KR20140111417A

KR20140111417A - Lighting module

Info

Publication number: KR20140111417A
Application number: KR1020130025514A
Authority: KR
Inventors: 한안나; 최병훈; 김준희; 이상훈
Original assignee: 엘지이노텍 주식회사
Priority date: 2013-03-11
Filing date: 2013-03-11
Publication date: 2014-09-19

Abstract

An embodiment relates to a light source module.
A light source module according to an embodiment includes a light emitting element; And a substrate including a base substrate, a circuit pattern layer disposed on the base substrate and including a pad on which the light emitting element is disposed, and a solder resist layer disposed on the base substrate and the circuit pattern layer excluding the pad; And the upper surface of the solder resist layer has fine protrusions.

Description

Light source module {LIGHTING MODULE}

An embodiment relates to a light source module.

Light emitting diodes (LEDs) are a type of semiconductor devices that convert electrical energy into light. The light emitting diode has advantages of low power consumption, semi-permanent lifetime, fast response speed, safety, and environmental friendliness compared with conventional light sources such as fluorescent lamps and incandescent lamps. Therefore, much research has been conducted to replace conventional light sources with light emitting diodes. Light emitting diodes are increasingly used as light sources for various lamps used in indoor / outdoor, liquid crystal display devices, electric sign boards, streetlights, and the like .

The embodiment provides a light source module capable of improving the light efficiency by improving the reflectance.

In addition, the embodiment provides a light source module capable of improving heat dissipation efficiency.

A light source module according to an embodiment includes a light emitting element; And a substrate including a base substrate, a circuit pattern layer disposed on the base substrate and including a pad on which the light emitting element is disposed, and a solder resist layer disposed on the base substrate and the circuit pattern layer excluding the pad; And the upper surface of the solder resist layer has fine protrusions.

The pad may have a microprojection.

The solder resist may be a white PSR ink.

The light emitting device may be an LED package including an LED chip and at least one phosphor.

The use of the light source module according to the embodiment has an advantage that the reflectance can be improved and the light efficiency can be increased.

Further, there is an advantage that the heat radiation efficiency can be improved.

1 is a perspective view of a light source module according to an embodiment.
FIG. 2 is a plan view of the light source module shown in FIG. 1, in which a light emitting element is removed. FIG.
3 is a cross-sectional view taken along line A-A 'in Fig. 2;
4 is a cross-sectional view taken along line B-B 'in Fig. 2;
5 is a cross-sectional view taken along line C-C 'in Fig. 2;

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

In the description of embodiments according to the present invention, it is to be understood that where an element is described as being formed "on or under" another element, On or under includes both the two elements being directly in direct contact with each other or one or more other elements being indirectly formed between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

Hereinafter, a light source module according to an embodiment will be described with reference to the accompanying drawings.

2 is a cross-sectional view taken along the line A-A 'in FIG. 2, and FIG. 3 is a cross-sectional view taken along line A-A' Is a cross-sectional view taken along line B-B 'in Fig. 2.

1 to 4, a light source module according to an embodiment includes a substrate 100 and a light emitting device 300.

The substrate 100 may be at least one of a printed circuit board (PCB), a metal core PCB, a flexible PCB, and a ceramic PCB. However, it should be understood that not only the PCBs listed above, but also any substrate on which the circuit pattern layer 130 and pad 135 and photo solder resist layer 150, which will be described later, can be formed.

The substrate 100 may include a base substrate 110, a circuit pattern layer 130, a pad 135, and a photo solder resist (PSR) layer 150.

The base substrate 110 is a substrate on which a circuit pattern layer 130, a pad 135, and a photo solder resist layer 150 can be formed.

The base substrate 110 may be a substrate composed of one layer or a substrate composed of a plurality of layers having various functions.

The base substrate 110 may emit heat generated from the light emitting device 300 disposed on the pad 135. The base substrate 110 may be formed of a metal having a high thermal conductivity such as aluminum (Al) or copper (Cu), or may be formed of a material other than metal, and a separate heat transfer material may be applied thereon.

