KR101510938B1 - Plate type led lighting device - Google Patents

Plate type led lighting device Download PDF

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Publication number
KR101510938B1
KR101510938B1 KR1020130052717A KR20130052717A KR101510938B1 KR 101510938 B1 KR101510938 B1 KR 101510938B1 KR 1020130052717 A KR1020130052717 A KR 1020130052717A KR 20130052717 A KR20130052717 A KR 20130052717A KR 101510938 B1 KR101510938 B1 KR 101510938B1
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South Korea
Prior art keywords
circuit board
wiring
led light
chip
light sources
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KR1020130052717A
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Korean (ko)
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KR20140133103A (en
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안종욱
박정환
박노준
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주식회사 올릭스
안종욱
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Priority to KR1020130052717A priority Critical patent/KR101510938B1/en
Priority to PCT/KR2013/005269 priority patent/WO2014181914A1/en
Publication of KR20140133103A publication Critical patent/KR20140133103A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Abstract

본 발명은 조명장치에 관한 것으로서, 특히 조명용 평판형 엘이디 장치에 관한 것이다. 본 발명에 의하면, 평판 형상의 회로 기판부; 상기 회로 기판부에 장착되어서 좌우로 정렬되는 다수의 단위 엘이디 광원; 상기 회로 기판부 상에 형성되며 상기 다수의 단위 엘이디 광원을 둘러싸는 마스크부; 및 상기 마스크부 내부 공간에 채워진 충진 형광체를 포함하며, 상기 단위 엘이디 광원은 상기 회로 기판부에 COB 방식으로 실장되는 베어칩 형태의 엘이디칩인 것을 특징으로 하는 조명용 엘이디바 장치가 제공된다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lighting apparatus, and more particularly to a flat panel type lighting apparatus. According to the present invention, there is provided a circuit board comprising: a flat circuit board portion; A plurality of unit LED light sources mounted on the circuit board portion and arranged in a left-right direction; A mask portion formed on the circuit board portion and surrounding the plurality of unit LED light sources; And a filler filled in the mask space, wherein the unit LED light source is an LED chip in the form of a bare chip mounted on the circuit board unit in a COB manner.

Description

평판형 엘이디 조명장치 {PLATE TYPE LED LIGHTING DEVICE}[0001] PLATE TYPE LED LIGHTING DEVICE [0002]

본 발명은 조명장치에 관한 것으로서, 특히 조명용 평판형 엘이디 장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lighting apparatus, and more particularly to a flat panel type lighting apparatus.

엘이디(LED : Light Emitting Diode)는 기존의 광원에 비해 소형이고 소비전력이 적으며 반영구적인 수명을 갖고 있어서, 최근 다양한 형태의 조명장치로 응용되고 있다.LED (Light Emitting Diode) is smaller than conventional light sources, consumes less power, has a semi-permanent lifetime, and has recently been applied to various types of lighting apparatuses.

엘이디 조명장치 중에는 다수 개의 엘이디 광원이 평면 상에 정렬된 형태를 갖는 평판형 엘이디 조명장치가 있다. 종래의 평판형 엘이디 조명장치는 넓은 면적을 제공하는 편평한 인쇄회로기판(PCB)과, 인쇄회로기판에 좌우로 정렬되어서 장착되는 다수의 엘이디 패키지를 구비한다. LED 패키지는 PCB에 표면실장 기술을 이용하여 실장된다. LED 패키지는 일반적으로 패키지 본체와 패키지 본체의 내부에 수용된 엘이디 칩(LED Chip)과 LED 칩을 감싸도록 패키지 본체 내부에 채워지는 수지 봉지재로 이루어진다. LED 패키지가 PCB에 실장되는 종래의 기술에서는 LED 패키지 자체가 차지하는 크기로 인해 평판형 엘이디 조명장치의 크기를 줄이는데 한계가 있고, 다수의 LED를 효율적으로 어레이하는데 어려움이 있어서, 개선이 요구되고 있다.In the LED lighting device, there is a flat-type LED lighting device in which a plurality of LED light sources are arranged on a plane. Conventional flat type LED lighting apparatuses have a flat printed circuit board (PCB) that provides a large area and a plurality of LED packages that are mounted side by side on a printed circuit board. The LED package is mounted on the PCB using surface mount technology. The LED package generally comprises a package body, an LED chip accommodated in the package body, and a resin encapsulant filled in the package body to enclose the LED chip. In the conventional technology in which the LED package is mounted on the PCB, there is a limit in reducing the size of the flat panel LED lighting device due to the size occupied by the LED package itself, and it is difficult to efficiently array a plurality of LEDs.

