CN110164770A - Plant ball directing plate - Google Patents
Plant ball directing plate Download PDFInfo
- Publication number
- CN110164770A CN110164770A CN201810148979.5A CN201810148979A CN110164770A CN 110164770 A CN110164770 A CN 110164770A CN 201810148979 A CN201810148979 A CN 201810148979A CN 110164770 A CN110164770 A CN 110164770A
- Authority
- CN
- China
- Prior art keywords
- ball
- plate
- guide channel
- plant
- conducting sphere
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000011084 recovery Methods 0.000 claims description 12
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000012447 hatching Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cultivation Receptacles Or Flower-Pots, Or Pots For Seedlings (AREA)
Abstract
The present invention discloses a plant ball directing plate, it includes a plates, the top surface of the plate forms multiple spaced guide channels, the groove bottom of each guide channel forms multiple spaced ball, and the plate forms a supporting part in the inside of each ball, it is ball-dropping area that the guide channel, which has the section definition of ball, wherein, in falling sphere operation process, guide channel can guide conducting sphere and be moved in guide channel and can arrange one by one, and conducting sphere can be moved along guide channel, when being moved to ball-dropping area, conducting sphere can smoothly fall into ball and against supporting part, and then each ball is allowed to have conducting sphere, ball rate is lacked to achieve the purpose that reduce, and then falling sphere operation ease can be improved and shorten the falling sphere activity duration.
Description
Technical field
The present invention relates to a plant ball directing plates, more particularly to a kind of plant ball directing plate that can reduce scarce ball rate.
Background technique
In the packaging operation of semiconductor, use conducting sphere instead of needle-shaped to achieve the purpose that electronic device micromation
Pin, and conducting sphere can be placed in the weld pad of substrate for package and capturing putting type and planting playing skill art, as shown in figure 13,
Capturing putting type plant playing skill art can be used a ball-planting device 90, which includes a ball case 91, be formed in the ball case 91
One accommodating space, the inner bottom surface of the ball case 91 form multiple ball 92, those ball 92 through the ball case 91 and are not connected to the appearance
Between emptying, wherein conducting sphere 93 can be put into the accommodating space of the ball case 91, and the ball case 91 can be shaken and conducting sphere 93 is allowed to roll
Enter in those ball 92, then the conducting sphere 93 in those ball 92 is drawn by a nozzle unit, which then drives
Conducting sphere 93 is moved on the weld pad of substrate, however the ball-planting device 90 allows conducting sphere 93 to roll into those by rocking the ball case 91
In ball 92, conducting sphere 93 be it is random roll into those ball 92, cause to lack ball rate high and undesirable.
Figure 14 is seen also, capturing putting type plant playing skill art can be used another ball-planting device 80, which includes one
Ball disk 81 and a ball case 82, the top surface of the ball disk 81 form multiple ball 83, those ball 83 do not run through the ball disk 81, Mei Yiqiu
The top in hole 83 forms one compared with large-diameter portion 84, and the smaller radial portion for connecting this compared with large-diameter portion 84 is formed at the lower part of each ball 83
85, which is movably disposed in the top of the ball disk 81, and an accommodating space, and the bottom of the ball disk 81 are formed in the ball disk 81
Face formed be connected to the accommodating space opening 86, wherein conducting sphere 88 can be put into the accommodating space of the ball case 82, the ball case 82 in
It is moved on the ball disk 81, when the opening 86 of the ball case 82 is moved in ball 83, conducting sphere 88 in accommodating space can be via
The opening 86 and fall into ball 83, ball can be fallen by the guiding of the relatively large-diameter portion 84 of ball 83 in the process convenient for conducting sphere 88
In hole 83, then by the conducting sphere 88 in those ball 83 of a nozzle unit 87 absorption, the nozzle unit 87 is then with moving conductive
Ball 88 is moved on the weld pad of substrate, however, the ball-planting device 80 pushes conducting sphere 88 using the movement of the ball case 82, simultaneously
Cooperate the guiding compared with large-diameter portion 84, is fallen into ball 83 with additional conductive ball 88, but conducting sphere 88 is in 82 moving process of ball case
In may interfere and conducting sphere 88 is caused not fall in ball 83, it is therefore undesirable so lacking ball rate can not still be effectively reduced.
Summary of the invention
The main purpose of the present invention is to provide a plant ball directing plate, improve whereby existing ball-planting device can not reduce it is scarce
The problem of ball rate.