Here, when the base substrate 110 is made of metal, an insulating layer (not shown) may be disposed between the base substrate 110 and the circuit pattern layer 130 for electrical insulation with the circuit pattern layer 130 .

The material of the base substrate 110 may be a resin material as well as a metal on which the circuit pattern layer 130, the pad 135 and the photo solder resist layer 150 can be formed.

The circuit pattern layer 130 is disposed on the upper surface of the base substrate 110. The circuit pattern layer 130 is formed of a metal having electrical conductivity and may have various shapes according to the intention of the circuit designer.

The circuit pattern layer 130 connects a plurality of light emitting devices 300 disposed on the substrate 100 in series or in parallel and receives external power to provide the light emitting devices 300 as a plurality of light emitting devices 300.

The circuit pattern layer 130 may comprise a pad 135. The pad 135 will be described in detail with reference to FIG.

5 is a cross-sectional view taken along line C-C 'in Fig.

Referring to FIGS. 1 and 5, a light emitting device 300 is disposed on a pad 135. The light emitting device 300 may be mounted on the pad 135 through an SMT (Surface Mounted Technology) process. Since the light emitting element 300 is mounted on the pad 135, the photo solder resist 150 may not be disposed.

The pad 135 may include an upper surface exposed to the outside and a lower surface contacting the base substrate 110.

The upper surface of the pad 135 may have the fine protrusion 135-1. When the fine protrusion 135-1 is formed on the pad 135, the area of the upper surface of the pad 135 is wider than in the case where there is no fine protrusion. Accordingly, since the contact area with the light emitting device 300 mounted on the pad 135 is increased, the heat emitted from the light emitting device 300 can be conducted more than in the case where there is no microprojection. Therefore, the heat dissipation efficiency of the light source module according to the embodiment can be further improved.

A method of forming the fine protrusion 135-1 of the pad 135 will be described later.

1 to 4, the photo solder resist layer 150 may be disposed on the remaining circuit pattern layer 130 except for the base substrate 110 and the pads 135. Referring to FIG.

The photo solder resist layer 150 prevents the solder from adhering to an unnecessary portion during the SMT process, that is, soldering. In addition, the photo-solder resist layer 150 is directly exposed to the air to prevent the circuit pattern layer 130 from being oxidized by oxygen or moisture. Further, the photo solder resist layer 150 also functions as a permanent protective film of the substrate 100. Therefore, various properties such as adhesion, electrical insulation, solder heat resistance, solvent resistance, chemical resistance, and the like are required.

The photo-solder resist layer 150 is made of PSR ink of various colors. In particular, the photo-solder resist layer 150 has a white PSR Ink.

A photolithography method is used as a method of forming the photo-solder resist layer 150 on the remaining circuit pattern layer 130 excluding the base substrate 110 and the pad 135. Particularly, An alkali developing type photolithography method is mainly used. In addition, the photo-solder resist layer 150 may be formed through a screen printing method and a curing process. The photo-solder resist layer 150 can be formed by a method other than the above-described methods.

The photo solder resist layer 150 may include an upper surface exposed to the outside and a lower surface contacting the circuit pattern layer 130 or the base substrate 110.

The upper surface of the photo solder resist layer 150 may have fine protrusions 155. When the fine protrusions 155 are formed in the photo solder resist layer 150, the total reflection of incident light can occur more than the photo-solder resist layer having no fine protrusions. Therefore, the light source module according to the embodiment having the fine protrusions 155 can be further improved in light efficiency than the light source module without the fine protrusions.

A method of forming the fine protrusions 155 of the photo solder resist layer 150 will be described. Here, the method of forming the fine protrusions 155 of the photo solder resist layer 150 is the same as the method of forming the fine protrusions 135-1 of the pad 135 shown in FIG. 5, do.

