KR20140004010A - 입사광 반사를 감소시키기 위한 단결정 반도체 기판의 텍스쳐링 - Google Patents

입사광 반사를 감소시키기 위한 단결정 반도체 기판의 텍스쳐링 Download PDF

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Publication number
KR20140004010A
KR20140004010A KR1020130074342A KR20130074342A KR20140004010A KR 20140004010 A KR20140004010 A KR 20140004010A KR 1020130074342 A KR1020130074342 A KR 1020130074342A KR 20130074342 A KR20130074342 A KR 20130074342A KR 20140004010 A KR20140004010 A KR 20140004010A
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KR
South Korea
Prior art keywords
solution
texturing
wafer
oxygen
single crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020130074342A
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English (en)
Korean (ko)
Inventor
로버트 케이. 바르
코리 오코너
피터 더블유. 힝클리
죠지 알. 알라디스
Original Assignee
롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨.
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Publication date
Application filed by 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. filed Critical 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨.
Publication of KR20140004010A publication Critical patent/KR20140004010A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/70—Surface textures, e.g. pyramid structures
    • H10F77/707—Surface textures, e.g. pyramid structures of the substrates or of layers on substrates, e.g. textured ITO layer on a glass substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/30—Coatings
    • H10F77/306—Coatings for devices having potential barriers
    • H10F77/311—Coatings for devices having potential barriers for photovoltaic cells
    • H10F77/315—Coatings for devices having potential barriers for photovoltaic cells the coatings being antireflective or having enhancing optical properties
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • C30B33/08—Etching
    • C30B33/10—Etching in solutions or melts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/70—Surface textures, e.g. pyramid structures
    • H10F77/703—Surface textures, e.g. pyramid structures of the semiconductor bodies, e.g. textured active layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Photovoltaic Devices (AREA)
  • Weting (AREA)
KR1020130074342A 2012-06-27 2013-06-27 입사광 반사를 감소시키기 위한 단결정 반도체 기판의 텍스쳐링 Withdrawn KR20140004010A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/535,224 US20140004701A1 (en) 2012-06-27 2012-06-27 Texturing of monocrystalline semiconductor substrates to reduce incident light reflectance
US13/535,224 2012-06-27

Publications (1)

Publication Number Publication Date
KR20140004010A true KR20140004010A (ko) 2014-01-10

Family

ID=48699591

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130074342A Withdrawn KR20140004010A (ko) 2012-06-27 2013-06-27 입사광 반사를 감소시키기 위한 단결정 반도체 기판의 텍스쳐링

Country Status (6)

Country Link
US (1) US20140004701A1 (https=)
EP (1) EP2680314A1 (https=)
JP (1) JP2014013895A (https=)
KR (1) KR20140004010A (https=)
CN (1) CN103515481B (https=)
TW (1) TWI488944B (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022172907A1 (https=) * 2021-02-10 2022-08-18

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001351906A (ja) * 2000-06-06 2001-12-21 Canon Inc シリコン基板のエッチング方法
CN102017176A (zh) * 2008-03-25 2011-04-13 应用材料股份有限公司 结晶太阳能电池的表面清洁与纹理化工艺
US7955989B2 (en) * 2009-09-24 2011-06-07 Rohm And Haas Electronic Materials Llc Texturing semiconductor substrates
CN101661972B (zh) * 2009-09-28 2011-07-20 浙江大学 一种低表面反射率的单晶硅太阳电池绒面制作工艺
US20110151671A1 (en) * 2009-12-17 2011-06-23 Rohm And Haas Electronic Materials Llc method of texturing semiconductor substrates
CN102181935B (zh) * 2010-10-26 2012-09-19 浚鑫科技股份有限公司 一种制作单晶硅绒面的方法及腐蚀液
US9038724B2 (en) * 2010-11-16 2015-05-26 Halliburton Energy Services, Inc. Oxygen scavenger compositions for completion brines
US20120295447A1 (en) * 2010-11-24 2012-11-22 Air Products And Chemicals, Inc. Compositions and Methods for Texturing of Silicon Wafers

Also Published As

Publication number Publication date
JP2014013895A (ja) 2014-01-23
TW201418417A (zh) 2014-05-16
CN103515481A (zh) 2014-01-15
EP2680314A1 (en) 2014-01-01
TWI488944B (zh) 2015-06-21
CN103515481B (zh) 2016-07-06
US20140004701A1 (en) 2014-01-02

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WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
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