KR20140028918A - Composition for polishing member, polishing member comprising the same and method of manufacturing the same - Google Patents

Abstract

The present invention relates to a composition for a polishing member, a polishing member comprising the same, and a method for manufacturing the same, and the composition for a polishing member according to an embodiment of the present invention comprises: a metal alloy matrix having a plurality of gaps on the surface and having hard particles attached to the gaps; and a polymer binder combined to the metal alloy matrix.

Description

Composition for polishing member, polishing member comprising same and method for manufacturing same {Composition for polishing member, polishing member comprising the same and method of manufacturing the same}

The present invention relates to an abrasive member composition, an abrasive member including the same, and a manufacturing method thereof, and more particularly, to an abrasive member composition having excellent polishing force and capable of shortening a polishing time, and an abrasive member comprising the same and a preparation thereof. It is about a method.

In general, semiconductor wafers include a slicing process of slicing a plurality of semiconductor wafers from a single crystal ingot, a lapping process of planarizing the surface of the semiconductor wafer, a chamfering process of chamfering the outer periphery of the semiconductor wafer, and etching for removing processing distortion of the semiconductor wafer. A process and a polishing process which mirror-mirrors the surface of a semiconductor wafer are performed.

As semiconductor devices become finer and denser, finer pattern formation techniques are being used. As a result, the surface structure of the semiconductor devices becomes more complicated and the level of the surface films becomes larger. In manufacturing semiconductor devices, a chemical mechanical polishing (CMP) process is used as a planarization technique for removing a step in a specific film formed on a substrate.

In addition, as the integration of semiconductor devices is advanced, the flatness required for semiconductor wafers (hereinafter also referred to as "wafers") is becoming strict. However, as the large diameter of the wafer advances, the improvement of the flatness becomes more difficult. Accordingly, a process in which a grinding process is introduced after etching in a wafer processing process has been proposed, and research for producing a wafer having excellent flatness through various polishing methods has continued.

An object of one embodiment according to the present invention is to provide a polishing member composition, a polishing member comprising the same and a method for manufacturing the same, which has excellent polishing force and can shorten the polishing time.

According to one embodiment of the present invention, a plurality of gaps are formed on a surface thereof, and a metal alloy matrix having hard particles attached thereto; And a polymer binder bonded to the metal alloy matrix.

According to one embodiment of the invention, the metal alloy matrix may be spherical, spherical or elliptical.

According to one embodiment of the invention, the diameter of the metal alloy matrix is 100 to 1000㎛, the size of the gap may be 1 to 10㎛.

According to one embodiment of the invention, the metal alloy matrix may comprise 95 to 99% Sn, 0.5 to 3% Ag, 0.5 to 2% Cu.

According to one embodiment of the invention, the hard particles may be at least one selected from the group consisting of diamond, tungsten carbide, titanium carbide, zirconium carbide, tantalum carbide, silicon carbide and silicon nitride.

According to one embodiment of the present invention, the diameter of the hard particles may be 1 to 10㎛.

According to one embodiment of the invention, the polymeric binder may be one or more selected from the group consisting of epoxy resins, polyimides and phenol resins.

Another embodiment of the present invention is a metal alloy matrix having a plurality of gaps formed on the surface, the hard particles attached to the gap; And it provides a polishing member formed by combining a polymer binder.

Another embodiment of the present invention includes the steps of providing a metal alloy matrix having a plurality of gaps formed on the surface, the hard particles attached to the gap; And bonding the metal alloy matrix and the polymer binder to each other.

According to one embodiment of the present invention, the step of combining the metal alloy matrix and the polymer binder may be performed by a pressing process or a curing process.

According to one embodiment of the present invention, the step of preparing a metal alloy matrix having hard particles attached to the gap formed on the surface is

(a) forming a metal alloy prematrix having a plurality of gaps formed on the surface thereof; And (b) adhering the hard particles to the gap by mixing the metal alloy prematrix and the hard particles.

According to an embodiment of the present invention, the metal alloy prematrix is formed by a DBM (Droplet Based Manufacturing) process, and the mixing of the metal alloy prematrix and the hard particles may be performed by a ball mill process.

According to one embodiment of the present invention, it is possible to provide a composition for an abrasive member comprising a metal alloy matrix in which hard particles are evenly dispersed. The hard particles can be densely arranged in the metal alloy matrix and the grip force can be improved.

