TWI649827B - Ball placement guide - Google Patents

Abstract

The invention relates to a planting ball guiding plate, which comprises a plate member, wherein a top surface of the plate member forms a plurality of guiding grooves arranged at intervals, and a groove bottom surface of each guiding groove forms a plurality of spherical holes arranged at intervals, and the plate member A bearing portion is formed inside each of the ball holes, and the interval in which the guiding groove has a ball hole is defined as a ball falling region, wherein the guiding groove can guide the conductive ball to move into the guiding groove during the ball dropping operation Arranged one by one, and the conductive ball can move along the guiding groove. When moving to the falling ball area, the conductive ball can smoothly fall into the ball hole and abut against the bearing portion, so that each ball hole has a conductive ball to reduce The purpose of missing the ball rate, in turn, can improve the convenience of the ball drop operation and shorten the time of the ball drop operation.

Description

Ball placement guide

The invention relates to a planting ball guiding plate, in particular to a ball guiding plate which can reduce the ball missing rate.

In the packaging operation of the semiconductor, in order to achieve the purpose of miniaturization of the electronic device, a conductive ball is used instead of the pin-shaped pin, and the conductive ball can be placed on the pad of the substrate to be packaged by holding the placement ball-planting technique, such as As shown in FIG. 13 , a ball placement device 90 can be used for the holding ball placement technique. The ball placement device 90 includes a ball box 91. The ball box 91 defines an accommodation space, and the inner bottom surface of the ball box 91 is formed. a plurality of ball holes 92 that do not penetrate the ball box 91 and communicate with the accommodating space, wherein the conductive ball 93 can be placed in the accommodating space of the ball box 91, and the ball box 91 can be shaken to allow The conductive ball 93 is rolled into the ball holes 92, and the conductive balls 93 in the ball holes 92 are sucked through a nozzle device. The nozzle device then drives the conductive balls 93 to move to the pads of the substrate. The device 90 causes the conductive balls 93 to roll into the ball holes 92 by shaking the ball box 91, and the conductive balls 93 are randomly rolled into the ball holes 92, resulting in a high ball missing rate which is not desirable.

Referring to FIG. 14 , the holding ball placement technique can employ another ball placement device 80. The ball placement device 80 includes a ball plate 81 and a ball box 82. The top surface of the ball plate 81 forms a plurality of ball holes 83. The ball holes 83 do not penetrate the ball plate 81, and a larger diameter portion 84 is formed in an upper portion of each of the ball holes 83, and a lower portion of each of the ball holes 83 forms a smaller diameter portion 85 connecting the larger diameter portion 84. The ball disc 81 is movably disposed above the disc 81. The accommodating space is formed in the disc 81, and the bottom surface of the disc 81 forms an opening 86 communicating with the accommodating space. 88 can be placed in the accommodating space of the ball box 82. The ball box 82 moves on the ball plate 81. When the opening 86 of the ball box 82 moves to the ball hole 83, the conductive ball 88 in the accommodating space can be The ball 86 is dropped into the ball hole 83 through the opening 86. During the process, the conductive ball 88 can be easily dropped into the ball hole 83 by the guiding of the large diameter portion 84 of the ball hole 83, and then sucked through a nozzle device 87. The conductive ball 88 in the ball hole 83, the nozzle device 87 then drives the conductive ball 88 to move to the pad of the substrate, however, the ball placement device 80 uses the movement of the ball box 82 to push the guide The ball 88 is simultaneously guided by the larger diameter portion 84 to assist the conductive ball 88 to fall into the ball hole 83, but the conductive ball 88 may interfere with each other during the movement of the ball box 82 to cause the conductive ball 88 not to fall into the ball hole. 83, so the lack of ball rate can not be effectively reduced, it is not ideal.

The main object of the present invention is to provide a planting ball guiding plate, thereby improving the problem that the existing ball placing device cannot reduce the ball missing rate.