본 발명의 목적은 다수의 LED 광원이 평면 상에 배치되도록 PCB에 실장된 평판형 엘이디 조명장치를 제공하는 것이다. 본 발명의 다른 목적은 소형화가 가능한 평판형 엘이디 조명장치를 제공하는 것이다. 본 발명의 또 다른 목적은 LED 광원의 실장효율이 향상된 평판형 엘이디 조명장치를 제공하는 것이다.SUMMARY OF THE INVENTION It is an object of the present invention to provide a flat panel LED lighting device mounted on a PCB such that a plurality of LED light sources are arranged on a plane. Another object of the present invention is to provide a flat-type LED illumination device capable of miniaturization. It is still another object of the present invention to provide a flat panel LED lighting device with improved mounting efficiency of an LED light source.

상기한 본 발명의 목적을 달성하기 위하여 본 발명의 일 측면에 따르면,According to an aspect of the present invention,

평판 형상의 회로 기판부; 상기 회로 기판부에 장착되어서 좌우로 정렬되는 다수의 단위 엘이디 광원; 상기 회로 기판부 상에 형성되며 상기 다수의 단위 엘이디 광원을 둘러싸는 마스크부; 및 상기 마스크부 내부 공간에 채워진 충진 형광체를 포함하며, 상기 단위 엘이디 광원은 상기 회로 기판부에 COB 방식으로 실장되는 베어칩 형태의 엘이디칩인 것을 특징으로 하는 평판형 엘이디 조명장치가 제공된다.A flat circuit board portion; A plurality of unit LED light sources mounted on the circuit board portion and arranged in a left-right direction; A mask portion formed on the circuit board portion and surrounding the plurality of unit LED light sources; And a filler filled in the mask space, wherein the unit LED light source is an LED chip in the form of a bare chip mounted on the circuit board unit in a COB manner.

상기 회로 기판부는 알루미늄 기반의 베이스 기판과, 상기 다수의 단위 엘이디 광원이 장착되고 단자부를 형성하며 상기 베이스 기판에 접착시트에 의해 부착되는 회로부를 구비하며, 상기 회로부는 상기 접착시트 위에 차례대로 적층된 유전체층, 구리층 및 니켈-은 합금층을 구비할 수 있다.Wherein the circuit board portion includes an aluminum-based base substrate, a circuit portion on which the plurality of unit LED light sources are mounted and which forms a terminal portion and is adhered to the base substrate by an adhesive sheet, A dielectric layer, a copper layer, and a nickel-silver alloy layer.

상기 마스크부는 비티레진으로 형성될 수 있다.The mask portion may be formed of a vitreous resin.

상기 다수의 엘이디칩은 440 내지 475nm 파장대를 갖는 하나 이상의 청색칩; 500 내지 510nm 파장대를 갖는 하나 이상의 청녹색칩을 구비하며, 상기 충진 형광체는 상기 청녹색칩 및 청녹색칩으로 발광하는 빛에 의하여 여기되어 발광하는 형광체일 수 있다.Wherein the plurality of LED chips comprises at least one blue chip having a wavelength band of 440 to 475 nm; And at least one blue-green chip having a wavelength band of 500 to 510 nm, wherein the filled phosphor may be a phosphor that is excited by light emitted from the blue-green chip and the blue-green chip to emit light.

본 발명에 의하면 앞서서 기재한 본 발명의 목적을 모두 달성할 수 있다. 구체적으로는, 평판 형상의 회로 기판부; 상기 회로 기판부에 장착되어서 좌우로 정렬되는 다수의 단위 엘이디 광원; 상기 회로 기판부 상에 형성되며 상기 다수의 단위 엘이디 광원을 둘러싸는 마스크부; 및 상기 마스크부 내부 공간에 채워진 충진 형광체를 포함하며, 상기 단위 엘이디 광원은 상기 회로 기판부에 COB 방식으로 실장되는 베어칩 형태의 엘이디칩인 것을 특징으로 하는 평판형 엘이디 조명장치가 제공되므로, 평판형 엘이디 조명장치의 소형화 가능하고, 실장효율도 비약적으로 향상된다.According to the present invention, all of the objects of the present invention described above can be achieved. More specifically, the present invention relates to a flat circuit board portion; A plurality of unit LED light sources mounted on the circuit board portion and arranged in a left-right direction; A mask portion formed on the circuit board portion and surrounding the plurality of unit LED light sources; And a filler filled in the mask space, wherein the unit LED light source is an LED chip in the form of a bare chip mounted on the circuit board unit in a COB manner. Therefore, Type LED illumination device can be downsized, and the mounting efficiency is remarkably improved.