In addition, according to one embodiment of the present invention, it is possible to provide a polishing member comprising a metal alloy matrix and a polymer binder to which hard particles are attached.

The metal alloy matrix may have an excellent bonding force with the polymer binder to reduce the ratio of hard particles and metal alloy matrix desorbed during the polishing and grinding process. In addition, the polishing member may include a metal alloy and a polymer at the same time, and may have high toughness and high hardness. Accordingly, grinding and lapping processes may be simultaneously performed with the polishing member.

Thus, according to one embodiment of the present invention, the grinding and polishing process can be continued in a single equipment, and the polishing force can be increased to reduce the polishing and grinding process time. In addition, the flatness and roughness of the wafer can be controlled simultaneously.

1 is a view schematically showing an enlarged portion of a polishing wheel and a polishing member including the polishing member made of the polishing member composition according to an embodiment of the present invention.
FIG. 2 is a diagram schematically showing a metal alloy matrix included in a composition for an abrasive member according to an embodiment of the present invention. FIG.
3 is a process schematic diagram schematically showing a process of manufacturing an abrasive member according to an embodiment of the present invention.
4 is a cross-sectional view schematically showing an apparatus for manufacturing a metal alloy free matrix according to one embodiment of the present invention.
FIG. 5A is a photograph of a metal alloy prematrix formed according to an embodiment of the present invention, and FIG. 5B is a photograph of a state in which hard particles are attached to the metal alloy prematrix. .
6 is a photograph of a metal alloy matrix formed according to an embodiment of the present invention.
7 is a graph showing the results of the FT-IR measurement of the polishing member produced according to an embodiment of the present invention.
FIG. 8 is a graph and a photograph showing measurement results of flatness (a), warpage (b) and surface roughness (c) of a wafer polished with a polishing member manufactured according to one embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention may be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shapes and sizes of the elements in the drawings may be exaggerated for clarity of description, and the elements denoted by the same reference numerals in the drawings are the same elements.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an enlarged and schematic view of an abrasive wheel including an abrasive member made of a polishing member composition according to an embodiment of the present invention and a part of the abrasive member. FIG. 2 is a diagram schematically showing a metal alloy matrix included in a composition for an abrasive member according to an embodiment of the present invention. FIG.

1 and 2, a polishing member composition according to an embodiment of the present invention includes a metal alloy matrix 110 having a plurality of gaps formed on a surface thereof, and hard particles 120 attached to the gaps; And a polymer binder 130 coupled to the metal alloy matrix 110.

According to one embodiment of the present invention, the polishing member composition may be formed of the polishing member 200 through a pressing or curing process. More specific details will be described later.

According to one embodiment of the present invention, a plurality of gaps may be formed on the surface of the metal alloy matrix 110, and hard particles 120 may be attached to the gaps.

The diameter of the metal alloy matrix 110 is not particularly limited, but may be, for example, 100 to 1000 μm. In addition, the metal alloy matrix may be spherical, spherical, elliptical.

The metal alloy matrix may include metals such as Sn, Ni, Co, Cr, Mo, W, Ag, Cu, Fe, and Mn.

More specifically, it may include 95 to 99% Sn, 0.5 to 3% Ag, 0.5 to 2% Cu.

The size of the gap is not particularly limited, but may be, for example, 1 to 10 μm, or 1 to 5 μm.

According to one embodiment of the present invention, the metal alloy matrix may be formed by a DBM (Droplet Based Manufacturing) process, which will be described later.

Hard particles 120 may be attached to a gap formed on the surface of the metal alloy matrix 110. The hard particles are not particularly limited, but for example, diamond, tungsten carbide, titanium carbide, zirconium carbide, tantalum carbide, silicon carbide, silicon nitride and the like can be used.

The diameter of the hard particles is not particularly limited, but may be, for example, 1 to 10 μm or 2 to 6 μm ultra fine particles. In addition, the content of the hard particles may be 3 to 10 parts by weight based on 100 parts by weight of the metal alloy matrix.

The polymer binder 130 is not particularly limited, but for example, an epoxy resin, a polyimide, a phenol resin, or the like may be used.

