KR20140024383A - Substrate for light emitting elements, material for substrates, and light emitting module - Google Patents

Abstract

An object of the present invention is to provide a light emitting element substrate capable of suppressing a decrease in the light amount of a light emitting module due to a decrease in the amount of reflection of light in the light reflection layer. In this light emitting element substrate 1, the base material layer 11 has the joining area | region 13 which can be bonded with the light reflection layer 12, and the light reflection layer is press-bonded with respect to all or part of the joining area | region of a base material layer. have.

Description

Substrate for light emitting device, substrate material and light emitting module {SUBSTRATE FOR LIGHT EMITTING ELEMENTS, MATERIAL FOR SUBSTRATES, AND LIGHT EMITTING MODULE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting element substrate, a substrate material, and a light emitting module, and in particular, includes a light emitting element substrate provided with a light reflection layer, a substrate material including a portion of the light emitting element substrate, and a light emitting element substrate. It relates to a light emitting module.

Conventionally, a light emitting module including a light emitting element substrate provided with a light reflection layer is known. A light emitting module including a light emitting element substrate provided with such a light reflection layer is disclosed in, for example, Japanese Patent Application Laid-Open No. 2008-10591.

Japanese Patent Application Laid-Open No. 2008-10591 discloses an LED device having a substrate made of ceramics and an LED chip disposed on the surface of the substrate. In the board | substrate of this LED device, the wiring pattern which consists of Cu is formed so that it may cover to the surface on the opposite side to an LED chip through the side surface from the surface on the LED chip side. On the surface of the LED chip side of the wiring pattern, Ag plating (light reflection layer) for reflecting light is formed, and on the surface of Ag plating, a thin film coat which is hard to transmit sulfur components in the air is formed. By a thin film coating, it has been inhibited to be a yuhwaeun (Ag ₂ S) is formed of black that make it difficult to reflect the light on the surface of the Ag plating.

Japanese Patent Application Publication No. 2008-10591

However, in the LED device disclosed in Japanese Patent Application Laid-Open No. 2008-10591, even when a thin film coat that is hard to penetrate sulfur components in the air is used, as long as Ag plating is used, the LED device can be used for a long time. It is thought that the emulsified silver which is hard to reflect light on the surface of Ag plating is formed. For this reason, it is thought that there exists a problem that the light quantity of an LED device falls because the reflection amount of the light in Ag plating (light reflection layer) decreases.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and one object of the present invention is to provide a light emitting device substrate capable of suppressing a decrease in the amount of light of the light emitting module due to a decrease in the amount of reflection of light in the light reflection layer, The present invention provides a substrate material including a portion of the substrate for light emitting elements and a light emitting module having the substrate for light emitting elements.

A substrate for a light emitting element according to a first aspect of the present invention includes a light reflection layer made of Al or an Al alloy on which a light emitting element is disposed, and a base layer made of Cu or Cu alloy, and the base layer can be bonded to the light reflection layer. It has a junction area | region, and the light reflection layer is press-contacted with respect to all or one part of the junction area | region of a base material layer.

In the light emitting element substrate according to the first aspect of the present invention, since the light emitting element has a light reflection layer made of Al or Al alloy disposed on the surface as described above, Al or Al alloy hardly reacts with sulfur in air. , Ag ₂ S or the like is not formed as a deposit on the light reflection layer. Thereby, since the reflection amount of the light in the light reflection layer which consists of Al or Al alloy can be suppressed from reducing, it can suppress that the light quantity falls in the light emitting module using the light emitting element substrate. In addition, since the light reflection layer is press-bonded to all or a part of the bonding region of the base material layer, unlike the case where the light reflection layer is formed by the plating treatment that is difficult to form the same thickness in the manufacturing process, Al or the light reflection layer is formed. It can suppress that the hole part (pin hole) in which Al alloy is not arrange | positioned is formed. Thereby, it can suppress that the reflection amount of the light in a light reflection layer decreases due to a pinhole.

In the light emitting element substrate according to the first aspect, as described above, by having a base layer made of Cu or Cu alloy having high thermal conductivity, heat generated by the light emitting element can be easily radiated through the base layer, It is possible to suppress the deterioration of the light emission characteristics of the light emitting element due to the heat generation.

In the light emitting element substrate according to the first aspect, preferably, the light reflection layer is formed in a bonding region provided on at least a part of the substrate layer. In such a configuration, the light amount in the light emitting module using the light emitting element substrate can be suppressed from decreasing in the bonding region provided on at least a part of the base material layer, and at the same time, the pinholes cause The decrease in the amount of reflection can be suppressed.

In the light emitting element substrate according to the first aspect, preferably, the substrate layer further has a protrusion provided with a portion having a thickness equal to or less than the total thickness of the light reflection layer and the substrate layer of the bonding region so as to protrude from the bonding region. . If comprised in this way, the board | substrate for light emitting elements can be easily transformed into a predetermined shape in a protrusion part. Moreover, by making the thickness of the sum total of the thickness of the light reflection layer in which a light emitting element is arrange | positioned, and the thickness of a base material layer more than the thickness of a protrusion part, it can make it easy to dissipate the heat from a light emitting element by a large junction area.

In the light emitting element substrate in which the base layer has a protrusion, preferably, the protrusion is formed at least in a region to be bent. If comprised in this way, in the protrusion part which can be deform | transformed easily, it can bend easily.

In the light emitting element substrate in which the base layer has a protruding portion, preferably, a stepped portion is formed between the bonding region of the base layer and the protruding portion. If comprised in this way, the protrusion part which has the junction area of a large thickness and the part of the small thickness which is easy to perform bending processing etc. can be easily formed on the stepped part boundary as a boundary.

In the substrate for a light emitting element having the base layer having a protruding portion, Preferably, at least a part of the surface of the base portion of the base layer has a plating layer containing a material having better wettability to solder than a base layer made of Cu or a Cu alloy. Is formed. If comprised in this way, since the base material layer which consists of Cu or Cu alloy and solder can be easily connected through a plating layer, the base material layer, the board | substrate which controls a light emitting element, etc. can be easily connected with solder through a plating layer.

In this case, Preferably, the light emitting element substrate main body which has a clad structure is bent so that the upper surface, the side surface, and the lower surface of the base which supports the light emitting element substrate main body from the opposite side to the side where the light emitting element is arrange | positioned, and a plating layer It is provided in the lower part of the light emitting element substrate main body which covers the lower surface of a silver base, and the side part of the light emitting element substrate main body which covers the side surface of a base. In such a configuration, since the plating layer is located not only on the bottom surface of the base but also on the side surface of the base, the base and the substrate for controlling the light emitting element can be connected by the solder disposed not only on the bottom surface of the base but also on the side surface of the base. Thereby, the base can be fixed reliably to a substrate or the like.

In the light emitting element substrate in which the base layer has a protrusion, preferably, the thickness of the bonding region of the base layer is larger than the thickness of the protrusion of the base layer. In such a configuration, the protrusion can be more easily deformed into a predetermined shape.

In the light emitting element substrate according to the first aspect, the thickness of the bonding region of the substrate layer is preferably larger than the thickness of the light reflection layer. When comprised in this way, in general, since the base material layer which consists of Cu or Cu alloy has large thermal conductivity compared with the light reflection layer which consists of Al or Al alloy, it joins compared with the case where the thickness of the junction area | region of a base material layer is smaller than the thickness of a light reflection layer. It is possible to easily dissipate heat from the light emitting element in the region.

In this case, Preferably, the thickness of the junction area | region of a base material layer is 10 times or more of the thickness of a light reflection layer. With such a configuration, it is possible to easily dissipate heat from the light emitting element by the bonding region having a larger thickness than the thickness of the light reflection layer.

