KR20140001305A - Probe card assembly - Google Patents

Abstract

The present invention relates to a probe card assembly. According to an embodiment of the present invention, the probe card assembly accurately controls the horizontal state of a probe card assembly. The probe card assembly includes a slight plate moved by a cam and a slight fixing part moving up and down.

Description

[0001] PROBE CARD ASSEMBLY [0002]

Embodiments of the present invention relate to a probe card assembly, and more particularly, to a probe card assembly used to inspect electrical characteristics of integrated circuit elements.

In general, integrated circuit elements such as semiconductor devices are fabricated by a fab process that forms electrical circuitry on a semiconductor wafer, an electrical diesorting (EDS) process for inspecting the electrical characteristics of the integrated circuit devices formed in the fab process, And a packaging process for encapsulating and individualizing the integrated circuit elements with an epoxy resin, respectively.

In the EDS process, electrical signals are applied to the integrated circuit elements formed on the semiconductor wafer, electrical signals output from the integrated circuit elements are obtained, and the electrical characteristics of the integrated circuit elements The acquired signals can be analyzed.

The apparatus for electrically testing the integrated circuit devices may include a tester for applying the electrical signals and analyzing the obtained signals, and a probe station for transferring the electrical signals. The probe station may include a probe card assembly that contacts the integrated circuit elements to transmit electrical signals.

The probe card assembly may include a probe card and a frame that mounts the probe card to the tester and serves as a first reinforcement plate that structurally reinforces the upper substrate. The probe card may include a probe substrate including a plurality of probe pins in contact with the integrated circuit elements and an upper substrate connected to the tester. The probe substrate and the upper substrate may be electrically connected by a plurality of connecting pins having elasticity,

It may be structurally supported by a second reinforcing plate mounted on the lower surface of the upper substrate. In particular, the second reinforcing plate and the probe substrate may be connected by an elastic member, and the flatness of the probe substrate may be adjusted by an adjusting member extending downward through the upper substrate. Examples of the method for adjusting the flatness of the probe substrate as described above are disclosed in Korean Patent Laid-Open Publication Nos. 2002-95151, 2006-126773, 2008-76457, and the like.

However, even when adjusting the flatness of the probe substrate using the adjustment member as described above, it is difficult to precisely adjust the horizontal state of the entire probe card assembly.

Embodiments of the present invention to provide a probe card assembly capable of precisely adjusting the horizontal state.

A probe card assembly according to embodiments of the present invention is a probe card configured to contact the integrated circuit elements for electrical inspection of integrated circuit elements formed on a substrate, coupled to an upper portion of the probe card and for inspection. A frame for mounting the probe card under the tester that provides a signal, and a relative height relative to the frame coupled to the frame to connect the frame and the tester to adjust the horizontal state of the probe card This may include a plurality of possible connecting members.

According to embodiments of the present invention, each of the connection members may be coupled to the edge portion of the frame by at least one bolt, the relative height of the connection member is coupled to the screw hole formed in the connection member of the frame It can be adjusted by a set screw in close contact with the edge portion.

According to embodiments of the present invention, each of the connection members may have a through hole through which the bolt passes, a bolt groove into which the head of the bolt is inserted, and an upper surface closely contacting the lower surface of the tester.

According to embodiments of the present invention, a scale may be formed on the upper surface of the connection member to surround the screw hole to adjust the rotation speed and the rotation angle of the set screw.

According to embodiments of the present invention, grooves into which the connecting members are inserted may be formed at edge portions of the frame.

According to embodiments of the present invention, the tester may have a plurality of hooks for holding the connecting members, and the connecting members may each have a hook coupling portion into which each hook is inserted.

According to embodiments of the present invention, the hooks may be configured to be movable in the vertical direction, each connecting member may have an upper surface in close contact with the lower surface of the tester by the movement of the hooks.

According to embodiments of the present invention, the hook coupling portion may include a slit-shaped inlet formed in the upper surface portion of the connection member so that the hook is inserted and a cavity formed so that the inserted hook is rotatable. have.

According to the embodiments of the present invention as described above, the probe card assembly including the frame and the probe card may be mounted to the bottom of the tester by a plurality of connecting members. The relative height of the connecting members relative to the frame can be adjusted by the set screws, so that the overall horizontal state of the probe card assembly can be precisely adjusted.

1 is a schematic cross-sectional view illustrating a probe card assembly according to an embodiment of the present invention.
FIG. 2 is a schematic plan view for explaining the frame illustrated in FIG. 1.
FIG. 3 is an enlarged plan view for describing an edge portion of the frame illustrated in FIG. 2.
4 is a schematic perspective view illustrating the connection member of FIG. 3.
5 is a plan view illustrating the operation of the connecting member of FIG. 4.
6 is a side cross-sectional view illustrating the operation of the connecting member of FIG. 4.

BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in more detail below with reference to the accompanying drawings showing embodiments of the invention. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

When an element is described as being placed on or connected to another element or layer, the element may be disposed or connected directly to the other element, and other elements or layers may be interposed therebetween It is possible. Alternatively, if one element is described as being placed directly on or connected to another element, there can be no other element between them. Like reference numerals refer to like elements throughout, and the term “and / or” includes any one or more combinations of related items.

The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms . These terms are only used to distinguish one element from another.

Accordingly, the first element, composition, region, layer or portion described below may be represented by the second element, composition, region, layer or portion without departing from the scope of the invention.

Spatially relative terms such as "bottom" or "bottom" and "top" or "top" may be used to describe the relationship of one element to another as described in the figures. Can be. Relative terms may include other orientations of the device in addition to the orientation shown in the figures. For example, if the device is reversed in one of the figures, the elements described as being on the lower side of the other elements will be fitted as being on the upper side of the other elements. Thus, the typical term “bottom” may include both “bottom” and “top” orientation for a particular orientation in the figures. Similarly, if the device is reversed in one of the figures, elements described as "below" or "below" of the other elements will be fitted "above" of said other elements. Thus, the typical term "below" or "below" may include both "below" and "above" orientations.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used below, what is shown in the singular also includes the plural unless specifically indicated otherwise. Also, when the terms “comprises” and / or “comprising” are used, they are characterized by the presence of the forms, regions, assemblies, steps, actions, elements and / or components mentioned. It is not intended to exclude the addition of other one or more forms, regions, assemblies, steps, actions, elements, components, and / or groups of these.

Unless defined otherwise, all terms including technical and scientific terms have the same meaning as would be understood by one of ordinary skill in the art having ordinary skill in the art. Such terms, such as those defined in conventional dictionaries, will be construed as having meanings consistent with their meanings in the context of the related art and detailed description, and are not to be interpreted as ideally or excessively intuitional in nature unless clearly defined. Will not.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Accordingly, changes from the shapes of the illustrations, such as changes in manufacturing methods and / or tolerances, are those that can be reasonably expected. Accordingly, the embodiments of the present invention are not limited to the specific shapes of the regions described in the drawings, but also include deviations in the shapes. For example, a region described as flat may generally have roughness and / or nonlinear shapes. Also, the sharp edges described as illustrations may be rounded. Accordingly, the regions described in the Figures are entirely schematic and their shapes are not intended to illustrate the exact shape of the regions and are not intended to limit the scope of the invention.

1 is a schematic cross-sectional view illustrating a probe card assembly according to an embodiment of the present invention.

Referring to Figure 1, a probe card assembly 100 in accordance with an embodiment of the present invention may be used to inspect the electrical characteristics of integrated circuit components. For example, it can be used to inspect electrical characteristics of integrated circuit elements formed on a semiconductor substrate.

The probe card assembly 100 may be electrically coupled to a tester 10 that provides electrical signals and analyzes the signals obtained from the integrated circuit devices and may be electrically coupled to the integrated circuitry Lt; / RTI >

In particular, the probe card assembly 100 includes a probe card 110 configured to contact the integrated circuit elements for electrical inspection of the integrated circuit elements formed on the semiconductor substrate, And a frame 130 for mounting the probe card 110 below the tester 10.

The frame 130 may have a substantially disc shape and may be connected to the lower surface of the tester 10 by a plurality of connecting members 140. The connecting members 140 may be coupled to edge portions of the frame 130 to connect the frame 130 and the tester 10. Particularly, the connection members 140 may be configured to adjust the relative height of the frame 130, that is, the height of the frame 130, to adjust the horizontal state of the probe card 110.

Although not shown in detail, the probe card 110 may include an upper substrate 112 electrically connected to the tester 10, for example, a printed circuit board and a plurality of probe pins for contacting the integrated circuit devices. Probe substrate 116 with 114 may be included.

The probe substrate 116 may be structurally connected to the upper substrate 112 by an elastic member 122 such as a second reinforcement plate 118, a third reinforcement plate 120, and a leaf spring. In particular, the second reinforcement plate 118 may be coupled to a lower surface of the upper substrate 112 using a plurality of bolts, and the third reinforcement plate 120 may support the probe substrate 116. Can be used. The second reinforcement plate 118 and the third reinforcement plate 120 may be connected by the elastic member 122. Here, the frame 130 may also function as a first reinforcing plate for structurally reinforcing the upper substrate 112.

Meanwhile, the upper substrate 112 and the probe substrate 116 may be electrically connected by a plurality of connection pins 124, and the flatness of the probe substrate 116 may be the frame 130 and the upper substrate 112. It can be adjusted by a plurality of adjusting members 126 extending through).

