supply unit through a wiring penetrating a center portion of the sealing member.

The connection unit may include a connection housing protruding from an upper surface of the heat dissipation base to form an inner space communicating with the light emitting module, a sealing member accommodated in the connection housing, and a sealing member protruding in a concentric manner on the upper surface of the sealing member. And a ring cover coupled to an open top of the connection housing, wherein a bottom surface of the ring cover is in contact with the contact rib.

The light emitting module is connected to the power supply part through a wiring penetrating the center part of the sealing member and the center part of the ring cover.

The connection unit includes a connection housing protruding from an upper surface of the heat dissipation base, and a cable gland coupled to an upper side of the connection housing. The cable gland forms an internal space communicating with the light emitting module. .

The light emitting module is connected to the power supply unit through a covered wiring penetrating the cable gland.

The connection unit includes a connection housing protruding from an upper surface of the heat dissipation base and forming an inner space communicating with the light emitting module, and a ring step formed on the inner lower part of the connection housing, A sealing member which is seated on the ring edge and is received in the connection housing, and a cable gland which is coupled to an upper side of the connection housing.

The light emitting module is connected to a power supply unit through a wire covered with the center portion of the sealing member and the cable gland.

The optical semiconductor lighting device may further include a control unit mounted on an upper end of the second radiating fin and disposed between the first radiating fins, wherein the control unit is electrically connected to the light emitting module through the connection unit, Is higher than or equal to the upper end of the first radiating fin.

The connection unit includes a connection housing protruding from an upper surface of the heat dissipation base and a cable gland coupled to an upper side of the connection housing, And the upper part is disposed between the first radiating fins with the control part mounted thereon.

The cable gland is mounted on an upper end portion of the second radiating fin and is covered with a covered wiring for connecting the light emitting module to the power supply portion through a control portion disposed between the first radiating fins.

The optical semiconductor lighting device may further include at least one rib projecting from an upper surface of the heat dissipation base and connected to the second heat dissipation fin.

In addition, the 'semiconductor optical device' described in the claims and the detailed description means such as a light emitting diode chip or the like which includes or uses an optical semiconductor.

The 'semiconductor optical device' may include a package level including various kinds of optical semiconductor devices including the above-described light emitting diode chip.

According to the present invention having the above-described configuration, the following effects can be achieved.

First, the present invention allows a basic heat dissipation effect by allowing the air to flow from the structure in which both side edges of the first and second heat dissipation fins protrude from both side edges of the heat dissipation base.

In addition, the present invention can provide basic waterproof and airtightness by providing connection portions according to various embodiments such as a ring cover and a cable gland.

In addition, since the ring cover and the cable gland are provided in the present invention, the ring cover, the cable gland, and the like can be selectively mounted on one module, and various types of wiring can be connected in different countries do.

In addition, the present invention is characterized in that the first radiating fins are formed to be higher than the second radiating fins protruding from the radiating base so as to be larger than the first radiating fins, so that the radiating fins are formed in a space portion formed by the structure of the first and second radiating fins Since the components such as the control unit and the fastening bracket can be mounted, it is possible to easily grasp the accurate fastening position and to easily assemble the fastening member, and it is also possible to provide a sufficient space for mounting the parts.

1 is a perspective view showing the overall structure of an optical semiconductor lighting apparatus according to an embodiment of the present invention;
Fig. 2 is a plan view showing the plan view from the view point A of Fig.
Fig. 3 is a side conceptual view seen from the viewpoint B of Fig.
Fig. 4 is an exploded perspective view in which the portion D in Fig. 1 is enlarged;
5 is a cross-sectional view taken along the line E-E '
6 is a partially exploded perspective view showing the structure of a connection part which is a main part of the optical semiconductor lighting device according to another embodiment of the present invention.
7 is a side conceptual diagram showing the overall configuration of an optical semiconductor lighting device according to another embodiment of the present invention

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a perspective view showing the overall structure of an optical semiconductor lighting apparatus according to an embodiment of the present invention. FIG. 2 is a plan view of the plan view as viewed from point A of FIG. 1, and FIG. 3 is a side conceptual view as viewed from point B of FIG. .

The present invention can be understood as a structure in which the light emitting module 500, the first and second heat dissipation fins 100 and 200, and the connection part 600 are provided in the heat dissipation base 300.

