WO2014181914A1 - Planar led lighting device - Google Patents

Planar led lighting device Download PDF

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Publication number
WO2014181914A1
WO2014181914A1 PCT/KR2013/005269 KR2013005269W WO2014181914A1 WO 2014181914 A1 WO2014181914 A1 WO 2014181914A1 KR 2013005269 W KR2013005269 W KR 2013005269W WO 2014181914 A1 WO2014181914 A1 WO 2014181914A1
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WO
WIPO (PCT)
Prior art keywords
unit
circuit board
led
chip
light sources
Prior art date
Application number
PCT/KR2013/005269
Other languages
French (fr)
Korean (ko)
Inventor
안종욱
박정환
박노준
Original Assignee
엘이디에스티 주식회사
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Publication of WO2014181914A1 publication Critical patent/WO2014181914A1/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]

Definitions

  • the present invention relates to a lighting device, and more particularly to a flat plate type LED device for lighting.
  • LED Light Emitting Diode
  • LED Light Emitting Diode
  • LED lighting apparatuses there is a flat LED lighting apparatus in which a plurality of LED light sources are aligned on a plane.
  • Conventional flat panel LED lighting devices include a flat printed circuit board (PCB) providing a large area, and a plurality of LED packages mounted vertically and horizontally on the printed circuit board.
  • the LED package is mounted on a PCB using surface mount technology.
  • the LED package generally includes a package body, an LED chip accommodated inside the package body, and a resin encapsulation material filled in the package body to surround the LED chip.
  • the size occupied by the LED package itself is limited in reducing the size of the flat panel LED lighting device, and there is a difficulty in efficiently arranging a plurality of LEDs.
  • a circuit board portion having a flat plate shape; A plurality of unit LED light sources mounted vertically and horizontally in the circuit board unit; A mask part formed on the circuit board part and surrounding the plurality of unit LED light sources; And a filling phosphor filled in the inner space of the mask part, wherein the unit LED light source is a bare chip type LED chip mounted on the circuit board part in a COB manner.
  • the circuit board part includes an aluminum-based base board, and a circuit part on which the plurality of unit LED light sources are mounted, forming a terminal part, and attached to the base substrate by an adhesive sheet, wherein the circuit part is sequentially stacked on the adhesive sheet.
  • a dielectric layer, a copper layer, and a nickel-silver alloy layer may be provided.
  • the mask part may be formed of a non-resin resin.
  • the plurality of LED chips may include at least one blue chip having a wavelength band of 440 to 475 nm; At least one blue green chip having a wavelength range of 500 to 510 nm, and the filling phosphor may be a phosphor that is excited by light emitted from the blue green chip and the blue green chip to emit light.
  • a flat circuit board portion A plurality of unit LED light sources mounted vertically and horizontally in the circuit board unit; A mask part formed on the circuit board part and surrounding the plurality of unit LED light sources; And a filling phosphor filled in the inner space of the mask part, wherein the unit LED light source is a flat LED type lighting device, which is a bare chip type LED chip mounted on the circuit board part in a COB manner.
  • the type LED lighting device can be miniaturized, and the mounting efficiency is dramatically improved.
  • FIG. 1 is a perspective view showing a flat panel LED lighting apparatus according to an embodiment of the present invention.
  • FIG. 2 is an enlarged plan view illustrating a portion where an LED chip is mounted in the flat LED lighting apparatus of FIG. 1.
  • FIG. 3 is a cross-sectional view showing a cross-sectional structure of the flat LED lighting apparatus shown in FIG.
  • FIG. 1 is a perspective view showing a flat LED lighting apparatus according to an embodiment of the present invention
  • Figure 2 is a plan view showing an enlarged portion of the LED chip mounted on the flat LED lighting apparatus shown in Figure 1
  • 3 is a cross-sectional view showing a cross-sectional structure of the flat LED lighting apparatus shown in FIG. 1 to 3
  • a flat LED lighting apparatus 100 according to an embodiment of the present invention includes a circuit board unit 110, a plurality of unit LED light sources 120, a mask unit 130, And a filling phosphor 140.