The horizontal state of the probe card 110 may be adjusted by the connection members 140. In particular, the connecting members 140 may be fixed on the bottom surface of the tester 10 by the hooks 12 of the tester 10, and the frame 130 of each of the connecting members 140 may be fixed. The overall horizontal state of the probe card assembly 100 can be adjusted by adjusting the relative height with respect to).

FIG. 2 is a schematic plan view for explaining the frame illustrated in FIG. 1.

As shown in the drawing, the frame 130 may have a substantially disk shape, and the plurality of connection members 140 may be formed at edge portions of the frame 130, for example, the frame 130. Can be combined. On the other hand, the shape of the frame 130 may be changed in various ways, thereby not limiting the spirit and scope of the present invention. In addition, although a certain number of connecting members 140 are shown as shown, the number of connecting members 140 will also not limit the spirit and scope of the present invention.

FIG. 3 is an enlarged plan view for explaining an edge portion of the frame shown in FIG. 2, and FIG. 4 is a schematic perspective view for explaining the connecting member of FIG. 3.

As shown in the drawing, the connection member 140 may be positioned at the edge of the frame 130 according to the embodiment of the present invention.

The connection member 140 may include a cam type adjusting part 142 and a slide fixing part 144.

The adjusting unit 142 is rotatable in a clockwise to counterclockwise direction. For example, the operator manipulates the adjusting unit 142, which means that the adjusting unit 142 may rotate. As will be described in more detail in the corresponding part, the adjusting unit 142 may be connected to the cam. Accordingly, when the adjusting unit 142 rotates, the cam may also rotate together. The cam rotates and can push the slite plate 148 of FIG. 5 in the horizontal direction. When the slit plate 148 of FIG. 5 is pushed, the distance between the slide fixing parts 144 may be changed. Therefore, the overall horizontal state of the probe card assembly 100 can be adjusted.

Using the adjusting unit 142 according to an embodiment of the present invention, it is possible to precisely adjust the horizontal state using a cap. That is, as compared with the case in which the adjusting unit 142 rotates and directly adjusts the horizontal state, the adjusting unit 142 rotates the cam and the rotated cam pushes the slide fixing unit 144 to adjust the horizontal state more precisely. It means you can. This can be more clearly understood in view of the following points. That is, when a thread is formed along the body of the adjusting unit 142, the precision of the up and down direction of the adjusting unit 142 may be determined according to the pitch of the thread. For example, when the pitch of the thread is large, the vertical movement is large even if the adjustment part 142 is rotated less, and in the opposite case, the vertical movement is small. The pitch of the thread may be affected by the processing accuracy. Furthermore, reducing the pitch of the threads may have processing limitations. In the probe card assembly 100 according to the embodiment of the present invention, the cam connected to the adjusting unit 142 pushes out the slit plate (148 of FIG. 5) and is pushed away from the slate plate (148 of FIG. 5). The interval between the slide fixing part 144 may be made far. Therefore, it may be possible to precisely adjust according to the inclination of the slate plate (148 of FIG. 5) of the rhombus shape.

The fixing part 144 may allow the slate plate (148 of FIG. 5) to be coupled to the connection member 140.

5 is a plan view for explaining the operation of the connecting member of Figure 4, Figure 6 is a side cross-sectional view for explaining the operation of the connecting member of FIG.

As shown in these drawings, in the connection member 140 according to an embodiment of the present invention, the slit plate 148 may move by the rotation operation of the adjusting unit 142.

As shown in (a) of FIG. 5, the adjusting unit 142 and the slit plate 148 may be located.

As shown in (b) and (c) of FIG. 5, the adjusting unit 142 is rotated and the cam pushes out the slit plate 148 to be moved by D1 to D2 from the initial position. The extent to which the slat plate 148 is pushed out may be proportional to the rotation of the cam by the rotation of the adjusting unit 142.

As shown in FIG. 6A, the slit plate 148 may be located between the slide fixing parts 144. In the initial position, the space between the slide fixing part 144 may be spaced apart by H1.

As shown in FIG. 6B, as the adjuster 142 rotates, the slit plate 148 may enter D3 between the slide fixing parts 144. As the slat plate 148 enters between the slide fixing portions 144, the spacing between the slice fixing portions 144 may increase from H1 to H2.

100: probe card assembly 140: connection member
142: adjusting unit 144: slide fixing unit
148: Slit Plate

Claims (1)

cam;
A slit plate in contact with the cam and moved by the cam; And
Probe card assembly including a slit fixing part for moving up and down in contact with at least one of the upper side and the lower side of the slit plate.

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