The content of the polymer binder 130 may be 0.1 to 10 parts by weight based on 100 parts by weight of the metal alloy matrix. If the content of the polymeric binder is less than 0.1 parts by weight, the bonding strength between the metal alloy matrix may be lowered. If the content of the polymer binder is more than 10 parts by weight, the polishing member may not have sufficient strength.

Generally, high-strength hard particles are used to polish substrates and wafers that are difficult to grind, such as glass or sapphire materials.

The hard particles may be mixed with a binder such as metal, resin, ceramic, or the like to be used as an abrasive member. However, as the hard particles are atomized, it is difficult to evenly disperse them in the binder, and after a certain time, the hard particles may be desorbed from the binder.

However, according to one embodiment of the invention, the hard particles are attached to the gap of the metal alloy matrix so that the hard particles can be evenly dispersed in the metal alloy matrix. In addition, the hard particles can be densely arranged in the metal alloy matrix, and the grip force can be improved.

Generally, in order to manufacture high quality wafers, many steps such as lapping, grinding, and polishing are performed, and different types of process equipment are required for each step. In particular, in order to ensure high flatness and roughness of a large-diameter wafer, a complicated process is required, and long grinding and grinding process time may adversely affect the quality of the wafer. In addition, in order to increase the roughness of the wafer, the flatness may be reduced, or when the flatness is increased, the roughness may be reduced.

However, according to one embodiment of the present invention, it is possible to provide a polishing member including a metal alloy matrix and a polymer binder to which hard particles are attached. The metal alloy matrix may have an excellent bonding force with the polymer binder to reduce the ratio of hard particles and metal alloy matrix desorbed during the polishing and grinding process. In addition, the polishing member may include a metal alloy and a polymer at the same time, and may have high toughness and high hardness. Accordingly, grinding and lapping processes may be simultaneously performed with the polishing member.

Thus, according to one embodiment of the present invention, the grinding and polishing process can be continued in a single equipment, and the polishing force can be increased to reduce the polishing and grinding process time. In addition, the flatness and roughness of the wafer can be controlled simultaneously.

Hereinafter, the manufacturing method of the grinding | polishing member which concerns on one Embodiment of this invention is demonstrated. The polishing member may be made of the composition for the polishing member described above.

According to one or more exemplary embodiments, a method of manufacturing an abrasive member includes providing a metal alloy matrix having a plurality of gaps formed on a surface thereof, and hard particles attached to the gaps; And combining the metal alloy matrix and the polymer binder.

3 is a process schematic diagram schematically showing a process of manufacturing an abrasive member according to an embodiment of the present invention.

First, as shown in FIG. 3, a plurality of gaps may be formed on a surface thereof, and a metal alloy matrix 110 having hard particles 120 attached thereto may be provided.

According to the exemplary embodiment of the present invention, the metal alloy matrix 110 having a plurality of gaps formed on the surface and the hard particles 120 attached to the gap is (a) a metal alloy free having a plurality of gaps formed on the surface thereof. Preparing a matrix (before hard particle attachment, 110a); And (b) adhering the hard particles 120 to the gap by mixing the metal alloy prematrix 110a and the hard particles 120.

According to an embodiment of the present invention, the metal alloy prematrix 110a having a plurality of gaps formed on the surface (a) may be formed by a DBM (Droplet Based Manufacturing) process. 4 is a cross-sectional view schematically showing an apparatus for manufacturing a metal alloy prematrix according to one embodiment of the present invention.

Referring to FIG. 4, in the apparatus for manufacturing a metal alloy prematrix 110a having a plurality of gaps formed on a surface thereof, a metal alloy solution M is accommodated, and an outlet 50 through which the metal alloy solution is discharged is formed. Crucible 10, shaft and disk 20 disposed inside the crucible, piezoelectrics 30 to vibrate the shaft disk, heater 40 to heat the crucible, The thermocouple 60 may measure a temperature inside the crucible and a charging plate 70 disposed under the nozzle.

When the metal alloy solution M is accommodated in the crucible 10 and electric electricity is applied, the piezoelectric body 30 may vibrate and vibration may be transmitted to the metal alloy solution M through the shaft disc 20. Accordingly, when the metal alloy solution is discharged through the outlet 50 and passes through the charging plate 70, the metal alloy solution may be discharged in the form of a drop, whereby a plurality of gaps are formed on the surface. The formed metal alloy prematrix 110a may be formed. In this case, the drop forming pressure of the metal alloy solution may be 0.5 to 2kgf / ㎠. The shape of the metal alloy matrix may be adjusted by adjusting the drop forming pressure.