In order to achieve the foregoing object, the ball guiding guide plate of the present invention comprises a plate member, wherein the top surface of the plate member forms a plurality of guiding grooves arranged at intervals, and the bottom surface of the groove of each guiding groove forms a plurality of spherical holes arranged at intervals, and The plate member defines a bearing portion inside each of the ball holes, and the interval in which the guiding groove has a ball hole is defined as a ball drop region.

The ball guiding guide plate of the present invention further forms a leading area on the bottom surface of the groove of each guiding groove, the leading area is located at the front end of the falling ball area, and further, the ball guiding guide plate forms a penetrating plate member at each carrying portion. a consistent hole that communicates with the corresponding ball hole and extends down to the bottom surface of the plate, the through hole having a smaller aperture than the corresponding ball hole.

In the above, the conductive ball can fall into the guiding groove formed on the top surface of the plate on the ball guiding guide plate, and fall into the ball hole located in the falling ball area along the guiding groove guide, and The carrying portion can support the conductive ball falling into the ball hole, and then the suction device sucks the conductive ball in the ball hole, thereby moving the conductive ball to the pad of the substrate, and the guiding groove of the ball guiding plate is effectively guided. The electric ball causes the conductive ball to smoothly fall into the hole along the guiding groove, effectively increasing the probability that the conductive ball falls into each hole, thereby reducing the ball missing rate, and the ball guiding plate is transmitted through the guiding slot. The setting improves the ease of operation of allowing the conductive ball to fall into the hole.

Referring to FIG. 1 to FIG. 5, a plurality of preferred embodiments of the ball guiding guide plate of the present invention include a plate member 10, and a top surface of the plate member 10 is formed with a plurality of guiding grooves 11 arranged at intervals. The bottom surface of the groove of the groove 11 is formed with a plurality of spaced-apart ball holes 13 , and the plate member 10 defines a bearing portion 14 inside the ball hole 13 . The ball hole 13 can accommodate the conductive ball 20 . The section having the spherical hole 13 is defined as the falling ball zone 12, wherein the groove bottom surface of each of the guiding grooves 11 forms a leading portion 15 which is located at the front end of the falling ball portion 12.

As shown in FIG. 6 , the ball guiding guide plate forms a consistent hole 16 extending through the plate member 10 in each of the bearing portions 14 , and the through hole 16 communicates with the corresponding ball hole 13 and extends downward to the bottom surface of the plate member 10 . The hole diameter of the through hole 16 is smaller than the diameter of the corresponding ball hole 13 , or the bearing portion 14 is annular in plan view and surrounds the corresponding through hole 16 , or the bearing portion 14 can be planar and closed. The bottom end of the corresponding ball hole 13 is open.

In the above, the plate member 10 can be an integral member or a combined member. Taking the combined member as an example, the plate member 10 includes a plurality of stacked layers. As shown in FIG. 7, the plate member 10 includes a a first plate layer 101 and a second plate layer 102, the through hole 16 is formed and penetrates the first plate layer 101, and the bearing portion 14 is formed on a top surface of the first plate layer 101 and surrounds the corresponding a hole 16 , the second plate layer 102 is stacked on a top surface of the first plate layer 101 , the guiding groove 11 is formed on a top surface of the second plate layer 102 , and the ball hole 13 is formed and penetrates the first hole a second plate layer 102, and the ball hole 13 extends to the top surface of the second plate layer 102, so that the bearing portion 14 on the second plate layer 102 corresponds to the ball hole 13 of the first plate layer 101, respectively, The number of layers of the plate member 10 may be two or more layers, or may be set to three or more layers according to requirements or other stitching patterns.

