KR20130117251A - Back light unit having heat dissipation layer and manufacturing method for the same - Google Patents

Abstract

PURPOSE: A backlight unit which includes a heat dissipation layer and a manufacturing method thereof are provided to improve heat dissipation effects by maintaining the surface temperature of an inorganic material layer low. CONSTITUTION: A light source (110) emits light. A bottom chassis (120) receives heat emitted from the light source. A heat dissipation layer (130) is laminated on the outer wall of the bottom chassis. The heat dissipation layer emits the heat received from the light source to the outside. The heat dissipation layer comprises a coating layer and an inorganic material layer.

Description

Back light unit with heat dissipation layer and its manufacturing method {BACK LIGHT UNIT HAVING HEAT DISSIPATION LAYER AND MANUFACTURING METHOD FOR THE SAME}

The present invention relates to a backlight unit provided with a heat dissipation layer in a bottom chassis, and more particularly, to a backlight unit provided with a heat dissipation layer in a bottom chassis so that heat transmitted from a light source can be quickly released from the bottom chassis.

A liquid crystal display device (hereinafter referred to as an "LCD device") refers to a device that displays an image by using the electrical and optical characteristics of the liquid crystal. LCD devices are widely used in portable computers, communication devices, liquid crystal televisions, industrial devices, and aerospace industries because they have the advantages of being very small in volume and light in weight compared to cathode ray tubes.

An LCD device cannot emit light on its own and thus requires a light source. The configuration for providing this light source is called a Back Light Unit (BLU). Conventionally, the amount of heat generated by light is not large by using a lamp as a light source of a BLU. However, in the case of an LCD device employing a light emitting diode (LED) light source, heat generation is severe and performance may be degraded in terms of display quality and lifespan of the device. There is a problem that can be.

In general, a heat sink is mainly used as a heat dissipation means of the LCD device as described above. Herein, the heat sink means a heat sink and is installed inside the LCD device or attached to the device of the LCD device to release heat generated from the inside of the LCD product or the device.

However, in the case of the heat sink, the size is increased and the number of uses is increased in order to cope with the increase in heat generation due to the high performance and high functionality of the LCD product, so it is not easy to implement it in an efficient form for installation in the LCD product, and the manufacturing cost is increased. There is a problem.

Accordingly, an object of the present invention is to solve such a conventional problem, and is effective for dissipating heat transferred from a light source by being laminated on a bottom chassis in order from a thermally conductive material having the highest thermal conductivity using a specific gravity of a material. The present invention provides a backlight unit having a heat dissipation layer in a bottom chassis that implements a shape and reduces manufacturing costs.

The object is, according to the present invention, a light source for emitting light, a bottom chassis for receiving heat emitted from the light source, a direction away from the bottom chassis for radiating heat from the light source to the outside The thermal conductivity is achieved by a backlight unit (Back Light Unit: BLU) having a heat dissipation layer, characterized in that it comprises a heat dissipation layer laminated on the outer surface of the bottom chassis so that the thermal conductivity has a small value.

Here, the heat dissipation layer is preferably formed by spraying a mixed solution of a thermally conductive material having different specific gravity on the outer surface of the bottom chassis.

In addition, the heat dissipation layer preferably has a triangular cross section in order to widen the contact area with the outside air.

In addition, the heat dissipation layer preferably includes a coating layer formed in contact with the bottom chassis and an inorganic layer in contact with the coating and exposed to the outside.

The coating layer may include a plurality of coating layers, and among the plurality of coating layers, the coating layer contacting the outer surface of the bottom chassis may be a thermally conductive material having a higher thermal conductivity than the bottom chassis.

In addition, the inorganic material is preferably a hollow portion formed therein.

In addition, the hollow part formed inside the inorganic material preferably has a polygonal, circular or elliptical cross section.

In addition, the backlight unit provided with the heat dissipation layer is a backlight unit preparing step of providing a backlight unit including a light source and a bottom chassis for receiving the light source therein, to provide a plurality of materials having different specific gravity and thermal conductivity characteristics A thermally conductive material preparation step, a mixed liquid preparation step of preparing a mixed liquid by mixing the plurality of thermal conductive materials, a spraying step of spraying the mixed liquid to the outer surface of the bottom chassis, the mixed liquid is separated into each of the material to have a high specific gravity It is preferable to be manufactured by a heat radiation layer forming step of forming a heat radiation layer by being sequentially aligned and stacked.

