KR20140097017A - Pressure-sensitive adhesive tape - Google Patents

Abstract

The present invention relates to a pressure-sensitive adhesive tape used for a dicing tape, wherein a standard deviation of a thickness variation σ of the adhesive tape is low, and a stress of expanding or raising a pin is equal inside the tape face. The adhesive tape of the present invention has an adhesive layer arranged on least one face of a substrate. A standard deviation of thickness variation σ of the adhesive tape is 2.0 μm or less.

Description

[0001] PRESSURE-SENSITIVE ADHESIVE TAPE [0002]

The present invention relates to an adhesive tape.

In the dicing of a semiconductor, dicing of a semiconductor wafer is performed on a dicing tape (adhesive tape), and the semiconductor wafer is small-sized (made into chips) to form a chip. The chip is collected on a dicing tape, (See, for example, Patent Document 1). As a method of collecting the chips on the dicing tape, the chips are stuck (called " pins up ") with a rod called a pin or needle or the like from the side on which the chip of the dicing tape is not mounted, The chips are adsorbed and separated on the dicing tape and collected.

Here, since the spacing between chips immediately after dicing is very small, that is, only about several hundreds of micrometers, when the chips are to be collected on the dicing tape in this state, they may collide with separate chips (particularly, adjacent chips) The chip is damaged.

Therefore, in the dicing of the semiconductor, before the chip is picked up on the dicing tape after dicing, the dicing tape is expanded (stretched) in a state where the chip is mounted on the dicing tape to widen the interval between the chips , The chip is usually taken on a dicing tape.

However, even in such a method, defects may be generated at the time of collection. As a result, further improvement in dicing of a semiconductor is required.

Typical examples of such defects include those that can not be accurately adsorbed and separated when a chip is adsorbed and separated on a dicing tape by a collet.

As a cause of the defect, there is a possibility that the adhesive force between the dicing tape and the chip is too strong. However, even if the adhesive force between the dicing tape and the chip is weakened, the defect is not solved.

Japanese Patent Application Laid-Open No. 2005-019607

The inventors of the present invention have made various investigations on the reason why the chips can not be accurately separated by adsorption and separation by a collet from the dicing tape. Then, attention was paid to the positional deviation of the chip from the adsorption surface of the collet, and the examination was repeated. As a result, it was thought that it is important that the stress of the dicing tape with respect to the expanse or the pin lift is uniform in the tape surface. It is thought that it is important that the thickness of the dicing tape does not vary in the plane so that the stress of the dicing tape with respect to the expanse or the pin lifting is uniform in the tape surface. The present invention has been accomplished on the premise that the level of the standard deviation sigma of < RTI ID = 0.0 > S < / RTI >

That is, an object of the present invention is to provide a pressure-sensitive adhesive tape which can be used as a dicing tape, in which the standard deviation sigma of variation in the thickness of the pressure-sensitive adhesive tape is small and the stress on the expanse or pin- And an adhesive tape.

In the adhesive tape of the present invention,

A pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer on at least one side of a substrate,

The standard deviation sigma of the thickness variation of the adhesive tape is 2.0 m or less.

In a preferred embodiment, the adhesive tape has an average thickness of 20 to 120 탆.

In a preferred embodiment, the modulus of the modulus at 100% tensile in the MD direction and the modulus at 100% tensile in the TD direction (100% modulus in the MD direction / 100% modulus in the TD direction) of the adhesive tape in the MD direction is 0.5 to 1.9.

In a preferred embodiment, the standard deviation? Of thickness variation of the base material is 2.0 占 퐉 or less.

In a preferred embodiment, the substrate has an average thickness of 20 to 120 탆.

In a preferred embodiment, the maximum elongation measured according to JIS-K-7127 (1999) of the substrate is 100% or more.

In a preferred embodiment, the substrate is a plastic film.

In a preferred embodiment, the plastic film includes at least one selected from polyvinyl chloride, polyolefin, and ethylene-vinyl acetate copolymer.

In a preferred embodiment, the pressure-sensitive adhesive layer is provided on one side of the substrate, and a non-adhesive layer is provided on the surface of the substrate opposite to the pressure-sensitive adhesive layer.

In a preferred embodiment, the non-adhesive layer is a mixed layer of silicon and a (meth) acrylic polymer.

In a preferred embodiment, the mixing ratio of silicon to the (meth) acrylic polymer in the non-adhesive layer is from 1:50 to 50: 1 in terms of weight ratio of the silicone: (meth) acrylic polymer.

In a preferred embodiment, the non-adhesive layer has a phase-separated structure.

In a preferred embodiment, the thickness of the non-adhesive layer is 0.01 탆 to 10 탆.

In a preferred embodiment, the pressure-sensitive adhesive layer contains at least one (meth) acryl-based polymer.

In a preferred embodiment, a release liner is provided on the surface of the pressure-sensitive adhesive layer.

In a preferred embodiment, the adhesive tape of the present invention is used for semiconductor processing.

In a preferred embodiment, the adhesive tape of the present invention is used for LED dicing.

According to the present invention, it is possible to provide a pressure-sensitive adhesive tape which can be used as a dicing tape, the pressure-sensitive adhesive tape having a small standard deviation sigma of fluctuation in thickness of the pressure-sensitive adhesive tape, .

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing an alignment state of chips after expanding in a case where the thickness accuracy is good; Fig.
Fig. 2 is a schematic view showing an alignment state of chips after expanding when thickness precision is poor; Fig.
3 is a photograph of an SEM showing the state of the surface side of the non-adhesive layer in the adhesive tape of the present invention.
Fig. 4 is a photograph of an SEM showing the state of the side surface of the non-adhesive layer in the adhesive tape of the present invention. Fig.
Fig. 5 is a photograph of a SEM showing the state of the cross-sectional side of the non-adhesive layer in the adhesive tape of the present invention with an explanation thereof. Fig.

The pressure-sensitive adhesive tape of the present invention comprises a pressure-sensitive adhesive layer on at least one side of a substrate. The pressure-sensitive adhesive tape of the present invention may have a pressure-sensitive adhesive layer on both sides of the substrate, or may have a pressure-sensitive adhesive layer on one side of the substrate.

The adhesive tape of the present invention has a standard deviation sigma of variation in thickness of 2.0 m or less, preferably 1.9 m or less, more preferably 1.7 m or less, further preferably 1.5 m or less, Or less. By adjusting the standard deviation sigma of the thickness variation of the adhesive tape of the present invention within the above range, the stress of the adhesive tape of the present invention against expansions or pin lifts can be made uniform in the tape surface. In the case of using the adhesive tape of the present invention as a dicing tape, as shown in Fig. 1, in the dicing of a semiconductor, the dicing When the interval between the chips 100 is widened by exposing the dicing tape 200 in a state in which the chips are mounted on the dicing tape before the chip is taken on the dicing tape, 100 are not misaligned and a well-aligned chip can be obtained. On the other hand, if the thickness variation of the adhesive tape is large, the thickness precision becomes worse. Therefore, when the adhesive tape of the present invention is used as the dicing tape as shown in Fig. 2, When the distance between the chips 100 is widened by extending (extending) the dicing tape 200 in a state where chips are mounted on the dicing tape before picking the chips 100 on the chip 100, Misalignment occurs, for example, pickup failure may occur. Particularly, since the LED chip is small, positional deviation of the chip tends to occur. A method of measuring the standard deviation sigma of the thickness variation will be described later.

As a method of measuring the thickness variation, any suitable method can be employed, such as measuring the thickness of any plural points in the surface of the measurement object and performing statistical processing. As a method of measuring the thickness, for example, a method in which a micrometer, a micro vernier caliper, a dial gauge or the like carries physical contact; A non-contact method for measuring the transmittance or the reflectance of? -Ray, X-ray, infrared ray, and electromagnetic wave to an object to be measured; A method of cutting an object to be measured at an arbitrary measuring point and observing the object with an optical microscope or an electron microscope; And the like, and combinations of these may be employed.