도 1은 본 발명의 일 실시예에 따른 평판형 엘이디 조명장치를 도시한 사시도이다.
도 2는 도 1에 도시된 평판형 엘이디 조명장치에서 엘이디칩이 장착된 부분을 확대하여 도시한 평면도이다.
도 3은 도 1에 도시된 평판형 엘이디 조명장치의 횡단면 구조를 도시한 단면도이다.1 is a perspective view illustrating a planar LED lighting device according to an embodiment of the present invention.
FIG. 2 is an enlarged plan view of a portion where the LED chip is mounted in the flat panel LED lighting apparatus shown in FIG. 1. FIG.
3 is a cross-sectional view showing the cross-sectional structure of the planar LED illumination device shown in Fig.

이하, 도면을 참조하여 본 발명의 실시예를 상세히 설명한다.
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

도 1은 본 발명의 일 실시예에 따른 평판형 엘이디 조명장치를 도시한 사시도이고, 도 2는 도 1에 도시된 평판형 엘이디 조명장치에서 엘이디칩이 장착된 부분을 확대하여 도시한 평면도이며, 도 3은 도 1에 도시된 평판형 엘이디 조명장치의 횡단면 구조를 도시한 단면도이다. 도 1 내지 도 3을 참조하면, 본 발명의 일 실시예에 따른 평판형 엘이디 조명장치(100)는 회로 기판부(110)와, 다수의 단위 엘이디 광원(120)과, 마스크부(130)와, 충진 형광체(140)를 포함한다. 이제, 도 1 내지 도 3에 도시된 본 발명의 일 실시예에 따른 평판형 엘이디 조명장치(100)의 구성하는 각 구성요소를 상세히 설명한다.
FIG. 1 is a perspective view illustrating a planar LED lighting apparatus according to an embodiment of the present invention, FIG. 2 is an enlarged plan view of a portion of the planar LED lighting apparatus shown in FIG. 1 on which an LED chip is mounted, 3 is a cross-sectional view showing the cross-sectional structure of the planar LED illumination device shown in Fig. 1 to 3, a planar LED illumination device 100 according to an exemplary embodiment of the present invention includes a circuit board 110, a plurality of unit LED light sources 120, a mask 130, , And a filled phosphor (140). Now, the constituent elements of the planar LED illumination device 100 according to an embodiment of the present invention shown in Figs. 1 to 3 will be described in detail.

회로 기판부(110)는 베이스 기판(111)과, 접착시트(112)와, 회로부(113)를 구비한다. 본 실시예에서는 회로 기판부(110)가 통상적인 MCPCB 구조를 갖는 것으로 설명한다. MCPCB는 금속 기반 기판에 유전체를 형성하고 그 위에 회로 패턴을 형성한 것으로서, COB(Chip on Board) 패키지 기술에서 널리 사용되고 있는 기판이다.
The circuit board portion 110 includes a base board 111, an adhesive sheet 112, and a circuit portion 113. In the present embodiment, it is assumed that the circuit board portion 110 has a conventional MCPCB structure. MCPCB is a substrate which is widely used in COB (Chip on Board) package technology by forming a dielectric on a metal-based substrate and forming a circuit pattern thereon.

베이스 기판(111)은 알루미늄 기반 기판이다. 본 실시예에서는 베이스 기판(111)은 Al 1085로 이루어지는 것으로 설명한다. 베이스 기판(111)은 넓은 면적을 제공하는 직사각형의 평판 형상이다.
The base substrate 111 is an aluminum-based substrate. In the present embodiment, it is assumed that the base substrate 111 is made of Al 1085. The base substrate 111 is in the shape of a rectangular flat plate providing a large area.

접착시트(bonding sheet))(112)는 베이스 기판(111) 위에 위치한다. 접착시트(112)는 베이스 기판(111) 위에 회로부(113)를 접착시킨다.
A bonding sheet) 112 is placed on the base substrate 111. [ The adhesive sheet 112 adheres the circuit portion 113 to the base substrate 111.