And, in the thermally conductive material preparation step, the plurality of thermally conductive materials are preferably characterized in that the specific gravity is larger the greater the thermal conductivity.

In addition, the heat dissipation layer preferably includes a coating layer formed in contact with the bottom chassis and an inorganic layer in contact with the coating layer and exposed to the outside.

According to the present invention, the thermally conductive material having the highest thermal conductivity laminated on the bottom chassis primarily dissipates heat transmitted from the light source, and then transfers heat to the sequentially stacked material, thereby dissipating heat. Provided is a backlight unit in which a heat dissipation layer is formed on a bottom chassis capable of improving the efficiency.

In addition, since the plurality of materials are mixed and sprayed into the bottom chassis in a mixed liquid state, the specific gravity is arranged to be smaller in a direction away from the bottom chassis, so that the manufacturing cost is reduced and manufactured rather than individually forming a layered structure. You can save time.

In addition, the cross section of the heat dissipation layer may be formed in a triangular shape to improve the contact area with the outside air to improve the heat dissipation effect.

In addition, the inorganic layer having a hollow portion inside thereof serves to store heat momentarily to store heat transmitted continuously from the bottom while heat is transferred from the surface to keep the surface temperature of the inorganic layer low to improve the heat dissipation effect. Can be.

1 is a schematic cross-sectional view of a backlight unit in which a heat dissipation layer is stacked on a bottom chassis according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a heat dissipation layer stacked on a bottom chassis in a backlight unit having a heat dissipation layer in a bottom chassis according to the embodiment of FIG. 1;
3 is a flowchart illustrating a method of manufacturing a backlight unit with a heat dissipation layer in a backlight unit with a heat dissipation layer in a bottom chassis according to an embodiment of the present invention.

Hereinafter, a backlight unit provided with a heat dissipation layer in a bottom chassis according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic cross-sectional view of a backlight unit provided with a heat dissipation layer in a bottom chassis according to an embodiment of the present invention, and FIG. 2 is a view illustrating a backlight unit provided with a heat dissipation layer in a bottom chassis according to an embodiment of FIG. 1. A schematic cross-sectional view of a heat dissipation layer stacked on a bottom chassis.

1 or 2, a backlight unit in which a heat dissipation layer is stacked on a bottom chassis according to an embodiment of the present invention includes a light source 110, a bottom chassis 120, and a heat dissipation layer 130.

The light source 110 is located inside the bottom chassis 120, and since it is a known technology, a detailed description thereof will be omitted.

The bottom chassis 120 receives the light source 110 therein and receives heat generated from the light source 110. In addition, since the bottom chassis 120 must transfer the heat transmitted from the light source 110 to the heat dissipation layer 130 to be described later, the thermal conductivity of the material of the bottom chassis 120 is the heat conduction of the material of the heat dissipation layer 130 to be described later. It is preferable to be larger than degrees.

The heat dissipation layer 130 is positioned on the other side of the bottom chassis 120 receives heat from the light source 110, and contacts the coating layer 131 and the coating layer 131 formed in contact with the bottom chassis 120. And an inorganic layer 135 exposed to the outside. In addition, the cross section of the heat dissipation layer 130 is formed in a triangular shape in order to increase the contact area with the outside air, but is not limited to such a shape.

The coating layer 131 includes a first coating layer 132, a second coating layer 133, and a third coating layer 134 having different thermal conductivity and specific gravity and sequentially stacked. In addition, the first coating layer of the first coating layer 132, the second coating layer 133 and the third coating layer 134 in contact with the bottom chassis 120 in order to dissipate heat transmitted to the bottom chassis 120 first of all. The thermal conductivity of 132 is the greatest, and the thermal conductivity decreases in the order of the second coating layer 133 and the third coating layer 134 sequentially stacked on the first coating layer 132.

In addition, since the heat dissipation layer 130 is formed by spraying a mixed liquid obtained by mixing a plurality of thermal conductive materials having different specific gravity in a solution state to the bottom chassis 120, the plurality of thermal conductive materials are aligned by specific gravity. Then sequentially separated and stacked. That is, the specific gravity of the first coating layer 132 in contact with the bottom chassis 120 is the largest, in the order of the second coating layer 133, the third coating layer 134 sequentially stacked on the first coating layer 132. Specific gravity becomes small.