Next, (b) the metal alloy prematrix 110a and the hard particles 120 may be mixed to attach the hard particles 120 to a gap existing on the surface of the metal alloy prematrix.

The method of attaching the hard particles is not particularly limited and may be performed by mechanical mixing, for example, as shown in FIG. 3. The present invention is not limited thereto, but may be performed by, for example, a ball mill process.

More specifically, tungsten carbide, zirconia balls, or the like may be used. Although not limited thereto, the rotation speed of the ball mill may be 300 rpm or more or 300 to 500 rpm. In addition, the process time may be 12 hours or more or 12 to 50 hours.

When the metal alloy matrix 110 having the hard particles 120 attached to the gap formed on the surface is provided, the metal alloy matrix 110 and the polymer binder 130 may be mixed. As described above, the content of the polymer binder 130 may be 0.1 to 10 parts by weight based on 100 parts by weight of the metal alloy matrix.

According to one embodiment of the present invention, a method of bonding the metal alloy matrix 110 and the polymer binder 130 is not particularly limited, but for example, the metal alloy matrix 110 and the polymer binder 130 are mixed. Then pressurized or cured.

Although not limited thereto, the pressing process may be performed at a pressure of 10 to 40 MPa.

In addition, but not limited thereto, the curing process may be performed for 1 to 3 hours at a temperature of 100 to 200 ℃.

In addition, when performing the curing process by pressing the curing process may be performed for a shorter time. Although not limited thereto, a pressure of 10 to 30 MPa may be added, and a curing process may be performed for 2 to 10 minutes at a temperature of 180 to 220 ° C.

According to one embodiment of the present invention, the polishing member may be manufactured in various shapes according to the polishing wheel.

Hereinafter, the present invention will be described in more detail through examples according to an embodiment of the present invention, but these are not intended to limit the scope of the present invention.

[Example]

First, using a DBM (Droplet Based Manufacturing) process under the conditions shown in Table 1, and having a 98.5% Sn, 1% Ag and 0.5% Cu (hereinafter, also referred to as 'SAC'), respectively diameter 300㎛ and 1000㎛ Phosphorus metal alloy prematrix was prepared.

orifice Φ (× 10 ^-6 m) △ P (kgf / ㎠) Jet generation speed (m / s) Actual jet generation speed (m / s) One 129 1.188 2.49 5.66 2 129 1.23 2.49 5.76 3 129 1.117 2.49 5.48 4 129 0.964 2.49 5.10 5 129 0.955 2.49 5.07 6 149.8 0.928 2.31 5.00 7 149.8 1.289 2.31 5.89 8 149.8 1.073 2.31 5.38 9 149.8 1.138 2.31 5.54 10 202.1 0.080 1.99 4.66 11 202.1 0.983 1.99 5.15 12 202.1 1.068 1.99 5.36 13 202.1 1.072 1.99 5.37 14 288 0.609 1.67 4.05

A ball mill (tungsten carbide, Pot: SUS 3L, Mc nylon (1L)) process was performed under the conditions as shown in Table 2 3 parts by weight of diamond 3㎛ diameter with respect to 100 weight of the metal alloy prematrix. As shown in Table 2, the state in which the diamond particles are attached to the metal alloy matrix was observed and evaluated as × and ○.

min
rpm 100 240 300 360 400 480 600 720 2880 250 × × × × × × × × × 300 × × × × × × × × ○ 350 × × × × × × × ○ ○

FIG. 5A is a photograph of a metal alloy prematrix formed according to an embodiment of the present invention, and FIG. 5B is a photograph of a state in which hard particles are attached to the metal alloy prematrix. . Referring to FIG. 5 (a), it can be observed that a plurality of gaps are formed on the surface of the metal alloy prematrix. Referring to FIG. 5 (b), it is confirmed that diamond particles are uniformly attached to the gap. Can be.

6 is a photograph of a metal alloy matrix formed according to an embodiment of the present invention. More specifically, the rotational speed of the examples described in Table 2 represents abrasive particles when the ball mill process is performed for 350 rpm and a processing time of 2,880 minutes. Referring to this, diamond particles are densely and uniformly contained in the metal alloy matrix. You can see that it is attached.

