TW201333594A - Heat dissipation base and backlight module using same - Google Patents

Abstract

The present invention relates to a heat dissipation base. The heat dissipation base includes a fastening part and a connecting part connecting with the fastening part. A periphery of the fastening part is connected to a periphery of the connecting part. The fastening part defines a semi-open receiving space in cooperation with the connecting part. The connecting part defines a microstructure area on a surface of the connecting part back to the receiving space. A surface of the connecting part facing the receiving space is configured for mounting a light source.

Description

Cooling base and backlight module using the same

The invention relates to a heat dissipation base and a backlight module using the heat dissipation base.

Since the light-emitting diode has a large amount of heat, it is usually mounted on a heat-dissipating base when used as a backlight, and a heat-dissipating base on which the light-emitting diode is mounted is disposed on the back plate of the backlight module to emit light. The heat generated by the diode is transferred to the backing plate and diverges outward. However, the surface of the heat sink base that is in contact with the back board is not completely smooth and flat, so a contact thermal resistance is formed between the heat sink base and the back board to affect the heat dissipation efficiency of the heat sink base.

In view of this, it is necessary to provide a heat dissipation base having high heat dissipation efficiency and a backlight module using the heat dissipation base.

A heat dissipation base includes a fixing portion and a connecting portion that are connected to each other. The fixing portion and the connecting portion are respectively fixedly connected to one side edge thereof and define a semi-open receiving space surrounded by the fixing portion and the connecting portion. The side surface of the connecting portion facing away from the receiving space includes a region provided with a microstructure. The fixing portion faces a side surface of the receiving space for fixing the light source.

A backlight module includes a heat dissipation base, a light source mounted on the heat dissipation base, and a back plate for carrying the heat dissipation base. The heat dissipation base includes a fixing portion and a connecting portion that are connected to each other. The fixing portion and the connecting portion are respectively fixedly connected to one side edge thereof and define a semi-open receiving space surrounded by the fixing portion and the connecting portion. The side surface of the connecting portion facing away from the receiving space includes a region provided with a microstructure. The light source is mounted on a side surface of the fixing portion facing the accommodating space. The backing plate includes side walls and a bottom wall that are connected to each other. A heat dissipation through hole is defined in the bottom wall corresponding to the microstructure region. The connecting portion is fixedly mounted on a bottom wall of the backboard. The microstructured region is exposed through the heat dissipation through hole.

Compared with the prior art, the backlight module provided by the present invention provides a microstructure on the heat dissipation base and provides a heat dissipation through hole on the back plate to expose the microstructure, thereby greatly increasing the heat dissipation area of the heat dissipation base and reducing The thermal resistance between the heat dissipation base and the back plate improves the heat dissipation efficiency of the backlight module.

As shown in FIG. 1 and FIG. 2 , the backlight module 1 provided by the embodiment of the present invention includes a back plate 10 , a heat dissipation base 20 , a light emitting diode light source 30 , and a light guide plate 40 . The light-emitting diode light source 30 includes a light bar 301, a plurality of light-emitting diodes 302 disposed on the light bar 301, and a power supply interface 303 disposed at one end of the light bar 301. The power interface 303 is connected to an external power source (not shown) for supplying a driving voltage to the LEDs 302 on the light bar 301. The light bar 301 is mounted on the heat dissipation base 20, and the heat dissipation base 20 is fixed to the back plate 10 by bolts 2. The light guide plate 40 is disposed on the heat dissipation base 20 . The light incident surface of the light guide plate 40 is opposite to the light emitting diode 302 on the light bar 301. The light emitted by the light-emitting diode light source 30 is uniformly mixed by the light guide plate 40 to provide backlight for the liquid crystal panel.

The heat dissipation base 20 includes a fixing portion 200 for mounting the light bar 301 and a connecting portion 202 for connecting with the back plate 10. One side edge of the fixing portion 200 is fixedly connected to the connecting portion 202 in a substantially L shape. In the present embodiment, the fixing portion 200 and the connecting portion 202 are each an elongated rectangular parallelepiped plate, and one side of the fixing portion 200 in the longitudinal direction is perpendicularly connected to one side of the connecting portion 202 along the longitudinal direction. . The fixing portion 200 and the connecting portion 202 together define a semi-open receiving space 22. The light guide plate 40 is disposed in the receiving space 22 . The fixing portion 200 includes an inner side surface 200a facing the receiving space 22 and an outer side surface 200b parallel to the inner side surface 200a. The connecting portion 202 includes a first surface 202a perpendicularly connected to the inner side surface 200a and a second surface 202b vertically connected to the outer side surface 200b. The light bar 301 is mounted on the inner side surface 200a of the fixing portion 200. The light emitting surface of the light emitting diode 302 on the light bar 301 faces the receiving space 22.

