KR20140099660A - Light emitting diode lamp - Google Patents

Abstract

An LED lamp may comprise a substrate in which at least one LED is disposed; a metal plate disposed on the lower part of the substrate; a body unit formed of a plastic, and including a substrate mounting portion to which the substrate and the metal plate are inserted, and a heat radiating portion which is connected to the substrate mounting portion and formed with a structure of widening air and a contact area to emit heat; and at least one support member which is formed in the metal plate, inserted into the substrate mounting portion, and receives the heat generated in the metal plate.

Description

LED lamp {LIGHT EMITTING DIODE LAMP}

An embodiment relates to an LED lamp.

Light emitting diodes (LEDs) are a type of semiconductor devices that convert electrical energy into light. Light emitting diodes have advantages of low power consumption, semi-permanent lifetime, fast response speed, safety, and environmental friendliness compared with conventional light sources such as fluorescent lamps and incandescent lamps. Therefore, much research is underway to replace an existing light source with a light emitting diode. In addition, the existing fluorescent lamps, fluorescent lamps, incandescent lamps can be installed directly to the lighting system, the existing fluorescent lights. It is manufactured in the form of incandescent lamp.

Like fluorescent lamps and incandescent lamps, lamps using light emitting diodes generate heat when converting high-voltage / high-current electrical energy into light. Particularly, incandescent lamps require a heat dissipating structure that dissipates the heat of the bulb because heat is transferred to the bulb. In addition, in order to use electric energy of high voltage / high current safely, electric insulation should be excellent. In addition, in order to promote the use of the lamp using the light emitting diode, the manufacturing cost must be low and there is no difficulty in mass production.

Korean Patent Laid-Open No. 10-2012-0013639 (published Feb. 15, 2012)

SUMMARY OF THE INVENTION An object of the present invention is to provide an LED lamp excellent in mass productivity, electrical insulation, and heat radiation characteristics.

In one embodiment, the LED lamp comprises a substrate on which at least one LED is disposed, a metal plate disposed under the substrate, a substrate seating portion formed of plastic and having a substrate and a metal plate inserted therein, And at least one supporting member inserted into the substrate seating part and receiving heat formed on the metal plate, the supporting part being formed of a body part having a heat dissipating part formed with a structure in which a contact area with air is enlarged, can do.

Additionally, in an LED lamp, the thickness of the metal plate may not exceed 4T.

Additionally, at least one of the metal plate and the support member in the LED lamp may comprise aluminum or an aluminum alloy.

In addition, in the LED lamp, the support member may have a length longer than a length of a side of the surface receiving the heat transmitted to the metal plate, the length of which is inserted into the substrate seating portion.

Additionally, in the LED lamp, the heat dissipation unit may be formed of a plurality of pins arranged at predetermined intervals.

In addition, in the LED lamp, a tube-shaped space may be formed in the substrate seating portion, and a power source portion disposed in the space.

Additionally, in an LED lamp, the substrate may further include an IC for receiving an AC power source for transfer to the LED.

In another embodiment, the LED lamp is formed of a substrate on which at least one LED is disposed, a substrate seating portion into which the substrate is inserted, a structure connected to the substrate seating portion and having a wider contact area with air And a heat dissipation unit for dissipating heat, and at least one support member formed of a metal and inserted into the body unit and receiving heat formed on the substrate.

Additionally, in an LED lamp, at least one of the support members may comprise aluminum or an aluminum alloy.

In addition, in the LED lamp, the support member may be formed so that the length of the support member inserted into the substrate seating portion is longer than one side of the surface of the substrate receiving the heat.

Additionally, in the LED lamp, the heat dissipation part may be formed of a plurality of fins arranged at predetermined intervals.

Additionally, the LED lamp may further include a power source portion in which a tubular space is formed in the substrate seating portion and disposed in the space.

Additionally, in an LED lamp, the substrate may further include an IC that receives the AC power and transfers it to the LED.

According to the embodiment, by using the plastic heat sink, the LED lamp is excellent in mass productivity and electrical insulation. In addition, since the metal supporting member is inserted into the heat discharging body, the heat discharging body is resistant to deformation such as warping, and the thermal conductivity generated in the substrate is high, and the lifetime can be increased.

