KR20140009767A - Apparatus for sinking heat using heat pipe - Google Patents

Apparatus for sinking heat using heat pipe Download PDF

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Publication number
KR20140009767A
KR20140009767A KR1020120076454A KR20120076454A KR20140009767A KR 20140009767 A KR20140009767 A KR 20140009767A KR 1020120076454 A KR1020120076454 A KR 1020120076454A KR 20120076454 A KR20120076454 A KR 20120076454A KR 20140009767 A KR20140009767 A KR 20140009767A
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KR
South Korea
Prior art keywords
heat
heat dissipation
heat pipe
pipe
base plate
Prior art date
Application number
KR1020120076454A
Other languages
Korean (ko)
Inventor
박종복
김홍철
홍정훈
송승용
이남영
이진원
이광현
Original Assignee
주식회사 케이에스비
이광현
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 주식회사 케이에스비, 이광현 filed Critical 주식회사 케이에스비
Priority to KR1020120076454A priority Critical patent/KR20140009767A/en
Publication of KR20140009767A publication Critical patent/KR20140009767A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Sustainable Development (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The present invention relates to an apparatus for sinking heat using a heat pipe. The apparatus for sinking heat using a heat pipe is based on a standard unit of a heat sinking module including: a contact unit which contacts with a heating element; a heat pipe contacted with one side of the contact unit; and a heat sinking unit formed on the elongated side of the heat pipe. According to the kind and size of the lighting, the number and basic size of the heat sinking module is variable, thus facilitating thereof usage, enhancing the heat sinking efficiency of the high-capacity lighting, and reducing the overall size of the lighting.

Description

Heat dissipation unit using heat pipes {APPARATUS FOR SINKING HEAT USING HEAT PIPE}

The present invention relates to a heat dissipation unit, and more particularly to a heat dissipation unit using a heat pipe that can be applied to a variety of lights using a heat dissipation module is applied to the heat pipe filled with the working fluid in the hollow channel.

The existing heat sink is composed of a base plate in contact with the heating element, and a heat radiation fin formed integrally with the base plate.

In the heat sink configured as described above, when the heat generated from the heat generating element is conducted to the base plate, the conducted heat is reconducted to the heat radiation fins, whereby final heat radiation is achieved at the heat radiation fins.

However, when the distance between the base plate and the radiating fin is too large, there is a problem that heat radiation efficiency is lowered due to low heat conduction efficiency between the base plate and the radiating fin. This makes the problem of heat dissipation efficiency more serious when the size of the heat sink increases. That is, when the lighting lamp is a high-capacity lamp, the volume of the heat sink increases in proportion thereto. As the volume of the heat sink increases, the distance between the base plate and the heat sink fins becomes further away. will be. In addition, as the volume of the heat sink increases, the weight of the entire lighting lamp to which the heat sink is applied increases, which requires a separate structure for supporting the heat sink, which increases the manufacturing cost.

Therefore, there is a need for a method for transferring heat from the base plate to the heat sink fins as quickly as possible.

Recently, various studies have been conducted to improve the thermal conductivity efficiency, one of which is a heat pipe (nanotube).

A heat pipe is a heat transfer device in which a fluid flows due to a capillary pressure and a density difference of a fluid formed due to thermal imbalance such as evaporation and temperature difference.

Since heat pipes are heat-transferd by natural convection without extra power, heat treatment performance of heat pipes is important as variables such as type and amount of injection fluid, vacuum in container, cleanliness and capillary force of wick structure. .

As a technology related to heat pipes, Korean Patent Publication No. 2005-0017632 discloses a working fluid containing metal of nanoparticles selected from gold, silver or copper. In addition, domestic patent publication No. 2005-0093959 discloses a working fluid having carbon nanotubes or carbon nanofibers. Japanese Laid-Open Patent Publication No. 2004-0019150 discloses a heat pipe in which a plurality of channels for guiding movement of vapor of a working fluid are formed inside a flat pipe, and channels are arranged in parallel along the horizontal direction of the flat pipe have.

By using this heat pipe, the heat dissipation efficiency can be improved by minimizing the temperature difference between the base plate and the heat dissipation fin. That is, the heat dissipation efficiency by the heat dissipation fin can be improved by transferring the heat of the heating element to the heat dissipation fin as efficiently as possible. In other words, a phenomenon in which heat accumulates near the heating element can be prevented.

