KR20130138317A - 열전도율이 높은 폴리아미드 조성물 - Google Patents

열전도율이 높은 폴리아미드 조성물 Download PDF

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Publication number
KR20130138317A
KR20130138317A KR1020137028780A KR20137028780A KR20130138317A KR 20130138317 A KR20130138317 A KR 20130138317A KR 1020137028780 A KR1020137028780 A KR 1020137028780A KR 20137028780 A KR20137028780 A KR 20137028780A KR 20130138317 A KR20130138317 A KR 20130138317A
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KR
South Korea
Prior art keywords
composition
polyamide
weight
graphite
polyamides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020137028780A
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English (en)
Korean (ko)
Inventor
태균 김
영출 유
Original Assignee
로디아 오퍼레이션스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 로디아 오퍼레이션스 filed Critical 로디아 오퍼레이션스
Publication of KR20130138317A publication Critical patent/KR20130138317A/ko
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0066—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34922—Melamine; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34928—Salts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5317—Phosphonic compounds, e.g. R—P(:O)(OR')2
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K21/00—Fireproofing materials
    • C09K21/06—Organic materials
    • C09K21/12—Organic materials containing phosphorus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/20—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the material in which the electroluminescent material is embedded
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
KR1020137028780A 2011-04-04 2012-03-30 열전도율이 높은 폴리아미드 조성물 Ceased KR20130138317A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1152863 2011-04-04
FR1152863A FR2973387B1 (fr) 2011-04-04 2011-04-04 Composition polyamide de forte conductivite thermique
PCT/EP2012/055821 WO2012136590A1 (fr) 2011-04-04 2012-03-30 Composition polyamide de forte conductivite thermique

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020157025986A Division KR101908770B1 (ko) 2011-04-04 2012-03-30 열전도율이 높은 폴리아미드 조성물

Publications (1)

Publication Number Publication Date
KR20130138317A true KR20130138317A (ko) 2013-12-18

Family

ID=45908054

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020157025986A Expired - Fee Related KR101908770B1 (ko) 2011-04-04 2012-03-30 열전도율이 높은 폴리아미드 조성물
KR1020137028780A Ceased KR20130138317A (ko) 2011-04-04 2012-03-30 열전도율이 높은 폴리아미드 조성물

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020157025986A Expired - Fee Related KR101908770B1 (ko) 2011-04-04 2012-03-30 열전도율이 높은 폴리아미드 조성물

Country Status (9)

Country Link
US (1) US9570665B2 (enExample)
EP (1) EP2694588B1 (enExample)
JP (1) JP5847287B2 (enExample)
KR (2) KR101908770B1 (enExample)
CN (2) CN107266910B (enExample)
BR (1) BR112013025583B1 (enExample)
ES (1) ES2542411T3 (enExample)
FR (1) FR2973387B1 (enExample)
WO (1) WO2012136590A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
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KR20200090813A (ko) * 2017-11-24 2020-07-29 아르끄마 프랑스 전기 또는 하이브리드 자동차 배터리의 냉각 및/또는 가열 디바이스

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CN103980700A (zh) * 2014-06-09 2014-08-13 惠州市华聚塑化科技有限公司 一种抗静电无卤阻燃尼龙工程塑料及其制备方法
CN104610737A (zh) * 2014-10-15 2015-05-13 东莞市雷毅德塑胶科技有限公司 一种高抗冲击阻燃的导热绝缘塑胶材料
CN105255171A (zh) * 2015-09-16 2016-01-20 安徽省和翰光电科技有限公司 一种led用纳米氧化铝-石墨短纤维填充改性的pa6/abs复合导热塑料及其制备方法
JP2017190407A (ja) * 2016-04-14 2017-10-19 ユニチカ株式会社 ポリアミド樹脂組成物およびそれからなる成形体
CN106439555A (zh) * 2016-09-28 2017-02-22 合肥海宝节能科技有限公司 节能灯的反射罩的制造方法
CN106439553A (zh) * 2016-09-28 2017-02-22 合肥海宝节能科技有限公司 节能灯
CN106439554A (zh) * 2016-09-28 2017-02-22 合肥海宝节能科技有限公司 节能灯的反射罩
CN106439732A (zh) * 2016-09-28 2017-02-22 合肥海宝节能科技有限公司 节能灯用反射罩成型材料的制备方法
CN106426497A (zh) * 2016-11-10 2017-02-22 吉林省林业科学研究院 一种纤维板及其制备方法
US20230357539A1 (en) * 2022-05-06 2023-11-09 Celanese International Corporation Fiber Reinforced Thermoplastic Polymer Composition With Flame Retardant Properties

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200090813A (ko) * 2017-11-24 2020-07-29 아르끄마 프랑스 전기 또는 하이브리드 자동차 배터리의 냉각 및/또는 가열 디바이스

Also Published As

Publication number Publication date
JP2014523449A (ja) 2014-09-11
EP2694588B1 (fr) 2015-04-22
US20140048841A1 (en) 2014-02-20
EP2694588A1 (fr) 2014-02-12
FR2973387A1 (fr) 2012-10-05
CN103459505A (zh) 2013-12-18
JP5847287B2 (ja) 2016-01-20
ES2542411T3 (es) 2015-08-05
FR2973387B1 (fr) 2013-03-29
CN107266910A (zh) 2017-10-20
KR20150114580A (ko) 2015-10-12
US9570665B2 (en) 2017-02-14
CN107266910B (zh) 2021-04-30
BR112013025583A2 (pt) 2020-06-16
WO2012136590A1 (fr) 2012-10-11
KR101908770B1 (ko) 2018-10-17
BR112013025583B1 (pt) 2021-04-20

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