KR20140008670A - Light emitting device package - Google Patents

Light emitting device package Download PDF

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Publication number
KR20140008670A
KR20140008670A KR1020120075469A KR20120075469A KR20140008670A KR 20140008670 A KR20140008670 A KR 20140008670A KR 1020120075469 A KR1020120075469 A KR 1020120075469A KR 20120075469 A KR20120075469 A KR 20120075469A KR 20140008670 A KR20140008670 A KR 20140008670A
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KR
South Korea
Prior art keywords
light emitting
emitting device
lens
light
device package
Prior art date
Application number
KR1020120075469A
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Korean (ko)
Inventor
김지후
김기현
Original Assignee
엘지이노텍 주식회사
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Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020120075469A priority Critical patent/KR20140008670A/en
Publication of KR20140008670A publication Critical patent/KR20140008670A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

The embodiment of the present invention relates to a light emitting diode package. The light emitting diode package according to the embodiment comprises a light emitting diode; and a lens which is arranged on the light emitting diode and has the incident surface on which the light emitted from the light emitting diode is incident and the emitting surface for emitting parallel rays, wherein the incident surface of the lens is the flat surface, and the emitting surface of the lens is the aspherical surface, and the relation between a wavelength of the light emitted from the light emitting diode and the equation of sin[π/2-tan^-1(R^2-(1+k)x^2)^1/2]sin[θ] is the continuous decreasing function relation, wherein R is a radius, k is a conic constant, x is a radial distance, and θ is an incident angle of a ray incident on the emitting surface of the lens (350).

Description

Light emitting device package {LIGHT EMITTING DEVICE PACKAGE}

An embodiment relates to a light emitting device package.

Light emitting diodes (LEDs) are a type of semiconductor devices that convert electrical energy into light. The light emitting diode has advantages of low power consumption, semi-permanent lifetime, fast response speed, safety, and environmental friendliness compared with conventional light sources such as fluorescent lamps and incandescent lamps. Therefore, much research has been conducted to replace conventional light sources with light emitting diodes. Light emitting diodes are increasingly used as light sources for various lamps used in indoor / outdoor, liquid crystal display devices, electric sign boards, streetlights, and the like .

The embodiment provides a light emitting device package capable of emitting parallel light.

In addition, the embodiment provides a light emitting device package capable of emitting light in a specific ultraviolet region.

The light emitting device package according to the embodiment includes a light emitting device; And a lens disposed on the light emitting element, the lens having an emission surface emitting parallel light with an incident surface to which light emitted from the light emitting element is incident, wherein the incident surface of the lens is a flat surface. The emitting surface is an aspherical surface, and the relationship between the wavelength of light emitted from the light emitting device and the following equation is a continuous decreasing function relationship.

Figure pat00001
Where R is a radius, k is a Conic Constant, x is a radial distance, and is an angle of incidence of the light incident on the emitting surface of the lens 350.

The light emitting device package according to the embodiment includes a light emitting device; And a lens disposed on the light emitting element, the lens having an emission surface emitting parallel light with an incident surface to which light emitted from the light emitting element is incident, wherein the incident surface is a flat surface and the emission surface is an aspherical surface. to be.

Using the light emitting device package according to the embodiment, there is an advantage that can emit parallel light.

In addition, the embodiment has the advantage that can emit light in a specific ultraviolet region.

1 is a perspective view of a light emitting device package according to an embodiment.
FIG. 2 is a perspective view of an optical unit of the light emitting device package illustrated in FIG. 1.
3 is a cross-sectional view taken along line AA ′ of the light emitting device package shown in FIG. 1.
4 is a view for explaining the relationship between the light emitting element and the lens shown in FIGS.
5 is a cross-sectional view showing a modified example of the light emitting device package shown in FIG.
6 is a cross-sectional view showing a modified example of the light emitting device package shown in FIG.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. In addition, the size of each component does not necessarily reflect the actual size.

In the description of embodiments according to the present invention, it is to be understood that where an element is described as being formed "on or under" another element, On or under includes both the two elements being directly in direct contact with each other or one or more other elements being indirectly formed between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

Hereinafter, a light emitting device package according to an embodiment will be described with reference to the accompanying drawings.

1 is a perspective view of a light emitting device package according to an embodiment, FIG. 2 is a perspective view when the optical unit 300 of the light emitting device package shown in FIG. 1 is removed, and FIG. 3 is a view of the light emitting device package shown in FIG. 1. It is sectional drawing to A-A '.

1 to 3, the light emitting device package according to the embodiment may include a housing 100, a light emitting device 200, and an optical unit 300. The light emitting device package according to the embodiment may be used in a semiconductor exposure process. In this case, the light emitting device 200 of the light emitting device package may be a UV LED emitting ultraviolet light of a specific wavelength band.

The housing 100 may have a structure for accommodating the light emitting device 200. For example, the housing 100 may have a rectangular box shape to accommodate the light emitting device 200.

