KR20130127120A - Printed circuit board and method of manufacturing the same - Google Patents

Abstract

The present invention relates to a printed circuit board and a method of manufacturing the same. The method comprises the steps of: preparing a base substrate; forming a metal layer on the base substrate; forming an insulating layer having an opening for bumps on the metal layer; stacking a metal foil layer for bumps including the opening for bumps on the insulating layer; forming an etching resist on the metal foil layer for bumps; and forming a metal bump by patterning the metal foil layer for bumps upon a pattern of the etching resist.

Description

Printed circuit board and method of manufacturing the same

The present invention relates to a printed circuit board and a manufacturing method thereof.

Currently, the bump forming technology is increasingly difficult to process as the bump pitch and size are reduced.

On the other hand, the bump formation method is mostly made through solder paste printing, as disclosed in Patent Document 1.

However, in the solder paste printing method, as the bumps are miniaturized, the frictional force between the mask interface and the solder paste increases, which causes problems such as detachment of the solder paste when the mask plate is separated. This is a phenomenon in which the bump size is formed smaller than the normal size or the bump is not formed.

US 2005-0051604 A

The present invention is to solve the above problems of the prior art, one of the present invention

The aspect is to provide a printed circuit board and a method of manufacturing the same through a solder bump manufacturing method applicable to fine bump pitch.

Method of manufacturing a printed circuit board according to an embodiment of the present invention, preparing a base substrate;

Forming a metal layer on the base substrate;

Forming an insulating layer having bump openings on the metal layer;

Stacking a bump metal foil layer including the bump openings on the insulating layer;

Forming an etching resist on the bump metal foil layer; And

And forming a metal bump by patterning the bump metal foil layer according to the pattern of the etching resist.

Laminating the bump metal foil layer of the method of manufacturing a printed circuit board according to an embodiment of the present invention,

Disposing a bump metal foil layer on the insulating layer; And

And bonding the bump metal foil layer to the insulating layer including the bump opening.

In the step of forming a metal bump of the method of manufacturing a printed circuit board according to an embodiment of the present invention,

After patterning the bump metal foil layer,

And applying heat to the bump metal foil layer.

The bump metal foil layer of the method of manufacturing the printed circuit board according to the embodiment of the present invention may be made of a solder material.

After forming the metal bumps of the method of manufacturing a printed circuit board according to an embodiment of the present invention,

The method may further include removing the etching resist.

In the preparing of the base substrate of the method of manufacturing a printed circuit board according to an embodiment of the present invention, the base substrate may be made of an insulating material.

In addition, a printed circuit board according to an embodiment of the present invention, the base substrate;

A metal layer formed on the base substrate;

An insulating layer formed to have an opening for bumps on the metal layer; And

It may include a; metal bump formed in the opening for the bump.

The metal bumps of the printed circuit board according to the embodiment of the present invention may be made of a solder material.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to that, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may properly define the concept of the term in order to best explain its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

The printed circuit board and the method of manufacturing the same according to an embodiment of the present invention improve the problems such as bump defects and bumps that are formed in a size smaller than the normal value because the patterning is performed after pressing the bump metal foil layer. It can be expected that the effect can be improved to improve the reliability for the fine bump pitch.

In addition, the embodiment of the present invention is to form a bump through the patterning after the metal foil layer laminated, it is possible to improve the uniformity of the bump size.

1 to 4 are cross-sectional views illustrating a method of manufacturing a printed circuit board according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The objectives, specific advantages, and novel features of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. It should be noted that, in the present specification, the reference numerals are added to the constituent elements of the drawings, and the same constituent elements are assigned the same number as much as possible even if they are displayed on different drawings. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. In this specification, the terms first, second, etc. are used to distinguish one element from another, and the element is not limited by the terms.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Manufacturing method of printed circuit board

1 to 4 are cross-sectional views illustrating a method of manufacturing a printed circuit board according to an exemplary embodiment of the present invention.

First, as shown in FIG. 1, the base substrate 110 may be prepared.

The base substrate 110 may be an insulating layer made of a common insulating material applied as a core substrate in the printed circuit board field.

As the insulating layer, a resin insulating layer may be used. As the resin insulating layer, a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a resin impregnated with a reinforcing material such as a glass fiber or an inorganic filler, for example, a prepreg can be used, And / or a photo-curable resin may be used, but the present invention is not limited thereto.

Next, the metal layer 120 may be formed on the base substrate 110.

In this case, the metal layer 120 is a connection pad through which the metal bumps 141 and 143 are to be formed as external connection terminals.

The metal bumps 141 and 143 electrically connect the semiconductor element or the external component to the inner layer circuit.

The circuit including the connection pad may be applied without limitation as long as it is used as a conductive metal for circuits in the circuit board field, and copper is typically used in a printed circuit board.

Next, an insulating layer 130 having bump openings (not shown) may be formed on the metal layer 120.