In the light emitting element substrate whose thickness of the junction region of the said base material layer is 10 times or more of the thickness of a light reflection layer, Preferably, the thickness of the junction area of a base material layer is 0.1 mm or more and 3 mm or less, and the thickness of a light reflection layer is 1 It is more than 50 micrometers. With such a configuration, it is possible to easily dissipate heat from the light emitting element by the junction region while forming the light reflection layer so as to have a thickness that can reliably reflect light.

In the light emitting element substrate whose thickness of the said light reflection layer is 1 micrometer or more and 50 micrometers or less, Preferably, the thickness of a light reflection layer is 1 micrometer or more and 10 micrometers or less. If comprised in this way, since the thickness of a light reflection layer is small enough, heat can be rapidly transmitted to the base material layer which is excellent in heat dissipation rather than a light reflection layer.

In the light emitting element substrate according to the first aspect, preferably, the bonding region to which the light reflection layer is bonded is formed at least in the region surrounded by the reflector formed to surround the light emitting element. With such a configuration, since the light from the light emitting element can be sufficiently reflected by the light reflection layer formed in the reflector and the region surrounded by the reflector, it is possible to further suppress the decrease in the amount of light in the light emitting module using the light emitting element substrate. .

In the light emitting element substrate in which the stepped portion is formed, preferably, the light emitting element substrate main body having a clad structure has an upper surface and a side surface of the base supporting the light emitting element substrate main body from a side opposite to the side where the light emitting element is disposed. And bent to cover the lower surface, and the stepped portion is formed on the surface of the side on which the light emitting element of the base layer is arranged, and the surface on the opposite side to the side on which the light emitting element of the base layer is arranged is formed into a substantially flat surface shape. have. In such a configuration, the surface on the opposite side to the side where the light emitting element of the base layer is arranged is formed in a substantially flat surface shape, so that the substrate body for the light emitting element can be easily brought into close contact with the top, side, and bottom surfaces of the base. Therefore, the heat generated by the light emitting device can be easily transmitted to the base.

In the light emitting element substrate according to the first aspect, preferably, the light reflection layer is embedded in the substrate layer, and the surface of the light reflection layer embedded in the substrate layer and the surface of the substrate layer located around the bonding region are It is connected in a substantially flat surface shape. If comprised in this way, the heat which a light emitting element generate | occur | produces can also be transmitted to a base material layer from the side surface of a light reflection layer. Thereby, the heat which a light emitting element generate | occur | produces can be dissipated more effectively through a base material layer.

The substrate material according to the second aspect of the present invention is a substrate material including a portion to be a plurality of light emitting element substrates, and each of the plurality of light emitting element substrates is Al or an Al alloy in which the light emitting element is disposed on the surface. The light reflection layer which consists of these, and the base material layer which consists of Cu or Cu alloy is provided, The base material layer has the joining area | region which can be joined with a light reflection layer, The light reflection layer is pressure-bonded to all or one part of the joining area | region of a base material layer, The part used as the some light emitting element board | substrate is comprised so that separation is possible, respectively.

In the substrate material according to the second aspect of the present invention, as described above, each of the plurality of light emitting element substrates has an Al or Al alloy by having a light reflection layer made of Al or an Al alloy on which the light emitting element is disposed. Since silver hardly reacts with sulfur in the air, Ag ₂ S or the like is not formed as a deposit on the light reflection layer. Thereby, since the reflection amount of the light in one surface which consists of Al or Al alloy can be suppressed from reducing, it can suppress that the light quantity falls in the light emitting module using the light emitting element substrate. In addition, since the light reflection layer is press-bonded to all or a part of the bonding region of the base material layer, unlike the case where the light reflection layer is formed by the plating treatment that is difficult to form the same thickness in the manufacturing process, Al or the light reflection layer is formed. It can suppress that the hole part (pin hole) in which Al alloy is not arrange | positioned is formed. Thereby, it can suppress that the reflection amount of the light in a light reflection layer decreases due to a pinhole.

In the substrate material according to the second aspect, as described above, each of the plurality of light emitting element substrates has a base layer made of Cu or a Cu alloy having a high thermal conductivity, thereby facilitating heat generated by the light emitting element. Since heat can be radiated through the base material layer, it is possible to suppress deterioration in the light emission characteristics of the light emitting device due to heat generation. In addition, by constituting the portions to be the plurality of light emitting element substrates separately, the plurality of light emitting element substrates can be easily manufactured from one substrate material.

A light emitting module according to a third aspect of the present invention includes a light emitting element, a light reflection layer made of Al or an Al alloy on which the light emitting element is disposed, and a base layer made of Cu or Cu alloy, and the base layer includes a light reflection layer and The light reflection layer has a bonding area | region which can be bonded, and the light reflection layer is equipped with the board | substrate for light emitting elements currently press-bonded with respect to all or one part of the bonding area | region of a base material layer, and the base arrange | positioned so that the opposite side to the light reflection layer of a base material may follow a surface. do.

In the light emitting module according to the third aspect of the present invention, as described above, the light emitting element substrate has a light reflection layer made of Al or an Al alloy in which the light emitting element is disposed on the surface, whereby the Al or Al alloy is selected from sulfur in air. Since it hardly reacts, Ag ₂ S or the like is not formed as a deposit on the light reflection layer. Thereby, since the reflection amount of the light in one surface which consists of Al or Al alloy can be suppressed from decreasing, it can suppress that the light quantity falls in a light emitting module. In the light emitting element substrate, the light reflection layer is press-bonded to all or a part of the bonding region of the substrate layer, whereby the light reflection layer is formed by a plating process that is difficult to form at the same thickness in the manufacturing process. Alternatively, the formation of holes (pin holes) in which Al or Al alloy is not disposed in the light reflection layer can be suppressed. Thereby, it can suppress that the reflection amount of the light in a light reflection layer decreases due to a pinhole.

Further, in the light emitting module according to the third aspect, as described above, the light emitting element substrate has a base layer made of Cu or Cu alloy having high thermal conductivity, so that heat generated by the light emitting element can be easily radiated through the base layer. It is possible to suppress the deterioration in the light emission characteristics of the light emitting element due to the heat generation.

In the light emitting module according to the third aspect, preferably, the light reflection layer is formed in a bonding region provided on at least a part of the base layer. With such a configuration, it is possible to suppress a decrease in the amount of light in the bonding region provided in at least a part of the base material layer, and to suppress the decrease in the amount of reflection of light in the light reflection layer due to the pinhole.

In the light emitting module according to the third aspect, preferably, the base material layer is formed at least in a region to be bent and has a thickness equal to or less than the total thickness of the light reflection layer and the base material layer of the bonding area so as to protrude from the bonding area. The part further has a protrusion provided, and the protrusion of the base layer is disposed on the base in a bent state so as to cover the side and the bottom of the base. If comprised in this way, the board | substrate for light emitting elements can be easily transformed into a predetermined shape in a protrusion part. Moreover, by making the thickness of the sum total of the light reflection layer and the base material layer of a junction area more than the thickness of a protrusion part, it can make it easy to radiate the heat from a light emitting element by a junction area with a large thickness. Moreover, since the contact area of a base material layer and a base can be enlarged by arrange | positioning a protrusion so that the side surface and the lower surface of a base can be transmitted, the heat of a base material layer can be transmitted by a base.

In this case, preferably, a stepped portion is formed between the joining region of the base layer and the protrusion. If comprised in this way, the protrusion part which has the junction area of a large thickness and the part of the small thickness which is easy to perform bending processing etc. can be easily formed on the stepped part boundary as a boundary.

According to the present invention, as described above, the decrease in the amount of light of the light emitting module can be suppressed due to the decrease in the amount of reflection of light in the light reflection layer.