The average thickness of the adhesive tape of the present invention is preferably 20 to 120 탆, more preferably 30 to 120 탆, and further preferably 40 to 120 탆. By adjusting the average thickness of the adhesive tape of the present invention within the above range, the stress of the adhesive tape of the present invention against expansions and pin lifting can be more uniform in the tape surface. In addition, if the average thickness of the adhesive tape of the present invention is too small, the handling property may deteriorate, and in particular, the bonding work may be difficult. If the average thickness of the adhesive tape of the present invention is too large, there is a fear that the followability against deformation such as elongation is deteriorated.

In the pressure-sensitive adhesive tape of the present invention, the modulus at 100% tensile in the MD direction and the modulus at 100% tensile in the TD direction (100% modulus in the MD direction / 100% modulus in the TD direction) More preferably from 0.5 to 1.8, still more preferably from 0.8 to 1.6, and particularly preferably from 1.0 to 1.5. By adjusting the above ratio (100% modulus in the MD direction / 100% modulus in the TD direction) within the above range, the stress of the adhesive tape of the present invention against expansions or pin lifts can be more uniform in the tape surface.

<Description>

Various factors may be considered to cause the thickness variation of the pressure-sensitive adhesive tape of the present invention such as variations in thickness of the base material, variations in the thickness of the pressure-sensitive adhesive layer, and variations in the thickness of the non- .

Of the above factors, the factor that has the greatest influence on the thickness variation of the adhesive tape is the thickness variation of the substrate. This is because, among the constituent elements of the adhesive tape, the stress is most strongly imposed on the stress of the expanding or pin lifting. Therefore, if the thickness variation of the base is large, the adhesive tape of the present invention The stress is likely to become uneven in the tape surface. The pressure-sensitive adhesive layer and the non-adhesive layer may be applied by coating or spreading on the surface of the substrate. However, if the variation of thickness of the substrate is large, even if the application accuracy of the pressure-sensitive adhesive layer or non- The thickness variation occurs also in the pressure-sensitive adhesive layer and the non-adhesive layer.

For such a reason, the standard deviation? Of the thickness variation of the substrate is preferably 2.0 占 퐉 or less, more preferably 1.8 占 퐉 or less, and further preferably 1.6 占 퐉 or less. By adjusting the standard deviation? Of thickness variation of the base material within the above range, the stress of the adhesive tape of the present invention against expansions or pin lifting can be more uniform in the tape surface. A method of measuring the standard deviation of thickness variation will be described later.

The average thickness of the base material is preferably 20 占 퐉 to 120 占 퐉, more preferably 30 占 퐉 to 120 占 퐉, and still more preferably 40 占 퐉 to 120 占 퐉. By adjusting the average thickness of the substrate of the present invention within the above range, the stress of the adhesive tape of the present invention against expansions or pin lifting can be more uniform in the tape surface. In addition, if the average thickness of the substrate is too small, the handling property may deteriorate. In particular, when the adhesive tape is constituted, the bonding work may be difficult. If the average thickness of the base material is excessively large, the followability against deformation such as elongation may be deteriorated.

The substrate has a maximum elongation measured according to JIS-K-7127 (1999), preferably 100% or more, and more preferably 200% to 1000%. By using such a substrate exhibiting the maximum elongation, the stress of the adhesive tape of the present invention against expansions or pin lifting can be more uniform in the tape surface. In addition, by using such a base material exhibiting the maximum elongation, it is possible to impart appropriate stretchability to the adhesive tape of the present invention, and to improve the followability to, for example, an adherend.

As the substrate, any suitable material can be selected as long as it does not impair the effect of the present invention provided that the above characteristics are satisfied. Such a substrate is preferably a plastic film.

The plastic film may comprise any suitable resin material. Preferable examples of such a resin material include polyvinyl chloride, polyolefin, ethylene-vinyl acetate copolymer, polyester, polyimide and polyamide, and more preferably polyvinyl chloride, polyolefin, Ethylene-vinyl acetate copolymer, and more preferably polyvinyl chloride. Since polyvinyl chloride is excellent in stress relaxation property, it can be used suitably for an adhesive tape used for semiconductor processing such as LED dicing.

As the content of the resin material in the plastic film, any suitable content ratio can be set depending on the purpose and use. Such a content ratio is, for example, preferably 50% by weight to 100% by weight, more preferably 60% by weight to 100% by weight, and still more preferably 70% by weight to 100% by weight.

The plastic film may contain a plasticizer. The content of the plasticizer in the plastic film is preferably 0.5 wt% to 50 wt%, and more preferably 1.0 wt% to 40 wt% with respect to the resin material in the plastic film. By including the plasticizer at the above content ratio in the plastic film, the stress of the adhesive tape of the present invention against expanding or pin lifting can be more uniform in the tape surface. Incorporation of a plasticizer at the content ratio in the plastic film makes it possible to further improve the followability of the pressure-sensitive adhesive tape of the present invention against deformation such as stretching.

Examples of the plasticizer include phthalic acid ester type, trimellitic acid ester type (W-700, trioctyl trimellitate, etc.), adipic acid ester type (manufactured by J. Plus, D620, dioctyl adipate, diisononyl adipate, etc.), phosphoric acid ester (such as tricresyl phosphate), adipic acid ester, citric acid ester (such as tributyl acetyl), sebacic acid ester, Epoxy esters, benzoic acid esters, polyether-based polyesters, epoxy-based polyesters (such as epoxidized soybean oil and epoxidized linseed oil), and polyesters (such as low molecular polyesters containing carboxylic acid and glycol). In the present invention, an ester plasticizer is preferably used. The plasticizer may be one kind or two or more kinds.

The plastic film may contain any other suitable component as long as the effect of the present invention is not impaired.

The inventors of the present invention have found out that a substrate having a small thickness variation standard deviation σ and a high thickness accuracy can be obtained by strictly designing the manufacturing method.

The substrate can be produced by any suitable production method within a range capable of manifesting the effect of the present invention. Examples of such a production method include injection molding, extrusion molding, inflation molding, calender molding, and blow molding. Among them, calender molding is preferable in order to obtain a substrate having a small thickness variation standard deviation sigma and high thickness accuracy.

As the calender molding, any suitable molding machine may be employed depending on the number of calender rolls and the arrangement type. As such a molding machine, for example, four L-shaped molds, four inverted L-shaped molds, four Z-shaped molds, an inclined mold modified by these molds, and six molds having rolls added thereto for further stabilization are generally used.

It is important to strictly control the condition of the calender molding in order to obtain a substrate having particularly high thickness accuracy because the standard deviation? Of the thickness variation is particularly small.

One preferred means for obtaining a substrate having a particularly high thickness accuracy because the standard deviation of the thickness variation is particularly small is to control the fluctuation of the compound temperature of the final bank within ± 5% in calender molding. By controlling the fluctuation of the compound temperature of the final bank within ± 5% in the calender molding, a substrate having a particularly high thickness accuracy can be obtained because the standard deviation? Of the thickness variation is particularly small, and the present invention The stress of the adhesive tape of the tape can be more uniform in the tape surface.

As another preferable means for obtaining a substrate having a particularly high thickness accuracy because the standard deviation? Of the thickness variation is particularly small, the difference in temperature between the last three rolls (three successive rolls in the latter half portion including the final roll) Is controlled within ± 20%, preferably within ± 18%, more preferably within ± 16%, particularly preferably within ± 15%. In the calender molding, by controlling the temperature difference of the last three rolls (three successive rolls in the latter half portion including the final roll) within the above-mentioned range, a substrate having particularly small standard deviation? , The stress of the adhesive tape of the present invention for expanding or pin lifting can be more uniform in the tape surface.

In the present invention, in order to obtain a substrate having a particularly high thickness accuracy because the standard deviation? Of the thickness variation is particularly small, the above two means are particularly preferable.

In order to obtain a substrate having particularly high thickness accuracy because the standard deviation? Of the thickness variation is particularly small, it is also effective to control the compound temperature in the range of 140 to 220 degrees in calender molding.