회로부(113)는 접착시트(112)에 의해 베이스 기판(111) 상에 접착되어 형성된다. 회로부(113)는 유전체층(114)과, 제1 배선부(113a)와, 제2 배선부(113b)와, 제3 배선부(113c)와, 포토솔더레지스트(PSR : Photo solder resist) 인쇄층(117)을 구비한다.
The circuit portion 113 is formed by adhering to the base substrate 111 with the adhesive sheet 112. [ The circuit portion 113 includes a dielectric layer 114, a first wiring portion 113a, a second wiring portion 113b, a third wiring portion 113c, a photo solder resist (PSR) (117).

유전체층(114)은 접착시트(112) 위에 접착되어서 형성된다. 본 실시예에서는 유전체층(114)이 비티레진(BT resin)으로 이루어지는 것으로 설명한다.
The dielectric layer 114 is formed by adhering on the adhesive sheet 112. In the present embodiment, it is assumed that the dielectric layer 114 is made of BT resin.

제1 배선부(113a)는 유전체층(114) 상에서 제3 배선부(113c)의 일측에 형성된다. 제1 배선부(113a)는 유전체층(114) 위에 형성되는 구리층(115)과, 구리층(115) 위에 형성된 니켈-은 합금층(116)을 구비한다. 니켈-은 합금층은 도금에 의해 형성될 수 있다.
The first wiring portion 113a is formed on one side of the third wiring portion 113c on the dielectric layer 114. [ The first wiring portion 113a includes a copper layer 115 formed on the dielectric layer 114 and a nickel-silver alloy layer 116 formed on the copper layer 115. [ The nickel-silver alloy layer may be formed by plating.

제2 배선부(113b)는 유전체층(114) 상에서 제3 배선부(113c)의 타측에 형성된다. 제2 배선부(113b)는 제3 배선부(113c)를 사이에 두고 서로 반대편에 서로 분리되어서 형성된다. 제1 배선부(113a)의 단면구조는 제1 배선부(113a)의 단면구조와 동일하므로 이에 대한 상세한 설명은 생략한다.
The second wiring portion 113b is formed on the other side of the third wiring portion 113c on the dielectric layer 114. [ The second wiring portions 113b are formed so as to be separated from each other on opposite sides of the third wiring portion 113c. The cross-sectional structure of the first wiring portion 113a is the same as the cross-sectional structure of the first wiring portion 113a, and a detailed description thereof will be omitted.

제3 배선부(113c)는 유전체층(114) 상에서 넓은 면적을 제공하도록 대체로 직사각형태로 형성된다. 제3 배선부(113c)는 유전체층(114) 상에 형성되며 그 단면구조는 제1 배선부(113a)의 단면구조와 동일하므로 이에 대한 상세한 설명은 생략한다. 제3 배선부(113c)는 엘이디칩(LED chip)인 엘이디 광원(120)이 장착되는 칩 패드로서 기능한다.
The third wiring portion 113c is formed in a substantially rectangular shape to provide a large area on the dielectric layer 114. [ The third wiring portion 113c is formed on the dielectric layer 114 and its sectional structure is the same as the sectional structure of the first wiring portion 113a, and a detailed description thereof will be omitted. The third wiring portion 113c functions as a chip pad on which the LED light source 120, which is an LED chip, is mounted.

PSR 인쇄층(117)은 회로부(113) 위에 형성된다. PSR 인쇄층(117)은 제3 배선부(113c) 전체와, 제1 배선부(113a)에서 제3 배선부(113c)와 인접하는 부분과, 제2 배선부(113b)에서 제3 배선부(113c)와 인접하는 부분에는 형성되는 않는다. 그에 따라, 제1 배선부(113a)에는 제1 노출부(113a1)이 형성되고, 제2 배선부(113b)에는 제2 노출부(113b1)가 형성된다. 또한, 제1 배선부(113a)에는 PSR 인쇄층(117)에 의해 덮이지 않고 외부로 노출된 제1 단자부(1161)가 마련된다. 그리고, 제2 배선부(113b)에는 PSR 인쇄층(117)에 의해 덮이지 않고 외부로 노출된 제2 단자부(1162)가 마련된다.
The PSR printing layer 117 is formed on the circuit portion 113. The PSR printing layer 117 is formed so that the entirety of the third wiring portion 113c and the portion adjacent to the third wiring portion 113c in the first wiring portion 113a and the portion adjacent to the third wiring portion 113c in the second wiring portion 113b, And is not formed in the portion adjacent to the opening 113c. The first exposed portion 113a1 is formed in the first wiring portion 113a and the second exposed portion 113b1 is formed in the second wiring portion 113b. The first wiring portion 113a is provided with a first terminal portion 1161 which is not covered with the PSR printing layer 117 but which is exposed to the outside. The second wiring portion 113b is provided with a second terminal portion 1162 which is not covered with the PSR printing layer 117 but which is exposed to the outside.