1 is a plan view showing a configuration of an LED module according to a first embodiment of the present invention.
2 is a cross-sectional view taken along line 600-600 of FIG.
It is sectional drawing which shows the periphery of the light reflection part and the step part of the heat radiation board | substrate which concerns on 1st Embodiment of this invention.
4 is a cross-sectional view taken along line 610-610 of FIG. 2.
5 is a perspective view for explaining a manufacturing process of the LED module according to the first embodiment of the present invention.
It is a perspective view for demonstrating the manufacturing process of the LED module by 1st Embodiment of this invention.
7 is a plan view for explaining a manufacturing process of the LED module according to the first embodiment of the present invention.
8 is a cross-sectional view showing a configuration of an LED module according to a second embodiment of the present invention.
It is a perspective view for demonstrating the manufacturing process of the LED module which concerns on 2nd Embodiment of this invention.
It is a perspective view for demonstrating the manufacturing process of LED module by the modified example of 2nd Embodiment of this invention.
It is a perspective view for demonstrating the manufacturing process of LED module by the modified example of 2nd Embodiment of this invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(1st embodiment)

First, the structure of the LED module 100 according to the first embodiment of the present invention will be described with reference to Figs. 1 to 4. Fig. The LED module 100 is an example of the " light emitting module " of the present invention.

As shown in FIG. 1 and FIG. 2, the LED module 100 according to the first embodiment of the present invention has one side in the direction (X direction) in which the Cu wirings 102a and 102b of the printed board 102 extend. X1 side) is connected to Cu wiring 102a via solder 101a, and the other side (X2 side) is connected to Cu wiring 102b via solder 101b. Thereby, the light emission of the LED element 2 of the LED module 100 is controlled by the control part (not shown) connected to the printed circuit board 102 separately.

In addition, the LED module 100 includes a heat dissipation substrate 1 divided into an X1 side and an X2 side, an LED element 2 fixed on an upper surface 12a described later on the X1 side of the heat dissipation substrate 1, and a heat dissipation substrate. The base 3 (refer FIG. 2) covered by (1) is included. The base 3 has an upper surface 3a (surface on the Z1 side), both side surfaces 3b in the longitudinal direction (X direction), and a part of the lower surface 3c (surface on the Z2 side). Covered). In addition, the heat radiation board | substrate 1 is an example of the "light emitting element substrate" and "light emitting element substrate main body" of this invention, and LED element 2 is an example of the "light emitting element" of this invention.

The heat radiating board | substrate 1 is the upper surface 3a side (Z1 side) of the base 3, and the notch part 10a formed in the X2 side rather than the center part of the X direction, and the lower surface 3c side of the base 3 ( Z2 side), and the notch part 10b (refer FIG. 2) formed in the center part of the X direction, and its periphery is comprised so that it may be divided into X1 side and X2 side. Further, the cutouts 10a and 10b are both formed to extend in the Y direction.

As shown in FIG. 2, the LED element 2 is comprised so that light may mainly be irradiated toward upper direction (Z1 side) from the upper surface (surface of Z1 side). In addition, a part of light irradiated from the LED element 2 is irradiated to the heat radiation board | substrate 1 side (Z2 side), and the reflector 6 side (side side) mentioned later.

The base 3 is made of white alumina (Al ₂ O ₃ ) that has insulation and can reflect light. The base 3 is also formed inside the cutouts 10a and 10b of the heat dissipation substrate 1. Thereby, insulation of the X1 side and X2 side of the heat radiation board | substrate 1 is ensured. Moreover, the light irradiated from the LED element 2 to the notch 10a below (Z2 side) is reflected toward the upper (Z1 side) by the base 3 arrange | positioned inside the notch 10a. It is possible to.

Moreover, the LED element 2 is adhere | attached on the upper surface 12a of the X1 side of the heat radiation board | substrate 1 through the adhesive member 4 which consists of insulating resins. In addition, a pair of electrodes (not shown) formed on the upper surface side of the LED element 2 are electrically connected to the X1 side and the X2 side of the heat dissipation substrate 1 via Au wires 5a and 5b, respectively.

1 and 2, the reflector 6 is disposed on the upper surface 12a of the heat dissipation substrate 1 so as to surround the LED element 2. The reflector 6 is made of alumina (Al ₂ O ₃ ) and is configured such that the opening becomes larger from the lower side (Z 2 side) toward the upper side (Z 1 side). Thereby, the reflector 6 is configured to be able to reflect the light irradiated from the LED element 2 to the side direction upward (Z1 direction). In the space formed by the reflector 6 and the heat dissipation substrate 1, a sealing resin 7 made of a transparent silicone resin is disposed so as to cover the LED element 2 and the Au wires 5a and 5b.

Here, in 1st Embodiment, the heat radiation board | substrate 1 is a clad which has the clad structure by which the base material layer 11 which consists of Cu, and the light reflection layer 12 which consists of Al was roll-joined mutually, as shown in FIG. Made of ashes. The base material layer 11 has the upper surface 3a (surface of Z1 side) of the base 3, the both side surfaces 3b of the longitudinal direction (X direction), and a part of lower surface 3c (surface of Z2 side). It is arrange | positioned so that the inner surface 11a may be covered. The light reflection layer 12 is disposed in a part of the bonding region 13 on the outer surface 11b of the base layer 11. In addition, the light reflection layer 12 is press-bonded to the area | region except the notch 10a among the bonding areas 13. That is, the light reflection layer 12 is arrange | positioned in a part of the bonding area | region 13 of the base material layer 11. As shown in FIG. Moreover, in the light reflection layer 12, the LED element 2 is adhere | attached on the upper surface 12a (surface of Z1 side), and the base material layer 11 is bonded to the lower surface 12b (surface of Z2 side). have.

Further, in the light reflection layer 12 made of Al, an oxide film (not shown) made of Al ₂ O ₃ having a very thin thickness is formed on the upper surface 12a (surface on the Z1 side). By this oxide film, it is suppressed that the light reflection layer 12 reacts with sulfur etc. in air.

In addition, in 1st Embodiment, as shown in FIG. 3, the thickness t1 of the heat dissipation board | substrate 1 in the junction area | region 13 which is the area | region where the base material layer 11 and the light reflection layer 12 were joined is It is larger than the thickness t2 of the thin plate part 14 which consists of areas other than the junction area | region 13. FIG. In addition, the thin plate part 14 is comprised only by the base material layer 11. Specifically, the pair of thin plate portions 14 are formed to sandwich the joining region 13 in the X direction. In addition, the step portions 15a and 15b are formed at the boundary between the bonding surface 13 and the pair of thin plate portions 14 on the outer surface 11b of the LED element 2 side of the base material layer 11. It is. Here, the stepped portion 15a is formed at the boundary between the thin plate portion 14 and the bonding region 13 on the X1 side, and the stepped portion 15b is formed of the thin plate portion 14 and the bonding region 13 on the X2 side. It is formed at the boundary of. The pair of thin plate portions 14 are formed to protrude from the stepped portion 15a on the X1 side of the bonding region 13 toward the X1 side, and from the stepped portion 15b on the X2 side of the bonding region 13. It is formed to protrude to the X2 side. In addition, the thin plate part 14 is an example of the "protrusion part" of this invention.

Moreover, in the heat radiation board | substrate 1, the height position (position of Z direction) of the joining area | region 13 side (X2 side) is made into the thin plate part 14 side (X1 side) with the step part 15a as a boundary. It is comprised so that it may become higher than a height position. Similarly, in the heat radiating board | substrate 1, it is comprised so that the height position of the junction area | region 13 side (X1 side) may become higher than the height position of the thin plate part 14 side (X2 side) with the step part 15b as a boundary. It is. On the other hand, as shown in FIG. 2, the step part is not formed in the inner surface 11a of the base 3 side of the base material layer 11, but is formed in substantially flat surface shape. Thereby, as shown in FIG. 3, the thickness t1 of the bonding area | region 13 is comprised so that it may become larger than the thickness t2 of the thin plate part 14. As shown in FIG.