In order to obtain a substrate having a particularly high thickness accuracy because the standard deviation? Of the thickness variation is particularly small, it is also effective to control the fluctuation of the number of revolutions of each roll within ± 5% in calender molding.

<Pressure-sensitive adhesive layer>

The thickness of the pressure-sensitive adhesive layer is preferably 1.0 占 퐉 to 30 占 퐉, more preferably 1.0 占 퐉 to 20 占 퐉, and still more preferably 3.0 占 퐉 to 15 占 퐉. When the thickness of the pressure-sensitive adhesive layer is less than 1.0 占 퐉, there is a possibility that sufficient adhesive force can not be exhibited. When the thickness of the pressure-sensitive adhesive layer is larger than 30 占 퐉, the adhesive force becomes excessively large depending on the use, and there is a fear that the adherend may be broken at the time of peeling or the like.

As the material of the pressure-sensitive adhesive layer, any suitable pressure-sensitive adhesive may be employed as long as the effect of the present invention is not impaired.

As the material of the pressure-sensitive adhesive layer, for example, a (meth) acrylic polymer; caoutchouc; A special natural rubber grafted with a monomer such as methyl methacrylate; Synthetic rubbers such as SBS, SBR, SEPS, SIS, SEBS, polybutene, polyisobutene, polyisobutylene, and butyl rubber; And the like. Among them, at least one (meth) acryl-based polymer is preferable in view of a small residual adhesive residue on the adherend after peeling, high cohesion, and excellent transparency.

When the pressure-sensitive adhesive layer contains a (meth) acrylic polymer, the content of the (meth) acrylic polymer in the pressure-sensitive adhesive layer can be appropriately set according to the purpose.

The (meth) acrylic polymer is a resin composed of a monomer component containing a (meth) acrylic monomer as a main monomer. The content of the (meth) acrylic monomer in the monomer component constituting the (meth) acrylic polymer is preferably 50% by weight or more, more preferably 70% by weight to 100% by weight, still more preferably 90% 100% by weight, particularly preferably 95% by weight to 100% by weight. The monomers in the monomer components may be either one kind alone, or two or more kinds.

As the (meth) acrylic monomer, (meth) acrylic acid ester and (meth) acrylic acid are preferable.

(Meth) acrylic esters include, for example, (meth) acrylic acid alkyl esters of alkyl groups of 1 to 30 carbon atoms (including cycloalkyl groups) and hydroxyl group-containing (meth) acrylic esters. The (meth) acrylic acid esters may be either one kind alone or two or more kinds.

Examples of the (meth) acrylic acid alkyl ester of the alkyl group having 1 to 30 carbon atoms (including the cycloalkyl group) include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) (Meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, t- (Meth) acrylate, isobutyl (meth) acrylate, isobutyl (meth) acrylate, isobutyl (meth) acrylate, (Meth) acrylate, pentadecyl (meth) acrylate, octadecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl , Nonadecyl (meth) acrylate, (meth) acrylate Rilsan eicosyl (meth) acrylic acid referred to us the like, (meth) acrylic acid alkyl ester having a carbon number of 1 to 30, an alkyl group (including cycloalkyl group) and the like. Among these (meth) acrylic acid esters, (meth) acrylic acid alkyl esters of an alkyl group (including a cycloalkyl group) having 2 to 20 carbon atoms are preferable, and an alkyl group (including a cycloalkyl group) having 4 to 18 carbon atoms, (Meth) acrylic acid alkyl ester.

Examples of the hydroxyl group-containing (meth) acrylic acid esters include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate and 4-hydroxybutyl (meth) acrylate.

The monomer component constituting the (meth) acryl-based polymer preferably includes at least one selected from a hydroxyl group-containing monomer and a carboxyl group-containing monomer so as to sufficiently exhibit the effect as a pressure-sensitive adhesive. More preferably, it is a carboxyl group-containing monomer. The monomer component constituting the (meth) acrylic polymer may contain acrylonitrile in order to sufficiently exhibit the effect as a pressure-sensitive adhesive.

Examples of the hydroxyl group-containing monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate and allyl alcohol. The number of the hydroxyl group-containing monomers may be one, or two or more.

Examples of the carboxyl group-containing monomer include (meth) acrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, crotonic acid, maleic acid, fumaric acid and itaconic acid. The carboxyl group-containing monomers may be either one kind alone or two or more kinds.

When the monomer component constituting the (meth) acrylic polymer includes a hydroxyl group-containing monomer, the content of the hydroxyl group-containing monomer in the monomer component constituting the (meth) acrylic polymer is preferably 0.1% by weight to 20% By weight, more preferably 0.1% by weight to 10% by weight. When the monomer component constituting the (meth) acrylic polymer comprises a carboxyl group-containing monomer, the content ratio of the carboxyl group-containing monomer in the monomer component constituting the (meth) acrylic polymer is preferably 0.1% by weight to 20% By weight, more preferably 0.1% by weight to 10% by weight. As described above, when the monomer component constituting the (meth) acrylic polymer contains at least one member selected from a hydroxyl group-containing monomer and a carboxyl group-containing monomer, a cross-linking agent is effectively used to generate a cross- So that the effect as a pressure-sensitive adhesive can be sufficiently exhibited. The content of the hydroxyl group-containing monomer in the monomer component constituting the (meth) acrylic polymer and the content ratio of the carboxyl group-containing monomer in the monomer component constituting the (meth) acrylic polymer are adjusted to fall within the above range, The fracture of the adherend during operation can be effectively prevented. When the content of the hydroxyl group-containing monomer in the monomer component constituting the (meth) acrylic polymer and the content ratio of the carboxyl group-containing monomer in the monomer component constituting the (meth) acrylic polymer are excessively larger than the above range, It may become too large to easily cause blocking, and there is a fear that the adherend may be easily broken at the peeling operation.

The pressure-sensitive adhesive layer preferably includes a cross-linking agent. When the pressure-sensitive adhesive layer contains a cross-linking agent, the content of the cross-linking agent in the pressure-sensitive adhesive layer can be suitably set according to the purpose, but is preferably 0.1 to 100 parts by weight, Parts by weight to 20 parts by weight. When the content of the cross-linking agent in the pressure-sensitive adhesive layer is within the above range, a suitable cross-linking reaction can be caused, and fracture of the adherend during the peeling operation can be effectively prevented.

Examples of the crosslinking agent include epoxy crosslinking agents, isocyanate crosslinking agents, melamine crosslinking agents, peroxide crosslinking agents, metal alkoxide crosslinking agents, metal chelate crosslinking agents, metal salt crosslinking agents, carbodiimide crosslinking agents, oxazoline crosslinking agents, aziridine crosslinking agents , Amine-based crosslinking agents, and the like. Of these cross-linking agents, melamine-based cross-linking agents, epoxy-based cross-linking agents and isocyanate-based cross-linking agents are preferable in that the effects of the present invention can be sufficiently exhibited. In addition, the crosslinking agent may be appropriately selected according to need, and may be only one kind, or may be a mixed type of two or more kinds.

The pressure-sensitive adhesive layer may contain a plasticizer. In the case where the pressure-sensitive adhesive layer contains a plasticizer, the content of the plasticizer in the pressure-sensitive adhesive layer can be appropriately set in accordance with the purpose, but is preferably 0.1 part by weight to 100 parts by weight of the main resin component (preferably a (meth) acrylic polymer) 70 parts by weight. By making the content of the plasticizer in the pressure-sensitive adhesive layer fall within the above range, the effect of the present invention can be more effectively expressed. If the content of the plasticizer in the pressure-sensitive adhesive layer is larger than 70 parts by weight based on 100 parts by weight of the main resin component (preferably, the (meth) acrylic polymer), the pressure-sensitive adhesive layer becomes excessively soft and the residual pressure- There is a fear that it becomes easy to occur.