To take off purpose before reaching, plant ball directing plate of the invention includes a plate, and the top surface of the plate forms multiple intervals
The guide channel of arrangement, the groove bottom of each guide channel forms multiple spaced ball, and the plate is in each ball
Portion forms a supporting part, and it is ball-dropping area that the guide channel, which has the section definition of ball,.
Plant ball directing plate of the invention further forms a leader in the groove bottom of each guide channel, which is located at
The front end of the ball-dropping area, in addition, the plant ball directing plate forms the perforation for running through the plate, perforation connection in each supporting part
Corresponding ball and the bottom surface for extending to the plate down, the aperture of the perforation are less than the aperture of corresponding ball.
Among the above, conducting sphere is on the plant ball directing plate, can fall into the guide channel for being formed in the top surface of the plate, and along
The guiding of guide channel and fall into the ball of ball-dropping area, and the sustainable conducting sphere for falling into ball of the supporting part then allows
Suction means comes up the conducting sphere absorption in ball, and then conducting sphere is moved on the weld pad of substrate, the plant ball directing plate
Guide channel effectively guide conducting sphere so that conducting sphere is smoothly fallen into ball along guide channel, effectively improve conducting sphere point
The probability for not falling into each ball achievees the purpose that the scarce ball rate of reduction and the plant ball directing plate, can by the setting of guide channel
Improve the operation ease for allowing conducting sphere to fall into ball.
Below in conjunction with the drawings and specific embodiments, the present invention will be described in detail, but not as a limitation of the invention.
Detailed description of the invention
Fig. 1: the appearance diagram of the first preferred embodiment of ball directing plate is planted for the present invention；
Fig. 2: the appearance diagram of the second preferred embodiment of ball directing plate is planted for the present invention；
Fig. 3: the schematic top plan view of the second preferred embodiment of ball directing plate is planted for the present invention；
Fig. 4: for the schematic cross-sectional view of the A-A hatching of Fig. 3；
Fig. 5: for the schematic cross-sectional view of the B-B hatching of Fig. 3；
Fig. 6: the schematic cross-sectional view of the third preferred embodiment of ball directing plate is planted for the present invention；
Fig. 7: the schematic cross-sectional view of the 4th preferred embodiment of ball directing plate is planted for the present invention；
Fig. 8: the operation chart of the cooperation ejector apparatus of the third preferred embodiment of ball directing plate is planted for the present invention；
Fig. 9: the three-dimensional partial schematic sectional view of the mode of operation of the third preferred embodiment of ball directing plate is planted for the present invention；
Figure 10: the schematic top plan view of the mode of operation of the third preferred embodiment of ball directing plate is planted for the present invention；
Figure 11: the diagrammatic side-view cross-sectional schematic diagram of the mode of operation of the third preferred embodiment of ball directing plate is planted for the present invention；
Figure 12: the appearance diagram of the 4th preferred embodiment of ball directing plate is planted for the present invention；
Figure 13: for the operation chart of existing ball-planting device；
Figure 14: for the operation chart of existing another ball-planting device.
Specific embodiment
Structural principle and working principle of the invention are described in detail with reference to the accompanying drawing:
Fig. 1 to Fig. 5 is please referred to, several preferred embodiments of ball directing plate are planted for the present invention, it includes a plate 10, the plates
The top surface of part 10 forms multiple spaced guide channels 11, and the groove bottom of each guide channel 11 forms multiple spaced balls
Hole 13, and the plate 10 forms a supporting part 14 in the inside of each ball 13, the ball 13 can accommodate conducting sphere 20, above-mentioned
It is ball-dropping area 12 that guide channel 11, which has the section definition of ball 13, wherein the groove bottom of each guide channel 11 forms a leader
15, which is located at the front end of the ball-dropping area 12.
As shown in fig. 6, the plant ball directing plate forms the perforation 16 for running through the plate 10, the perforation in each supporting part 14
The corresponding ball 13 of 16 connections and the bottom surface for extending to the plate 10 down, wherein the aperture of the perforation 16 is less than corresponding
The aperture of ball 13 or the supporting part 14 are in overlooking annular in shape and surrounding corresponding perforation 16, alternatively, the supporting part 14
It can be in bottom end opening that is planar and closing corresponding ball 13.
Among the above, component or knockdown component which can be integrated, by taking knockdown component as an example, the plate
10 include multiple stacked plate layers, as shown in fig. 7, the plate 10 includes one first plate layer 101 and one second plate layer 102, it is described
Perforation 16 forms and is formed in the top surface of the first plate layer 101 through the first plate layer 101 and the supporting part 14 and surround
Corresponding perforation 16, the second plate layer 102 are stacked at the top surface of the first plate layer 101, the guide channel 11 be formed in this second
The top surface of plate layer 102, the ball 13 forms and runs through the second plate layer 102, and the ball 13 extends to the second plate layer
102 top surface, so that the supporting part 14 on the second plate layer 102 respectively corresponds the ball 13 of the first plate layer 101, among the above, the plate
The plate layer number of part 10 can also be arranged three layers or more or using other splicing states other than it can be two layers according to demand
Sample.