1 is a side perspective view showing an embodiment of an LED lamp.
FIG. 2 is a perspective view of the LED lamp shown in FIG. 1 in a state in which the bulb is removed.
FIG. 3 is a side view showing an embodiment of a body part employed in the LED lamp shown in FIG. 1. FIG.
Fig. 4 is a side view showing another embodiment of the body part employed in the LED lamp shown in Fig. 1. Fig.
FIG. 5 is a perspective view showing a case where the pin interval is constant in the LED lamp shown in FIG. 2. FIG.
FIG. 6 is a perspective view showing a case where the pin thickness is constant in the LED lamp shown in FIG. 2. FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It is to be understood, however, that the appended drawings illustrate the present invention in order to more easily explain the present invention, and the scope of the present invention is not limited thereto. You will know.

In addition, the upper or lower reference of each component is described with reference to the drawings. The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

In describing an embodiment according to the present invention, in the case where it is described as being arranged "on or under" of each element, the upper (upper) or lower (lower) (on or under) all involve both two elements being directly in contact with each other or one or more other elements being disposed indirectly between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a side perspective view showing an embodiment of an LED lamp, and FIG. 2 is a perspective view of the LED lamp shown in FIG. 1 in a state where a bulb is detached.

Referring to FIGS. 1 and 2, the LED lamp 100 is combined with a lighting device (not shown) to serve as a light source of the lighting device. The LED lamp 100 includes a body portion 110 to which a substrate 101 on which at least one LED 102 is disposed is attached and radiates heat generated from the LED 102, A bulb 120 having a hemispherical shape and a base 130 disposed below the body 110 and connected to a lighting device (not shown) to receive power from the lighting device and apply power to the LED 102, .

FIG. 3 is a side view showing an embodiment of a body part employed in the LED lamp shown in FIG. 1. FIG.

3, the body part 110 is connected to the substrate seating part 110a where the substrate 101 and the metal plate 104 are disposed and the support member 105 is inserted and the substrate seating part 110a, And a heat dissipation unit 110b having a heat dissipation structure in which a contact area is widened.

First, the substrate 101, the metal plate 104, and the support member 105 disposed on the body 110 will be described. The substrate 101 may be arranged with at least one LED 102. [ In particular, the substrate 101 may be formed in a circular shape, and one IC 103 may be formed at the center, and at least one LED 102 may be disposed at a predetermined distance from the IC 103 formed in the center. When a plurality of LEDs 102 are disposed, each of the LEDs 102 can be arranged at a same distance as the IC 103, and the plurality of LEDs 102 can be arranged in a circular shape. However, the arrangement of the plurality of LEDs 102 is not limited thereto. The plurality of LEDs 102 are capable of emitting light by receiving electrical energy through the IC 103. The LED 102 emits light by using a high current / high voltage and generates heat. Thus, the substrate 101 on which the LEDs 102 are disposed can be heated by the heat generated in the LEDs 102. In addition, the IC 103 may emit heat when supplying high current / high voltage electrical energy to the LED 102. In particular, since the AC power is supplied at a higher voltage than the DC power, when the IC 103 is supplied with the AC power, it can emit more heat than when the DC power is supplied. However, it is dangerous to use a material having a low electrical insulation property to improve the heat dissipation property. Therefore, an IC using an AC power source can not be used without improving the heat dissipation characteristics and electrical insulation of the LED lamp. Therefore, in order to allow the IC 103 to receive the AC power, the substrate seating portion 110a and the heat dissipating portion 110b should be formed using a material having excellent electrical insulation such as plastic and designed to have high heat dissipation characteristics. However, even if the IC 103 is formed of a material having excellent electrical insulation and has a high heat radiation characteristic, it is also possible to supply the electric power to the LED 102 by receiving the DC power.

The metal plate 104 is disposed under the substrate 101 and enables the heat generated from the substrate 101 to be effectively discharged. The metal plate 104 can be made of aluminum with excellent thermal conductivity, and can have a thickness of 2T or more. If the thickness of the metal plate 104 does not exceed 2T, the thermal conductivity of the metal plate 104 is insufficient, and the heat dissipation characteristics may not be improved even if the metal plate 104 is disposed under the substrate 101. Here, 1T means 1mm. The metal plate 104 may be arranged to be in contact with the substrate 101. Here, the contact may include that the substrate 101 and the metal plate 104 are in close contact with each other and are arranged with a small gap therebetween. However, in order to more effectively dissipate the heat of the substrate 101, the metal plate 104 can be brought into close contact with the substrate 101 without any gap. Further, the metal plate 104 can be connected to a power line (not shown) for forming a hole (not shown) at a position corresponding to the IC 103 and for applying power to the IC 103 through the hole Do.

