KR20140013838A - Solder ball mounting apparatus using gravity, solder ball mounting system and method for mounting solder ball using the same - Google Patents

Abstract

A solder ball mounting method according to the present invention includes the following steps of: (A) arranging a printed circuit board in order to mount solder balls; (B) positioning the printed circuit board between a table of a solder ball mounting apparatus and a mask for mounting; (C) supplying multiple solder balls to the mask for mounting, generating a vibration to the table of the solder ball mounting apparatus by the control of a control unit, and respectively tilting the table in a left and right direction at an acute angle; (D) determining whether the control unit fills opening parts of the mask for mounting with the solder balls or not; and (E) generating a vibration to the table and repetitively tilting the table again in the left and right direction respectively at an acute angle by the control unit depending on the determination result. [Reference numerals] (400) Control unit; (500) Display unit

Description

Solder ball mounting apparatus using self weight, solder ball mounting system including the same and solder ball mounting method using the same {Solder ball mounting apparatus using gravity, solder ball mounting system and method for mounting solder ball using the same}

The present invention relates to a solder ball mounting apparatus using its own weight, a solder ball mounting system including the same, and a solder ball mounting method using the same.

Background Art Conventionally, applications of a flip chip method of forming solder bumps on a printed circuit board (PCB) and mounting a device thereon are gradually increasing.

In particular, in the case of a CPU and graphics computing device that computes large amounts of data at high speed, a board and a device are connected by solder bumps using a Au wire. There is a rapid increase in the transition to the flip chip method with improved connection resistance.

These solder bumps are formed by printing and reflowing solder paste onto a substrate, by forming microscopic solder balls on a substrate, and by directly or masking molten solder onto the substrate. It can be classified into a method of injecting and forming using. The solder bumps formed on the substrate are melted to be connected to the Cu pads or solder bumps formed on the chip to bond between the metals.

A method of forming such a solder bump is as described in Korean Patent Laid-Open Publication No. 2008-0014143 (published on February 13, 2008), and after forming openings having the same size in a mask, the solder balls are squeeged. By squeezing, ball holes are mounted through the mask opening to the input / output pads of the substrate, or in the jig, vacuum holes are formed in the same manner as the substrate pattern, and the solder balls are picked up by vacuum. An example is a method of mounting on a substrate by picking up.

In the case of the pick-up method, in the process of first forming the vacuum holes of the jig by mechanical processing and chemically etching, as the number of solder balls increases and the pitch between the balls decreases, the processing ratio of the vacuum holes increases rapidly. In addition, there is a size constraint when forming the vacuum hole of the jig, and the ball may not be picked up sufficiently by the vacuum, causing the ball to fall off the jig and cause defects.

In addition, when picking up and mounting solder balls, when the jig is contaminated by flux applied to the substrate, unwanted solder balls are picked up on the jig part contaminated with the flux and are mounted on the substrate. It also causes.

On the other hand, in the case of the ball placing method, the solder ball is pressed by the squeegee during the process of mounting the solder ball by squeezing the solder ball into the mask and squeeging it, or blocking the hole of the mask, or during squeegeeing. Solder balls may hit each other, breaking the surface, causing rapid oxidation.

Therefore, this defect causes solder balls to fail to metal bond with the input / output pads of the substrate during the reflow process.

An aspect of the present invention is to provide a solder ball mounting apparatus capable of mounting a solder ball using its own weight without a squeeze to solve the above problems.

Another aspect of the present invention is to provide a solder ball mounting system capable of mounting a solder ball using its own weight without a squeeze to solve the above problems.

Another aspect of the present invention is to provide a solder ball mounting method using a solder ball mounting apparatus capable of mounting a solder ball using its own weight without squeeze to solve the above problems.

Solder ball mounting apparatus according to an embodiment of the present invention includes a table mounted to the upper surface printed circuit board; A position adjusting unit contacting one side or both sides of the table to generate an inclination in the left and right directions of the table; And a mounting mask having respective openings corresponding to the respective pads of the printed circuit board and overlapping the table with the table between the table and the printed circuit board.