The heat dissipation base 300 provides an area in which the light emitting module 500, the first and second heat dissipation fins 100 and 200 and the connection portion 600 are disposed. The heat dissipation base 300 is generated from the semiconductor optical device 400 of the light emitting module 500 Heat is transferred through the first and second heat dissipation fins 100 and 200 to form a heat transfer area for realizing the heat dissipation effect.

The light emitting module 500 includes at least one semiconductor optical device 400 and is mounted on the bottom surface of the heat dissipating base 300 and includes a printed circuit board on which the semiconductor optical device 400 is disposed.

The first radiating fins 100 protrude from both ends of the upper surface of the radiating base 300 to form a heat transfer area for realizing the radiating performance.

The second radiating fin 200 is formed on the upper surface of the radiating base 300 and the height h2 protruding from the upper surface of the radiating base 300 is smaller than the protrusion height h1 of the first radiating fin 100, A plurality of members disposed between the first radiating fins 100 together with the first radiating fins 100 form a heat transfer area for realizing heat radiation performance.

A space formed by a structure in which the height h2 of the second radiating fins 200 protruded is smaller than the height h1 of the first radiating fins 100 protruding from the first radiating fins 100 at both ends of the radiating base 300 And the upper end of the second radiating fin 200 may be utilized as a space for mounting various accessories including the controller 700 to be described later and will be described later in detail.

The connection unit 600 is formed on the upper surface of the heat dissipation base 300 and can be waterproof and hermetically maintained to a certain degree and can be connected to the wiring c electrically connected to the light emitting module 500 Is penetrated.

The first and second heat dissipation fins 100 and 200 may protrude from both side edges of the heat dissipation base 300 in order to provide a passage through which the air flows and improve the heat dissipation performance due to natural convection or forced convection desirable.

It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or scope of the invention.

The optical semiconductor lighting apparatus according to the present invention is characterized in that the first and second radiating fins 100 and 200 are formed on the heat dissipating base 300 and the light emitting module 500 including the semiconductor optical device 400 is mounted, The heat dissipation base 300 having the heat dissipation fins 100 and 200 includes the light emitting module 500 as described above.

The optical semiconductor lighting apparatus according to the present invention may further include at least one rib 310 protruding from the upper surface of the heat dissipating base 300 and connected to the second heat dissipating fin 200.

The rib 310 may be a technical means provided to provide a fastening structure such as providing a thread forming space for fastening with an installation bracket or a supporting structure (not shown) from above the optical semiconductor lighting apparatus according to the present invention have.

That is, the rib 310 is formed in a space formed by a structure in which the height h2 of the second radiating fin 200 protruded is smaller than the height h1 of the first radiating fin 100 protruded, It is useful in terms of utilization of the space formed between the first radiating fins 100 and the upper ends of the second radiating fins 200. [

More specifically, the ribs 310 are disposed such that mounting brackets or supporting structures are disposed in spaces formed between the first radiating fins 100 at both ends of the radiating base 300 and the upper ends of the second radiating fins 200, And can be fixed to the rib 310 through a newly formed thread or the like.

The connecting portion 600 is electrically connected to the light emitting module 500 as described above, and is used for waterproofing and hermetic sealing. The ring cover 620 may be coupled to the connecting housing 610.

That is, the connection housing 610 forms an inner space communicating with the light emitting module 500 as shown in FIG. 4, and protrudes from the upper surface of the heat dissipating base 300.

The ring cover 620 is coupled to the open upper portion of the connection housing 610 to seal the inner space of the connection housing 610.

Here, the light emitting module 500 is connected to the power supply part P (see FIG. 8) through the wiring c passing through the center of the ring cover 620.

At this time, the connecting part 600 is fastened to the coupling rib 630 and the connecting blade 622 of the ring cover 620 by a fastener 690 such as a bolt for mutual coupling of the coupling housing 610 and the ring cover 620. [ do.

That is, the connection ribs 630 are formed on both sides of the outer circumferential surface of the connection housing 610 along the outer circumferential surface of the connection housing 610 from the upper surface of the heat dissipation base 300, and are connected to the second heat dissipation fin 200.

Here, the ring cover 620 is coupled to the open top of the connection housing 610 and the upper end of the connection rib 630, and the connection vane 622 extending on both sides of the ring cover 620 is connected to the fixture 690 So that the coupling housing 610 and the ring cover 620 are coupled to each other.

In this case, the connection part 600 may further include a sealing member 650 that is seated in the ring step 640 for watertightness and hermeticity.