On the other hand, existing heat sinks are mainly manufactured as extrudates, so they are manufactured in a form suitable for mass production. Therefore, they are relatively unsuitable for medium and small quantity production methods. have. Therefore, there is a need for a method of applying a heat pipe to a medium-to-small amount production method.

Republic of Korea Patent Publication No. 10-2005-0017632 (published 2005.02.22.) Republic of Korea Patent Publication No. 10-2005-0093959 (Publication date September 26, 2005) Republic of Korea Patent Publication No. 10-2004-0019150 (Published Date 2004.03.05.)

Accordingly, the present invention has been made to solve the above problems of the prior art, an object of the present invention by combining at least one heat dissipation module as a base unit of the heat dissipation module coupled to the heat sink and heat pipe, all kinds of lamps And to provide a heat dissipation unit using a heat pipe to correspond to the size.

The heat dissipation unit using the heat pipe of the present invention for achieving the above object includes a contact portion in contact with the heating element, a heat pipe one side is in contact with the contact portion, and a heat dissipation portion formed on the other side of the heat pipe is extended; At least one heat dissipation module may be formed according to a lamp using the heat dissipation module as a basic unit.

In this case, the heat pipe is fixed to the contact portion by a fixture, the fixture is preferably coupled to the contact portion. Accordingly, the heating element may be installed in contact with the fixed body.

The contact part may be a substrate on which the heating element is formed.

In addition, a plurality of heat pipes may be formed in the contact portion.

The heat pipe includes a body having a hollow channel in the longitudinal direction and a working fluid filling the hollow channel, wherein the inner wall of the hollow channel is formed with irregularities, and the working fluid is aluminum oxide (Al 2 O 3 ) And nanoparticles of carbon nanotubes.

As described above, the heat dissipation unit using the heat pipe according to the present invention provides the following effects.

According to the present invention, the heat radiation efficiency can be maximized by using a heat pipe, so that not only can be applied to a high-capacity lighting lamp, but even a high-capacity lighting lamp can relatively reduce the size of the heat dissipation unit, thereby reducing the size of the entire lighting lamp. have.

In this way, since the size of the entire illumination lamp can be reduced, the weight of the illumination lamp is reduced, thereby eliminating the need to manufacture a separate structure for supporting the illumination lamp.

In addition, according to the present invention, since the heat dissipation unit uses the heat dissipation module as a basic unit, it can cope with all kinds of lightings by using the quantity change of the heat dissipation module or the change in the basic size of the heat dissipation module. It has the advantage of being suitable for all.

1 is a view showing a heat dissipation module that is a basic unit of the present invention.
2 is a view showing a heat dissipation unit according to an embodiment of the present invention.
3 is a perspective view of a heat dissipation unit to which a plurality of heat pipes is applied as a modification of the present invention.
4 is a perspective view of a heat pipe applied to the present invention.
5 is a perspective view of a heat pipe sealed in a vacuum state applied to the present invention.

Hereinafter, a heat dissipation unit using a heat pipe of the present invention will be described in detail with reference to the accompanying drawings.

1 is a view showing a heat dissipation module that is a basic unit of the present invention.

As shown in FIG. 1, the heat dissipation module 1, which is a basic unit constituting the heat dissipation unit, includes a base plate 11 in contact with the heating element L, and a heat pipe in which one side contacts the base plate 11. 13 and a heat dissipation fin 15 formed on the other side to which the heat pipe 13 extends. Here, the base plate 11 functions as a contact portion contacting the heat generating element, and the radiating fin 15 functions as a heat radiating portion.

It is preferable that the heat dissipating module 1 further includes a fixing portion 17 for allowing the heat pipe 13 to be in close contact with the base plate 11. [ The fixing portion 17 is preferably coupled to the base plate 11 through the coupling means 19. [ The fixing unit 17 and the base plate 11 are brought into contact with the heat pipe 13 so that the heating body L can be formed or attached to the fixing unit 17 and the base plate 11. [ That is, the LED module, the PCB, and the like may be mounted on the fixing unit 17 and the base plate 11. On the other hand, the base plate 11 may be a substrate on which a heating element L such as an LED module is formed.