In the solder ball mounting apparatus according to an embodiment of the present invention, the table further includes a vibration shaft connected to the motor to generate vibration in the axial direction on one side thereof.

In the solder ball mounting apparatus according to the embodiment of the present invention, the position adjusting unit is displaced in the up and down axial direction by using a cylinder or a motor.

In the solder ball mounting apparatus according to an embodiment of the present invention, the mounting mask includes a mounting surface having the opening; And sidewalls formed along edges of the mounting surface.

Solder ball mounting apparatus according to another embodiment of the present invention includes a table mounted on the upper surface of the printed circuit board; A vibration unit provided at one side of the lower portion of the table to generate vibration; A support plate provided below the table; Guide parts provided on both sides between an upper surface of the support plate and a lower surface of the table to perform reciprocating motion along an axis; A position adjusting unit which abuts on one side or both sides of the support plate to generate an inclination in the left and right directions of the table; And a mounting mask having respective openings corresponding to the respective pads of the printed circuit board and overlapping the table with the table between the table and the printed circuit board.

In the solder ball mounting apparatus according to another embodiment of the present invention, the vibration unit is provided on one side between the table and the support plate; And a motor provided at the support plate to drive the cam.

In the solder ball mounting apparatus according to another embodiment of the present invention, the guide part includes an LM guide (Linear Motion Guide).

In the solder ball mounting apparatus according to another embodiment of the present invention, the position adjusting unit is displaced in the up and down axial direction by using a cylinder or a motor.

In the solder ball mounting apparatus according to another embodiment of the present invention, the mounting mask is formed as a trapping region having a slope shape at both ends of the mounting region having the opening.

In addition, the solder ball mounting system according to another embodiment of the present invention is a solder ball mounting device; A control unit connected to the solder ball mounting apparatus; An imaging unit provided at an upper portion of the solder ball mounting apparatus and transferring image information to the control unit; And a display unit connected to the control unit.

In the solder ball mounting system according to another embodiment of the present invention, the solder ball mounting apparatus includes a table having a printed circuit board mounted on an upper surface thereof; A position adjusting unit contacting one side or both sides of the table to generate an inclination in the left and right directions of the table; And a mounting mask having respective openings corresponding to the respective pads of the printed circuit board and overlapping the table with the table between the table and the printed circuit board.

In the solder ball mounting system according to another embodiment of the present invention, the solder ball mounting apparatus includes a table having a printed circuit board mounted on an upper surface thereof; A vibration unit provided at one side of the lower portion of the table to generate vibration; A support plate provided below the table; Guide parts provided for reciprocating motion along an axis at both sides between an upper surface of the support plate and a lower surface of the table; A position adjusting unit which abuts on one side or both sides of the support plate to generate an inclination in the left and right directions of the table; And a mounting mask having respective openings corresponding to the respective pads of the printed circuit board and overlapping the table with the table between the table and the printed circuit board.

In addition, the solder ball mounting method according to another embodiment of the present invention includes the steps of (A) preparing a printed circuit board on which the solder ball is to be mounted; (B) mounting the printed circuit board between the table of the solder ball mounting apparatus and the mounting mask; (C) supplying a plurality of the solder balls to the mounting mask, generating vibrations on a table of the solder ball mounting apparatus under control of a controller, and tilting the tables by acute angles in left and right directions, respectively; (D) the control unit determining whether the solder balls are respectively filled in the openings of the mounting mask; And (E) the controller generating the vibration in the table and repeatedly tilting the table by an acute angle in the left and right directions according to the determination result.

In the solder ball mounting method according to another embodiment of the present invention, the step (C) includes (C-1) supplying a plurality of solder balls to the mounting mask; (C-2) generating vibration by using a vibration shaft provided at one inner side of the table; And (C-3) generating, by the control unit, an inclination by an acute angle in the left and right directions of the table, respectively, by using a position adjusting unit which is in contact with one side or both sides of the table.