Here, the thickness t2 of the thin plate portion 14 is about 0.1 mm. In the bonding region 13, the thickness t 3 of the light reflection layer 12 is about 10 μm, and the thickness t 4 of the base layer 11 is about 0.49 mm. That is, the thickness t4 (about 0.49 mm) of the base material layer 11 is larger than the thickness t2 (about 0.1 mm) of the thin plate portion 14 and the thickness t3 (about 10 μm) of the light reflection layer 12. In more detail, the base material layer 11 in the bonding area | region 13 has about 4.9 times the thickness of the thin-plate part 14, and has about 49 times the thickness of the light reflection layer 12. FIG. In addition, the thickness t1 of the bonding area | region 13 which added the thickness t3 of the light reflection layer 12 and the thickness t4 of the base material layer 11 is set to about 0.5 mm (= about 0.49 mm + about 10 micrometers).

In addition, the light reflection layer 12 (bonding region 13) is formed so as to extend from the end of one side (Y1 side) in the Y direction to the end of the other side (Y2 side) in the Y direction as shown in FIG. have. In addition, the light reflection layer 12 is an area | region except the notch 10a, and is formed in the area | region enclosed by the reflector 6 at least. Thereby, the light reflected layer 12 can reflect the light irradiated from the LED element 2 below (Z2 side, FIG. 2) toward upper (Z1 side, FIG. 2). In the bonding region 13, the substrate layer 11 and the light reflection layer 12 have a width W1 of about 5 mm in the Y direction and a length L1 of about 5 mm in the X direction.

In addition, the base material layer 11 consists of Cu of purity about 99.9% or more, such as oxygen free copper, tough pitch copper, and phosphorus phosphate copper. The light reflection layer 12 consists of Al of purity about 99% or more, such as JIS1100, JIS1050, JIS1070, JIS1080, and JIS1060, and is comprised so that light can be reflected. Here, the thermal conductivity [about 400W / (m × k)] of the base material layer 11 which consists of Cu is larger than the thermal conductivity [about 240W / (m × k)] of the light reflection layer 12 which consists of Al. In addition, the conductivity [about 60 × 10 ⁶ / (Ω × m)] of the base layer 11 made of Cu is the conductivity [about 35 × 10 ⁶ / (Ω × m)] of the light reflection layer 12 made of Al]. Greater than That is, the base material layer 11 is made of a material which is easier to receive heat and easier to dissipate heat than the light reflection layer 12 and is made of a material having high conductivity.

2, the thin plate part 14 of the heat radiation board | substrate 1 is comprised so that the base 3 may be covered. Specifically, in the thin plate portion 14 of the heat dissipation substrate 1, the boundary between the upper surface 3a of the base 3 and both side surfaces 3b in the X direction, the lower surface 3c of the base 3, The boundary between the two side surfaces 3b in the X direction is bent at approximately right angles, whereby the thin plate portion 14 is positioned near the end of the upper surface 3a of the base 3, the two side surfaces 3b in the X direction, and the base ( A part of the lower surface 3c of 3) is covered. In addition, the heat radiation board | substrate 1 has a length of about 20 mm in a X direction in the state which is not bending.

In addition, a plating layer 16 is formed on the surface of the thin plate portion 14 of the heat dissipation substrate 1 (on the outer surface 11b of the base layer 11). The plating layer 16 is formed of at least the region where the solders 101a and 101b are arranged, and is made of a material having better wettability than Cu constituting the base layer 11. Specifically, the plating layer 16 is on the heat dissipation substrate 1 on the outer surface 11b of a part of the Z2 side of the region corresponding to the side surface 3b of the base 3 and on the lower surface of the base 3. It is formed on the outer surface 11b of the area | region corresponding to (3c). That is, the plating layer 16 is formed in a part of the side part of the heat radiation board | substrate 1, and the lower part of the heat radiation board | substrate 1. Thereby, a part of heat transmitted from the LED element 2 to the heat dissipation board | substrate 1 is comprised so that it may be transmitted to the printed circuit board 102 side through the solders 101a and 101b.

In addition, as shown in FIG. 4, the plating layer 16 is Ni layer 16a, Pd layer 16b, and Au layer 16c from the side near the outer surface 11b of the base material layer 11 which consists of Cu. ) Has a laminated structure in this order. Here, the Au layer 16c has better wettability with respect to the solders 101a and 101b than the base layer 11 (Cu). Moreover, thickness t5 of Ni layer 16a is about 0.5 micrometer or more and about 1.5 micrometer or less. In addition, the thickness t6 of the Pd layer 16b is about 0.02 micrometer or more and about 0.06 micrometer or less. In addition, the thickness t7 of the Au layer 16c is about 0.001 micrometer or more and about 0.005 micrometer or less.

Next, with reference to FIGS. 1-7, the manufacturing process of the LED module 100 by 1st Embodiment of this invention is demonstrated.

First, a Cu plate made of Cu having a length of about 60 mm in a predetermined direction (X direction) and extending in the Y direction orthogonal to the X direction, and having a length of about 60 mm in the X direction, extending in the Y direction An Al plate made of Al is prepared. In addition, the thickness of a Cu board is about 49 times the thickness of an Al board. And Cu board and Al board are rolled (rolling joining) in the state which Al board is arrange | positioned in the substantially whole surface on the surface of Cu board. Subsequently, by diffusing annealing the Cu plate and the Al plate, as shown in FIG. 5, the light reflection layer 12 made of Al is formed on almost the entire surface on the outer surface 11b of the base layer 11 made of Cu. By forming the joined clad structure, the heat radiation substrate material 200 made of the clad material is formed. In addition, the heat radiation board | substrate material 200 is an example of the "substrate material" of this invention.

Then, the heat dissipation substrate material 200 is mechanically cut from the Z1 side in the thickness direction (Z direction) except for the region corresponding to the bonding region 13. Thereby, as shown in FIG. 6, the step part 15a is formed in the X1 side of the junction area | region 13 so that the junction area | region 13 may be inserted, and the step | step difference in the X2 side of the junction area | region 13 is carried out. The part 15b is formed. Moreover, the thin plate part 14 which has the thickness t2 (refer FIG. 3) smaller than the thickness t1 (refer FIG. 3) of the junction area | region 13 on the X1 side of the step part 15a, and the X2 side of the step part 15b. Is formed. Thereby, the joining area | region 13 to which the base material layer 11 and the light reflection layer 12 were bonded, and the thin-plate part 14 which consists only of the base material layer 11 alternately to the heat radiating substrate material 200 in the X direction. Is placed. As a result, a plurality of portions corresponding to the heat dissipation substrate 1 are formed so as to be arranged in plural in the X direction and the Y direction.

Thereafter, the Ni layer 16a, the Pd layer 16b, and the Au layer are formed at predetermined positions on the surface of the thin plate portion 14 (on the outer surface 11b of the base layer 11) by the plating treatment. (C) (refer FIG. 4) is laminated | stacked in this order, and the plating layer 16 is formed.

And as shown in FIG. 7, the notch part 10a extended in a Y direction is formed in each joining area | region 13 of the heat radiation board | substrate material 200 by press work. Thereafter, the base 3 and the reflector 6 are formed in each of the portions corresponding to the heat dissipation substrate 1 of the heat dissipation substrate material 200 by insert molding. At the same time, the boundary between the upper surface 3a of the base 3 and the two side surfaces 3b in the X direction and the boundary between the lower surface 3c of the base 3 and the both side surfaces 3b in the X direction are approximately perpendicular to each other. By bending, the thin plate part 14 is bent so that the base 3 may be covered.