  • the circuit board unit 110 includes a base substrate 111, an adhesive sheet 112, and a circuit unit 113.
  • the circuit board unit 110 will be described as having a typical MCPCB structure.
  • MCPCB is a substrate formed of a dielectric on a metal-based substrate and a circuit pattern formed thereon, and is widely used in a chip on board (COB) packaging technology.
  • the base substrate 111 is an aluminum based substrate. In the present embodiment, the base substrate 111 is described as being made of Al 1085.
  • the base substrate 111 is in the shape of a rectangular flat plate providing a large area.
  • a bonding sheet 112 is positioned on the base substrate 111.
  • the adhesive sheet 112 bonds the circuit unit 113 on the base substrate 111.
  • the circuit unit 113 is bonded to the base substrate 111 by the adhesive sheet 112 and formed.
  • the circuit portion 113 includes a dielectric layer 114, a first wiring portion 113a, a second wiring portion 113b, a third wiring portion 113c, and a photo solder resist (PSR) printed layer. 117 is provided.
  • the dielectric layer 114 is formed by being bonded on the adhesive sheet 112.
  • the dielectric layer 114 will be described as being made of BT resin.
  • the first wiring portion 113a is formed on one side of the third wiring portion 113c on the dielectric layer 114.
  • the first wiring portion 113a includes a copper layer 115 formed on the dielectric layer 114 and a nickel-silver alloy layer 116 formed on the copper layer 115.
  • the nickel-silver alloy layer may be formed by plating.
  • the second wiring portion 113b is formed on the other side of the third wiring portion 113c on the dielectric layer 114.
  • the second wiring portions 113b are formed by being separated from each other on opposite sides with the third wiring portion 113c therebetween. Since the cross-sectional structure of the first wiring portion 113a is the same as that of the first wiring portion 113a, a detailed description thereof will be omitted.
  • the third wiring portion 113c is formed in a generally rectangular shape to provide a large area on the dielectric layer 114. Since the third wiring part 113c is formed on the dielectric layer 114 and its cross-sectional structure is the same as that of the first wiring part 113a, a detailed description thereof will be omitted.
  • the third wiring part 113c functions as a chip pad on which the LED light source 120, which is an LED chip, is mounted.
  • the PSR printed layer 117 is formed over the circuit portion 113.
  • the PSR printed layer 117 includes the entire third wiring portion 113c, the portion of the first wiring portion 113a adjacent to the third wiring portion 113c, and the third wiring portion 113b. It is not formed in the part adjacent to 113c. Accordingly, the first exposed portion 113a1 is formed in the first wiring portion 113a, and the second exposed portion 113b1 is formed in the second wiring portion 113b.
  • the first wiring portion 113a is provided with a first terminal portion 1161 exposed to the outside without being covered by the PSR printed layer 117.
  • the second wiring portion 113b is provided with a second terminal portion 1162 exposed to the outside without being covered by the PSR printed layer 117.
  • the plurality of unit LED light sources 120 are bare chips. Each LED chip 120 is mounted on the third wiring portion 113c serving as a chip pad in a COB manner and aligned vertically and horizontally. Since the bare chip LED chip 120 is directly mounted, the flat LED lighting device 100 is dramatically miniaturized, and the mounting efficiency is greatly increased.
  • the mask part 130 is fixed on the circuit part 113 by the adhesive sheet 118 to surround the plurality of LED light sources 120.
  • the plurality of LED light sources 120, the first exposed part 113a1, and the second exposed part 113a2 are exposed to the outside.
  • a first exposed groove 131 exposing the first terminal portion 1161 and a second exposed groove 132 exposing the second terminal portion 1162 are provided outside the mask portion 130.