Examples of the plasticizer include phthalate ester type, trimellitic acid ester type (W-700 manufactured by Dainippon Ink and Chemicals, Inc., trioctyl trimellitate and the like), adipic acid ester type (manufactured by J. Plus, D620, dioctyl adipate, diisononyl adipate, etc.), phosphoric acid ester (such as tricresyl phosphate), adipic acid ester, citric acid ester (such as tributyl acetyl), sebacic acid ester, Epoxy esters, benzoic acid esters, polyether-based polyesters, epoxy-based polyesters (such as epoxidized soybean oil and epoxidized linseed oil), and polyesters (such as low molecular polyesters containing carboxylic acid and glycol). In the present invention, an ester plasticizer is preferably used. The plasticizer may be one kind or two or more kinds.

The pressure-sensitive adhesive layer may contain any suitable catalyst in order to accelerate the crosslinking reaction and the like. When the pressure-sensitive adhesive layer contains a catalyst, the content of the catalyst in the pressure-sensitive adhesive layer can be appropriately set according to the purpose, but is preferably 0.01 part by weight to 100 parts by weight of the main resin component (preferably a (meth) 10 parts by weight. By bringing the content of the catalyst in the pressure-sensitive adhesive layer within the above range, the effect of the present invention can be more effectively expressed.

Examples of the catalyst include tetraisopropyl titanate, tetra-n-butyl titanate, tin octylate, lead octylate, cobalt octylate, zinc octylate, calcium octylate, lead naphthenate, cobalt naphthenate, dibutyl Organometallic compounds such as tin diacetate, dibutyltin dioctoate, dibutyltin dilaurate, dioctyltin dilaurate and dibutyltin maleate; Basic compounds such as butylamine, dibutylamine, hexylamine, t-butylamine, ethylenediamine, isophoronediamine, imidazole, lithium hydroxide, potassium hydroxide and sodium methylate; acidic compounds such as p-toluenesulfonic acid, trichloroacetic acid, phosphoric acid, monoalkylphosphoric acid, dialkylphosphoric acid, phosphoric acid esters of? -hydroxyethyl acrylate, monoalkyl phosphorous acid and dialkyl phosphoric acid; And the like. The catalyst may be of only one type, or two or more types.

The pressure-sensitive adhesive layer preferably has an SP value of ^0.5 to 12.0 (cal / cm3) ^0.5 , more preferably 9.5 (cal / cm3) ^0.5 To 11.0 (cal / cm &lt; 3 &gt;) ^0.5 . The SP value is a solubility parameter calculated by the Small equation. The calculation of the SP value can be performed by a method described in a well-known document (for example, Journal of Applied Chemistry, 3, 71, 1953.).

The pressure-sensitive adhesive layer may contain any suitable additives insofar as the effect of the present invention is not impaired. Examples of such additives include ultraviolet absorbers, fillers, antioxidants, tackifiers, pigments, dyes, silane coupling agents and the like.

The pressure-sensitive adhesive tape of the present invention may be provided with a release liner on the surface of the pressure-sensitive adhesive layer.

As the release liner, any suitable separator can be employed. Examples of such a release liner include a substrate having a release layer such as a plastic film or paper surface-treated with a releasing agent such as silicone, long chain alkyl, fluorine, or molybdenum sulfide; Fluorinated polymers such as polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, and chlorofluoroethylene-vinylidene fluoride copolymer. A low adhesion substrate; A low adhesive base material comprising a non-polar polymer such as an olefin resin (e.g., polyethylene, polypropylene, etc.); And the like.

As a method for providing the pressure-sensitive adhesive layer on a substrate, any appropriate means can be employed as long as the effect of the present invention is not impaired. As such means, a pressure-sensitive adhesive layer is preferably formed by applying a coating solution for forming a pressure-sensitive adhesive layer on a substrate.

In the formation of the pressure-sensitive adhesive layer by such a coating application, uneven coating or the like at the time of applying may affect the thickness variation of the pressure-sensitive adhesive tape. As one of the means for reducing such an influence, the winding tension of the pressure-sensitive adhesive tape obtained after application is preferably 200 N / m or less, more preferably 30 N / m to 180 N / m, Preferably 30 N / m to 160 N / m, and particularly preferably 30 N / m to 150 N / m. The winding tension refers to the tension when the adhesive tape is wound in a roll form. By adjusting the winding tension within the above range, it is possible to reduce the influence of coating unevenness during coating and the like on the thickness variation of the adhesive tape, and the stress of the adhesive tape according to the present invention, It can be more uniform in the plane.

As another means for reducing the influence of coating unevenness at the time of applying and coating on the thickness variation of the adhesive tape, it is preferable that the drying temperature at the time of drying the adhesive tape obtained after application is preferably 200 DEG C or less, Preferably 180 占 폚 or lower, more preferably 160 占 폚 or lower. By adjusting the drying temperature within the above range, it is possible to reduce the influence of coating unevenness at the time of applying and coating on the thickness variation of the adhesive tape, and the stress of the adhesive tape according to the present invention, It can be more uniform in the plane.

As the application method, any suitable application method can be employed within a range not to impair the effect of the present invention. Examples of such a coating method include a reverse method, a direct method, and various methods combining a metering roll. In order to fully manifest the effect of the present invention, it is preferable to adjust the variation of the thickness of the applied coating layer in the wet state including the solvent within ± 20% in the width direction.

<Non-adhesive layer>

The pressure-sensitive adhesive tape of the present invention preferably has a pressure-sensitive adhesive layer on one side of the substrate and a non-adhesive layer on the side opposite to the pressure-sensitive adhesive layer of the substrate.

The composition of the non-adhesive layer is not particularly limited, and examples thereof include a silicon layer, a (meth) acrylic polymer layer, a mixed layer of a silicon layer and a (meth) acrylic polymer layer, Layer and the like. Among these, a mixed layer of silicon and a (meth) acrylic polymer is preferable. The affinity between the non-adhesive layer and the substrate (particularly, the plastic film) is improved by making the non-adhesive layer a mixed layer of the silicone and the (meth) acrylic polymer, and the adhesive tape of the present invention has good followability against deformation such as elongation do.

The surface of the non-adhesive layer preferably has a concavo-convex structure. Since the surface of the non-adhesive layer has a concavo-convex structure, over-adhesion to the pedestal can be effectively suppressed. Specifically, the concavo-convex structure is preferably such that the arithmetic average surface roughness Ra of the non-adhesive layer is preferably 0.1 탆 or more, more preferably 0.1 탆 to 3.0 탆, still more preferably 0.2 탆 to 2.0 탆, Particularly preferably from 0.3 탆 to 2.0 탆, and most preferably from 0.5 탆 to 2.0 탆. When the arithmetic average surface roughness Ra of the non-adhesive layer is within the above-mentioned range, it is possible to suppress the occurrence of over-fitting in the case of carrying out the suction fixation by the negative pressure. The method of measuring the arithmetic mean surface roughness Ra of the non-adhesive layer will be described later.

The non-adhesive layer preferably has a glass transition temperature Tg determined by differential scanning calorimetry (DSC measurement) of preferably 20 ° C or more, more preferably 30 ° C or more, still more preferably 50 ° C or more, Lt; / RTI &gt; The upper limit of the glass transition temperature Tg determined by the differential scanning calorimetry of the non-adhesive layer is not particularly limited, but is preferably 200 deg. C or lower, more preferably 170 deg. C or lower, Is 150 DEG C or lower, particularly preferably 130 DEG C or lower, and most preferably 100 DEG C or lower. When the glass transition temperature Tg determined by the differential scanning calorimetry of the non-adhesive layer is within the above range, the hardness of the surface of the non-adhesive layer is appropriately increased even at a high temperature, so that the heat resistance is increased, and the adhesive tape of the present invention is fixed It is possible to effectively suppress the occurrence of over-tightening due to heat generation of the pedestal, etc., in the case of performing dicing or the like by adsorption and fixing on the pedestal. A method of measuring the glass transition temperature Tg by differential scanning calorimetry (DSC measurement) of the non-adhesive layer will be described later.