In other words, the thermal conductivity decreases in the order of the first coating layer 132, the second coating layer 133, and the third coating layer 134, and the specific gravity is the first coating layer 132, the second coating layer 133, and the third. The coating layer 134 becomes smaller in order.

In addition, the first coating layer 132, the second coating layer 133 and the third coating layer 134 is preferably provided in a plate form in order to efficiently transfer heat, but is not limited thereto.

The inorganic layer 135 is provided to have a hollow portion formed therein in order to maximize contact with external air, but is not limited thereto. In addition, the cross section of the hollow formed therein is formed to have a polygonal, circular or elliptical cross section, but is not limited thereto.

Hereinafter, a process of transferring heat of an embodiment of the backlight unit provided with the heat dissipating layer in the above-described bottom chassis will be described.

The light source 110 that emits light emits heat together with the light.

Heat generated from the light source 110 is transferred to the surface facing the light source 110 in the bottom chassis 120.

Heat transmitted to one surface of the bottom chassis 120 is transferred to the heat dissipation layer 130 formed on the other surface of the bottom chassis 120. At this time, the heat is rapidly dissipated through the outer inclined surface of the first coating layer 132 in contact with the bottom chassis 120 and has a higher thermal conductivity than the bottom chassis 120, and the remaining heat not radiated to the outside is the second coating layer 133. Is passed). Some of the heat transferred to the second coating layer 133 is radiated through the outer inclined surface of the second coating layer 133, and the remaining heat that is not radiated is transferred to the third coating layer 134 again. Some of the third coating layer 134 is also radiated through the outer inclined surface of the third coating layer 134, and the remaining heat that is not radiated is transferred to the inorganic layer 135. In order to improve the effect of the layered heat transfer mechanism, it is necessary to have a wide contact area with the outside air, and in this case, it is preferable that the cross section of the heat dissipation layer 130 has a triangular shape.

In addition, the inorganic layer 135 has a hollow portion formed therein, and serves as a heat storage to temporarily store heat, while the heat is released to the surface exposed to the outside of the inorganic layer 135, from the coating layer 131 It contains heat that is continuously transmitted.

In the case where the hollow part is not formed inside the inorganic layer 135, absorbing heat transferred from the coating layer 131 and transferring the heat directly to the surface of the inorganic layer 135 is effective in lowering the surface temperature of the inorganic layer 135. There is no, but when the heat storage is formed by forming a hollow inside, the surface temperature of the inorganic layer 135 is adjusted so as not to rise so that the effect of lowering the surface temperature can be obtained than when the hollow part is not formed.

That is, since the heat transmitted from the coating layer is gradually released to the surface of the inorganic layer by the hollow portion formed in the inorganic layer to control the surface temperature of the inorganic layer, the bottom chassis 120 receives heat from the light source 110. By maintaining the temperature difference between one surface of the surface and the surface of the inorganic layer 135, the heat dissipation effect is excellent.

The method of manufacturing the heat dissipating layer in the backlight unit provided with the heat dissipating layer in the above-described bottom chassis will now be described.

3 is a flowchart illustrating a method of manufacturing a backlight unit in which a heat dissipation layer is stacked in a backlight unit having a heat dissipation layer in a bottom chassis according to an embodiment of the present invention.

Referring to FIG. 3, in a backlight unit having a heat dissipation layer in a bottom chassis, a method of manufacturing a backlight unit in which a heat dissipation layer is stacked includes a backlight unit including a light source and a backlight unit including a bottom chassis accommodating the light source therein. Preparation step (S30) and a mixed solution for preparing a mixed solution by mixing a plurality of thermally conductive material step (S20) and a plurality of thermally conductive material to prepare a plurality of thermally conductive material having different specific gravity and thermal conductivity characteristics (S30) ) And a spraying step (S40) for injecting the mixed solution to the outer surface of the bottom chassis and the heat-dissipating layer forming step (S50) to form a heat-dissipating layer by separating the mixed liquid into the respective materials and sequentially aligned and stacked from a material having a high specific gravity It includes.

The backlight unit preparation step (S10) is a step of preparing a backlight unit including a bottom chassis 120 accommodating the light source 110 and the light source 110 therein and stacking the heat dissipation layer 130.