As shown in FIG. 9 to FIG. 11, the conductive ball 20 can be confined in a ball box (not shown), the ball box can be moved on the ball guiding guide plate, and the conductive ball passing through the opening of the bottom surface of the ball box 20 may be located on the upper surface of the plate member 10. Since the top surface of the ball guiding guide plate is provided with the guiding groove 11, the guiding groove 11 can guide the conductive ball 20 to move to the guiding groove 11, and the ball box is dropped from the leading portion 15 to the ball. When the direction of the region 12 is moved, the conductive ball 20 can be first moved to the guiding groove 11 through the leading portion 15, and the conductive balls 20 can be arranged one by one in the leading portion 15 of the guiding groove 11, with the ball box When moving to the ball landing zone 12, the conductive ball 20 located in the leading zone 15 is moved to the ball landing zone 12, and when passing through the ball hole 13 located in the ball landing zone 12, the conductive ball 20 can smoothly fall into the ball hole 13 and be carried by the ballhole 13 The conductive ball 20 at the rear of the portion 14 continues to move along the guiding slot 11 and falls into the next ball hole 13. In the above, the conductive ball 20 in the ball box is continuously filled into the guiding slot 11 and guided along The groove 11 is moved to surely fall into each of the ball holes 13, so that the ball holes 13 can have the conductive balls 20.

In addition to moving the conductive ball 20 on the ball guiding guide through the ball box, the conductive ball 20 may be brushed by the squeegee or the bristles, or the conductive ball 20 may be blown by the airflow, or the conductive ball guiding plate may be shaken to make the conductive The ball 20 is guided by the guiding groove 11, so that the conductive balls 20 can be arranged one by one in the guiding groove 11 and moved along the guiding groove 11, so that they can fall into the bottom surface of the groove of the guiding groove 11 one by one. The ball holes 13 have conductive balls 20 in each of the ball holes 13.

After the ball-forming operation of the conductive ball 20 falls into the ball hole 13 is completed, the conductive ball 20 in the ball hole 13 is sucked up by a suction device, and the suction device further drives the conductive ball 20 sucked up onto a substrate. The conductive ball 20 can be smoothly placed on the pad of the substrate.

As shown in FIG. 8 , during the process of taking out the conductive ball 20 into the ball hole 13 , an ejector device 30 can be further cooperated, and the push rods 31 of the ejector device 30 respectively extend into the corresponding through holes 16 and The conductive balls 20 in the ball holes 13 are ejected.

As shown in FIG. 12, in the ball guiding guide plate, a top surface of the plate member 10 forms a recovery area 17, and the recovery area 17 is located at the rear end of the guiding groove 11, and the plate member 10 is used for the recycling. The region 17 forms at least one recovery hole 18 penetrating the plate member 10, wherein the conductive ball 20 remaining after use can fall into the recovery hole 18 to recover the conductive ball that fails to fall into the ball hole 13. 20.

In addition, the plate member 10 can adopt a one-piece member or a combined member according to requirements. If the plate member 10 adopts a combined member, the manufacturing complexity of the member can be reduced.

In summary, the ball guiding guide plate is matched with the ball hole 13 by the guiding slot 11, so that the guiding slot 11 can guide the conductive ball 20, so that the conductive ball 20 can fall into the guiding slot 11 and move along the guiding slot 11. The conductive ball 20 can be smoothly placed in the ball hole 13 of the falling ball region 12 of the guiding groove 11, and the conductive ball 20 is accommodated in the ball hole 13 by the carrying portion 14, wherein the guiding groove 11 makes the conductive ball 20 can be arranged one by one, thereby ensuring that the ball holes 13 located at the bottom surface of the groove of the guiding groove 11 have the conductive balls 20, thereby achieving the purpose of reducing the ball missing rate, and improving the convenience of the ball dropping operation, and further, the setting of the leading portion 15 The conductive balls 20 can be pre-arranged before entering the falling ball area 12, so that the conductive balls 20 are arranged one by one in advance, and the ball missing rate can be assisted, and the falling ball working time can be shortened.