Although the base plate 11 and the heat pipe 13 are formed in a flat plate shape in the present embodiment, the present invention is not limited thereto. That is, the base plate 11 is preferably manufactured in a shape corresponding to the state (type, shape, position) of the heating element L, and the heat pipe 13 in contact with the base plate 11 is also the base plate ( It is preferable to be manufactured in the shape corresponding to the shape of 11).

2 is a view showing a heat dissipation unit according to an embodiment of the present invention.

As shown in FIG. 2, a plurality of heat dissipation modules 1 shown in FIG. 1 are applied to constitute a heat dissipation unit 2.

The heat dissipation unit 2 can easily correspond to the size and type of the lamp by changing the number and position of the heat dissipation module (1).

3 is a perspective view of a heat dissipation unit to which a plurality of heat pipes is applied as a modification of the present invention.

As shown in FIG. 3, in the heat dissipation unit 3 according to the present modification, a plurality of heat pipes 33 are applied to the base plate 31 having a flat plate shape.

Specifically, in the heat dissipation unit 3 according to the present modification, a plurality of heat pipes 33 and fixing parts 37 are provided on one surface of the flat plate-shaped base plate 31, and the heat pipes 33 are provided. The heat dissipation fin 35 is formed at an end portion thereof. At this time, the fixing portion 37 is preferably coupled to the base plate 31 by the coupling means 39 so that the heat pipe 33 is fixed to the base plate 31 in close contact.

As described above, after manufacturing one base plate 31 corresponding to the size of the LED module, that is, the size of the lamp, the heat pipe 33 and the heat dissipation fins 35 are disposed on the base plate 31, thereby the size of the lamp and the like. It can respond easily to a kind.

In this modified example, in order to further improve heat dissipation efficiency, the heat dissipation fins 35 groups are distributed to both sides of the base plate 31.

Meanwhile, in the present exemplary embodiment, a modified example having a plurality of heat pipes 33 and heat dissipation fins 35 corresponding to one base plate 31 is illustrated, but a plurality of heat dissipation modules 1 shown in FIG. 1 are disposed. It is also possible to configure substantially the same heat dissipation unit (3).

FIG. 4 is a perspective view of a heat pipe applied to the present invention, and FIG. 5 is a perspective view of a heat pipe sealed in a vacuum state applied to the present invention.

4 and 5, the heat pipes 13 and 33 applied to the present invention, the body 131 having a hollow channel (H) in the longitudinal direction (L), and the hollow channel (H) It consists of a filling working fluid. The inner wall of the hollow channel (H) is irregularities 133 is formed.

Specifically, the heat pipes 13 and 33 proposed in the present embodiment have a flat metal body 131 to maximize the contact area with the base plate 11, and a plurality of heat pipes 13 and 33 are provided inside the body 131. A plurality of hollow channels (H) are formed in the longitudinal direction. Hollow channel (H) is formed with a plurality of concave-convex (133) (WICK) in the longitudinal direction symmetrically up and down the inner wall. Both ends of the body 131 are simultaneously sealed to form an end 135. Meanwhile, although the heat pipes 13 and 33 of the flat type are exemplified in the present embodiment, the present invention is not limited thereto and may be modified in various forms to maximize the contact area. In addition, the concavities and convexities 133 of the hollow channel H may be modified in various forms to maximize the contact area of the working fluid.

Body 131 is made of aluminum for improved conductivity and ease of manufacture. That is, by selecting aluminum as the material of the body 131, it can be easily produced in a square tube shape by the extrusion method. Body 131 is the length and thickness of the longitudinal direction (ℓ) of the body 131 is determined according to the flow rate of the working fluid injected into the hollow channel (H) to the heat transfer design, the length of the longitudinal direction (ℓ) is 30mm It is preferred that the thickness t is 1.5 mm to 3 mm, but the length and thickness may be changed according to the amount of heat to be radiated. In addition, the size and number of the concave-convex 133 formed on the inner wall of the hollow channel (H) is determined according to the heat transfer design, for example, the depth is 0.3mm to 0.4mm, the width (width) is 0.2mm to 0.3 It is preferable that the irregularities 133 having a size of mm are formed to be symmetrically up and down, and the size and number of the hollow channels H are also determined according to the heat transfer design, and the hollow according to the structure of the application field to which the present invention is applied. The size and number of channels H may be changed. The number of hollow channels H formed in the body 131 is also determined by the design of the heat transfer such as the heat transfer distance, and when the distance of the heat transfer is relatively short and manufactured for the purpose of rapid heat dissipation, the maximum number of channels is 12 to 14 channels. If the heat transfer distance is greater, the length of the longitudinal direction (l) is determined in consideration of the total amount of heat to be transmitted while the channel is somewhat enlarged in order to reduce the release of heat between movements.