And the non-adhesive layer is a (meth) containing an acrylic polymer, a non-adhesive layer of the (meth) acrylic polymers, the SP value is preferably 9.0 (cal / ㎤) ^0.5 to 12.0 (cal / ㎤) ^0.5, More preferably 9.5 (cal / cm3) ^0.5 to 11.5 (cal / cm3) ^0.5 , and still more preferably 9.5 (cal / cm3) ^0.5 to 11.0 (cal / cm3) ^0.5 . The SP value is a solubility parameter calculated by the Small equation. The calculation of the SP value can be performed by a method described in a well-known document (for example, Journal of Applied Chemistry, 3, 71, 1953.).

The non-adhesive layer preferably has a phase separation structure. Since the non-adhesive layer has a phase separation structure, a minute uneven structure can be efficiently formed on the surface of the non-adhesive layer. This is presumably because, for example, when the non-adhesive layer is a mixed layer of silicon and a (meth) acrylic polymer, it is presumed that irregularities are generated due to the difference in the material mobility of the silicone and the (meth) do. By forming the concave-convex structure, it is possible to suppress the occurrence of over-fitting in the case of carrying out the suction fixation by the negative pressure in the pressure-sensitive adhesive tape of the present invention, and to prevent the blocking in the roll- And can be prevented from being blown or torn when rewound from a roll-like shape.

The non-adhesive layer preferably includes a (meth) acrylic polymer-rich phase in which a silicon-rich phase containing silicon more than the (meth) acrylic polymer and a (meth) acrylic polymer containing more than silicon. More preferably, the non-adhesive layer preferably includes a phase-separated structure in which the silicon-rich phase and the (meth) acrylic polymer-rich phase are independent from each other, and more preferably, the silicon-rich phase comprises an air interface side , Plastic film), and the (meth) acrylic polymer-rich phase is present on the substrate (particularly, the plastic film) side. By having such a phase separation structure, the blocking is effectively suppressed by the silicon rich phase existing on the air interface side, and the (meth) acrylic polymer rich phase existing on the substrate (particularly, the plastic film) Particularly, the plastic film) is improved, so that the follow-up property is improved. The phase separation structure can be formed by adjusting the mixing ratio of silicon and (meth) acrylic polymer in the non-adhesive layer as follows.

The non-adhesive layer contains a (meth) acrylic polymer-rich phase having a phase-separated structure or a (meth) acryl-based polymer containing silicon in a larger amount than silicon such that the silicon is more abundant than the (meth) Can be observed by any suitable method. Examples of such observation methods include observation of the cross section of the non-adhesive layer using an electron microscope such as a transmission electron microscope (TEM), a scanning electron microscope (SEM), and an electrolytic discharge type scanning electron microscope (FE-SEM) Method. The two-layer separation structure can be read by the shade in the shape observation. It is also possible to observe a change in the content of silicon or carbon contained in the composition by changing the depth of the probe light from the air interface side of the non-adhesive layer to the inside by infrared absorption spectroscopy by the total reflection method. In addition, a method of observing with an X-ray micro analyzer or X-ray photoelectron spectroscopy is also available. These methods may be appropriately combined and observed.

In the case where the non-adhesive layer has a phase separation structure on the (meth) acrylic polymer-rich phase existing on the side of the air interface (on the side opposite to the substrate (in particular, the plastic film) When the non-adhesive layer is adsorbed and fixed to the fixing base by vacuum pressure and the fixing base is heated, the surface structure of the phase-separation structure is destroyed by heat load caused by the heating, The surface structure of the phase separation structure in the convex portion abutting on the receiving base may be destroyed and the (meth) acrylic polymer rich phase may be exposed on the air interface side in the convex portion. However, in the pressure-sensitive adhesive tape of the present invention, since the glass transition temperature Tg measured by differential scanning calorimetry of the non-adhesive layer is preferably within the above range, the hardness of the convex portion subjected to heat load is appropriately high, . Therefore, when the pressure-sensitive adhesive tape of the present invention is suction-fixed to the fixing base by the negative pressure to perform dicing or the like, it is possible to effectively suppress occurrence of over-fitting due to heat generation of the base.

When the non-adhesive layer is a mixed layer of silicon and a (meth) acrylic polymer, the mixing ratio of silicon and the (meth) acrylic polymer in the non-adhesive layer is preferably 1: 50 to 50 (Meth) acrylate polymer is preferably 1: 10 to 10: 1, more preferably 1: 10 to 1: 1, more preferably silicone: (meth) acrylate polymer = 1:30 to 30: (Meth) acrylate polymer is 1: 5 to 5: 1, and most preferably, the silicone: (meth) acrylate polymer is 1: 3 to 5: 1. If the content of silicon in the non-adhesive layer is too large, the chemical affinity with the back surface of the substrate (in particular, the plastic film) is lowered, and the back surface of the substrate (particularly, the plastic film) may not be familiar. If the content of silicon in the non-adhesive layer is too large, the adhesive tape may deteriorate the followability to deformation such as drawing, and the non-adhesive layer may be broken and cause contamination. If the content of the (meth) acryl-based polymer in the non-adhesive layer is too large, there is a fear that the non-adhesive layer may act as an acrylic adhesive, and blocking tends to occur.

As the silicon, any suitable silicon can be employed. Examples of such silicones include addition type silicon obtained by curing an alkenyl group-containing polydialkylsiloxane and a polydialkylhydrogenpolysiloxane by an addition reaction using a platinum-based compound as a catalyst, addition type silicon obtained by adding a methyl And condensation type silicon obtained by reacting an ortho-containing polydialkylsiloxane with a polydialkylhydrogenpolysiloxane. Examples of addition type silicon include "KS-776A" and "KS-839L" manufactured by Shinetsu Silicones. Examples of the condensation type silicone include &quot; KS723A / B &quot; manufactured by Shinetsu Silicones. In addition to the platinum-based catalyst and the tin-based catalyst, other cross-linking agents, cross-linking accelerators, etc. may be used for producing silicon. Examples of the properties of silicon include a type dissolved in an organic solvent such as toluene, an emulsion type emulsified in an emulsion, and a solventless type containing only silicon. In addition to the addition type silicon or condensation type silicone, a silicone / acrylic graft polymer, a silicone / acrylic block polymer, or the like can be used. Examples of the silicone / acrylic graft polymer include Siamac GS-30, GS101, US-270, US-350 and US-380 (manufactured by Toagosei Co., Ltd.). Examples of the silicone / acrylic block polymer include Modifiers FS700, FS710, FS720, FS730, and FS770 (manufactured by Nichiyu Corporation).

As the (meth) acrylic polymer, any suitable (meth) acrylic polymer may be employed. In the present invention, &quot; (meth) acryl &quot; means &quot; acrylic and / or methacrylic &quot;.

The (meth) acrylic polymer is a polymer composed of a monomer component containing a (meth) acrylic monomer as a main monomer. The content of the (meth) acrylic monomer in the monomer component constituting the (meth) acrylic polymer is preferably 50% by weight or more, more preferably 70% by weight to 100% by weight, still more preferably 90 to 100% By weight, particularly preferably 95% by weight to 100% by weight. The monomers in the monomer components may be either one type alone or two or more types.

As the (meth) acrylic monomer, (meth) acrylic acid ester and (meth) acrylic acid are preferable.

(Meth) acrylic esters include, for example, (meth) acrylic acid alkyl esters of alkyl groups of 1 to 30 carbon atoms (including cycloalkyl groups) and hydroxyl group-containing (meth) acrylic esters. The (meth) acrylic acid esters may be either one kind alone or two or more kinds.

Examples of the (meth) acrylic acid alkyl ester of the alkyl group having 1 to 30 carbon atoms (including the cycloalkyl group) include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) (Meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, t- (Meth) acrylate, isobutyl (meth) acrylate, isobutyl (meth) acrylate, isobutyl (meth) acrylate, (Meth) acrylate, pentadecyl (meth) acrylate, octadecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl , Nonadecyl (meth) acrylate, (meth) acrylate Rilsan eicosyl (meth) acrylic acid referred to us the like, (meth) acrylic acid alkyl ester having a carbon number of 1 to 30, an alkyl group (including cycloalkyl group) and the like. Among these (meth) acrylic acid esters, (meth) acrylic acid alkyl esters of an alkyl group (including a cycloalkyl group) having 2 to 20 carbon atoms are preferable, and an alkyl group (including a cycloalkyl group) having 4 to 18 carbon atoms, (Meth) acrylic acid alkyl ester.