다수의 단위 엘이디 광원(120)은 베어칩(bare chip) 형태의 엘이디칩이다. 각 엘이디칩(120)은 칩 패드 역할을 하는 제3 배선부(113c)에 각각 COB 방식으로 실장되어서 좌우로 정렬된다. 베어칩 형태의 엘이디칩(120)이 바로 장착되므로 평판형 엘이디 조명 장치(100)가 비약적으로 소형화되고, 실장효율도 크게 증가한다.
The plurality of unit LED light sources 120 are LED chips in the form of a bare chip. Each LED chip 120 is mounted on the third wiring portion 113c serving as a chip pad in a COB manner and is laterally aligned. Since the LED chip 120 in the form of a bare chip is directly mounted, the flat panel LED illumination device 100 is remarkably miniaturized and the mounting efficiency is greatly increased.

마스크부(130)는 다수의 엘이디 광원(120)을 둘러싸도록 접착시트(118)에 의해 회로부(113) 위에 고정된다. 마스크부(130)는 내부 영역에는 다수의 엘이디 광원(120)과 제1 노출부(113a1)와, 제2 노출부(113a2)가 외부로 노출된다. 마스크부(130)의 바깥쪽에는 제1 단자부(1161)를 노출시키는 제1 노출 홈(131)와, 제2 단자부(1162)를 노출시키는 제2 노출 홈(132)이 마련된다.
The mask part 130 is fixed on the circuit part 113 by the adhesive sheet 118 so as to surround the plurality of LED light sources 120. A plurality of LED light sources 120, a first exposed portion 113a1, and a second exposed portion 113a2 are exposed to the outside of the mask portion 130 in the inner region. A first exposure groove 131 for exposing the first terminal portion 1161 and a second exposure groove 132 for exposing the second terminal portion 1162 are formed on the outer side of the mask portion 130.

충진 형광체(140)는 마스크부(130)의 내부 공간(110a)에 채워진다.
The filled phosphors 140 are filled in the inner space 110a of the mask unit 130. FIG.

본 발명은 우수한 연색지수를 갖는 멀티 칩 방식의 엘이디바 장치를 제공하기 위하여, 440 내지 475nm 파장대를 갖는 하나 이상의 청색칩; 500 내지 510nm 파장대를 갖는 하나 이상의 청녹색칩; 및 상기 청녹색칩 및 청녹색칩으로 발광하는 빛에 의하여 여기되어 발광하는 형광체(140)를 포함한다. 여기에서 형광체(140)는 적색, 황색 및 녹색빛을 발광하는 적색, 황색 및 녹색 형광체가 혼합된 복합 형광체일 수 있다.
The present invention provides a multi-chip LED bar device having an excellent color rendering index, comprising: at least one blue chip having a wavelength band of 440 to 475 nm; One or more blue-green chips having a wavelength range of 500 to 510 nm; And a phosphor 140 which is excited by light emitted from the blue-green chip and the blue-green chip to emit light. Here, the phosphor 140 may be a composite phosphor mixed with red, yellow and green phosphors emitting red, yellow and green light.

이상 실시예를 통해 본 발명을 설명하였으나, 본 발명은 이에 제한되는 것은 아니다. 상기 실시예는 본 발명의 취지 및 범위를 벗어나지 않고 수정되거나 변경될 수 있으며, 본 기술분야의 통상의 기술자는 이러한 수정과 변경도 본 발명에 속하는 것임을 알 수 있을 것이다.Although the present invention has been described with reference to the above embodiments, the present invention is not limited thereto. It will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims.