On the other hand, the working fluid is a material containing nanoparticles. Specifically, the working fluid is filled and sealed inside each hollow channel (H), preferably made of a distilled water type working fluid or alcohol type working fluid containing aluminum oxide (Al 2 O 3 ) and carbon nanotubes of the nanoparticles. Do.

The aluminum oxide (Al 2 O 3 ) of the nanoparticles and the carbon nanotubes are metal nanoparticles having a particle size of 1 to 50 nm, and preferably made of metal nanoparticles having a particle size of 30 nm.

The aluminum oxide (Al 2 O 3 ) of the nanoparticles and the carbon nanotubes are mixed in the working fluid in a volume ratio of about 1 to 5%, preferably about 2 to 2.5%

The working fluid containing nanoparticles of aluminum oxide (Al 2 O 3 ) and carbon nanotubes is a mixed fluid having a large heat transfer coefficient and a large heat capacity, so that it is possible to greatly improve the ability to treat heat generated by the evaporation portion as a condensation portion The heat transfer area and the heat capacity of the fluid can be increased within the working fluid, and the conductivity between the fluids can be improved, thereby improving the heat transfer characteristics.

The heat pipes 13 and 33 configured as described above are hollow without using a conventional wick which serves as a passage for the liquid working fluid to flow (return) from the condenser section to the evaporator section. The liquid working fluid flows by the capillary force generated by the unevenness 133 vertically formed on the inner wall of the channel H. That is, the concave and convex portions 133 formed on the inner wall of the hollow channel H vertically serve as a conventional wick.

Accordingly, the heat generated by the heating element (L) can be quickly transferred to the heat sink (F) by the heat transfer by the phase change between the liquid and the vapor by the liquid working fluid injected in the state where the inside of the hollow channel (H) The heat radiation efficiency can be improved.

Since the heat dissipation unit 2 configured as described above can exhibit excellent performance in heat dissipation due to convective conduction because the temperature difference between the heat generating element L and the heat dissipation fin 15 is not severe, the LED street light, floodlight, It can be used for picking up.

On the other hand, depending on the type and size of the lighting lamp, a large number of the heat dissipation modules 1 can be applied, or the size of the heat dissipation module 1 can be arbitrarily set. Respectively.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention.

1: heat dissipation module 11: base plate
13 heat pipe 131 body
133: irregularities 135: end
15: heat dissipation fins 2, 3: heat dissipation unit
L: Heating element H: Hollow channel

Claims (6)

At least one heat dissipation module is formed in accordance with a lamp by using a heat dissipation module including a contact part in contact with a heating element, a heat pipe having one side in contact with the contact part, and a heat dissipation part formed at the other side from which the heat pipe extends. Heat dissipation unit using a heat pipe, characterized in that.
The method of claim 1,
The heat pipe is fixed to the contact portion by a fixture, the heat dissipation unit using a heat pipe, characterized in that coupled to the contact portion.
3. The method of claim 2,
Heat dissipation unit using a heat pipe, characterized in that the heating element is installed in contact with the fixed body.
The method of claim 1,
The heat dissipation unit using a heat pipe, characterized in that the contact portion is a substrate on which the heating element is formed.
The method of claim 1,
The heat dissipation unit using a heat pipe, characterized in that a plurality of heat pipes are formed in the contact portion.
The method of claim 1,
The heat pipe includes:
A body having a hollow channel in a longitudinal direction, and a working fluid filling the hollow channel,
The inner wall of the hollow channel is formed with irregularities,
The working fluid is a heat dissipation unit using a heat pipe, characterized in that the nanoparticles of aluminum oxide (Al2O3) and carbon nanotubes.
KR1020120076454A 2012-07-13 2012-07-13 Apparatus for sinking heat using heat pipe KR20140009767A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020120076454A KR20140009767A (en) 2012-07-13 2012-07-13 Apparatus for sinking heat using heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120076454A KR20140009767A (en) 2012-07-13 2012-07-13 Apparatus for sinking heat using heat pipe

Publications (1)

Publication Number Publication Date
KR20140009767A true KR20140009767A (en) 2014-01-23

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