Examples of the hydroxyl group-containing (meth) acrylic acid esters include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate and 4-hydroxybutyl (meth) acrylate.

The monomer component constituting the (meth) acrylic polymer may contain at least one member selected from a hydroxyl group-containing monomer and a carboxyl group-containing monomer in order to fully manifest the effect of the present invention.

Examples of the hydroxyl group-containing monomer include allyl alcohol and the like. The number of the hydroxyl group-containing monomers may be one, or two or more.

Examples of the carboxyl group-containing monomer include carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, crotonic acid, maleic acid, fumaric acid and itaconic acid. The carboxyl group-containing monomers may be either one kind alone or two or more kinds.

When the non-adhesive layer contains a (meth) acrylic polymer, the content of the hydroxyl group-containing (meth) acrylic acid ester in the monomer component constituting the (meth) acrylic polymer in the non- Is preferably 2% by weight to 30% by weight, more preferably 3% by weight to 25% by weight, and particularly preferably 5% by weight to 20% by weight, based on the total amount of the monomer components other than the monomer . When the non-adhesive layer contains a (meth) acrylic polymer, the content ratio of the hydroxyl group-containing (meth) acrylic acid ester among the monomer components constituting the (meth) acrylic polymer in the non- The minute unevenness structure is more efficiently formed on the surface of the non-adhesive layer, and the formation of this uneven structure allows the pressure-sensitive adhesive tape of the present invention to be adsorbed by negative pressure It is possible to further suppress the occurrence of over-tightening in the case of fixing, and furthermore, it is possible to more effectively suppress the blocking in the roll-shaped form and further suppress the breaking or tearing of the roll- can do.

When the non-adhesive layer contains a (meth) acryl-based polymer, the (meth) acrylic polymer in the non-adhesive layer preferably contains a monomer component other than the hydroxyl group-containing (meth) Methacrylic acid and / or (meth) acrylic acid esters. In this case, the content ratio of the (meth) acrylic acid and the (meth) acrylic acid ester is preferably 0: 100 to 20: 80, more preferably 0: : 100 to 10: 90, and more preferably from 0: 100 to 5: 95.

When the content ratio of the (meth) acrylic acid and the (meth) acrylic acid ester falls within the above range, a minute concavo-convex structure is more efficiently formed on the surface of the non-adhesive layer, It is possible to further suppress the occurrence of overfilling in the case of carrying out the suction fixation by the negative pressure, and furthermore, the blocking in the roll-like form can be suppressed more effectively, Tearing can be further suppressed.

The (meth) acrylic polymer can be produced by any suitable polymerization method.

The non-adhesive layer may contain any suitable additive as long as the effect of the present invention is not impaired. Examples of such an additive include a catalyst, an ultraviolet absorber, a filler, an antioxidant, a tackifier, a pigment, a dye, and a silane coupling agent.

The thickness of the non-adhesive layer is preferably 0.01 탆 to 10 탆, more preferably 0.1 탆 to 5 탆, and still more preferably 0.1 탆 to 2 탆. When the thickness of the non-adhesive layer is less than 0.01 탆, blocking tends to occur. If the thickness of the non-adhesive layer is larger than 10 mu m, the followability against deformation such as elongation may be deteriorated. If the thickness of the non-adhesive layer is less than 0.01 탆, the effect of the present invention may be difficult to manifest, and the production may be difficult.

As a method for forming a non-adhesive layer on one side of a substrate (in particular, a plastic film), for example, a non-adhesive layer is formed by applying a material of a non-adhesive layer to one side of a substrate Method. Examples of the application method include a method using a bar coater, a gravure coater, a spin coater, a roll coater, a knife coater, an applicator, or the like.

The adhesive tape of the present invention can be used in any suitable application. As described above, the pressure-sensitive adhesive tape of the present invention can effectively suppress the occurrence of over-tightening due to heat generation of the pedestal, etc. in the case of performing dicing or the like by performing suction fixation on the fixing base by the negative pressure, The affinity of the non-adhesive layer with the plastic film is good and the followability against deformation such as elongation is good without breaking or tearing when rewinding from the roll shape . Therefore, it can be suitably used for semiconductor processing using a semiconductor wafer composed of a weak material and capable of finely sophisticated and dense circuit patterns as an adherend. When the pressure-sensitive adhesive tape of the present invention is used for semiconductor processing, it is possible to effectively suppress occurrence of over-tightening due to heat generation of the pedestal, etc. when dicing or the like is performed by suction fixation on the fixing pedestal by negative pressure, Can be smoothly advanced. Further, when the adhesive tape of the present invention is used for semiconductor processing, accumulation of film deformation and stress distortion occurring due to the conventional blocking does not occur, so that the semiconductor wafer is precisely followed and closely bonded to a fine- It is possible to effectively prevent the semiconductor wafer from being crushed because natural strain of the stress distortion after bonding to the semiconductor wafer does not occur. Particularly, since the wafer used for the LED is composed of a very weak material such as gallium nitride, gallium arsenide, and silicon carbide, the adhesive tape of the present invention is very suitable for dicing (LED dicing) of wafers used for LED Do.

[Example]

Hereinafter, the present invention will be described in detail by way of examples, but the present invention is not limited to these examples. Parts means parts by weight. Further, the amount of the reagent supplied to the solution is represented by the amount of solid content (solid content conversion amount) remaining after volatilizing the solution.

&Lt; Average thickness &

The thickness of 55 points in the MD direction and 55 points in the TD direction were measured at intervals of 50 mm with a 1/1000 dial gauge. The measurement in the TD direction was performed by shifting the position by 50 mm in the MD direction when the length was short, and then the value was continuously measured. After that, 5 points were taken from the maximum value of the measured value of 110 points in total, and 100 points excepting the minimum value were taken. Then, the AVERAGE function of EXCEL was used to calculate the average value.

<Standard deviation of thickness variation σ>

The thickness of 55 points in the MD direction and 55 points in the TD direction were measured at intervals of 50 mm with a 1/1000 dial gauge. The measurement in the TD direction was performed by shifting the position by 50 mm in the MD direction when the length was short, and then the value was continuously measured. After that, 5 points were taken from the maximum value of the measured value of 110 points in total, and 100 points excepting the minimum value were taken. Then, the standard deviation? Of the thickness variation was calculated using the STDEV function of EXCEL.

<Modulus at 100% tensile in MD and 100% at TD in modulus>

Was measured by an Instron type tensile tester (Autograph, manufactured by Shimadzu Corporation) according to JIS-K-7127 (1999). Specifically, a sample having a width of 20 mm and a length of 100 mm was set at a chuck distance of 50 mm, followed by tensile at a tensile speed of 0.3 m / min. Thereafter, the chart was read, and the load at the time of 100% elongation (at a stretch of 50 mm) was determined as a modulus.

<Dicing Condition>

Apparatus: &quot; DFD-651 &quot; (product of DISCO)

Blade: trade name &quot; 27HECC &quot; (manufactured by DISCO)

Blade revolution: 40000 rpm

Dicing speed: 120 mm / sec

Dicing depth: 25 탆

Cut mode: Down cut

Dicing size: 3.0 mm x 3.0 mm

Expandoon: 10㎜

<Expendence>

EXAMPLES The adhesive tape obtained in the comparative example was bonded to the grinding surface of a polished 6-inch semiconductor wafer (thickness = 30 mu m) in an atmosphere of 23 DEG C and 50% RH by reciprocating the pressing roller 2. [ Subsequently, the wafer was diced by the dicing conditions, and then expanded.

The displacement of 20 consecutive chips after expansion was measured and evaluated according to the following criteria. Also, the standard of deviation was 20 center lines.