Specifically, the heat radiation substrate material 200 is cut along the Y direction so as to follow the cutting line 200a (see FIG. 6). The thin plate portion 14 located on the X1 side of the cutting line 200a is bent to the base 3 on the X1 side of the cutting line 200a, and is located on the X2 side of the cutting line 200a. The thin plate portion 14 is bent to the base 3 on the X2 side of the cutting line 200a. Thus, the heat dissipation substrate material 200 is formed in a state in which portions corresponding to the individual heat dissipation substrates 1 are separated from each other in the X direction. Moreover, the connection part 201 for forming each of the part corresponding to the heat dissipation board | substrate 1 in the Y direction is formed between each Y direction of the part corresponding to the heat dissipation board | substrate 1, and is formed.

Thereafter, the LED element 2 is mounted on the heat dissipation board 1. A pair of electrodes (not shown) formed on the upper surface side of the LED element 2 are connected to one end of the Au wire 5a and one end of the Au wire 5b by ultrasonic welding, respectively. Moreover, by ultrasonic welding, the X1 side and X2 side of the light reflection layer 12 of the heat radiation board | substrate 1, the other end of the Au wire 5a, and the other end of the Au wire 5b are connected, respectively. At this time, when the Au wires 5a and 5b are welded to the base layer 11 made of Cu, the Au wires 5a and 5b in the base layer 11 are caused due to the reaction of Cu with oxygen in the atmosphere. Vulnerable oxides are formed in the welded portion with the. This weakens the bonding between the heat dissipation substrate 1 and the Au wires 5a and 5b. On the other hand, in 1st Embodiment, when Au wire 5a and 5b are welded to the light reflection layer 12 which consists of Al as mentioned above, only the oxide film of the welding part among the oxide films of the light reflection layer 12 will peel off, The Au wires 5a and 5b and the exposed Al of the light reflection layer 12 are directly bonded. Thereby, it is possible to firmly bond the heat radiating board | substrate 1 and Au wire 5a and 5b.

Then, the sealing resin 7 is disposed and solidified in the space formed by the reflector 6 and the heat dissipation substrate 1 so as to cover the LED element 2 and the Au wires 5a and 5b. Thereby, the heat radiation board | substrate material 200 with which the part in which the LED module 100 was formed is provided in multiple numbers is formed.

And the some LED module 100 is isolate | separated in the connection part 201. As a result, the portions corresponding to the individual heat dissipation substrates 1 are separated from each other not only in the X direction but also in the Y direction, thereby forming a plurality of LED modules 100. Finally, the LED module 100 is connected to the printed circuit board 102 in which Cu wiring 102a and 102b was formed using the solder 101a and 101b. Thereby, the LED module 100 connected to the printed circuit board 102 shown in FIG. 1 and FIG. 2 is manufactured.

In the first embodiment, as described above, the heat dissipation substrate 1 is bonded to the LED element 2 on the upper surface 12a and provided with a light reflection layer 12 made of Al, whereby the surface is thinly oxidized. Al formed with a film (not shown) hardly reacts with sulfur in the air, so Ag ₂ S or the like is not formed as a deposit. Thereby, since the reflection amount of the light in the light reflection layer 12 which consists of Al can be suppressed from reducing, it can suppress that the light quantity in the LED module 100 falls.

In addition, in 1st Embodiment, the heat-radiation board | substrate 1 is a base material layer 11 which consists of Cu, and the light reflection layer 12 which consists of Al is a part of the bonding area | region 13 of the base material layer as mentioned above. In the manufacturing process, unlike the case where the light reflection layer 12 is formed by the plating process, holes (pinholes) in which Al is not disposed are formed in the light reflection layer 12. It can be suppressed. Thereby, it can suppress that the reflection amount of the light in the light reflection layer 12 decreases due to a pinhole.

In addition, in the first embodiment, as described above, by using the base layer 11 made of Cu having high thermal conductivity, the heat generated by the LED element 2 can be easily used as the base layer 11. Since heat can be radiated through, it is possible to suppress deterioration in the light emission characteristics of the LED element 2 due to heat generation.

In addition, in 1st Embodiment, the thickness t1 of the heat dissipation board | substrate 1 in the junction area | region 13 which is the area | region where the base material layer 11 and the light reflection layer 12 were bonded as mentioned above is made into the base material layer 11 Only and having a thickness larger than the thickness t2 of the thin plate portion 14 composed of regions other than the bonding region 13, the heat dissipation substrate 1 is bent to cover the base 3 in the thin plate portion 14 easily. can do. Moreover, the heat from the LED element 2 can be transmitted by the heat dissipation board | substrate 1 by the big junction area | region 13 of thickness t1.

In the first embodiment, as described above, in the thin plate portion 14 of the heat dissipation substrate 1, the boundary between the upper surface 3a of the base 3 and both side surfaces 3b in the X direction, and the base ( By bending the boundary between the lower surface 3c of 3) and the side surfaces 3b in the X-direction at approximately right angles, the thin plate portion 14 which can be easily deformed can be easily bent.

In addition, in the first embodiment, as described above, the step portion 15a is formed at the boundary between the thin plate portion 14 and the bonding region 13 on the X1 side, and the thin plate portion 14 and the bonding region on the X2 side. By forming the stepped portion 15b at the boundary of (13), the junction region 13 having a large thickness t1 and the small thickness t2, which are easy to bend, can be easily set as the boundary between the stepped portions 15a and 15b. Thin plate portion 14 can be formed on the heat dissipation substrate 1.

In addition, in the first embodiment, the plating layer 16 is formed in at least the region where the solders 101a and 101b are arranged as described above and includes a material Au having better wettability than the base layer 11 (Cu). ), The base layer 11 made of Cu and the solders 101a and 101b can be easily connected through the plating layer 16. Thus, the base layer 11 and the printed board ( 102 can be easily connected with the solders 101a and 101b.

In the first embodiment, the thin plate portion 14 is formed by forming the thickness t4 (about 0.49 mm) of the base material layer 11 to be larger than the thickness t2 (about 0.1 mm) of the thin plate portion 14 as described above. Can be more easily bent to cover the base 3, and the heat from the LED element 2 can be easily dissipated by the bonding region 13 of the base layer 11.

In the first embodiment, as described above, the thickness t3 of the light reflection layer 12 is about 10 µm, and the thickness t4 of the base layer 11 is about 0.49 mm, so that light can be reliably reflected. Heat from the LED element 2 in the junction region 13 having a thickness t4 of about 0.49 mm larger than the thickness t3 of the light reflection layer 12 while forming the light reflection layer 12 to have a thickness t3 of μm. It can make heat dissipation more easily.

In addition, in the first embodiment, as described above, the heat dissipation substrate material 200 is formed in a state in which portions corresponding to the heat dissipation substrate 1 are separated from each other in the X direction, and correspond to the heat dissipation substrate 1. A plurality of heat dissipation substrates 1 are formed on one heat dissipation substrate by forming a connection portion 201 for separating the portions corresponding to the heat dissipation substrate 1 in the Y direction between the respective Y directions of the portions to be separated. It can manufacture easily from the dragon material 200.

In addition, in 1st Embodiment, in the thin plate part 14 of the heat radiation board | substrate 1 as mentioned above, the boundary between the upper surface 3a of the base 3, and both side surfaces 3b of the X direction, and the base 3 The boundary between the lower surface 3c of the bottom surface 3c and the two side surfaces 3b in the X direction is bent at approximately right angles, so that the thin plate portion 14 is near the end of the upper surface 3a of the base 3 and both sides in the X direction. By bending to cover a part of the lower surface 3c of the base 3 and the base 3, the contact area between the base layer 11 and the base 3 can be increased, so that the heat of the base layer 11 is increased. It can convey by the base 3.