  • the filling phosphor 140 is filled in the internal space 110a of the mask unit 130.
  • the present invention to provide a multi-chip LED device having an excellent color rendering index, at least one blue chip having a wavelength range of 440 ⁇ 475nm; One or more bluish green chips having a wavelength band of 500 to 510 nm; And a phosphor 140 that is excited by and emits light by the blue green chip and the blue green chip.
  • the phosphor 140 may be a composite phosphor in which red, yellow, and green phosphors that emit red, yellow, and green light are mixed.

Abstract

The present invention relates to a lighting device and, specifically, to a planar LED device for lighting. According to the present invention, provided is a planar LED lighting device, comprising: a planar circuit board; a plurality of unit LED light sources mounted on the circuit board and arranged vertically and horizontally; a mask unit, formed on the circuit board, surrounding the plurality of unit LED light sources; and a filling phosphor filled in the internal space of the mask unit, wherein the unit LED light sources are bare-chip-type LED chips mounted on the circuit board in a COB manner.

Description

평판형 엘이디 조명장치Flat LED Lighting
본 발명은 조명장치에 관한 것으로서, 특히 조명용 평판형 엘이디 장치에 관한 것이다.The present invention relates to a lighting device, and more particularly to a flat plate type LED device for lighting.
엘이디(LED : Light Emitting Diode)는 기존의 광원에 비해 소형이고 소비전력이 적으며 반영구적인 수명을 갖고 있어서, 최근 다양한 형태의 조명장치로 응용되고 있다.LED (Light Emitting Diode) has a small size, low power consumption and a semi-permanent life compared to the existing light source, has recently been applied to various types of lighting devices.
엘이디 조명장치 중에는 다수 개의 엘이디 광원이 평면 상에 정렬된 형태를 갖는 평판형 엘이디 조명장치가 있다. 종래의 평판형 엘이디 조명장치는 넓은 면적을 제공하는 편평한 인쇄회로기판(PCB)과, 인쇄회로기판에 종횡으로 정렬되어서 장착되는 다수의 엘이디 패키지를 구비한다. LED 패키지는 PCB에 표면실장 기술을 이용하여 실장된다. LED 패키지는 일반적으로 패키지 본체와 패키지 본체의 내부에 수용된 엘이디 칩(LED Chip)과 LED 칩을 감싸도록 패키지 본체 내부에 채워지는 수지 봉지재로 이루어진다. LED 패키지가 PCB에 실장되는 종래의 기술에서는 LED 패키지 자체가 차지하는 크기로 인해 평판형 엘이디 조명장치의 크기를 줄이는데 한계가 있고, 다수의 LED를 효율적으로 어레이하는데 어려움이 있어서, 개선이 요구되고 있다.Among LED lighting apparatuses, there is a flat LED lighting apparatus in which a plurality of LED light sources are aligned on a plane. Conventional flat panel LED lighting devices include a flat printed circuit board (PCB) providing a large area, and a plurality of LED packages mounted vertically and horizontally on the printed circuit board. The LED package is mounted on a PCB using surface mount technology. The LED package generally includes a package body, an LED chip accommodated inside the package body, and a resin encapsulation material filled in the package body to surround the LED chip. In the conventional technology in which the LED package is mounted on the PCB, the size occupied by the LED package itself is limited in reducing the size of the flat panel LED lighting device, and there is a difficulty in efficiently arranging a plurality of LEDs.
본 발명의 목적은 다수의 LED 광원이 평면 상에 배치되도록 PCB에 실장된 평판형 엘이디 조명장치를 제공하는 것이다. 본 발명의 다른 목적은 소형화가 가능한 평판형 엘이디 조명장치를 제공하는 것이다. 본 발명의 또 다른 목적은 LED 광원의 실장효율이 향상된 평판형 엘이디 조명장치를 제공하는 것이다.It is an object of the present invention to provide a flat LED lighting apparatus mounted on a PCB such that a plurality of LED light sources are disposed on a plane. Another object of the present invention is to provide a flat type LED lighting device that can be miniaturized. Still another object of the present invention is to provide a flat type LED lighting apparatus having improved mounting efficiency of an LED light source.