In the solder ball mounting method according to another embodiment of the present invention, vibration is generated by using the cam of the vibration unit.

In the solder ball mounting method according to another embodiment of the present invention, the step (D) is performed by the controller analyzing image information of the mounting mask received from the scratches provided on the solder ball mounting apparatus. Determine whether solder ball is installed.

The solder ball mounting method according to another embodiment of the present invention further includes (F) performing a reflow process on the solder ball.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to this, terms and words used in the present specification and claims should not be construed in a conventional, dictionary sense, and should not be construed as defining the concept of a term appropriately in order to describe the inventor in his or her best way. It should be construed in accordance with the meaning and concept consistent with the technical idea of the present invention.

Since the mounting method using the solder ball mounting apparatus according to the present invention conventionally mounts a plurality of solder balls through the openings of the mounting mask without using a squeeze, the solder balls are pressed against the squeegee to block the openings of the mask. When discarding or squeezing, the solder balls collide with each other, so that the surface is broken and oxidation rapidly occurs, thereby improving the reliability of solder ball mounting.

1 is a block diagram showing a system including a solder ball mounting apparatus according to an embodiment of the present invention.
2A and 2B are exemplary views for explaining a mounting method using a solder ball mounting apparatus according to an embodiment of the present invention.
Figure 3 is a block diagram showing a system including a solder ball mounting apparatus according to another embodiment of the present invention.
Figures 4a and 4b is an exemplary view for explaining the operation of the solder ball mounting apparatus according to another embodiment of the present invention.
5 is an exemplary view for explaining a mounting method using a solder ball mounting apparatus according to another embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The objects, particular advantages and novel features of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. It should be noted that, in the present specification, the reference numerals are added to the constituent elements of the drawings, and the same constituent elements are assigned the same number as much as possible even if they are displayed on different drawings. Also, the terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. 1 is a block diagram showing a system including a solder ball mounting apparatus according to an embodiment of the present invention, Figures 2a and 2b is a description of a mounting method using a solder ball mounting apparatus according to an embodiment of the present invention It is an illustration for.

A system including a solder ball mounting apparatus according to an embodiment of the present invention includes a solder ball mounting apparatus, a controller 400 connected to a solder ball mounting apparatus, an imaging unit 600 provided on an upper portion of a solder ball mounting apparatus, and a controller ( And a display unit 500 connected to 400.

In particular, the solder ball mounting apparatus includes a table 100 on which the printed circuit board 300 is mounted on an upper surface thereof, and position adjusting units 131 and 132 contacting both sides of the table 100 to generate an inclination in the left and right directions of the table 100. And a mounting mask 200 having respective openings 210 corresponding to respective pads of the printed circuit board 300 and overlappingly mounted on the table 100 on the printed circuit board 300.

Table 100 is a member for mounting and supporting the printed circuit board 300 on the upper surface, while the mounting mask 200 is superimposed and mounted using a coupling means such as a clamp, the table 100 and the mounting mask 200 The printed circuit board 300 may be fixedly interposed therebetween.

The table 100 includes a vibrating shaft 110 at the center, and performs a back and forth reciprocating motion in the axial direction of the vibrating shaft 110 under the control of the controller 400, and accordingly the mounting mask 200. ) Has the pressure and vibration back. Here, the vibrating shaft 110 may be connected to, for example, a linear motor to perform the pressure, rear reciprocating motion in the axial direction.

The position adjusting units 131 and 132 may be provided in contact with both sides of the table 100 using, for example, a cylinder or an electric motor, and may be moved in the up and down axial direction under the control of the controller 400. The table 100 is converted into an inclined form having an acute angle in the left and right directions.

The mounting mask 200 may be formed by using one or a mixture of metals, synthetic resins, and dry films, and the like, and in particular, may be formed by coating a dry film on a metal plate.