In addition, in 1st Embodiment, as above-mentioned, the plating layer 16 is formed in a part of the side part of the heat dissipation board | substrate 1, and the lower part of the heat dissipation board | substrate 1, and not only the base 3c but also the lower surface 3c of the base 3 is carried out. Since the plating layer 16 is located also at the side surface 3b of (3), the base is made of solder 101a and 101b disposed not only on the lower surface 3c of the base 3 but also on the side surface 3b of the base 3. (3) and the printed circuit board 102 which controls the LED element 2 can be connected. Thereby, the base 3 can be fixed to the printed circuit board 102 reliably.

In the first embodiment, as described above, the light reflection layer 12 is formed in the region surrounded by the reflector 6 at least, so that the light reflection layer formed in the region surrounded by the reflector 6 and the reflector 6 ( Since the light from the LED element 2 can be fully reflected by 12), the fall of light quantity in the LED module 100 using the heat radiating board | substrate 1 can be suppressed more.

In addition, in 1st Embodiment, by forming the inner surface 11a by the side of the base 3 of the base material layer 11 in substantially flat surface shape as mentioned above, the upper surface 3a of the base 3, Since it can make close contact with the side surface 3b and the lower surface 3c, it can make it easy to transfer the heat which the LED element 2 generate | occur | produces to the base 3.

(Second Embodiment)

Next, a second embodiment of the present invention will be described with reference to Figs. 8 and 9. Fig. In the second embodiment, unlike the first embodiment, the light reflection layer 312 is embedded in the groove portion 311c formed in the base layer 311 in the heat dissipation substrate 301 of the LED module 300. The case will be described. In addition, the LED module 300 is an example of the "light emitting module" of this invention, and the heat radiating board | substrate 301 is an example of the "light emitting element substrate" and "light emitting element substrate main body" of this invention.

In the second embodiment of the present invention, as shown in FIG. 8, the groove portion 311c is formed in the base layer 311 of the heat dissipation substrate 301 of the LED module 300. The groove portion 311c has a length L2 of about 3 mm in the X direction at the center portion and its periphery on the outer surface 311b corresponding to the upper surface 3a of the base 3.

Moreover, the base material layer 311 and the light reflection layer 312 are roll-bonded with each other in the state in which the light reflection layer 312 was embedded in the groove part 311c. That is, the heat dissipation substrate 301 is made of a clad material having a clad structure. Moreover, in the light reflection layer 312, the LED element 2 is adhere | attached on the upper surface 312a, and the base material layer 311 is bonded to the lower surface 312b. Further, by being embedded in the groove portion 311c, the light reflection layer 312 has a length L2 of about 3 mm in the X direction.

Moreover, periphery parts 316a and 316b which consist only of the base material layer 311 are formed in the both ends of the bonding area | region 313 which is the area | region where the base material layer 311 and the light reflection layer 312 were joined, respectively. The peripheral portion 316a is formed to protrude from the end on the X1 side of the bonding region 313 to the X1 side, and the peripheral portion 316b is formed to protrude from the end on the X2 side of the bonding region 313 to the X2 side. In addition, the thickness of the bonding area | region 313, the thickness of the peripheral part 316a, and the thickness of the peripheral part 316b are comprised so that all may become substantially the same. In addition, the peripheral parts 316a and 316b are an example of the "protrusion part" of this invention.

In addition, step portions 315a and 315b are formed on the outer surface 311b of the LED element 2 side of the base material layer 311 and on the X1 side of the peripheral portion 316a and the X2 side of the peripheral portion 316b, respectively. It is. Further, thin plate portions 314 are formed on the side opposite to the junction region 313 of the stepped portion 315a and on the side opposite to the junction region 313 of the stepped portion 315b. Here, the thickness of the thick plate portion composed of the bonding region 313 and the peripheral portions 316a and 316b is larger than the thickness of the thin plate portion 314 composed of the regions other than the bonding region 313 and the peripheral portions 316a and 316b. Further, the thick plate portion composed of the bonding region 313, the peripheral portion 316a and the peripheral portion 316b has a length L3 of about 5 mm in the X direction. In addition, the thin plate part 314 is an example of the "protrusion part" of this invention.

In the second embodiment, the light reflection layer 312 is embedded in the groove portion 311c, so that the light reflection layer 312 is embedded in the upper surface 312a of the light reflection layer 312 in the bonding region 313 and the region around the bonding region 313. The outer surface 311b of the base material layer 311 in a substantially flat surface shape is connected. As a result, both side surfaces of the light reflection layer 312 in the X direction are configured to contact the inner surface of the groove portion 311c.

The light reflection layer 312 is a region excluding the cutout portion 10a and is formed at least in the region surrounded by the reflector 6. The light reflection layer 312 is disposed in a part of the bonding region 313 of the base layer 311. In addition, the other structure of 2nd Embodiment of this invention is the same as that of the said 1st Embodiment.

Next, with reference to FIG. 9, the manufacturing process of the LED module 300 by 2nd Embodiment of this invention is demonstrated.

First, a Cu plate having a length of about 60 mm in a predetermined direction (X direction) and extending in the Y direction orthogonal to the X direction is prepared. Then, the grooves 311c (see Fig. 9) having a predetermined length in the X direction are formed on the Cu plate at equal intervals in the X direction so as to extend in the Y direction. Further, an Al plate made of Al which has a width substantially the same as that of the groove portion 311c in the X direction and extends in the Y direction is prepared. And Cu plate and Al plate are rolled (rolled joining) in the state which has arrange | positioned Al plate in each of the some groove part 311c extended in the Y direction of a Cu plate. Subsequently, by diffusing annealing the Cu plate and the Al plate, as shown in FIG. 9, the base layer layer 311 made of Cu and the plurality of light reflection layers 312 made of Al are joined in the bonding region 313. The formed cladding structure is formed, whereby the heat dissipation substrate material 400 made of the cladding material is formed. At this time, the length L2 in the X direction of the light reflection layer 312 embedded in the groove portion 311c and the groove portion 311c is about 3 mm. In addition, the heat radiation board | substrate material 400 is an example of the "substrate material" of this invention.

And the area | region except the joining area | region 313 and the peripheral parts 316a and 316b is rolled with a rolling roll. As a result, the step portions 315a and 315b are formed so as to sandwich the joining region 313 and the peripheral portions 316a and 316b, and a thick plate portion composed of the bonding region 313 and the peripheral portions 316a and 316b. The thin plate portions 314 are alternately arranged in the X direction. As a result, a plurality of portions corresponding to the heat dissipation substrate 301 (see Fig. 8) are formed in the X direction and the Y direction. In addition, the other manufacturing process of 2nd Embodiment of this invention is the same as that of the said 1st Embodiment.

In the second embodiment, as described above, the heat-radiating base material 301 is made of Al by adhering the LED element 2 to the upper surface 312a and providing the light reflection layer 312 made of Al. The decrease in the amount of reflection of light in the reflective layer 312 can be suppressed. Further, the heat dissipation base material 301 is made of a clad material having a clad structure in which the light reflection layer 312 made of Al and the base material layer 311 made of Cu are roll-bonded with each other, whereby the light reflection layer ( It is possible to suppress the decrease in the amount of reflection of light in 312). In addition, by using the base layer 311 made of Cu having high thermal conductivity as the heat dissipation base material 301, it is possible to suppress deterioration in the light emission characteristics of the LED element 2 due to heat generation.