The second surface 202b of the connecting portion 202 includes a heat dissipation area 2020 and a connection area 2022. The heat dissipation region 2020 is provided with a microstructure 2023. The microstructure 2023 increases the heat dissipation area of the connection portion 202 to improve the heat dissipation efficiency of the entire heat dissipation base 20. The microstructures 2023 are a plurality of closely arranged protrusions, and the shape of the protrusions may be spherical, pointed, or ellipsoidal. The connecting portion 2022 is a flat surface, and the connecting portion 2022 is provided with a plurality of fixed through holes 2024 extending through the first surface 202a and the second surface 202b. The heat dissipation zone 2020 provided with the microstructures 2023 is discontinuously distributed. In the present embodiment, the shape of the microstructure 2023 is an elongated circular protrusion extending in the longitudinal direction of the connecting portion 202. The heat dissipation region 2020 and the connection region 2022 are rectangular regions spaced apart from each other along the longitudinal direction of the heat dissipation base 20. The extension length of the heat dissipation region 2020 along the longitudinal direction of the heat dissipation base 20 is greater than the extension length of the connection region 2022 along the length direction of the heat dissipation base 20 .

In the present embodiment, the thickness of the heat dissipation region 2020 is slightly larger than the thickness of the connection region 2022 such that the end of the microstructure 2023 protrudes from the surface of the connection region 2022. In this embodiment, the microstructures 2023 are first formed over the entire second surface 202b using a mold and the area in which the connection regions 2022 are located are flattened such that the microstructures 2023 protrude from the surface of the connection regions 2022.

In another alternative embodiment, the thickness of the heat dissipation region 2020 is equal to the thickness of the connection region 2022 such that the end of the microstructure 2023 is coplanar with the surface of the connection region 2022. In this embodiment, the connecting portion 202 may form the microstructure 2023 by micro-engraving or embossing on the flattened second surface 202b after molding.

The backplane 10 is an outer casing of the entire backlight module 1 for carrying the heat dissipation base 20 on which the light emitting diode light source 30 is mounted. The backing plate 10 includes side walls 100 and a bottom wall 102 that are connected to each other and are substantially L-shaped. The side wall 100 corresponds to the fixing portion 200 of the heat dissipation base 20 . The bottom wall 102 corresponds to the connection portion 202 of the heat dissipation base 20. In the embodiment, the side wall 100 and the bottom wall 102 are flat plates that are vertically connected to each other. The bottom wall 102 is provided with a heat dissipation through hole 1020 having a shape and a size corresponding to the heat dissipation region 2020 at a position adjacent to the sidewall 100 for exposing the microstructure 2023. In this embodiment, the surface of the microstructure 2023 is slightly higher than the surface of the connection region 2022. The heat dissipation through hole 1020 is also used to receive the microstructure 2023 above the surface of the connection region 2022. The bottom wall 102 further defines a threaded through hole 1022 corresponding to the fixed through hole 2024 at a position between the two heat dissipation through holes 1020.

Referring to FIG. 3 and FIG. 4 together, the outer side surface 200b of the fixing portion 200 is in close contact with the side wall 100 of the backboard 10. The second surface 202b of the connecting portion 202 abuts against the bottom wall 102 of the backboard 10. The heat dissipation zone 2020 is aligned with the heat dissipation through hole 1020 on the bottom wall 102. The fixed through hole 2024 is aligned with the threaded through hole 1022 , and the plurality of bolts 2 are screwed through the fixed through hole 2024 to fix the heat dissipation base 20 in the threaded through hole 1022 of the back plate 10 . The heat dissipating area 2020 formed by the microstructure 2023 is disposed on the connecting portion 202 of the heat dissipation base 20 to greatly increase the heat dissipation area of the heat dissipation base 20, and the heat dissipation area 2020 passes through the heat dissipation through hole on the back plate 10. The 1020 is exposed to reduce the thermal resistance between the heat dissipation base 20 and the back plate 10, thereby further improving the heat dissipation efficiency of the heat dissipation base 20.

It is to be understood by those skilled in the art that the above embodiments are only intended to illustrate the invention, and are not intended to limit the invention, as long as it is within the spirit of the invention Changes and modifications are intended to fall within the scope of the invention.