The thermally conductive material preparing step (S20) is a step of preparing a plurality of thermally conductive materials having different specific gravity and thermal conductivity characteristics. In this case, the plurality of thermally conductive materials should have a larger value of specific gravity as the thermal conductivity becomes larger, which is when each thermally conductive material is separately stacked by the size of specific gravity in a heat radiation layer forming step (S50), which will be described later. This is to stack sequentially so as to be smaller.

The mixed solution preparing step (S30) is a step of preparing a mixture of a plurality of thermally conductive material in a liquid state in the state of the mixed liquid.

The spraying step (S40) is a step of spraying the mixed liquid on the outer surface of the bottom chassis. The mixed liquid may be sprayed by the spray method so that the mixed liquid is evenly sprayed on the outer surface of the bottom chassis 120, but is not limited thereto.

In the heat dissipation layer forming step (S50), the mixed liquid sprayed on the outer surface of the bottom chassis 120 is separated into respective materials by specific gravity, and then sequentially stacked and cured by a material having a high specific gravity on the outer surface of the bottom chassis 120. This is the step of forming a heat dissipation layer. At this time, the process of separating and dissipating the heat dissipation layer does not require separate equipment because each material is separated by the specific gravity difference.

Therefore, according to the present invention, a heat dissipation layer can be easily formed without a separate alignment process only by spraying a mixture of thermally conductive materials having different specific gravity in a liquid phase.

The scope of the present invention is not limited to the above-described embodiments, but may be embodied in various forms of embodiments within the scope of the appended claims. Without departing from the gist of the invention claimed in the claims, it is intended that any person skilled in the art to which the present invention pertains falls within the scope of the claims described in the present invention to various extents which can be modified.

100: backlight unit 110: light source
120: bottom chassis 130: heat dissipation layer
131: coating layer 132: first coating layer
133: second coating layer 134: third coating layer
135: inorganic layer

Claims (10)

A light source emitting light;
A bottom chassis that receives heat emitted from the light source;
And a heat dissipation layer laminated on an outer surface of the bottom chassis so as to have a low thermal conductivity in a direction away from the bottom chassis to dissipate heat transferred from the light source to the outside. Backlight unit. The method of claim 1,
The heat dissipation layer is a backlight unit having a heat dissipation layer, characterized in that formed by spraying a mixture of a mixture of thermal conductive materials having different specific gravity on the outer surface of the bottom chassis. The method of claim 2,
The heat dissipation layer is a backlight unit with a heat dissipation layer, characterized in that it comprises a coating layer formed in contact with the bottom chassis and the inorganic layer in contact with the coating layer and exposed to the outside. The method of claim 1,
The heat dissipation layer is a backlight unit having a heat dissipation layer, characterized in that the cross-section is triangular in order to increase the contact area with the outside air. The method of claim 3, wherein
The coating layer is provided in plurality,
The coating unit of the plurality of coating layers in contact with the outer surface of the bottom chassis is a thermally conductive material, characterized in that the thermal conductivity is higher thermal conductivity than the bottom chassis. The method of claim 3, wherein
The inorganic layer is a backlight unit provided with a heat dissipation layer, characterized in that the hollow portion is formed therein. The method according to claim 6,
The hollow unit formed inside the inorganic layer has a polygonal, circular or oval cross section, characterized in that the backlight unit with a heat radiation layer. A backlight unit preparation step of providing a backlight unit including a light source and a bottom chassis accommodating the light source therein;
A thermally conductive material preparing step of preparing a plurality of thermally conductive materials having different specific gravity and thermal conductivity characteristics;
A mixed liquid preparation step of preparing a mixed liquid by mixing the plurality of thermal conductive materials;
Spraying the mixed liquid onto an outer surface of a bottom chassis;
And a heat dissipation layer forming step of forming a heat dissipation layer by separating the mixed solution into respective materials and sequentially ordering and stacking the materials having a specific gravity. 2. The method of claim 8,
The method of manufacturing a backlight unit with a heat dissipating layer, characterized in that in the thermally conductive material preparation step, the plurality of thermally conductive materials have a higher specific gravity as thermal conductivity increases. The method of claim 9,
The heat dissipation layer is a manufacturing method of the backlight unit with a heat dissipation layer, characterized in that it comprises a coating layer formed in contact with the bottom chassis and the inorganic layer in contact with the coating layer and exposed to the outside.

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