상기한 본 발명의 목적을 달성하기 위하여 본 발명의 일 측면에 따르면,According to an aspect of the present invention to achieve the above object of the present invention,
평판 형상의 회로 기판부; 상기 회로 기판부에 장착되어서 종횡으로 정렬되는 다수의 단위 엘이디 광원; 상기 회로 기판부 상에 형성되며 상기 다수의 단위 엘이디 광원을 둘러싸는 마스크부; 및 상기 마스크부 내부 공간에 채워진 충진 형광체를 포함하며, 상기 단위 엘이디 광원은 상기 회로 기판부에 COB 방식으로 실장되는 베어칩 형태의 엘이디칩인 것을 특징으로 하는 평판형 엘이디 조명장치가 제공된다.A circuit board portion having a flat plate shape; A plurality of unit LED light sources mounted vertically and horizontally in the circuit board unit; A mask part formed on the circuit board part and surrounding the plurality of unit LED light sources; And a filling phosphor filled in the inner space of the mask part, wherein the unit LED light source is a bare chip type LED chip mounted on the circuit board part in a COB manner.
상기 회로 기판부는 알루미늄 기반의 베이스 기판과, 상기 다수의 단위 엘이디 광원이 장착되고 단자부를 형성하며 상기 베이스 기판에 접착시트에 의해 부착되는 회로부를 구비하며, 상기 회로부는 상기 접착시트 위에 차례대로 적층된 유전체층, 구리층 및 니켈-은 합금층을 구비할 수 있다.The circuit board part includes an aluminum-based base board, and a circuit part on which the plurality of unit LED light sources are mounted, forming a terminal part, and attached to the base substrate by an adhesive sheet, wherein the circuit part is sequentially stacked on the adhesive sheet. A dielectric layer, a copper layer, and a nickel-silver alloy layer may be provided.
상기 마스크부는 비티레진으로 형성될 수 있다.The mask part may be formed of a non-resin resin.
상기 다수의 엘이디칩은 440 내지 475nm 파장대를 갖는 하나 이상의 청색칩; 500 내지 510nm 파장대를 갖는 하나 이상의 청녹색칩을 구비하며, 상기 충진 형광체는 상기 청녹색칩 및 청녹색칩으로 발광하는 빛에 의하여 여기되어 발광하는 형광체일 수 있다.The plurality of LED chips may include at least one blue chip having a wavelength band of 440 to 475 nm; At least one blue green chip having a wavelength range of 500 to 510 nm, and the filling phosphor may be a phosphor that is excited by light emitted from the blue green chip and the blue green chip to emit light.
본 발명에 의하면 앞서서 기재한 본 발명의 목적을 모두 달성할 수 있다. 구체적으로는, 평판 형상의 회로 기판부; 상기 회로 기판부에 장착되어서 종횡으로 정렬되는 다수의 단위 엘이디 광원; 상기 회로 기판부 상에 형성되며 상기 다수의 단위 엘이디 광원을 둘러싸는 마스크부; 및 상기 마스크부 내부 공간에 채워진 충진 형광체를 포함하며, 상기 단위 엘이디 광원은 상기 회로 기판부에 COB 방식으로 실장되는 베어칩 형태의 엘이디칩인 것을 특징으로 하는 평판형 엘이디 조명장치가 제공되므로, 평판형 엘이디 조명장치의 소형화 가능하고, 실장효율도 비약적으로 향상된다.According to the present invention, all the objects of the present invention described above can be achieved. Specifically, a flat circuit board portion; A plurality of unit LED light sources mounted vertically and horizontally in the circuit board unit; A mask part formed on the circuit board part and surrounding the plurality of unit LED light sources; And a filling phosphor filled in the inner space of the mask part, wherein the unit LED light source is a flat LED type lighting device, which is a bare chip type LED chip mounted on the circuit board part in a COB manner. The type LED lighting device can be miniaturized, and the mounting efficiency is dramatically improved.