The ring step 640 is stepped on the inner lower part of the connection housing 610 and communicates with the light emitting module 500 and the sealing member 650 is seated on the ring step 640 to be received in the connection housing 610 Waterproof and airtight.

That is, the sealing member 650 is made of an elastic material such as rubber, synthetic rubber, synthetic resin, or the like, and is an outer surface corresponding to the inner surface of the connection housing 610. The sealing member 650 is fit to the connection housing 610 to be watertight and hermetic .

The light emitting module 500 is connected to the power supply unit P by the wiring c passing through the communication hole 651 formed at the center of the sealing member 650. [

Further, it is preferable that the sealing member 650 further includes a sealing rib 652 to further increase the adhesion with the ring cover 620 to increase waterproofing and airtightness.

The bottom surface of the ring cover 620 is in contact with the contact rib 652 as shown in FIG. 5, so that the waterproof and airtightness .

That is, the light emitting module 500 is connected to the power supply part P by the wiring c passing through the center part of the sealing member 650 and the center part of the ring cover 620, and the sealing member 650 The wiring c passing through the communication hole 651 is more closely adhered as the sealing member 650 on the main surface of the communication hole 651 is pressed by the ring cover 620. Therefore, Watertightness and airtightness can be maintained.

Thus, as described above, the embodiment of the structure shown in Figs. 4 and 5 will be applicable in Japan or European countries including Korea.

4 and 5, it is not possible to use a product having a structure in which the wiring line c is exposed, so that the wiring lines C can be used in connection with the power supply unit P, It is preferable to apply the embodiment of the structure including the cable gland 660 as shown in Fig.

That is, the cable gland 660 itself is provided with an O-ring for waterproof and airtight performance and is coupled to the upper side of the connection housing 610, and the light emitting module 500 is covered with a cover And is connected to the power supply unit P by the wiring C that is formed.

4, the sealing member 650 is seated in the ring step 640 formed inside the connection housing 610 to forcefully fit the cable gland 660 into the connection housing 610 It is also possible to realize a double waterproof and airtight structure.

The light emitting module 500 may be connected to the power supply unit P with a wire C covered through the center of the sealing member 650 and the cable gland 660. [

7, the present invention may be applied to a structure including a control unit 700 for driving each or a part of the semiconductor optical devices 400. [

That is, the control unit 700 is mounted on the upper end of the second radiating fin 200 and disposed between the first radiating fins 100 to be electrically connected to the light emitting module 500 through the connection unit 600.

In other words, the controller 700 controls the space formed by the structure in which the height h2 of the second radiating fin 200 protruded is smaller than the height h1 of the first radiating fin 100 protruded, that is, Is installed in a space formed between the first radiating fins (100) at both ends and the upper end of the second radiating fin (200).

Here, the upper surface of the controller 700 may be deformed and applied so as to be higher than or equal to the upper end of the first radiating fin 100 according to the installation environment.

The cable gland 660 is mounted on the upper end of the second radiating fin 200 and is connected to the first radiating fins 100 through a cover 700 that connects the light emitting module 500 and the power supplying unit P, The wire C that has been formed may be penetrated.

As described above, it is understood that the present invention is based on a technical idea to provide an optical semiconductor lighting device capable of connecting various kinds of wirings in different countries as one module and enabling heat radiation performance and airtightness.

It will be apparent to those skilled in the art that many other modifications and applications are possible within the scope of the basic technical idea of the present invention.

100 ... first radiating fin 200 ... second radiating fin
300 ... heat dissipation base 400 ... semiconductor optical device
500 ... light emitting module 600 ... connection

Claims (17)