In addition, the polishing member was prepared using the metal alloy matrix and the polymer binder prepared above as described in Table 3 below, and the hardness (Vickers microhardness) was measured and shown in Table 4 below.

Metal Alloy Matrix (Diameter) Polymer resin (content) Coupling condition A SAC 300㎛ Polyimide 0.3% 110 ℃ / 2 hours curing B SAC 1000㎛ Polyimide 0.6% 110 ℃ / 2 hours curing C SAC 300㎛ Polyimide 0.3% 120 ℃ / 2 hours curing D SAC 1000㎛ Polyimide 0.6% 120 ℃ / 2 hours curing E SAC 1000㎛ Polyimide 0.6% 150 ℃ / 2 hours curing F SAC 300㎛ Polyimide 0.3% 150 ℃ / 2 hours curing

Longitude value medium A 15.7 16.9 17.1 16.6 B 14.3 14.1 14.6 14.3 C 17.2 16.5 15.4 16.4 D 14.1 15.3 14.5 14.6 E 15.4 15.5 15.0 15.3 F 16.3 15.9 16.7 16.3

7 is a graph showing the results of the FT-IR measurement of the abrasive member manufactured in the above embodiment.

In addition, the 4 inch wafer was polished with the polishing member prepared in the above embodiment (work feeding speed: 0.03 to 0.05 mm / min, work rpm: 800 rpm, wheel rpm: 1500 rpm), and the flatness, warpage and surface of the wafer. Roughness was measured and shown in Table 5 below.

Flatness BOW Surface Roughness result 1.69 μm 7.24㎛ 0.85 μm How to measure NIDEX FT-17 NIDEX FT-17 3D laser measuring machine

8 is a graph and a photograph showing the measurement results of the flatness (a), warpage (b) and surface roughness (c) of the wafer. Referring to this, when polishing the wafer by using the polishing member manufactured according to an embodiment of the present invention it was confirmed that it has excellent flatness, surface roughness and bending characteristics.

The present invention is not limited by the above-described embodiments and the accompanying drawings, but is intended to be limited only by the appended claims. It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. something to do.

110: metal alloy matrix 110a: metal alloy prematrix
120: hard particles 130: polymer binder
200: abrasive member

Claims (11)

A metal alloy matrix having a plurality of gaps formed on a surface thereof, and hard particles attached to the gaps; And
A polymer binder bonded to the metal alloy matrix;
Polishing member composition comprising a.
The method of claim 1,
The diameter of the metal alloy matrix is 100 to 1000㎛, the size of the gap is a polishing member composition for 1 to 10㎛.
The method of claim 1,
The metal alloy matrix is a composition for polishing members comprising 95 to 99% Sn, 0.5 to 3% Ag, 0.5 to 2% Cu.
The method of claim 1,
Wherein the hard particles are at least one selected from the group consisting of diamond, tungsten carbide, titanium carbide, zirconium carbide, tantalum carbide, silicon carbide and silicon nitride.
The method of claim 1,
The hard particles have a diameter of 1 to 10㎛ composition for polishing members.
The method of claim 1,
The polymer binder is at least one selected from the group consisting of epoxy resins, polyimide and phenol resins polishing member composition.
A metal alloy matrix having a plurality of gaps formed on a surface thereof, and hard particles attached to the gaps; And a polishing member formed by combining the polymer binder.
Providing a metal alloy matrix having a plurality of gaps formed on a surface thereof, and hard particles attached to the gaps; And
Bonding the metal alloy matrix and a polymer binder;
Method of manufacturing a polishing member comprising a.
9. The method of claim 8,
Joining the metal alloy matrix and the polymer binder is a method of manufacturing a polishing member is performed by a pressing process or a curing process.
9. The method of claim 8,
Preparing a metal alloy matrix having hard particles attached to the gap formed on the surface
(a) forming a metal alloy prematrix having a plurality of gaps formed on the surface thereof; And
(b) adhering the hard particles to the gap by mixing the metal alloy prematrix and the hard particles.
11. The method of claim 10,
The metal alloy prematrix is formed by a DBM (Droplet Based Manufacturing) process, and the step of mixing the metal alloy prematrix and the hard particles is a manufacturing method of the polishing member is performed by a ball mill process.

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