도 1은 본 발명의 일 실시예에 따른 평판형 엘이디 조명장치를 도시한 사시도이다.1 is a perspective view showing a flat panel LED lighting apparatus according to an embodiment of the present invention.
도 2는 도 1에 도시된 평판형 엘이디 조명장치에서 엘이디칩이 장착된 부분을 확대하여 도시한 평면도이다.FIG. 2 is an enlarged plan view illustrating a portion where an LED chip is mounted in the flat LED lighting apparatus of FIG. 1.
도 3은 도 1에 도시된 평판형 엘이디 조명장치의 횡단면 구조를 도시한 단면도이다.3 is a cross-sectional view showing a cross-sectional structure of the flat LED lighting apparatus shown in FIG.
이하, 도면을 참조하여 본 발명의 실시예를 상세히 설명한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
도 1은 본 발명의 일 실시예에 따른 평판형 엘이디 조명장치를 도시한 사시도이고, 도 2는 도 1에 도시된 평판형 엘이디 조명장치에서 엘이디칩이 장착된 부분을 확대하여 도시한 평면도이며, 도 3은 도 1에 도시된 평판형 엘이디 조명장치의 횡단면 구조를 도시한 단면도이다. 도 1 내지 도 3을 참조하면, 본 발명의 일 실시예에 따른 평판형 엘이디 조명장치(100)는 회로 기판부(110)와, 다수의 단위 엘이디 광원(120)과, 마스크부(130)와, 충진 형광체(140)를 포함한다. 이제, 도 1 내지 도 3에 도시된 본 발명의 일 실시예에 따른 평판형 엘이디 조명장치(100)의 구성하는 각 구성요소를 상세히 설명한다.1 is a perspective view showing a flat LED lighting apparatus according to an embodiment of the present invention, Figure 2 is a plan view showing an enlarged portion of the LED chip mounted on the flat LED lighting apparatus shown in Figure 1, 3 is a cross-sectional view showing a cross-sectional structure of the flat LED lighting apparatus shown in FIG. 1 to 3, a flat LED lighting apparatus 100 according to an embodiment of the present invention includes a circuit board unit 110, a plurality of unit LED light sources 120, a mask unit 130, And a filling phosphor 140. Now, each component constituting the flat LED lighting device 100 according to an embodiment of the present invention shown in Figures 1 to 3 will be described in detail.
회로 기판부(110)는 베이스 기판(111)과, 접착시트(112)와, 회로부(113)를 구비한다. 본 실시예에서는 회로 기판부(110)가 통상적인 MCPCB 구조를 갖는 것으로 설명한다. MCPCB는 금속 기반 기판에 유전체를 형성하고 그 위에 회로 패턴을 형성한 것으로서, COB(Chip on Board) 패키지 기술에서 널리 사용되고 있는 기판이다.The circuit board unit 110 includes a base substrate 111, an adhesive sheet 112, and a circuit unit 113. In this embodiment, the circuit board unit 110 will be described as having a typical MCPCB structure. MCPCB is a substrate formed of a dielectric on a metal-based substrate and a circuit pattern formed thereon, and is widely used in a chip on board (COB) packaging technology.
베이스 기판(111)은 알루미늄 기반 기판이다. 본 실시예에서는 베이스 기판(111)은 Al 1085로 이루어지는 것으로 설명한다. 베이스 기판(111)은 넓은 면적을 제공하는 직사각형의 평판 형상이다.The base substrate 111 is an aluminum based substrate. In the present embodiment, the base substrate 111 is described as being made of Al 1085. The base substrate 111 is in the shape of a rectangular flat plate providing a large area.