◯: Over 20 pieces, a deviation of 1 mm or more is 1.0 or less.

X: Over 20 pieces, a deviation of 1 mm or more exceeds 1.0

<Maximum height>

The maximum elongation was measured according to JIS-K-7127 (1999) by an Instron-type tensile tester (Autograph, manufactured by Shimadzu Corporation). Specifically, a sample having a width of 20 mm and a length of 100 mm was set at a chuck distance of 50 mm, and then tensile was performed at a tensile speed of 0.3 m / min.

&Lt; Modulus of elasticity &

Was measured by an Instron type tensile tester (Autograph, manufactured by Shimadzu Corporation) according to JIS-K-7127 (1999). Specifically, a sample having a width of 20 mm and a length of 100 mm was set at a chuck distance of 50 mm, and then subjected to tensile at a tensile speed of 0.3 m / min to obtain an initial modulus of elasticity. The initial elastic modulus was corrected by dividing the tangent line in the range of 0 to 2% of the elongation at break to a value obtained by linearly extending the tangent line to the value of elongation at 100%.

&Lt; Observation of non-adhesive layer >

(Observation by SEM)

After processing so that the cross section of the non-adhesive layer could be observed, the morphology was observed with a transmission electron microscope (SEM).

(Observation by infrared spectroscopy (ATR-IR) by total reflection method)

The total reflection measurement method was selected using an infrared spectrophotometer (manufactured by Perkinermer, Spectrum One), and two types of total reflection prisms (ZnSe 45 ° and Ge 45 °) were used to change the depth of analysis of the probe light, ATR-IR &lt; / RTI &gt;

<Arithmetic mean surface roughness Ra>

Using a confocal laser microscope &quot; LEXT3000 &quot; manufactured by OLYMPUS, the objective lens was measured at 20 times in the 3D mode. The observation range of the 3D mode was determined by setting the position at which the CF image (the confocal image) becomes dark when the lens was moved up and down, to Top and Bottom of the observation range, respectively.

In the image reading method in the 3D mode, image reading was performed with a 0.2 占 퐉 pitch using the Step method.

The measurement of the arithmetic average surface roughness Ra was performed by measuring the Ra at an arbitrary position by the roughness analysis in the analysis mode. Further, the value was obtained as an average value of n = 5.

&Lt; Measurement of glass transition temperature Tg by differential scanning calorimetry (DSC measurement) of non-adhesive layer >

The non-adhesive layer was collected by a feather blade and filled into a solid measuring pan of DSC in an amount of about 3 mg.

The pan was charged into a high-sensitivity differential scanning calorimeter Q2000 manufactured by TA Instrument, and the temperature was raised from 0 deg. C to 200 deg. C at a heating rate of 2 deg. C / min.

Further, the mixture was cooled under the same conditions and the temperature was raised. An intersection of a straight line connecting the external insertion of the linear portion below the transition region of the secondary run and the external insertion of the linear portion of the transition region beyond the transition region and the measurement curve was obtained and this was taken as the glass transition temperature Tg.

[Example 1]

(materials)

A soft polyvinyl chloride film containing 27 parts by weight of a DOP plasticizer (bis (2-ethylhexyl phthalate), manufactured by J. Plus) was coated on a 100 part by weight basis of polyvinyl chloride having a degree of polymerization P = 1050 by a calendering method. The variation of the compound temperature of the last bank of the hour was set to 3% and the temperature difference of the last 3 rolls was set to within 10%, and the film was formed by an inverse L-type calendar. The thickness of the obtained soft polyvinyl chloride film 1A (MD) measured in accordance with JIS-K-7127 (1999) was 485 MPa, and the maximum elongation (MD) measured according to JIS-K-7127 (1999) was 300%.

(Non-adhesive layer)

, 60 parts by weight of a silicone resin (KS-723A, Shinetsu Kagaku Kogyo), 40 parts by weight of a silicone resin (KS-723B, Shinetsu Chemical Industry Co., Ltd.), 40 parts by weight of an acrylic copolymerization polymer (methyl methacrylate (MMA) 50 parts by weight of butyl acrylate (BA) / hydroxyethyl acrylate (HEA) = 60 / 30/10) and 10 parts by weight of a tin catalyst (Cat-PS3, manufactured by Shinetsu Chemical Industry Co., Ltd.) To obtain a mixed solution. The mixing ratio of silicon and (meth) acrylic polymer in the mixed solution (1B) was 2: 1 by weight in the ratio of silicone: (meth) acrylic polymer.

The above mixed solution was applied to one side of the flexible polyvinyl chloride film (1A) and dried in a state where the drying temperature was maintained at 160 占 폚 or lower to form a non-adhesive layer (1B) having a thickness of 1.0 占 퐉.

Further, when the non-adhesive layer 1B was observed by SEM, it was confirmed that the composition was different on the air interface side and the plastic film side due to the shade in the morphological observation, as shown in Figs. 3, 4 and 5 (Meth) acryl-based polymer rich phase and a (meth) acryl-based polymer rich phase, wherein the silicon-rich phase and the (meth) acrylic polymer- It was observed that the silicon rich phase was present on the air interface side (opposite side of the plastic film), and the (meth) acrylic polymer rich phase was present on the plastic film side.

Further, when the non-adhesive layer 1B was subjected to infrared spectroscopic measurement (ATR-IR) by the reflection measuring method, it was confirmed that the peak of Si-CH ₃ derived from the carbonyl group-derived peak of 1725 cm ^-1 in the (meth) 800㎝ the results of the measurement of the absorbance ratio in the vicinity of ^-1 peak, it was found that in the case of using the prism of Ge45 ° relative to ZnSe45 ° increase of the peak near 800㎝ ^-1. Therefore, it was found that the silicon content was improved at the air interface side as compared with the substrate side.

Further, it was confirmed in the FT-IR that the silicon-rich phase in the non-adhesive layer 1B is present on the air interface side (opposite side to the plastic film). The measurement by FT-IR was carried out by using "Spectrum One" manufactured by Perkinermer, and the air interface side was measured by two kinds of prisms (ZnSe45 °, Ge45 °) in the depth direction of analysis by ATR method. Bar, non-pressure-sensitive adhesive layer of the (meth) for the 1720㎝ ^-1 -1730㎝ ^-1 attributable to the C = O peak derived from the acrylic polymer, of the Si-CH ₃ 800㎝ ^-1 vicinity of the peak derived from verified, thereby obtaining the chart In the case of using a prism having a shallow depth of 45 degrees in the analytical depth direction. From this, it can be proved that the concentration of silicon is higher on the air interface side.

As a result of these observations and considering the principle of minimizing the surface free energy, it was found that a two-layer structure having a silicon rich phase on the air interface side was formed in the non-adhesive layer.

(Pressure-sensitive adhesive layer)

100 parts by weight of an acrylic copolymerization polymer composed of butyl acrylate (BA) / acrylonitrile (AN) / acrylic acid (AA) = 85/15 / 2.5 (weight ratio), 100 parts by weight of melamine crosslinking agent (butanol modified melamine formaldehyde resin, Manufactured by Nippon Polyurethane Industry Co., Ltd.), and 60 parts by weight of a DOP plasticizer (bis (2-ethylhexyl phthalate), manufactured by J. Plus).

The pressure-sensitive adhesive solution was coated on the side opposite to the non-adhesive layer 1B of the flexible polyvinyl chloride film 1A and then dried under the condition that the drying temperature was maintained at 160 DEG C or lower to obtain a pressure sensitive adhesive layer 1C Was formed on the side opposite to the non-adhesive layer 1B of the flexible polyvinyl chloride film 1A.

(Adhesive tape)

The laminated structure of the non-adhesive layer 1B / the flexible polyvinyl chloride film 1A / the pressure-sensitive adhesive layer 1C was constructed as described above and wound up at a winding tension of 100 N / m to produce an adhesive tape 1 .

The results are summarized in Table 1.

[Example 2]

A pressure-sensitive adhesive tape (2) was produced in the same manner as in Example 1 except that the film was wound at a winding tension of 150 N / m.