The support member 105 may be formed of a rod-shaped metal material, and at least one support member 105 may be inserted into the body 110. When the body portion 110 is made of plastic, the body portion 110 is lower in thermal conductivity than that of the metal, but is more excellent in mass productivity and electrical insulation. In order to compensate the thermal conductivity of the plastic body 110, the heat generated from the substrate 101 is transferred to the support member 105 by inserting the support member 105 made of a material having high thermal conductivity into the body 110 105 so as to be easily transmitted to the body portion 110. [ The support member 105 may be made of a material having high thermal conductivity such as aluminum. The length of the support member 105 inserted into the substrate seating portion 110a may be longer than the length of one side of the surface contacting the metal plate 104 so that the support member 105 can be easily detached from the substrate seating portion 110a . One side of the face means one of the length, width, or diagonal of the face. As a result, the support member 105 is attached to the metal plate 104, so that the metal plate 104 may not be easily separated from the body 110.

The body 110 allows the substrate 101 to be mounted and fixed so that the heat generated from the substrate 101 can be easily released. The body portion 110 may include a substrate seating portion 110a and a heat dissipation portion 110b. The substrate seating part 110a has a groove 112 corresponding to the shape of the substrate 101 and the metal plate 104 formed on the upper part thereof and a metal plate 104 is first placed on the groove 112, So that the substrate 101 can be seated. It is also possible to arrange a material such as a thermal grid between the metal plate 104 and the substrate 101 that can help the metal plate 104 and the substrate 101 contact each other. The support member 105 formed on the metal plate 104 is inserted into the substrate seating portion 110a so that the heat transferred to the metal plate 104 is efficiently conducted to the substrate seating portion 110a along the support member 105. [ . A power source unit (not shown) for supplying power to the substrate 101 may be disposed at the center of the substrate mount 110a. The heat dissipation unit 110b has a heat dissipation structure for widening the contact area with air, so that the heat conducted to the substrate placement unit 110a can escape through contact with the air. In the heat dissipation structure, a plurality of thin plate-like fins 111 may be arranged with a predetermined gap. The plurality of fins 111 may have a fixed interval between the fins 111 and the width and the number of the fins 111 may be adjusted. The width of the plurality of pins 111 is fixed and the number of the pins 111 and the distance between the pins 111 and the pins 111 can be adjusted. It is possible to estimate the number and width of the optimum pins by fixing the interval of the pins 111 or fixing the thickness of the pins 111 to measure the temperature of the substrate.

Table 1 below shows the measurement of the temperature at the point where the highest temperature of the substrate 101 is obtained by changing the number of the pins 111 by fixing the pin interval to 2.3 mm and adjusting the thickness of the fin 111. [

Number of pins Pin spacing Substrate temperature (˚C) 16 2.3mm 74.7 18 74.6 20 75 22 75.4 24 75.8 26 76.1

Table 2 below shows the measurement of the temperature at the point having the highest temperature among the temperature measurement points of the substrate by fixing the thickness of the fin 111 to 1.8 mm and adjusting the number of the fins 111 by adjusting the fin spacing.

Number of pins Pin Thickness Substrate temperature (˚C) 20 1.8mm 77.2 24 76.5 28 75.9

In Tables 1 and 2, measurements were made in the state that only the metal plate 104 was formed below the substrate without using the support member 105, and the interval between the fins 111 was 2.3 mm and the number of the fins 111 was 18 It can be seen that the temperature of the substrate is the lowest.

Therefore, according to the results of Tables 1 and 2, the interval between the fins 111 can be set to 2.3 mm and the number of pins can be set to 18, but this is not restrictive.

In addition, the IC 103 receives external power and supplies the power to the LED 102. Therefore, it is necessary to secure the electric seat receiving portion 110a and the heat dissipating portion 110b with a material having excellent electrical insulation to ensure safety For this purpose, the substrate seating portion 110a and the heat dissipating portion 110b may be formed of a material having excellent electrical insulation, for example, plastic. If the substrate seating portion 110a and the heat dissipating portion 110b are formed of plastic, the processing is easy and the manufacturing cost can be reduced.

Fig. 4 is a side view showing another embodiment of the body part employed in the LED lamp shown in Fig. 1. Fig.

4, the body 110 includes a substrate seating part 110a in which the substrate 101 is disposed and into which the supporting member 105 is inserted, and a substrate seating part 110a, And a heat dissipation unit 110b having a heat dissipation structure. That is, the supporting member 105 is attached to the substrate 101 without the metal plate under the substrate 101, which is different from that of FIG.