The mounting mask 200 includes a mounting surface having a plurality of openings 210 corresponding to each pad of the printed circuit board 300, and sidewalls formed along an edge of the mounting surface. The mounting mask 200 receives a plurality of solder balls 120 to be mounted on each pad of the printed circuit board 300.

For the solder ball mounting apparatus according to an embodiment of the present invention configured as described above, the control unit 400 controls the vibrating shaft 110 and the position adjusting units 131 and 132 of the table 100, for mounting together with the table 100. The mask 200 may be inclined at an acute angle on both sides and at the same time, and vibration may be generated through the vibration shaft 110.

The solder ball may be mounted on each pad of the printed circuit board 300 by using the system including the solder ball mounting apparatus according to the exemplary embodiment of the present invention.

Specifically, as shown in FIG. 2A, the controller 400 generates vibration in the axial direction of the vibration shaft 110 while simultaneously increasing the height of the left position adjusting unit 131 and lowering the height of the right position adjusting unit 132. , Together with the table 100, the mounting mask 200 may be switched to a right angle at an acute angle by "α".

Subsequently, as shown in FIG. 2B, the control unit 400 lowers the height of the left position adjusting unit 131 and raises the height of the right position adjusting unit 132 while generating vibration in the axial direction of the vibration shaft 110. Together with 100, the mounting mask 200 is switched to the left at an acute angle by "β".

As described above, the process of tilting the mounting mask 200 at an acute angle in the left and right directions with respect to the horizontal line may be repeatedly performed. Accordingly, the plurality of solder balls 120 may be mounted on the mounting surface inclined by its own gravity. The left and right are respectively filled in the openings 210 of the mounting mask 200.

Here, the reason why the mounting mask 200 is inclined by an acute angle is that when the mounting mask 200 is inclined beyond the acute angle, the solder balls 120 respectively filled in the openings 210 of the mounting mask 200 fall out again. Because it comes out.

Subsequently, the controller 400 is connected to the opening 210 of the mounting mask 200 from the image information about the surface of the mounting mask 200 received through the imaging unit 600 positioned above the solder ball mounting apparatus. It can be determined whether the solder balls 120 are all mounted. In this case, the controller 400 may display image information regarding the surface of the mounting mask 200 received from the imaging unit 600 to the user through the display unit 500.

When it is determined that the solder balls 120 are not mounted, all of the solder balls 120 are controlled, and the controller 400 controls the vibration shaft 110 and the position adjusters 131 and 132 to incline the mounting mask 200 to the left and right sides again. By repeatedly forming the state, all of the solder balls 120 can be mounted in the opening 210.

Therefore, in the mounting method using the solder ball mounting apparatus according to the embodiment of the present invention, all the solder balls 120 are filled in the openings 210 of the mounting mask 200 using self weight without squeeze in the related art. The solder ball 120 may be mounted on each pad of the printed circuit board 300.

Accordingly, the problem that the solder ball is pressed by the squeegee to block the opening of the mask, or the solder balls collide with each other during the squeegee, and the surface is broken and the oxidation suddenly occurs can be solved, thereby improving the reliability of the solder ball mounting. .

Hereinafter, a system including a solder ball mounting apparatus and a mounting method using the same according to another embodiment of the present invention will be described with reference to FIGS. 3 to 5. 3 is a block diagram showing a system including a solder ball mounting apparatus according to another embodiment of the present invention, Figure 4 is an exemplary view for explaining the operation of the solder ball mounting apparatus according to another embodiment of the present invention, 5 is an exemplary view for explaining a mounting method using a solder ball mounting apparatus according to another embodiment of the present invention.

As shown in FIG. 3, the system including the solder ball mounting apparatus according to another embodiment of the present invention includes a solder ball mounting apparatus, a controller 4000 connected to the solder ball mounting apparatus, and an image provided on the solder ball mounting apparatus. And a display unit 5000 connected to the unit 6000 and the control unit 4000.