접착시트(bonding sheet)(112)는 베이스 기판(111) 위에 위치한다. 접착시트(112)는 베이스 기판(111) 위에 회로부(113)를 접착시킨다.A bonding sheet 112 is positioned on the base substrate 111. The adhesive sheet 112 bonds the circuit unit 113 on the base substrate 111.
회로부(113)는 접착시트(112)에 의해 베이스 기판(111) 상에 접착되어 형성된다. 회로부(113)는 유전체층(114)과, 제1 배선부(113a)와, 제2 배선부(113b)와, 제3 배선부(113c)와, 포토솔더레지스트(PSR : Photo solder resist) 인쇄층(117)을 구비한다.The circuit unit 113 is bonded to the base substrate 111 by the adhesive sheet 112 and formed. The circuit portion 113 includes a dielectric layer 114, a first wiring portion 113a, a second wiring portion 113b, a third wiring portion 113c, and a photo solder resist (PSR) printed layer. 117 is provided.
유전체층(114)은 접착시트(112) 위에 접착되어서 형성된다. 본 실시예에서는 유전체층(114)이 비티레진(BT resin)으로 이루어지는 것으로 설명한다.The dielectric layer 114 is formed by being bonded on the adhesive sheet 112. In this embodiment, the dielectric layer 114 will be described as being made of BT resin.
제1 배선부(113a)는 유전체층(114) 상에서 제3 배선부(113c)의 일측에 형성된다. 제1 배선부(113a)는 유전체층(114) 위에 형성되는 구리층(115)과, 구리층(115) 위에 형성된 니켈-은 합금층(116)을 구비한다. 니켈-은 합금층은 도금에 의해 형성될 수 있다. The first wiring portion 113a is formed on one side of the third wiring portion 113c on the dielectric layer 114. The first wiring portion 113a includes a copper layer 115 formed on the dielectric layer 114 and a nickel-silver alloy layer 116 formed on the copper layer 115. The nickel-silver alloy layer may be formed by plating.
제2 배선부(113b)는 유전체층(114) 상에서 제3 배선부(113c)의 타측에 형성된다. 제2 배선부(113b)는 제3 배선부(113c)를 사이에 두고 서로 반대편에 서로 분리되어서 형성된다. 제1 배선부(113a)의 단면구조는 제1 배선부(113a)의 단면구조와 동일하므로 이에 대한 상세한 설명은 생략한다.The second wiring portion 113b is formed on the other side of the third wiring portion 113c on the dielectric layer 114. The second wiring portions 113b are formed by being separated from each other on opposite sides with the third wiring portion 113c therebetween. Since the cross-sectional structure of the first wiring portion 113a is the same as that of the first wiring portion 113a, a detailed description thereof will be omitted.
제3 배선부(113c)는 유전체층(114) 상에서 넓은 면적을 제공하도록 대체로 직사각형태로 형성된다. 제3 배선부(113c)는 유전체층(114) 상에 형성되며 그 단면구조는 제1 배선부(113a)의 단면구조와 동일하므로 이에 대한 상세한 설명은 생략한다. 제3 배선부(113c)는 엘이디칩(LED chip)인 엘이디 광원(120)이 장착되는 칩 패드로서 기능한다.The third wiring portion 113c is formed in a generally rectangular shape to provide a large area on the dielectric layer 114. Since the third wiring part 113c is formed on the dielectric layer 114 and its cross-sectional structure is the same as that of the first wiring part 113a, a detailed description thereof will be omitted. The third wiring part 113c functions as a chip pad on which the LED light source 120, which is an LED chip, is mounted.