The housing 100 may be a structure and a material for radiating heat from the light emitting device 200. The housing 100 may be a metal material or a resin material having excellent heat dissipation efficiency. Specifically, the housing 100 may be made of a material having a high thermal conductivity (generally 150Wm-1K-1 or more, more preferably 200Wm-1K-1 or more). For example, it may be copper (about 400 Wm-1K-1 thermal conductivity), aluminum (about 250 Wm-1K-1 thermal conductivity), anodized aluminum, aluminum alloy, magnesium alloy. In addition, metal loaded plastic materials, such as polymers, for example epoxy or thermally conductive ceramic materials (e.g., aluminum silicon carbide (AlSiC) (thermal conductivity of about 170 to 200 Wm-1K-1) Can be).

Here, the housing 100 may further have a plurality of fins of the same or similar material as the housing 100 to increase the heat dissipation area. The plurality of pins may extend outward from the outer surface of the housing 100.

The housing 100 may include one surface 110 on which the light emitting device 200 is disposed and a sidewall 150 formed around the surface 110. The one surface 110 and the inner surface 155 of the sidewall 150 may form a recess. The inner surface 155 and the one surface 110 of the side wall 150 may be obtuse, and the inner surface 155 of the side wall 150 may be a reflective surface capable of reflecting light emitted from the light emitting device 200. .

The light emitting device 200 is disposed in the housing 100. In detail, the light emitting device 200 may be disposed on one surface 110 of the housing 100. In addition, the light emitting device 200 may be disposed in the recess of the housing 100.

The light emitting device 200 may be disposed on a substrate (not shown) disposed on one surface 110 of the housing 100, or may be directly disposed on one surface 110 of the housing 100.

There may be one light emitting device 200 or a plurality of light emitting devices 200. When there are a plurality of light emitting devices 200, the plurality of light emitting devices 200 may be uniformly arranged on one surface 110 of the housing 100.

The plurality of light emitting devices 200 may correspond one-to-one with the plurality of lenses 350 of the optical unit 300. In detail, one lens 350 may be disposed on one light emitting device 200 such that one light emitting device 200 corresponds to one lens 350.

The light emitting device 200 may be a light emitting device that emits light in the ultraviolet region. For example, the light emitting device 200 may be a light emitting diode emitting light in an ultraviolet region having main peaks of 365 nm, 405 nm, and 436 nm. Here, if the light emitting device 200 is a light emitting diode, there is an advantage that the unnecessary ultraviolet ray is not emitted in the exposure process, there is an advantage that a separate filtering process for removing the unnecessary ultraviolet ray is unnecessary.

One of the plurality of light emitting devices 200 may emit ultraviolet light of 365 nm, the other may emit ultraviolet light of 405 nm, and the other may emit ultraviolet light of 435 nm. Meanwhile, all of the plurality of light emitting devices 200 may emit ultraviolet rays of any one of 365 nm, 405 nm, and 436 nm.

The optical unit 300 transmits and emits light incident from the light emitting device 200. Specifically, the optical unit 300 transforms and emits light incident from the light emitting device 200 into parallel light.

The optical unit 300 may include a base unit 310 and a lens 350. The base 310 may be disposed on the housing 100, and the lens 350 may be disposed at the center of the base 310. The base portion 310 and the lens 350 may be formed of the same material and may be integrated, or may be combined with each other as a separate configuration.

The base portion 310 of the optical portion 300 is disposed on the housing 100. In detail, the base 310 of the optical unit 300 may be disposed on the sidewall 150 of the housing 100, thereby allowing the lens 350 to be spaced apart from the light emitting device 200 by a predetermined distance.

The lens 350 may be disposed in the base portion 310. The plurality of lenses 350 may correspond one-to-one with the light emitting devices 200.

One lens 350 may convert light incident from one light emitting device 200 into parallel light and emit the same. This will be described in detail with reference to FIG. 4.

4 is a view for explaining a relationship between the light emitting device 200 and the lens 350 illustrated in FIGS. 1 to 3.

Referring to FIG. 4, the lens 350 is disposed on the light emitting device 200. In addition, the lens 350 has an incident surface and an emitting surface. The incident surface may be a flat surface parallel to the light emitting surface of the light emitting device 200, and the emitting surface may be an aspherical surface. The light emitted from the light emitting device 200 is incident on the incident surface of the lens 350, and passes through the interior of the lens 350 to the outside through the emitting surface.

Here, the form of light emitted from the emitting surface of the lens 350 is different from the form of light emitted from the light emitting device 200. That is, although the light emitting device 200 emits light at a predetermined beam angle, the light emitted from the lens 350 is not emitted and collected. That is, the light emitted from the light emitting element 200 is divergent light, and the light emitted from the lens 350 is parallel light.

Here, when the relationship between the wavelength λ of the light emitted from the light emitting device 200 and the following Equation 1 is in a continuous decreasing function, the light emitted from the emission surface of the lens 350 is It can be parallel light.

Figure pat00002

Equation 1 may be derived through the following process.

First, the equation of the tangent of the emission surface of the lens 350 is calculated. The tangential equation uses the Sag equation of Equation 2 below.