10‧‧‧ boards

11‧‧‧ guiding slot

101‧‧‧ first ply

102‧‧‧ second ply

12‧‧‧The ball area

13‧‧‧ ball hole

14‧‧‧Loading Department

15‧‧‧leading area

16‧‧‧through holes

17‧‧‧Recycling area

18‧‧‧Recovery hole

20‧‧‧Electrical ball

30‧‧‧Empty device

31‧‧‧Put

80‧‧‧Balling device

81‧‧‧ball

82‧‧‧ ball box

83‧‧‧ ball hole

84‧‧‧ Larger diameter department

85‧‧‧Small diameter department

86‧‧‧ openings

87‧‧‧ nozzle device

88‧‧‧Electrical ball

90‧‧‧Balling device

91‧‧‧ ball box

92‧‧‧ ball hole

93‧‧‧ Conductive ball

Figure 1 is a perspective view showing the appearance of a first preferred embodiment of the ball guiding guide of the present invention. 2 is a schematic view showing the appearance of a second preferred embodiment of the ball guiding guide of the present invention. 3 is a top plan view showing a second preferred embodiment of the ball guiding guide of the present invention. Figure 4 is a schematic cross-sectional view of the A-A cut line of Figure 3. Figure 5 is a schematic cross-sectional view of the B-B cut line of Figure 3. Figure 6 is a cross-sectional view showing a third preferred embodiment of the ball guiding guide of the present invention. Figure 7 is a cross-sectional view showing a fourth preferred embodiment of the ball guiding guide of the present invention. Figure 8 is a schematic view showing the operation of the ejector unit of the third preferred embodiment of the ball guiding guide of the present invention. Figure 9 is a perspective, partial, cross-sectional view showing the operational state of the third preferred embodiment of the ball guiding guide of the present invention. Figure 10 is a top plan view showing the operational state of the third preferred embodiment of the ball guiding guide of the present invention. Figure 11 is a side cross-sectional view showing the operational state of a third preferred embodiment of the ball guiding guide of the present invention. Figure 12 is a perspective view showing the appearance of a fourth preferred embodiment of the ball guiding guide of the present invention. Figure 13 is a schematic view of the operation of the existing ball placement device. Figure 14 is a schematic view showing the operation of another prior ball-planting device.

Claims (10)

a planting ball guiding plate comprising a plate member, wherein a top surface of the plate member forms a plurality of guiding grooves arranged at intervals, and a groove bottom surface of each guiding groove forms a plurality of spherical holes arranged at intervals, and the plate member is each The inside of the ball hole forms a bearing portion, and the section in which the guiding groove has a ball hole is defined as a ball landing zone. The ball guiding guide plate of claim 1, wherein a bottom surface of the groove of each guiding groove forms a leading area, and the leading area is located at a front end of the falling ball area. The ball guiding guide plate of claim 1, wherein the ball guiding guide plate forms a consistent hole penetrating the plate member at each of the bearing portions, the through hole communicating with the corresponding ball hole and extending downward to the plate member Bottom surface. The ball guiding guide plate of claim 2, wherein the ball guiding guide plate forms a uniform hole penetrating the plate member at each of the bearing portions, the through hole communicating with the adjacent ball hole and extending downward to the plate member Bottom surface. The ball guiding guide according to claim 3, wherein the through hole has a smaller aperture than the corresponding spherical hole. The ball guiding guide according to claim 4, wherein the through hole has a smaller aperture than the corresponding spherical hole. The ball guiding guide according to any one of claims 1 to 6, wherein the panel comprises a plurality of stacked layers. The ball guiding guide according to claim 3 or 5, wherein the plate member comprises a first plate layer and a second plate layer, the through hole is formed and penetrates the first plate layer, and the bearing portion Forming on a top surface of the first ply and surrounding a corresponding through hole, the second plate is laminated on a top surface of the first ply, and the guiding groove is formed on a top surface of the second ply The ball holes are formed and penetrate the second ply. The ball guiding guide according to any one of claims 1 to 6, wherein a top surface of the plate member forms a recovery area, the recovery area is located at a rear end of the guiding groove, and the plate is The recovery zone forms at least one recovery orifice. The ball guiding guide plate according to claim 8, wherein a top surface of the plate member forms a recovery area, the recovery area is located at a rear end of the guiding groove, and the plate member forms at least one in the recovery area. Recover holes.