PSR 인쇄층(117)은 회로부(113) 위에 형성된다. PSR 인쇄층(117)은 제3 배선부(113c) 전체와, 제1 배선부(113a)에서 제3 배선부(113c)와 인접하는 부분과, 제2 배선부(113b)에서 제3 배선부(113c)와 인접하는 부분에는 형성되는 않는다. 그에 따라, 제1 배선부(113a)에는 제1 노출부(113a1)이 형성되고, 제2 배선부(113b)에는 제2 노출부(113b1)가 형성된다. 또한, 제1 배선부(113a)에는 PSR 인쇄층(117)에 의해 덮이지 않고 외부로 노출된 제1 단자부(1161)가 마련된다. 그리고, 제2 배선부(113b)에는 PSR 인쇄층(117)에 의해 덮이지 않고 외부로 노출된 제2 단자부(1162)가 마련된다. The PSR printed layer 117 is formed over the circuit portion 113. The PSR printed layer 117 includes the entire third wiring portion 113c, the portion of the first wiring portion 113a adjacent to the third wiring portion 113c, and the third wiring portion 113b. It is not formed in the part adjacent to 113c. Accordingly, the first exposed portion 113a1 is formed in the first wiring portion 113a, and the second exposed portion 113b1 is formed in the second wiring portion 113b. The first wiring portion 113a is provided with a first terminal portion 1161 exposed to the outside without being covered by the PSR printed layer 117. The second wiring portion 113b is provided with a second terminal portion 1162 exposed to the outside without being covered by the PSR printed layer 117.
다수의 단위 엘이디 광원(120)은 베어칩(bare chip) 형태의 엘이디칩이다. 각 엘이디칩(120)은 칩 패드 역할을 하는 제3 배선부(113c)에 각각 COB 방식으로 실장되어서 종횡로 정렬된다. 베어칩 형태의 엘이디칩(120)이 바로 장착되므로 평판형 엘이디 조명 장치(100)가 비약적으로 소형화되고, 실장효율도 크게 증가한다. The plurality of unit LED light sources 120 are bare chips. Each LED chip 120 is mounted on the third wiring portion 113c serving as a chip pad in a COB manner and aligned vertically and horizontally. Since the bare chip LED chip 120 is directly mounted, the flat LED lighting device 100 is dramatically miniaturized, and the mounting efficiency is greatly increased.
마스크부(130)는 다수의 엘이디 광원(120)을 둘러싸도록 접착시트(118)에 의해 회로부(113) 위에 고정된다. 마스크부(130)는 내부 영역에는 다수의 엘이디 광원(120)과 제1 노출부(113a1)와, 제2 노출부(113a2)가 외부로 노출된다. 마스크부(130)의 바깥쪽에는 제1 단자부(1161)를 노출시키는 제1 노출 홈(131)와, 제2 단자부(1162)를 노출시키는 제2 노출 홈(132)이 마련된다.The mask part 130 is fixed on the circuit part 113 by the adhesive sheet 118 to surround the plurality of LED light sources 120. In the mask area 130, the plurality of LED light sources 120, the first exposed part 113a1, and the second exposed part 113a2 are exposed to the outside. A first exposed groove 131 exposing the first terminal portion 1161 and a second exposed groove 132 exposing the second terminal portion 1162 are provided outside the mask portion 130.
충진 형광체(140)는 마스크부(130)의 내부 공간(110a)에 채워진다. The filling phosphor 140 is filled in the internal space 110a of the mask unit 130.
본 발명은 우수한 연색지수를 갖는 멀티 칩 방식의 엘이디바 장치를 제공하기 위하여, 440 내지 475nm 파장대를 갖는 하나 이상의 청색칩; 500 내지 510nm 파장대를 갖는 하나 이상의 청녹색칩; 및 상기 청녹색칩 및 청녹색칩으로 발광하는 빛에 의하여 여기되어 발광하는 형광체(140)를 포함한다. 여기에서 형광체(140)는 적색, 황색 및 녹색빛을 발광하는 적색, 황색 및 녹색 형광체가 혼합된 복합 형광체일 수 있다.The present invention to provide a multi-chip LED device having an excellent color rendering index, at least one blue chip having a wavelength range of 440 ~ 475nm; One or more bluish green chips having a wavelength band of 500 to 510 nm; And a phosphor 140 that is excited by and emits light by the blue green chip and the blue green chip. The phosphor 140 may be a composite phosphor in which red, yellow, and green phosphors that emit red, yellow, and green light are mixed.