1. . . Backlight module

2. . . bolt

10. . . Backplane

20. . . Cooling base

30. . . Light-emitting diode source

40. . . Light guide

301. . . Light

302. . . Light-emitting diode

303. . . Power interface

200. . . Fixed part

202. . . Connection

twenty two. . . Containing space

200a. . . Inner side

200b. . . Outer side

202a. . . First surface

202b. . . Second surface

2020. . . Heat sink

2022. . . Connection area

2023. . . microstructure

2024. . . Fixed through hole

100. . . Side wall

102. . . Bottom wall

1020. . . Thermal through hole

1022. . . Threaded through hole

1 is a schematic exploded view of a backlight module according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view showing another angle of the backlight module of FIG. 1. FIG.

FIG. 3 is a schematic view showing the assembly of the backlight module of FIG. 1.

4 is a cross-sectional view taken along line III-III of the backlight module of FIG. 3.

30. . . Light-emitting diode source

40. . . Light guide

200. . . Fixed part

202. . . Connection

200a. . . Inner side

200b. . . Outer side

202b. . . Second surface

2023. . . microstructure

100. . . Side wall

102. . . Bottom wall

Claims (14)

A heat dissipation base includes a fixing portion and a connecting portion which are connected to each other, and the fixing portion and the connecting portion are fixedly connected to one side edge of each of the connecting portions and define a semi-open type surrounded by the fixing portion and the connecting portion. The receiving space, the side surface of the connecting portion facing away from the receiving space includes a region provided with a microstructure, and the fixing portion faces a side surface of the receiving space for fixing the light source. The heat dissipation base according to claim 1, wherein the microstructure is a plurality of closely arranged protrusions. The heat sink base of claim 2, wherein the shape of the protrusion is selected from the group consisting of a spherical shape, a pointed shape, and an ellipsoid shape. The heat dissipation base according to claim 1, wherein the microstructure is formed by micro-engraving or embossing on a flat surface after molding, the thickness of the microstructure region being equal to the thickness of the flat surface The end of the microstructure is coplanar with the flat surface. The heat dissipation pedestal of claim 1, wherein the microstructured regions are discontinuously distributed, and the adjacent microstructured regions are flat surfaces. The heat dissipation base of claim 5, wherein the microstructured portion has a thickness slightly larger than a thickness of the flat surface such that a surface of the microstructure protrudes from the flat surface. A backlight module includes a heat dissipation base, a light source mounted on the heat dissipation base, and a back plate for carrying the heat dissipation base, the heat dissipation base including a fixing portion and a connecting portion connected to each other, the fixing The connecting portion and the connecting portion are respectively fixedly connected at one side edge thereof and define a semi-open receiving space surrounded by the fixing portion and the connecting portion, and the connecting portion includes a setting on a side surface facing away from the receiving space. In the micro-structured area, the light source is mounted on a side surface of the fixing portion facing the receiving space, and the back plate includes mutually connected side walls and a bottom wall, and the bottom wall is provided with a heat dissipation through hole corresponding to the microstructure area The connecting portion is fixedly mounted on a bottom wall of the backboard, and the microstructured region is exposed through the heat dissipation through hole. The backlight module of claim 7, further comprising a light guide plate disposed in the receiving space, the light incident surface of the light guide plate being opposite to the light source. The backlight module of claim 7, wherein the microstructured regions are discontinuously distributed, and the adjacent microstructured regions are flat surfaces and are provided with a plurality of fixed through holes, and the bottom wall corresponds to the same The fixed through hole is provided with a plurality of threaded through holes, and the heat dissipation base passes through the fixed through hole through the bolt and is screwed and fixed in the threaded through hole. The backlight module of claim 7, wherein the microstructure is a plurality of closely arranged protrusions. The backlight module of claim 10, wherein the shape of the protrusion is selected from a spherical shape, a pointed shape, and an ellipsoid shape. The backlight module of claim 7, wherein the microstructure is formed by micro-engraving or embossing on a flat surface after molding, the thickness of the microstructure region being equal to the thickness of the flat surface The end of the microstructure is coplanar with the flat surface. The backlight module of claim 7, wherein the microstructured regions are discontinuously distributed, and the adjacent microstructured regions are flat surfaces. The backlight module of claim 13, wherein the microstructured region has a thickness slightly larger than a thickness of the planar surface such that a surface of the microstructure protrudes from the planar surface.