Specifically, the solder ball mounting apparatus includes a table 1000 on which the printed circuit board 3000 is mounted on the upper surface, and a guide part 1100 mounted on both sides of the lower surface of the table 1000 and mounted on the support plate 1010. Is provided on one side between the table 1000 and the support plate 1010, the vibration unit 1200 for generating a vibration in the table 1000, connected to both sides of the lower surface of the support plate 1010 and the table together with the support plate (1010) A position adjusting unit 1310 and 1320 for tilting the 1010 in the left and right directions, and respective openings 2100 corresponding to the respective pads of the printed circuit board 3000 and the table 1010 on the printed circuit board 3000. The mounting mask 2000 is superimposed.

The table 1000 is a member for mounting and supporting the printed circuit board 3000 on the upper surface. The mounting mask 2000 is superimposed and mounted using a coupling means such as a clamp and the table 1000 and the mounting mask 2000. The printed circuit board 3000 may be interposed therebetween and fixedly mounted therebetween.

The guide part 1100 is provided on both sides of the lower surface of the table 1000 so as to be reciprocated in a forward and backward direction (relative to the ground) along an axis, and according to the vibration generated by the vibration part 1200, the table ( 1000 vibrates in a forward and backward direction along the guide part 1100. Here, the guide unit 1100 may use, for example, an LM guide (Linear Motion Guide) to be movable in the forward and backward directions.

The vibrator 1200 is mounted on the cam 1220 provided at one side between the table 1000 and the support plate 1010, and the lower portion of the support plate 1010 to drive the cam 1220 under the control of the controller 4000. And a motor 1210.

In particular, as the cam 1220 of the vibrator 1200 reciprocates, the table 1000 reciprocates in a forward and backward direction along the guide 1100. Accordingly, vibration is also transmitted to the mounting mask 2000 mounted together with the table 1000 such that the plurality of solder balls 2500 may be moved forward and backward.

The position adjusting units 1310 and 1320 may be connected to both sides of the support plate 1010 using, for example, a cylinder or an electric motor, and may be moved in the up and down axial directions under the control of the controller 4000. The table 1000 is converted into an inclined form having an acute angle in left and right directions.

The mounting mask 2000 may be formed by using one or a mixture of metals, synthetic resins, and dry films, and the like, and in particular, may be formed by coating a dry film on a metal plate.

The mounting mask 2000 includes a central area having respective openings 2100 corresponding to each pad of the printed circuit board 3000, and a slope capable of collecting excess solder balls 2500 at both ends. ) Is formed into a trapping region of the form.

In addition, the mounting mask 2000 is supplied with a plurality of solder balls 2500 to be mounted on each pad of the printed circuit board 3000 in a collecting area, and is provided with a plurality of solder balls through a central area having an opening 2100. The 2500 may be mounted on each pad of the printed circuit board 3000.

For the solder ball mounting apparatus according to another embodiment of the present invention configured as described above, the control unit 4000 controls the vibrator 1200 and the position adjusting units 1310 and 1320 to mount the mounting mask 2000 together with the table 1000. ) Are inclined at an acute angle to both sides, and at the same time, the mounting mask 2000 may oscillate forward and backward along the guide part 1100.

According to the mounting method using the solder ball mounting system according to another embodiment of the present invention, a plurality of solder balls 2500 may be mounted on each pad of the printed circuit board 3000.

Specifically, as shown in FIG. 4A, the control unit 4000 generates a vibration through the vibration unit 1200 while simultaneously increasing the height of the left position adjusting unit 1310 and lowering the height of the right position adjusting unit 1320, the table. Along with 1000, the mounting mask 2000 may be switched to a right angle tilted to the right.

Subsequently, as shown in FIG. 4B, the controller 4000 generates vibration through the vibrator 1200 while simultaneously lowering the height of the left position adjusting unit 1310 and raising the height of the right position adjusting unit 1320. ) And the mounting mask 2000 can be switched to the left inclined state by an acute angle.