100 : 평판형 엘이디 조명장치 110 : 회로 기판부
111 : 베이스 기판 112 : 접착시트
113 : 회로부 113a : 제1 배선부
113a1 : 제1 노출부 113b : 제2 배선부
113b1 : 제2 노출부 113c : 제3 배선부
114 : 유전체층 115 : 구리층
116 : 니켈-은 합금 도금층 1161 : 제1 단자부
1162 : 제2 단자부 117 : PSR 인쇄층
120 : 단위 엘이디 광원 130 : 마스크부
140 : 충진 형광체100: a flat panel LED lighting device 110: a circuit board part
111: base substrate 112: adhesive sheet
113: circuit part 113a: first wiring part
113a1: first exposed portion 113b: second wiring portion
113b1: second exposed portion 113c: third wiring portion
114: dielectric layer 115: copper layer
116: nickel-silver alloy plating layer 1161: first terminal portion
1162: second terminal portion 117: PSR printing layer
120: unit LED light source 130: mask unit
140: filled phosphors

Claims (4)

평판 형상의 회로 기판부;
상기 회로 기판부에 장착되어서 좌우로 정렬되는 다수의 단위 엘이디 광원;
상기 회로 기판부 상에 형성되며 상기 다수의 단위 엘이디 광원 모두가 노출되는 하나의 내부 공간이 형성되는 마스크부; 및
상기 마스크부 내부 공간에 채워진 충진 형광체를 포함하며,
상기 단위 엘이디 광원은 상기 회로 기판부에 COB 방식으로 실장되는 베어칩 형태의 엘이디칩이며,
상기 회로 기판부는 알루미늄 기반의 베이스 기판과, 상기 다수의 단위 엘이디 광원이 장착되고 단자부를 형성하며 상기 베이스 기판에 접착시트에 의해 부착되는 회로부를 구비하며,
상기 회로부는 상기 접착시트 위에 접착되어서 형성된 비타레진으로 이루어진 유전체층과, 제1 단자부가 마련되고 상기 유전체층 상에 형성된 제1 배선부와, 제2 단자부가 마련되고 상기 유전체층 상에 상기 제1 배선부와 분리되어서 형성된 제2 배선부와, 상기 유전체층 상에 상기 제1, 제2 배선부의 사이에 분리되어서 형성되고 상기 다수의 단위 엘이디 광원이 장착되는 제3 배선부와, PSR 인쇄층을 구비하며,
상기 제1, 제2, 제3 배선부는 상기 유전체층 상에 차례대로 적층된 구리층과 니켈-은 합금 층을 구비하며,
상기 마스크부는 상기 마스크부에 형성된 상기 하나의 내부 공간을 통해서 상기 제3 배선부 전체와, 상기 제1 배선부에서 상기 제3 배선부와 인접하는 부분과, 상기 제2 배선부에서 상기 제3 배선부와 인접하는 부분이 노출되도록 상기 제1, 제2 배선부 상에 형성되며,
상기 다수의 엘이디칩은 440 내지 475nm 파장대를 갖는 하나 이상의 청색칩; 500 내지 510nm 파장대를 갖는 하나 이상의 청녹색칩을 구비하며,
상기 충진 형광체는 상기 청녹색칩 및 청녹색칩으로 발광하는 빛에 의하여 여기되어 발광하는 형광체인 것을 특징으로 하는 평판형 엘이디 조명장치.
A flat circuit board portion;
A plurality of unit LED light sources mounted on the circuit board portion and arranged in a left-right direction;
A mask part formed on the circuit board part and having one internal space through which the plurality of unit LED light sources are exposed; And
And a filled phosphor filled in the mask space,
Wherein the unit LED light source is an LED chip in the form of a bare chip mounted on the circuit board portion in a COB manner,
Wherein the circuit board portion includes an aluminum-based base substrate, a circuit portion mounted with the plurality of unit LED light sources and attached to the base substrate by an adhesive sheet,
Wherein the circuit portion comprises a dielectric layer made of non-resin formed by being adhered on the adhesive sheet, a first wiring portion provided with a first terminal portion and formed on the dielectric layer, and a second terminal portion provided on the dielectric layer, A third wiring portion formed separately from the first and second wiring portions on the dielectric layer and on which the plurality of unit LED light sources are mounted, and a PSR printing layer,
The first, second, and third wiring portions include a copper layer and a nickel-silver alloy layer that are sequentially stacked on the dielectric layer,
Wherein the mask portion is formed by the entirety of the third wiring portion, the portion adjacent to the third wiring portion in the first wiring portion, and the portion adjacent to the third wiring portion in the second wiring portion through the one internal space formed in the mask portion, The first and second wiring parts are formed on the first and second wiring parts,
Wherein the plurality of LED chips comprises at least one blue chip having a wavelength band of 440 to 475 nm; And at least one blue-green chip having a wavelength band of 500 to 510 nm,
Wherein the filled phosphor is a phosphor that emits light by being excited by light emitted from the blue-green chip and the blue-green chip.
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