As shown in Figures 9 to 11, conducting sphere 20 can be restricted in a ball case (not shown), which can draw in the plant ball
It is moved on guide plate, and 10 upper surface of plate can be located at by the conducting sphere 20 of the opening of the ball case bottom surface, since the plant ball draws
Guide channel 11 is arranged in the top surface of guide plate, and guide channel 11 can guide conducting sphere 20 and be moved to guide channel 11, in ball case from leader 15
When the direction of past ball-dropping area 12 is mobile, leader 15 can be first passed through and allow conducting sphere 20 that can first be moved to guide channel 11, and conducting sphere
20 can arrange one by one in the leader 15 of guide channel 11, as the ball case is when being moved to ball-dropping area 12, positioned at leader 15
Conducting sphere 20 is passed to ball-dropping area 12, and is passing through position in the ball 13 of ball-dropping area 12, and conducting sphere 20 can smoothly fall into ball
It is carried in hole 13 and by supporting part 14, the conducting sphere 20 being located behind continues on the movement of guide channel 11 and falls into next ball
13, among the above, the conducting sphere 20 in the ball case constantly fills into guide channel 11 and moves along guide channel 11, each to fall into really
In ball 13, make ball 13 that can all have conducting sphere 20.
It except movement, can also be swiped by scraper plate, bristle on planting ball directing plate except through ball case by conducting sphere 20
Conducting sphere 20 perhaps blows conducting sphere 20 with air-flow or allows conducting sphere 20 to pass through guide channel 11 with plant ball directing plate is shaken
Guiding auxiliary and then can be fallen one by one so that conducting sphere 20 can be arranged one by one in guide channel 11 and be moved along guide channel 11
Enter to be located at the ball 13 of the groove bottom of guide channel 11, allowing in each ball 13 all has conducting sphere 20.
After falling into the falling sphere job execution to ball 13 to conducting sphere 20, then will be in ball 13 with a suction means
The absorption of conducting sphere 20 comes up, which drives in turn on 20 to one substrate of conducting sphere being drawn up, makes conducting sphere 20
It can smoothly be placed on the weld pad of substrate.
As shown in figure 8, can further match unification ejector apparatus 30 during conducting sphere 20 is taken out into ball 13,
The push rod 31 of the ejector apparatus 30 is respectively protruding into corresponding perforation 16, and the conducting sphere 20 in ball 13 is ejected.
As shown in figure 12, in the plant ball directing plate, the top surface of the plate 10 forms a recovery area 17, which is located at
At the rear end of the guide channel 11, and the plate 10 forms an at least recovery holes 18 in the recovery area 17, and the recovery holes 18 are passed through
Wear the plate 10, wherein the recovery holes 18 can be fallen into using rear remaining conducting sphere 20, fail to fall into ball 13 with recycling
Conducting sphere 20.
In addition, the plate 10 can use the component or knockdown component of integral type according to demand, if the plate 10 is adopted
With knockdown component, the processing and manufacturing complexity of component can be reduced.
In conclusion the plant ball directing plate cooperates ball 13 using guide channel 11, so that guide channel 11 can guide conducting sphere
20, conducting sphere 20 can be fallen into guide channel 11 and be moved along guide channel 11, so that conducting sphere 20 can smoothly fall into position in guide channel
In the ball 13 of 11 ball-dropping area 12, and conducting sphere 20 is allowed to be accommodated in ball 13 using supporting part 14, wherein guide channel 11 allows
Conducting sphere 20 can arrange one by one, and then can ensure that the ball 13 positioned at the groove bottom of guide channel 11 all has conducting sphere 20, reaches drop
The purpose of low scarce ball rate, and falling sphere operation ease is improved, in addition, the setting of the leader 15 can allow conducting sphere 20 entering
First arrangement in advance, allows conducting sphere 20 to arrange one by one in advance, and can assist reducing scarce ball rate before ball-dropping area 12, and can shorten falling sphere work
The industry time.
Certainly, the present invention can also have other various embodiments, without deviating from the spirit and substance of the present invention, ripe
It knows those skilled in the art and makes various corresponding changes and modifications, but these corresponding changes and change in accordance with the present invention
Shape all should fall within the scope of protection of the appended claims of the present invention.