In addition, in 2nd Embodiment, the light reflection layer 312 is embedded in the groove part 311c as mentioned above, and the upper surface 312a of the light reflection layer 312 in the junction area 313, and the junction area 313 is carried out. The outer surface 311b of the base material layer 311 in the surrounding area is connected so as to have a substantially flat surface shape, whereby the heat generated by the LED element 2 is generated by the lower surface 312b of the light reflection layer 312. Not only from the above, but also from both sides of the light reflection layer 312 in the X direction can be transferred to the base layer 311. Thereby, the heat which the LED element 2 generate | occur | produces can be dissipated more effectively through the base material layer 311. FIG. In addition, the other effect of 2nd Embodiment is the same as that of the said 1st Embodiment.

(Modification of 2nd Embodiment)

Next, with reference to FIG. 8, FIG. 10, and FIG. 11, the modification of 2nd Embodiment of this invention is demonstrated. In the modified example of the second embodiment, unlike the second embodiment, when the heat dissipation substrate material 500 is formed such that a plurality of portions corresponding to the heat dissipation substrate 301 are arranged only in the Y direction. Explain about. In addition, the structure (refer FIG. 8) of the LED module 300 in the modification of 2nd Embodiment of this invention is the same as that of the said 2nd Embodiment. In addition, the heat radiation board | substrate material 500 is an example of the "board | substrate material" of this invention.

In the manufacturing method of the LED module 300 in the modification of 2nd Embodiment of this invention, first, it has a length of about 10 mm in a predetermined direction (X direction), and extends in the Y direction orthogonal to a X direction. A Cu plate made of Cu is prepared. And the groove part 311c (refer FIG. 10) which has predetermined length in a X direction is formed in the substantially center part of the X direction of a Cu board so that it may extend in a Y direction. Further, an Al plate made of Al which has a width substantially the same as that of the groove portion 311c in the X direction and extends in the Y direction is prepared. And Cu plate and Al plate are rolled (rolled joining) in the state which has arrange | positioned Al plate in the groove part 311c extended in the Y direction of Cu plate. After that, by annealing the Cu plate and the Al plate, as shown in FIG. 10, the cladding layer of the base layer 311 made of Cu and the light reflection layer 312 made of Al is bonded in the bonding region 313. By forming the structure, the heat radiation substrate material 500 made of the clad material is formed.

Then, the heat dissipation substrate material 500 is cut along the X direction so as to follow the cutting line 500a. As a result, as shown in FIG. 11, a plurality of heat dissipation substrates 301 are formed. Thereafter, the regions other than the bonding region 313 and the peripheral portions 316a and 316b of the individual heat dissipation substrate 301 are coined. As a result, the step portions 315a and 315b are formed so as to sandwich the joining region 313 and the peripheral portions 316a and 316b, and a thick plate portion composed of the bonding region 313 and the peripheral portions 316a and 316b. The thin plate portion 314 is formed.

As shown in FIG. 8, the plating layer 16 is formed at a predetermined position of the thin plate portion 314 by the plating treatment, and the cutout portion 10a is formed on the heat dissipation substrate 301 by press working. To form. Thereafter, the base 3 and the reflector 6 are formed by insert molding, and the thin plate portion 314 is bent to follow the base 3. Thereafter, the LED element 2 is mounted on the heat dissipation board 301 and the Au wires 5a and 5b are connected. And one LED module 300 is formed by arrange | positioning sealing resin 7. Finally, the LED module 300 is connected to the printed circuit board 102 using the solders 101a and 101b. Thereby, the LED module 300 connected to the printed circuit board 102 shown in FIG. 8 is manufactured.

In addition, the other effect of the modification of 2nd Embodiment is the same as that of the said 2nd Embodiment.

It is also to be understood that the embodiments disclosed herein are illustrative and non-restrictive in all respects. The scope of the present invention is not described in the above embodiments, but is disclosed by the claims, and includes all changes within the scope and meaning equivalent to the scope of the claims.

For example, in the said 1st and 2nd embodiment, the light reflection layer 12 (312) is used as the junction region [13 (313)] of the outer surface 11b (311b) of the base material layer 11 (311). Although the example arrange | positioned at a part was shown, this invention is not limited to this. In the present invention, the light reflection layer 12 (312) may be disposed on the entire surface on the outer surface 11b (311b) of the base layer 11 (311). In addition, you may arrange | position the light reflection layer 12 (312) in the whole bonding area | region 13 (313) of the base material layer 11 (311).

In addition, in the said 1st and 2nd embodiment, the base material layer 11 (311) consists of Cu of about 99.9% or more purity, and the light reflection layer 12 (312) consists of Al of about 99% or more purity. Although shown, this invention is not limited to this. In the present invention, the base layer [11 (311)] may be configured to be made of a Cu alloy having a purity of about 99.9% or less, such as C19400 (CDA standard) made of Cu-2.30Fe-0.10Zn-0.03P. . Further, the light reflection layer 12 (312) may be configured to be made of an Al alloy having an Al purity of about 99% or less.

In addition, in the said 1st Embodiment, the example which made thickness t1 of the bonding area | region 13 to which the base material layer 11 and the light reflection layer 12 join is larger than the thickness t2 of the thin plate part 14, The said In 2nd Embodiment, although the thickness of the thick plate part containing the junction area | region 313 to which the base material layer 311 and the light reflection layer 312 are joined was shown larger than the thickness of the thin plate part 314, this invention was shown. Is not limited to this. In the present invention, the thickness of the entire heat dissipation substrate 1 (301) may be approximately the same thickness. Thereby, it is not necessary to perform the process for making a thickness different with respect to the heat radiation board | substrate 1 (301), and it is possible to simplify a manufacturing process. At this time, the heat radiation substrate [1 301] does not need to be bent.

In addition, although the example which made thickness t2 of the thin plate part 14 into about 0.1 mm was shown in the said 1st Embodiment, this invention is not limited to this. In the present invention, the thickness t2 of the thin plate portion 14 may not be about 0.1 mm. The thickness t2 of the thin plate portion 14 is preferably about 0.05 mm or more and about 0.5 mm or less and smaller than the thickness t1 of the bonding region 13 of the base material layer 11.

In addition, although the thickness t3 of the light reflection layer 12 was made into about 10 micrometers, and the thickness t4 of the base material layer 11 was made into about 0.49 mm in the said 1st Embodiment, the present invention is not limited to this. Do not. In this invention, the thickness t3 of the light reflection layer 12 may not be about 10 micrometers, and the thickness t4 of the base material layer 11 may not be about 0.49 mm. The thickness t3 of the light reflection layer 12 is preferably about 1 µm or more and about 50 µm or less, and more preferably about 1 µm or more and about 10 µm or less. Thereby, since the thickness t3 of the light reflection layer 12 is sufficiently small, it is possible to transfer heat to the base material layer 11 which is more excellent in heat dissipation than the light reflection layer 12. Moreover, it is preferable that thickness t4 of the base material layer 11 is about 0.1 mm or more and about 3 mm or less. In addition, it is preferable that the thickness t4 of the base material layer 11 is 10 times or more of the thickness t3 of the light reflection layer 12.

In the first embodiment, in the bonding region 13, the base layer 11 and the light reflection layer 12 have a width W1 of about 5 mm in the Y direction and a length of about 5 mm in the X direction. Although the example formed so that it may have L1 was shown, this invention is not limited to this. In the present invention, in the bonding region 13, the base layer 11 and the light reflection layer 12 may be formed to have a width W1 of about 2 mm or more and about 5 mm or less in the Y direction, and about 5 in the X direction. You may form so that it may have length L1 of mm or more and 10 mm or less.

In addition, although the example which formed the light reflection layer 312 in the 2nd embodiment so that it has length L2 of about 3 mm in the X direction was shown, this invention is not limited to this. In the present invention, the reflective layer 312 may be formed to have a length L2 of about 2 mm or more and about 3 mm or less in the X direction.