Figure pat00003

In Equation 2 above, R is a radius, k is a Conic Constant, and x is a radial distance.

The equation of the tangent of the emission surface of the lens 350 may be different from the above Equation 2 with respect to x, as shown in Equation 3 below.

Figure pat00004

Next, the equation of the normal line (S) is calculated using the equation of the tangent of Equation 3 above. When the equation of the normal line (S) is calculated, it is expressed as Equation 4 below.

Figure pat00005

Meanwhile, Snell's Law is shown in Equation 5 below.

Figure pat00006

In Equation 5, n1 is the refractive index of the lens 350, n2 is the refractive index of air,

Figure pat00007
Is an angle of incidence of the light rays incident on the emitting surface of the lens 350, and is an angle between the normal line S and the light rays in the lens 350.
Figure pat00008
Denotes an exit angle of light rays emitted from the emitting surface of the lens 350 to the outside, and is an angle between the normal line S and the light rays outside the lens 350.

After arranging the above Equation 5 for n and applying Equation 4, Equation 1 can be derived.

5 is a cross-sectional view illustrating a modified example of the light emitting device package illustrated in FIG. 3.

Referring to FIG. 5, the optical unit 300 ′ of the light emitting device package according to another embodiment has one lens 350 ′. One lens 350 ′ is disposed on the plurality of light emitting devices 200. That is, one lens 350 ′ corresponds to the plurality of light emitting devices 200. Here, the plurality of light emitting devices 200 may be light emitting diodes emitting ultraviolet light having any one of 365 nm, 405 nm, and 436 nm.

The relationship shown in FIG. 4 may also be established between one lens 350 'and the plurality of light emitting devices 200.

6 is a cross-sectional view illustrating a modified example of the light emitting device package illustrated in FIG. 5.

Referring to FIG. 6, the optical unit 300 ′ of the light emitting device package according to another embodiment has one lens 350 ′, and one lens 350 ′ on one light emitting device 200. Is placed. That is, one lens 350 ′ corresponds to one light emitting device 200. Here, the one light emitting device 200 may be a light emitting diode that emits ultraviolet light having a wavelength of any one of 365 nm, 405 nm, and 436 nm.

The relationship shown in FIG. 4 may be established between one lens 350 ′ and one light emitting device 200.

Although the above description has been made with reference to the embodiments, these are only examples and are not intended to limit the present invention, and those of ordinary skill in the art to which the present invention pertains should not be exemplified above without departing from the essential characteristics of the present embodiments. It will be appreciated that many variations and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100: Housing
200: light emitting element
300: optics

Claims (6)

A light emitting element; And
A lens disposed on the light emitting element, the lens having an emission surface emitting parallel light with an incident surface on which light emitted from the light emitting element is incident;
The incident surface of the lens is a flat surface, the emitting surface of the lens is an aspherical surface,
The relationship between the wavelength of the light emitted from the light emitting device and the following equation is a continuous decreasing function (Recreasing Function) relationship.
Figure pat00009

Where R is a radius, k is a Conic Constant, x is a radial distance, and is an angle of incidence of the light incident on the emitting surface of the lens 350. The method of claim 1,
The light emitting element and the lens is a plurality,
The light emitting device package corresponding to the plurality of light emitting devices and the plurality of lenses in a one-to-one correspondence. 3. The method of claim 2,
The light emitting device package of the plurality of light emitting devices to emit light in the ultraviolet region of the main peak is 365nm, 405nm and 436nm. The method of claim 1,
The light emitting device is a light emitting device package is a light emitting diode whose main peak emits light in the ultraviolet region of any one of 365nm, 405nm and 436nm. The method of claim 1,
A housing having a recess in which the light emitting element is disposed; And
An optical unit including the lens and disposed on the housing;
Emitting device package. The method of claim 5, wherein
The housing has a light emitting device package having a surface on which the light emitting device is disposed and a side wall surrounding the one surface.
KR1020120075469A 2012-07-11 2012-07-11 Light emitting device package KR20140008670A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017164672A1 (en) * 2016-03-23 2017-09-28 엘지이노텍 주식회사 Optical module
WO2020098775A1 (en) * 2018-11-17 2020-05-22 深圳市奥拓电子股份有限公司 Led beads and display structure

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017164672A1 (en) * 2016-03-23 2017-09-28 엘지이노텍 주식회사 Optical module
KR20170110476A (en) * 2016-03-23 2017-10-11 엘지이노텍 주식회사 Optical module
CN108885351A (en) * 2016-03-23 2018-11-23 Lg伊诺特有限公司 Optical module
JP2019511127A (en) * 2016-03-23 2019-04-18 エルジー イノテック カンパニー リミテッド Optical module
US10738968B2 (en) 2016-03-23 2020-08-11 Lg Innotek Co., Ltd. Optical module
CN108885351B (en) * 2016-03-23 2021-06-04 Lg伊诺特有限公司 Optical module
WO2020098775A1 (en) * 2018-11-17 2020-05-22 深圳市奥拓电子股份有限公司 Led beads and display structure

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