The results are summarized in Table 1.

[Example 3]

(materials)

A flexible polyvinyl chloride film containing 27 parts by weight of a DOP plasticizer (bis (2-ethylhexyl phthalate), manufactured by JAPAN) was added to 100 parts by weight of polyvinyl chloride having a degree of polymerization P = 1050 by the calendar method. Concretely, the film was formed by an inverted L-type calender while the variation of the compound temperature of the final bank at the time of film formation was set to ± 4.5% and the temperature difference of the final three rolls was set to within ± 15%. The obtained soft polyvinyl chloride film 3A had a thickness of 70 mu m and an elastic modulus (MD) measured according to JIS-K-7127 (1999) was measured in accordance with JIS-K-7127 (1999) The maximum elongation (MD) was 480%.

(Non-adhesive layer)

Adhesive layer 3B having a thickness of 1.0 mu m was formed on one side of the flexible polyvinyl chloride film 3A in the same manner as in Example 1. [

(Pressure-sensitive adhesive layer)

A pressure-sensitive adhesive layer 3C having a thickness of 10 mu m was laminated on the non-adhesive layer (3B) of the flexible polyvinyl chloride film (3A) to the non-adhesive layer (3C) of the soft polyvinyl chloride film 3B on the opposite side.

(Adhesive tape)

The laminated structure of the non-adhesive layer 3B / the flexible polyvinyl chloride film 3A / the pressure-sensitive adhesive layer 3C was constructed as described above and wound up at a winding tension of 150 N / m to produce an adhesive tape 3 .

The results are summarized in Table 1.

[Comparative Example 1]

(materials)

A flexible polyvinyl chloride film containing 27 parts by weight of a DOP plasticizer (bis (2-ethylhexyl phthalate), manufactured by JAPAN) was added to 100 parts by weight of polyvinyl chloride having a degree of polymerization P = 1050 by the calendar method. Specifically, the fluctuation of the compound temperature of the final bank at the time of film formation was set to ± 10%, and the temperature difference of the last three rolls was set to within ± 20%, and the film was formed by an inverted L-type calendar. The thickness of the obtained flexible polyvinyl chloride film (C1A) was 80 占 퐉 and the modulus of elasticity (MD) measured according to JIS-K-7127 (1999) was 450 MPa and measured according to JIS-K-7127 The maximum elongation (MD) was 530%.

(Non-adhesive layer)

Adhesive layer (C1B) having a thickness of 1.0 mu m was formed on one side of the flexible polyvinyl chloride film (C1A). The drying temperature during formation was maintained at 170 占 폚 or lower.

(Pressure-sensitive adhesive layer)

A pressure-sensitive adhesive layer (C1C) having a thickness of 10 mu m was laminated on the surface of the soft polyvinyl chloride film (C1A) opposite to the non-adhesive layer (C1B) of the soft polyvinyl chloride film (C1A) C1B on the opposite side. The drying temperature during formation was maintained at 170 占 폚 or lower.

(Adhesive tape)

The laminated structure of the non-adhesive layer C1B / flexible polyvinyl chloride film (C1A) / pressure-sensitive adhesive layer (C1C) was constructed as described above and wound up at a winding tension of 250 N / m to produce an adhesive tape (C1) .

The results are summarized in Table 1.

[Comparative Example 2]

(materials)

A flexible polyvinyl chloride film containing 27 parts by weight of a DOP plasticizer (bis (2-ethylhexyl phthalate), manufactured by JAPAN) was added to 100 parts by weight of polyvinyl chloride having a degree of polymerization P = 1050 by the calendar method. Specifically, the variation of the compound temperature of the final bank at the time of film formation was set to ± 10%, the temperature difference of the last three rolls was set within ± 10%, and the film was formed by an inverse L-type calendar. The thickness of the obtained flexible polyvinyl chloride film (C2A) was 77 m, and the modulus of elasticity (MD) measured according to JIS-K-7127 (1999) was 450 MPa and measured according to JIS-K-7127 The maximum elongation (MD) was 520%.

(Non-adhesive layer)

Adhesive layer (C2B) having a thickness of 1.0 占 퐉 was formed on one side of the flexible polyvinyl chloride film (C2A). The drying temperature during formation was maintained at 170 占 폚 or lower.

(Pressure-sensitive adhesive layer)

A pressure-sensitive adhesive layer (C2C) having a thickness of 10 占 퐉 was laminated on the side of the soft polyvinyl chloride film (C2A) opposite to the non-adhesive layer (C2B) of the soft polyvinyl chloride film (C2A) C2B on the opposite side. The drying temperature during formation was maintained at 170 占 폚 or lower.

(Adhesive tape)

The laminate structure of the non-adhesive layer C2B / flexible polyvinyl chloride film (C2A) / pressure-sensitive adhesive layer (C2C) was constructed as described above and wound up at a winding tension of 150 N / m to produce an adhesive tape C2 .

The results are summarized in Table 1.

In the pressure-sensitive adhesive tape of the present invention, the standard deviation sigma of the thickness variation is small, and the stresses against expansions and pin lifts are uniform in the tape surface. Therefore, it is possible to accurately follow and closely contact the fine and dense circuit patterns of the semiconductor wafer, and the natural release of the stress distortion after bonding to the semiconductor wafer does not occur, so that the semiconductor wafer can be effectively prevented from being broken . Particularly, since the wafer used for the LED is composed of a very weak material such as gallium nitride, gallium arsenide, and silicon carbide, the adhesive tape of the present invention is very suitable for LED dicing and the like.

100: chip
200: Dicing tape

Claims (17)

A pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer on at least one side of a substrate,
Wherein the standard deviation sigma of the thickness variation of the adhesive tape is 2.0 m or less
Adhesive tape. The method according to claim 1,
Wherein the adhesive tape has an average thickness of 20 占 퐉 to 120 占 퐉. 3. The method according to claim 1 or 2,
(100% modulus in the MD direction / 100% modulus in the TD direction) of 0.5 to 1.9 in a tensile direction at 100% in the MD direction and a modulus at 100% tensile in the TD direction in the MD direction. 4. The method according to any one of claims 1 to 3,
Wherein the standard deviation? Of thickness variation of the base material is 2.0 占 퐉 or less. 5. The method according to any one of claims 1 to 4,
Wherein the substrate has an average thickness of 20 to 120 占 퐉. 6. The method according to any one of claims 1 to 5,
A pressure-sensitive adhesive tape having a maximum elongation of 100% or more as measured according to JIS-K-7127 (1999). 7. The method according to any one of claims 1 to 6,
Wherein the substrate is a plastic film. 8. The method of claim 7,
Wherein the plastic film comprises at least one selected from polyvinyl chloride, polyolefin, and ethylene-vinyl acetate copolymer. 9. The method according to any one of claims 1 to 8,
Wherein the pressure-sensitive adhesive layer is provided on one side of the substrate, and a non-adhesive layer is provided on a surface of the substrate opposite to the pressure-sensitive adhesive layer. 10. The method of claim 9,
Wherein the non-adhesive layer is a mixed layer of silicon and a (meth) acrylic polymer. 11. The method of claim 10,
Wherein the mixing ratio of silicon to the (meth) acrylic polymer in the non-adhesive layer is from 1: 50 to 50: 1 in terms of the weight ratio of the silicone: (meth) acrylic polymer. 12. The method according to any one of claims 9 to 11,
Wherein the non-adhesive layer has a phase-separated structure. 13. The method according to any one of claims 9 to 12,
Wherein the thickness of the non-adhesive layer is from 0.01 mu m to 10 mu m. 14. The method according to any one of claims 1 to 13,
Wherein the pressure-sensitive adhesive layer comprises at least one (meth) acryl-based polymer. 15. The method according to any one of claims 1 to 14,
And a release liner provided on the surface of the pressure-sensitive adhesive layer. 16. The method according to any one of claims 1 to 15,
Adhesive tape used in semiconductor processing. 17. The method according to any one of claims 1 to 16,
Adhesive tape used for LED dicing.

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