In the second embodiment, the light reflection layer 312 is embedded in the groove portion 311c, so that the upper surface 312a of the light reflection layer 312 in the bonding region 313 and the surroundings of the bonding region 313 are formed. Although the example which connected the outer surface 311b of the base material layer 311 in an area to substantially flat surface shape was shown, this invention is not limited to this. In the present invention, the upper surface 312a of the light reflection layer 312 and the outer surface 311b of the base material layer 311 may be connected by a step. At this time, the upper surface 312a of the light reflection layer 312 is located below the outer surface 311b of the base layer 311 from the entire surface of both side surfaces of the light reflection layer 312 in the X direction. 311) is preferable because it is possible to transmit heat.

In the above first and second embodiments Despite an example base 3 and a reflector 6 are made of alumina (Al ₂ O _3), the invention is not limited to this. For example, you may comprise so that the base 3 and the reflector 6 may consist of aluminum nitride (AlN).

Further, in the second embodiment, the Cu plate and the Al plate are placed in each of the plurality of groove portions 311c extending in the Y direction of the Cu plate, with Al plates having substantially the same width as the groove portions 311c. While the example of rolling and forming the heat dissipation substrate material 400 is shown, in the modification of the second embodiment, the groove portion 311c extending in the Y direction of the Cu plate has a width substantially the same as that of the groove portion 311c. Although the example in which the Cu board and Al board were rolled and the heat-dissipation board | substrate 500 was formed in the state which has the Al plate which has it was shown, this invention is not limited to this. In the present invention, by rolling the Cu plate and the Al plate in a state where the Al plate is disposed on the substantially entire surface on the surface of the Cu plate on which the groove is not formed, Al is almost the entire surface on the outer surface of the base layer made of Cu. The cladding material which the light reflection layer which consists of is joined is formed. Thereafter, among the light reflection layers bonded to the substantially entire surface on the outer surface of the substrate layer, the light reflection layer in the region excluding the periphery of the LED element is mechanically or chemically removed, thereby modifying the second embodiment and the second embodiment. An example heat radiation substrate material 400 (500) may be formed.

In addition, although the said 1st and 2nd embodiment showed the example which used the heat radiation board | substrate 1 (301) for the LED module 100 (300) which has the LED element 2, this invention is not limited to this. Do not. For example, you may use the heat radiation board | substrate 1 (301) for the laser element module which emits a laser beam.

1, 301: heat dissipation substrate (light emitting element substrate, light emitting element substrate body)
2: LED element (light emitting element)
3: expectation
3a: upper surface
3b: Side
3c: if
6: reflector
11, 311: base material layer
12, 312: light reflection layer
13, 313: junction area
14, 314: thin plate part (protrusion part)
15a, 15b, 315a, 315b: stepped portion
16: plating layer
100, 300: LED module (light emitting module)
316a, 316b: peripheral part (projection part)
200, 400, 500: material for heat dissipation substrate (substrate material)

Claims (20)

The light emitting element 2 is provided with the light reflection layer 12 which consists of Al or Al alloy arrange | positioned at the surface 12a, and the base material layer 11 which consists of Cu or Cu alloy,
The base material layer has a bonding region 13 that can be bonded to the light reflection layer,
The light reflection layer is a light emitting element substrate (1), wherein the light reflection layer is press-bonded to all or part of the bonding region of the base layer. The said light reflection layer is a light emitting element substrate of Claim 1 provided in the said junction area | region provided in at least one part of the said base material layer. The light emitting element according to claim 1, wherein the base layer further has a protrusion 14 provided with a portion having a thickness equal to or less than the total thickness of the light reflection layer and the base layer in the bonding region so as to protrude from the bonding region. Substrate. The light emitting element substrate according to claim 3, wherein the protrusion is formed at least in a region to be bent. The light emitting element substrate according to claim 3, wherein a stepped portion (15a) is formed between the bonding region of the base layer and the protrusion. 4. The plating layer 16 according to claim 3, wherein at least a part of the surface at the protruding portion of the substrate layer is formed with a plating layer 16 containing a material having better wettability to solder than the substrate layer made of Cu or a Cu alloy. Light emitting element substrate. 7. The light emitting element substrate main body 1 according to claim 6, wherein the substrate main body 1 having the clad structure has an upper surface 3a of the base 3 supporting the light emitting element substrate main body from a side opposite to the side where the light emitting element is disposed; It is bent to cover the side surface 3b and the lower surface 3c,
The said plating layer is provided in the lower part of the said light emitting element substrate main body which covers the lower surface of the said base, and the side part of the said light emitting element substrate main body which covers the side surface of the said base. The light emitting element substrate according to claim 3, wherein a thickness of the bonding region of the base layer is larger than a thickness of the protruding portion of the base layer. The light emitting element substrate according to claim 1, wherein a thickness of the bonding region of the base layer is larger than a thickness of the light reflection layer. The substrate for light emitting elements according to claim 9, wherein the thickness of the bonding region of the base layer is at least 10 times the thickness of the light reflection layer. The light emitting element substrate according to claim 10, wherein the bonding region of the substrate layer is 0.1 mm or more and 3 mm or less, and the thickness of the light reflection layer is 1 µm or more and 50 µm or less. The light emitting element substrate according to claim 11, wherein the light reflection layer has a thickness of 1 µm or more and 10 µm or less. The substrate for light emitting elements according to claim 1, wherein the junction region to which the light reflection layer is bonded is formed in a region surrounded by the reflector (6) formed to surround at least the light emitting element. The light emitting device substrate body having the clad structure is bent to cover the top, side, and bottom surfaces of the base supporting the light emitting device substrate body from a side opposite to the side where the light emitting device is disposed. ,
The stepped portion is formed on the surface of the side on which the light emitting element is disposed, and the surface 12b on the side opposite to the side on which the light emitting element is disposed of the base layer is formed to have a substantially flat surface shape. A substrate for light emitting elements. The method of claim 1, wherein the light reflection layer 312 is embedded in the base layer 311,
The surface 312a of the light reflection layer embedded in the substrate layer and the surface 311b of the substrate layer located around the junction region 313 are connected in a substantially flat surface shape. (301). It is a substrate material 200 including the part used as the some light emitting element substrate 1,
Each of the plurality of light emitting element substrates includes a light reflection layer 12 made of Al or an Al alloy on which the light emitting element 2 is disposed on the surface 12a, and a base layer 11 made of Cu or Cu alloy. The base layer has a bonding region 13 that can be bonded to the light reflection layer, and the light reflection layer is press-bonded to all or part of the bonding region of the base layer.
The part used as the said board | substrate for light emitting elements is each comprised separably. A light emitting element 2,
The light emitting element includes a light reflection layer 12 made of Al or an Al alloy disposed on the surface 12a, and a base layer 11 made of Cu or a Cu alloy, wherein the base layer is joined to the light reflection layer. The light reflection layer has the area | region 13, The light-emitting element substrate 1 which is press-contacted with respect to all or one part of the said bonding area | region of the said base material layer,
A light emitting module (100) having a base (3) disposed on the side opposite to the light reflection layer of the base layer along the surface (3a). The light emitting module according to claim 17, wherein the light reflection layer is formed in the bonding region provided on at least part of the substrate layer. 18. The projection portion according to claim 17, wherein the base layer is formed at least in a region to be bent and provided with a portion having a thickness equal to or less than the total thickness of the light reflection layer and the base layer in the bonding region so as to protrude from the bonding region. Have 14 more,
A projection module of the base layer is disposed on the base in a bent state so as to cover the side surfaces (3b) and the lower surface (3c) of the base. The light emitting module according to claim 19, wherein a stepped portion (15a) is formed between the joining region and the protrusion of the base layer.

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