Heat dissipation base;
A light emitting module including at least one semiconductor optical device and mounted on a bottom surface of the heat dissipation base;
A first radiating fins formed on both sides of the upper surface of the heat dissipation base, the first heat dissipation fins including both side edges projecting from both sides of the heat dissipation base;
Wherein the heat radiating base includes a pair of side edge portions protruding from both sides of the heat radiating base and formed on an upper surface of the heat radiating base and protruding from an upper surface of the heat radiating base is smaller than the first radiating fin, The second radiating fins of the first radiating fin; And
And a connection portion formed on an upper surface of the heat dissipation base and through which a wiring electrically connected to the light emitting module passes.
The method according to claim 1,
The connecting portion
A connection housing protruding from an upper surface of the heat dissipation base,
And a ring cover coupled to an open top of the connection housing.
The method of claim 2,
Wherein the light emitting module is connected to a power supply unit through a wiring penetrating a center portion of the ring cover.
The method according to claim 1,
The connecting portion
A connection housing protruding from an upper surface of the heat dissipation base,
A connection rib formed along the outer circumferential surface of the connection housing from an upper surface of the heat dissipation base and connected to the second heat dissipation fin,
And a ring cover coupled to an open top of the connection housing and an upper end of the connection rib.
The method of claim 4,
Wherein the light emitting module is connected to a power supply unit through a wiring penetrating a center portion of the ring cover.
The method according to claim 1,
The connecting portion
A connection housing protruding from an upper surface of the heat dissipation base,
A ring step formed on an inner lower portion of the connection housing so as to be stepped, the ring step communicating with the light emitting module,
And a sealing member that is seated on the ring step and received in the connection housing.
The method of claim 6,
Wherein the light emitting module is connected to a power supply unit through wiring passing through a center portion of the sealing member.
The method according to claim 1,
The connecting portion
A connection housing protruding from an upper surface of the heat dissipation base,
A sealing member accommodated in the connection housing,
At least one contact rib protruding in a concentric manner on the upper surface of the sealing member,
And a ring cover coupled to an open top of the connection housing,
And the bottom surface of the ring cover is in contact with the contact rib.
The method of claim 8,
Wherein the light emitting module is connected to a power supply part through a wiring penetrating a center part of the sealing member and a center part of the ring cover.
The method according to claim 1,
The connecting portion
A connection housing protruding from an upper surface of the heat dissipation base,
And a cable gland coupled to an upper side of the connection housing.
The method according to claim 1,
Wherein the light emitting module is connected to a power supply unit through a covered wiring passing through the cable gland.
The method according to claim 1,
The connecting portion
A connection housing protruding from an upper surface of the heat dissipation base,
A ring step formed on an inner lower portion of the connection housing so as to be stepped, the ring step communicating with the light emitting module,
A sealing member that is seated on the ring edge and is accommodated in the connection housing,
And a cable gland coupled to an upper side of the connection housing.
The method of claim 12,
Wherein the light emitting module is connected to a power supply unit through a central portion of the sealing member and wiring covered with the cable gland.
The method according to claim 1,
The connecting portion
A connection housing protruding from an upper surface of the heat dissipation base,
And a cable gland coupled to an upper side of the connection housing,
Wherein an upper end of the second radiating fin is placed between the first radiating fins with a control part mounted thereon.
15. The method of claim 14,
Wherein the cable gland is mounted on an upper end portion of the second radiating fin and is covered with a covered wiring connecting the light emitting module and the power supplying portion through a control portion disposed between the first radiating fins.
The method according to claim 1,
In the optical semiconductor lighting device,
And at least one rib protruding from an upper surface of the heat dissipation base and connected to the second radiating fin.
The method according to claim 1,
In the optical semiconductor lighting device,
And a control unit mounted on the upper end of the second radiating fin and disposed between the first radiating fins,
Wherein the control unit is electrically connected to the light emitting module through the connection unit,
Wherein an upper surface of the control unit is higher than or equal to an upper end of the first radiating fin.
KR1020130030813A 2012-08-03 2013-03-22 Optical semiconductor illuminating apparatus KR20140115766A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
KR1020130030813A KR20140115766A (en) 2013-03-22 2013-03-22 Optical semiconductor illuminating apparatus
EP13825943.7A EP2881659A4 (en) 2012-08-03 2013-06-18 Optical semiconductor lighting apparatus
CN201380041092.1A CN104520642A (en) 2012-08-03 2013-06-18 Optical semiconductor lighting apparatus
PCT/KR2013/005357 WO2014021550A1 (en) 2012-08-03 2013-06-18 Optical semiconductor lighting apparatus
US13/921,526 US9115874B2 (en) 2012-08-03 2013-06-19 Optical semiconductor illuminating apparatus
TW102122882A TW201407082A (en) 2012-08-03 2013-06-27 Optical semiconductor illuminating apparatus
US14/790,366 US20150300623A1 (en) 2012-08-03 2015-07-02 Optical semiconductor illuminating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130030813A KR20140115766A (en) 2013-03-22 2013-03-22 Optical semiconductor illuminating apparatus

Publications (1)

Publication Number Publication Date
KR20140115766A true KR20140115766A (en) 2014-10-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130030813A KR20140115766A (en) 2012-08-03 2013-03-22 Optical semiconductor illuminating apparatus

Country Status (1)

Country Link
KR (1) KR20140115766A (en)

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