The fine protrusions 135-1 and 155 may be formed through a plasma process. Specifically, the photo-solder resist layer 150 can be plasma-processed to form the fine protrusions 155, and the pads 135 can be plasma-processed to form the fine protrusions 135-1. Here, the fine protrusions 155 of the photo solder resist layer 150 and the fine protrusions 135-1 of the pads 135 may be formed together. In this case, two fine protrusions 135-1 , 155 may be formed at one time.

The plasma treatment may be performed by using a separate etching mask to perform plasma etching on the upper surface of the pad 135 or the photo solder resist 150 or to perform plasma etching using the pad 135 or the photo solder resist 150 without using a separate mask. The plasma etching may be performed on the upper surface of the substrate 150. Such plasma processing can be performed in a separate plasma processing apparatus.

The plasma processing apparatus may be configured in various types, such as a single substrate type, a batch type, or a continuous type. The single substrate type refers to a method in which one object to be processed is charged in one chamber and then plasma processing is performed. The arrangement type refers to a method in which a plurality of objects to be processed are charged into one chamber and then subjected to plasma processing at the same time , And the continuous type can be referred to as a system in which the object to be processed is moved into the chamber by a belt type and continuously processed. Even in the case of a single substrate type, a plurality of chambers may be constituted in one plasma processing apparatus, and plasma processing may be performed simultaneously in a plurality of chambers to increase productivity.

Referring again to FIG. 1, the light emitting device 300 may be disposed on the substrate 100. Specifically, the light emitting device 300 may be disposed on the pad 135 of the substrate 100. The light emitting device 300 may be mounted on the pad 135 through an SMT process.

The light emitting device 300 may be an LED package including at least one or more LED chips. When the light emitting device 300 is an LED package, the lead frame of the LED package may be connected to the pad 135 through a solder paste.

The LED chip may emit light in the visible light range such as Blue, Red, Yellow and Green, or may emit light in the ultraviolet light range. Also, the LED chip may be a lateral type, a vertical type, and a flip type.

The LED package may include a lens. The lens is arranged to cover the LED chip. Such a lens can control the direction of light emitted from the LED chip or the direction of light. The lens is a hemispherical type and can be a light transmitting resin such as a silicone resin or an epoxy resin without an empty space. The light transmitting resin may include a phosphor dispersed wholly or partially.

When the LED chip is a blue light emitting diode, the phosphor included in the light transmitting resin is at least one of a garnet (YAG, TAG), a silicate, a nitride, and an oxynitride And may include any one or more of them.

Natural light (white light) can be realized by including only a yellow phosphor in the translucent resin. However, a green phosphor or a red phosphor may be further included to improve the color rendering index and reduce the color temperature.

When various kinds of phosphors are mixed in the light transmitting resin, the addition ratio of the phosphors may be more green series phosphors than red series phosphors, and yellow series phosphors may be used more than green series phosphors. YAG, silicate, and oxynitride systems of the garnet system may be used as the yellow phosphor, silicate system and oxynitride system may be used as the green system phosphor, and nitrides may be used as the red system phosphor. have. A layer having a red-based phosphor, a layer having a green-based phosphor, and a layer having a yellow-based phosphor may be separately formed in addition to a mixture of various kinds of phosphors in the translucent resin.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100: substrate
110: Base substrate
130: circuit pattern layer
135: Pad
135-1:
150: photo solder resist
155: fine protrusion
300: Light emitting element

Claims

A light emitting element; And
A substrate including a base substrate, a circuit pattern layer disposed on the base substrate and including a pad on which the light emitting device is disposed, and a solder resist layer disposed on the base substrate and the circuit pattern layer excluding the pad, Including,
And the upper surface of the solder resist layer has fine protrusions.

The method according to claim 1,
Wherein the pad has fine protrusions.

3. The method according to claim 1 or 2,
Wherein the solder resist is a white PSR ink.

3. The method according to claim 1 or 2,
Wherein the light emitting device is an LED package including an LED chip and at least one phosphor.