In this case, the insulating layer 130 may be a solder resist.

The solder resist functions as a protective layer to protect the outermost layer circuit and is formed for electrical insulation, and an open portion is formed to expose the outermost connection pads. The solder resist may be composed of, for example, a solder resist ink, a solder resist film or an encapsulant, as is known in the art, but is not particularly limited thereto.

Next, the bump metal foil layer 140 is stacked on the insulating layer 130 including the bump openings.

In this case, the bump metal foil layer 140 refers to a metal foil that is already formed in a separate configuration before laminating on the insulating layer 130, and the pressing process is performed on the insulating layer 130 through a process described below. Laminated through.

The bump metal foil layer 140 may be made of a solder material.

In more detail, the step of stacking the bump metal foil layer 140 may include disposing the bump metal foil layer 140 on the insulating layer 130 and compressing the bump metal foil layer 140. Including the bump opening may include the step of adhering on the insulating layer (130).

That is, in the embodiment of the present invention, since the metal bumps are formed through the process of pressing the bump metal foil instead of the solder paste printing on the insulating layer 130, the mask process required during the solder paste printing process may be omitted. Therefore, it is possible to prevent a variety of problems, such as hearing the solder paste when removing the mask.

On the other hand, the process of compressing the bump metal foil layer 140 to the insulating layer 130, it is possible to apply a variety of pressing processes, including a heating roll or a heat press method.

Next, as shown in FIG. 2, an etching resist 150 may be formed on the bump metal foil layer 140.

In this case, the etching resist 150 may be patterned for patterning the bump metal foil layer 140 below.

Next, as shown in FIG. 3, the bump metal foil layer 140 may be patterned according to the pattern of the etching resist 150 to form the metal bump 141.

After forming the metal bumps 141, the etching resist 150 may be removed.

Next, as shown in FIG. 4, after the bump metal foil layer 140 is patterned, heat may be applied to the bump metal foil layer to form a ball-shaped metal bump 143.

That is, the metal bumps may be used as they are in the form of reference numeral 141 or in the case of using the balls in reference numeral 143.

Printed circuit board

As shown in FIG. 3 or 4, the printed circuit board 100 may have a base substrate 110, a metal layer 120 formed on the base substrate 110, and a bump opening portion on the metal layer 120. Metal bumps 141 and 143 formed in the insulating layer 130 and the bump openings may be formed.

The metal bumps 141 and 143 may be made of a solder material.

The base substrate 110 may be an insulating layer made of a common insulating material applied as a core substrate in the printed circuit board field.

As the insulating layer, a resin insulating layer may be used. As the resin insulating layer, a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a resin impregnated with a reinforcing material such as a glass fiber or an inorganic filler, for example, a prepreg can be used, And / or a photo-curable resin may be used, but the present invention is not limited thereto.

In addition, the insulating layer 130 may be a solder resist.

The solder resist functions as a protective layer to protect the outermost layer circuit and is formed for electrical insulation, and an open portion is formed to expose the outermost connection pads. The solder resist may be composed of, for example, a solder resist ink, a solder resist film or an encapsulant, as is known in the art, but is not particularly limited thereto.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the same is by way of illustration and example only and is not to be construed as limiting the present invention. It is obvious that the modification or improvement is possible.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

100: printed circuit board 110: base board
120: metal layer 130: insulating layer
140: bump metal foil layer 141, 143: metal bump
150: etching resist

Claims (8)

Preparing a base substrate;
Forming a metal layer on the base substrate;
Forming an insulating layer having bump openings on the metal layer;
Stacking a bump metal foil layer including the bump openings on the insulating layer;
Forming an etching resist on the bump metal foil layer; And
Patterning the bump metal foil layer according to the pattern of the etching resist to form metal bumps;
And a step of forming the printed circuit board.
The method according to claim 1,
Laminating the bump metal foil layer,
Disposing a bump metal foil layer on the insulating layer; And
Bonding the bump metal foil layer to the insulating layer including the bump opening;
And forming a printed circuit board on the printed circuit board.
The method according to claim 1,
In the forming of the metal bumps,
After patterning the bump metal foil layer,
Applying heat to the bump metal foil layer;
Method of manufacturing a printed circuit board further comprising a.
The method according to claim 1,
The bump metal foil layer is a manufacturing method of a printed circuit board, characterized in that made of a solder material.
The method according to claim 1,
After forming the metal bumps,
Removing the etching resist;
Method of manufacturing a printed circuit board further comprising a.
The method according to claim 1,
In the step of preparing the base substrate,
The base substrate is a manufacturing method of a printed circuit board made of an insulating material.
Base substrate;
A metal layer formed on the base substrate;
An insulating layer formed to have an opening for bumps on the metal layer; And
A metal bump formed in the opening for the bump;
And a printed circuit board.
The method of claim 7,
The metal bump is a printed circuit board, characterized in that made of a solder material.

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