이상 실시예를 통해 본 발명을 설명하였으나, 본 발명은 이에 제한되는 것은 아니다. 상기 실시예는 본 발명의 취지 및 범위를 벗어나지 않고 수정되거나 변경될 수 있으며, 본 기술분야의 통상의 기술자는 이러한 수정과 변경도 본 발명에 속하는 것임을 알 수 있을 것이다.Although the present invention has been described through the above embodiments, the present invention is not limited thereto. The above embodiments may be modified or changed without departing from the spirit and scope of the present invention, and those skilled in the art will recognize that such modifications and changes also belong to the present invention.

Claims (4)

  1. 평판 형상의 회로 기판부;A circuit board portion having a flat plate shape;
    상기 회로 기판부에 장착되어서 종횡으로 정렬되는 다수의 단위 엘이디 광원;A plurality of unit LED light sources mounted vertically and horizontally in the circuit board unit;
    상기 회로 기판부 상에 형성되며 상기 다수의 단위 엘이디 광원을 둘러싸는 마스크부; 및A mask part formed on the circuit board part and surrounding the plurality of unit LED light sources; And
    상기 마스크부 내부 공간에 채워진 충진 형광체를 포함하며,Filled phosphor filled in the inner space of the mask portion,
    상기 단위 엘이디 광원은 상기 회로 기판부에 COB 방식으로 실장되는 베어칩 형태의 엘이디칩인 것을 특징으로 하는 평판형 엘이디 조명장치.The unit LED light source is a flat type LED lighting device, characterized in that the LED chip of the bare chip type mounted on the circuit board portion in the COB method.
  2. 청구항 1에 있어서,The method according to claim 1,
    상기 회로 기판부는 알루미늄 기반의 베이스 기판과, 상기 다수의 단위 엘이디 광원이 장착되고 단자부를 형성하며 상기 베이스 기판에 접착시트에 의해 부착되는 회로부를 구비하며,The circuit board unit includes an aluminum-based base substrate, a circuit unit to which the plurality of unit LED light sources are mounted, form a terminal unit, and be attached to the base substrate by an adhesive sheet.
    상기 회로부는 상기 접착시트 위에 차례대로 적층된 유전체층, 구리층 및 니켈-은 합금층을 구비하는 것을 특징으로 하는 평판형 엘이디 조명장치.And the circuit part comprises a dielectric layer, a copper layer, and a nickel-silver alloy layer sequentially stacked on the adhesive sheet.
  3. 청구항 1에 있어서,The method according to claim 1,
    상기 마스크부는 비티레진으로 형성되는 것을 특징으로 하는 평판형 엘이디 조명장치.Flat panel LED lighting apparatus, characterized in that the mask portion is formed of a non-resin resin.
  4. 청구항 1에 있어서,The method according to claim 1,
    상기 다수의 엘이디칩은 440 내지 475nm 파장대를 갖는 하나 이상의 청색칩; 500 내지 510nm 파장대를 갖는 하나 이상의 청녹색칩을 구비하며,The plurality of LED chips may include at least one blue chip having a wavelength band of 440 to 475 nm; One or more blue-green chips having a wavelength range of 500 to 510 nm,
    상기 충진 형광체는 상기 청녹색칩 및 청녹색칩으로 발광하는 빛에 의하여 여기되어 발광하는 형광체인 것을 특징으로 하는 평판형 엘이디 조명장치.The filling phosphor is a flat LED lighting device, characterized in that the phosphor is excited by the light emitted by the blue green chip and the blue green chip to emit light.
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