As described above, the process of tilting the mounting mask 2000 at an acute angle in the left and right directions with respect to the horizontal line may be repeatedly performed. Accordingly, the plurality of solder balls 2500 are mounted on the mounting mask inclined by gravity. The openings 2100 of the mounting mask 2000 are respectively filled while moving left and right along the mounting surface of the 2000.

In addition, the excess solder balls 2500 that are not filled in the opening 2100 of the mounting mask 2000 may be collected in the collecting regions formed at both ends of the mounting mask 2000.

Specifically, as shown in FIG. 5, in the state where the mounting mask 2000 is inclined along the table 1000 to the right by an acute angle θ, a plurality of solders present in the left collecting region of the mounting mask 2000. The balls 2500 are accelerated by their own weight in the initial stage of "I ", and are naturally filled in the openings 2100 of the mounting mask 2000 with decreasing speed in the intermediate stage of " II " In the late stage, excess solder balls 2500 naturally gather in the right capture area.

Accordingly, the solder ball mounting method according to another embodiment of the present invention is conventionally a problem that the solder ball is pressed on the squeegee to block the opening of the mask, or when the solder balls collide with each other during squeegeeing, the surface is broken and oxidation rapidly occurs. In order to solve the problem, a large number of solder balls may be naturally filled in the openings 2100 of the mounting mask 2000 by using the own weight, and processed in a reflow process.

Accordingly, the solder ball mounting method according to another embodiment of the present invention mounts the solder balls naturally filled in the openings 2100 on the respective pads of the printed circuit board 3000 using their own weight, thereby improving reliability of the solder ball mounting method. You can.

Although the technical idea of the present invention has been specifically described according to the above preferred embodiments, it is to be noted that the above-described embodiments are intended to be illustrative and not restrictive.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention.

100: table 110: vibration axis
131: left position adjusting unit 132: right position adjusting unit
200: mounting mask 210: opening
300: printed circuit board 400: control unit
500: display unit 600: imaging unit

Claims (24)