Claims (10)
1. a plant ball directing plate, which is characterized in that include a plate, the top surface of the plate forms multiple spaced guidings
Slot, the groove bottom of each guide channel forms multiple spaced ball, and the plate forms one in the inside of each ball and holds
Load portion, it is ball-dropping area that the guide channel, which has the section definition of ball,.
2. plant ball directing plate according to claim 1, which is characterized in that it is leading that the groove bottom of each guide channel forms one
Area, the leader are located at the front end of the ball-dropping area.
3. plant ball directing plate according to claim 1, which is characterized in that the plant ball directing plate is passed through in the formation of each supporting part
A perforation of the plate is worn, which is connected to corresponding ball and extends to the bottom surface of the plate down.
4. plant ball directing plate according to claim 2, which is characterized in that the plant ball directing plate is passed through in the formation of each supporting part
A perforation of the plate is worn, which is connected to neighbouring ball and extends to the bottom surface of the plate down.
5. plant ball directing plate according to claim 3, which is characterized in that the aperture of the perforation is less than corresponding ball
Aperture.
6. plant ball directing plate according to claim 4, which is characterized in that the aperture of the perforation is less than corresponding ball
Aperture.
7. plant ball directing plate according to any one of claim 1 to 6, which is characterized in that the plate includes multiple stacked
Plate layer.
8. the plant ball directing plate according to claim 3 or 5, which is characterized in that the plate includes one first plate layer and one the
Two plate layers, the perforation forms and runs through the first plate layer and the supporting part is formed in top surface and the ring of the first plate layer
Around corresponding perforation, which is set to the top surface of the first plate layer, and the guide channel is formed in the top of the second plate layer
Face, the ball form and run through the second plate layer.
9. plant ball directing plate according to any one of claim 1 to 6, which is characterized in that the top surface of the plate forms one
Recovery area, the recovery area are located at the rear end of the guide channel, and the plate forms an at least recovery holes in the recovery area.
10. plant ball directing plate according to claim 8, which is characterized in that the top surface of the plate forms a recovery area, this time
It receives area to be located at the rear end of the guide channel, and the plate forms an at least recovery holes in the recovery area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810148979.5A CN110164770A (en) | 2018-02-13 | 2018-02-13 | Plant ball directing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810148979.5A CN110164770A (en) | 2018-02-13 | 2018-02-13 | Plant ball directing plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110164770A true CN110164770A (en) | 2019-08-23 |
Family
ID=67635283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810148979.5A Pending CN110164770A (en) | 2018-02-13 | 2018-02-13 | Plant ball directing plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110164770A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115497858A (en) * | 2022-11-17 | 2022-12-20 | 深圳市立可自动化设备有限公司 | Guide plate of ball planting machine |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5329144B2 (en) * | 1974-03-27 | 1978-08-18 | ||
| JPH11251369A (en) * | 1998-03-05 | 1999-09-17 | Matsushita Electric Ind Co Ltd | Conductive ball mounting device |
| CN101276759A (en) * | 2007-03-26 | 2008-10-01 | 矽品精密工业股份有限公司 | Equipment for soldering and planting ball as well as acquisition apparatus |
| CN103429006A (en) * | 2013-08-20 | 2013-12-04 | 中国电子科技集团公司第十四研究所 | BGA (Ball Grid Array) ball embedding method using SMT (Surface Mounting Technology) chip mounter |
| CN108063103A (en) * | 2016-11-08 | 2018-05-22 | 竑腾科技股份有限公司 | Ball attachment machine directing plate |
-
2018
- 2018-02-13 CN CN201810148979.5A patent/CN110164770A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5329144B2 (en) * | 1974-03-27 | 1978-08-18 | ||
| JPH11251369A (en) * | 1998-03-05 | 1999-09-17 | Matsushita Electric Ind Co Ltd | Conductive ball mounting device |
| CN101276759A (en) * | 2007-03-26 | 2008-10-01 | 矽品精密工业股份有限公司 | Equipment for soldering and planting ball as well as acquisition apparatus |
| CN103429006A (en) * | 2013-08-20 | 2013-12-04 | 中国电子科技集团公司第十四研究所 | BGA (Ball Grid Array) ball embedding method using SMT (Surface Mounting Technology) chip mounter |
| CN108063103A (en) * | 2016-11-08 | 2018-05-22 | 竑腾科技股份有限公司 | Ball attachment machine directing plate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115497858A (en) * | 2022-11-17 | 2022-12-20 | 深圳市立可自动化设备有限公司 | Guide plate of ball planting machine |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190823 |