Table 1 below shows the temperature of various points on the substrate 101. The first type 1 indicates the temperature of the substrate 101 in the LED lamp 100 in which the body 110 is made of plastic. And the second type 2 is a measurement of the temperature on the substrate 101 in the LED lamp 100 employing the body 110 shown in FIG. Indicates that the temperature on the substrate 101 is measured in the LED lamp 100 employing the body 110 shown in Fig. The body 110 employed in the LED lamps 100 of the first type (Type 1) to the third type (Type 3) has a structure in which the number of fins of the heat dissipation portion 110b is 18, (101).

Type One 2 3 Board
Temperature (˚C) 79.3 71.70 72.60 77.35 70.42 71.32 75.41 69.13 70.05 73.46 67.85 68.77 71.52 66.56 67.49 69.57 65.28 66.22 67.62 63.99 64.94 65.68 62.71 63.66 63.73 61.42 62.38 61.78 60.14 61.11 59.84 58.85 59.83 57.89 57.57 58.55 55.95 56.28 57.28 54.00 55.00 56.00

The maximum temperature of the substrate 101 is 79.3 ° C and the minimum temperature is 54.00 ° C. In the case of the second type (type 2), the substrate 101 The maximum temperature is 71.70 ° C and the minimum temperature is 55.00 ° C. In the case of the third type (type 3), the maximum temperature of the substrate 101 is 72.60 ° C and the minimum temperature is 56.00 ° C. That is, the temperature of the substrate 101 is lower in the second type (type 2) and the third type (type 1) than in the first type (type 1). That is, the heat dissipation characteristics are improved by the metal plate 104 and the support member 105.

FIG. 5 is a perspective view showing a case where the pin spacing is constant in the LED lamp shown in FIG. 2, and FIG. 6 is a perspective view showing a case where the pin thickness is constant in the LED lamp shown in FIG.

Referring to FIGS. 5 and 6, the pin thickness of the LED lamp can be adjusted by adjusting the thickness (w) of the LED lamp in a state in which the distance s between the pin and the pin is fixed. When the interval s is fixed to 2.3 mm, the number of fins can range from 16 to 26, but as shown in Table 1 above, the number of fins is set to 18, Heat dissipation property is the best. In addition, the number of pins can be adjusted by adjusting the interval (s) between the pins with the pin thickness (w) of the LED lamp fixed. When the thickness (w) of the pin is fixed to 1.8 mm, the number of fins can range from 20 to 28. However, as shown in Table 2, when the number of fins is 28, The heat dissipation characteristic is the best.

The features, structures, effects and the like described in the embodiments are included in one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100: LED lamp 101: substrate
102: LED 103: IC
104: metal plate 105: support member
110: Body part 110a:
110b: heat radiating portion 111: pin
120: bulb 130: base

Claims (13)

A substrate on which at least one LED is disposed;
A metal plate disposed under the substrate;
And a heat dissipation unit connected to the substrate seating unit and having a structure in which a contact area with the air is enlarged to emit heat, the substrate unit comprising: a substrate; And
And at least one support member formed of a metal and inserted into the substrate seating portion and receiving heat formed on the metal plate. The method according to claim 1,
The thickness of the metal plate does not exceed 4T. The method according to claim 1,
Wherein at least one of the metal plate and the supporting member comprises aluminum or an aluminum alloy. The method according to claim 1,
Wherein the support member has a length longer than a length of one side of a surface of the metal plate receiving the heat transmitted to the substrate seating portion. The method according to claim 1,
Wherein the heat dissipation unit is formed of a plurality of pins arranged at predetermined intervals. The method according to claim 1,
Further comprising a power source section in which a tubular space is formed in the substrate seating section and is disposed in the space. The method according to claim 1,
Wherein the substrate further comprises an IC for receiving an AC power source and delivering the AC power to the LED. A substrate on which at least one LED is disposed;
And a heat dissipation unit connected to the substrate seating unit and having a structure in which a contact area with the air is enlarged to emit heat; And
And at least one support member formed of a metal and inserted into the body portion and receiving heat generated in the substrate. 9. The method of claim 8,
Wherein at least one of the support members comprises aluminum or an aluminum alloy. 9. The method of claim 8,
Wherein the supporting member is longer than a length of one side of a surface of the substrate receiving the heat, the length of which is longer than the length of one side of the supporting member. 9. The method of claim 8,
Wherein the heat dissipation unit is formed of a plurality of pins arranged at predetermined intervals. 9. The method of claim 8,
Further comprising a power source section in which a tubular space is formed in the substrate seating section and is disposed in the space. 9. The method of claim 8,
Wherein the substrate further comprises an IC for receiving an AC power source and delivering the AC power to the LED.

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