A table having a printed circuit board mounted on an upper surface thereof;
A position adjusting unit contacting one side or both sides of the table to generate an inclination in the left and right directions of the table; And
A mounting mask having respective openings corresponding to the respective pads of the printed circuit board, the mounting mask being superimposed on the table via the printed circuit board;
Solder ball mounting device comprising a.
The method according to claim 1,
The table further comprises a vibration shaft connected to the motor to generate vibration in the axial direction on one side of the solder ball mounting apparatus.
The method according to claim 1,
Solder ball mounting apparatus for displacing the position adjustment portion in the axial direction up and down using a cylinder or a motor.
The method according to claim 1,
The mounting mask is
A mounting surface having the opening; And
Sidewalls formed along edges of the mounting surface;
Solder ball mounting apparatus comprising a.
A table having a printed circuit board mounted on an upper surface thereof;
A vibration unit provided at one side of the lower portion of the table to generate vibration;
A support plate provided below the table;
Guide parts provided on both sides between an upper surface of the support plate and a lower surface of the table to perform reciprocating motion along an axis;
A position adjusting unit which abuts on one side or both sides of the support plate to generate an inclination in the left and right directions of the table; And
A mounting mask having respective openings corresponding to the respective pads of the printed circuit board, the mounting mask being superimposed on the table via the printed circuit board;
Solder ball mounting device comprising a.
The method according to claim 5,
The vibrating portion
A cam provided at one side between the table and the support plate; And
A motor provided at the support plate to drive the cam;
Solder ball mounting device comprising a.
The method according to claim 5,
The guide part is a solder ball mounting device including an LM guide (Linear Motion Guide).
The method according to claim 5,
Solder ball mounting apparatus for displacing the position adjustment portion in the axial direction up and down using a cylinder or a motor.
The method according to claim 5,
The mounting mask is a solder ball mounting device is formed as a slope (slope) trap area at both ends with respect to the mounting area having the opening.
Solder ball mounting units;
A control unit connected to the solder ball mounting apparatus;
An imaging unit provided at an upper portion of the solder ball mounting apparatus and transferring image information to the control unit; And
A display unit connected to the control unit;
Solder ball mounting system comprising a.
The method of claim 10,
The solder ball mounting device is
A table having a printed circuit board mounted on an upper surface thereof;
A position adjusting unit contacting one side or both sides of the table to generate an inclination in the left and right directions of the table; And
A mounting mask having respective openings corresponding to the respective pads of the printed circuit board, the mounting mask being superimposed on the table via the printed circuit board;
Solder ball mounting system comprising a.
The method of claim 11,
The table further includes a solder shaft mounted to the motor to generate vibration in the axial direction on one side of the inside under the control of the control unit solder ball mounting system.
The method of claim 11,
The position adjusting unit includes a solder ball mounting system including a cylinder or a motor displaced in the axial direction up and down under the control of the control unit.
The method of claim 10,
The solder ball mounting device is
A table having a printed circuit board mounted on an upper surface thereof;
A vibration unit provided at one side of the lower portion of the table to generate vibration;
A support plate provided below the table;
Guide parts provided for reciprocating motion along an axis at both sides between an upper surface of the support plate and a lower surface of the table;
A position adjusting unit which abuts on one side or both sides of the support plate to generate an inclination in the left and right directions of the table; And
A mounting mask having respective openings corresponding to the respective pads of the printed circuit board, the mounting mask being superimposed on the table via the printed circuit board;
Solder ball mounting system comprising a.
The method according to claim 14,
The vibrating portion
A cam provided at one side between the table and the support plate; And
A motor provided at the support plate to drive the cam;
Solder ball mounting system comprising a.
The method according to claim 14,
The guide part is a solder ball mounting system including an LM guide (Linear Motion Guide).
The method according to claim 14,
Solder ball mounting system for displacing the positioning portion in the axial direction up and down using a cylinder or a motor.
The method according to claim 14,
The mounting mask is a solder ball mounting system is formed as a slope (slope) collection area at both ends with respect to the mounting area having the opening.
(A) preparing a printed circuit board on which solder balls are to be mounted;
(B) mounting the printed circuit board between the table of the solder ball mounting apparatus and the mounting mask;
(C) supplying a plurality of the solder balls to the mounting mask, generating vibrations on a table of the solder ball mounting apparatus under control of a controller, and tilting the tables by acute angles in left and right directions, respectively;
(D) the control unit determining whether the solder balls are respectively filled in the openings of the mounting mask; And
(E) in response to the determination result, the control unit generating vibrations on the table and repeatedly tilting the table again by an acute angle in the left and right directions;
Solder ball mounting method comprising a.
The method of claim 19,
The step (C)
(C-1) supplying a plurality of solder balls to the mounting mask;
(C-2) generating vibration by using a vibration shaft provided at one inner side of the table; And
(C-3) generating, by the control unit, an inclination by an acute angle in the left and right directions of the table by using a position adjusting unit which is in contact with one side or both sides of the table;
Solder ball mounting method comprising a. The method of claim 19,
The step (C)
(C-1) supplying a plurality of solder balls to the mounting mask;
(C-2) generating vibration using a vibration unit provided at one side of the lower side of the table to generate vibration; And
(C-3) the control unit inclining the table by an acute angle in each of the left and right directions using a position adjusting unit provided on one side or both sides of the support plate connected to the table via at least one guide unit;
Solder ball mounting method comprising a.
23. The method of claim 21,
Solder ball mounting method for generating a vibration using the cam of the vibration unit.
The method of claim 19,
In the step (D), the control unit analyzes the image information of the mounting mask received from the scratches provided in the upper portion of the solder ball mounting device, it is determined whether the solder ball mounting completion.
The method of claim 19,
(F) a solder ball mounting method further comprising performing a reflow process for the solder ball.

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