KR20130109438A - Flexible circuit board - Google Patents

Abstract

PURPOSE: A flexible circuit board improves the reliability of a product by improving heat radiation characteristics. CONSTITUTION: A circuit pattern (110) is formed on at least one surface of a metal flexible board. An alignment mark (120a-120d) is separated from the circuit pattern on one surface of the flexible circuit board. The metal flexible circuit board includes a metal base material, an insulating layer, and a through hole (130). The through hole includes a sprocket hole (134), an alignment hole, and a device hole (132) formed on a position combined with an integrated circuit chip. The sprocket hole is parallel to both ends of the metal base material in the longitudinal direction. The alignment hole is overlapped with a part of the alignment mark.

Description

Flexible Circuit Board {FLEXIBLE CIRCUIT BOARD}

The present invention relates to a flexible circuit board, and more particularly to a metal flexible circuit board.

BACKGROUND ART [0002] Recently, thin flexible substrates have been attracting attention as next generation substrates suitable for weight reduction of electronic products. Flexible circuit boards are used in various electronic products. For example, it is used in a flat panel display (FPD) such as a liquid crystal display (LCD), a plasma display panel (PDP), or the like.

In recent years, light emitting diodes (hereinafter referred to as "LEDs") have been widely used in various products, and flexible circuit boards have led to the flexible circuit boards in the form of surface mount according to the trend of miniaturization and thinning of information and communication devices. It is mounted directly.

However, in the conventional flexible circuit board, since the polyimide, which is a flexible material, is used as the base film, heat generated from the flat panel display and the light emitting diode is not sufficiently discharged to the outside of the device, thereby preventing the reliability of the product. .

The problem to be solved by the present invention is to provide a flexible circuit board and its manufacturing method which can improve the heat dissipation characteristics to improve the reliability of the product.

Another object of the present invention is to provide a flexible circuit board capable of smoothly performing the reliability test of the flexible circuit board.

Problems to be solved by the present invention are not limited to the above-mentioned problems, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

The flexible circuit board according to an embodiment of the present invention for solving the above problems is formed on a metal flexible substrate having a through hole, a circuit pattern formed on at least one surface of the metal flexible substrate, formed on at least one surface of the metal flexible substrate And an alignment mark spaced apart from the circuit pattern, wherein at least a portion of the alignment mark overlaps at least a portion of the through hole.

In addition, the through hole may include an alignment hole overlapping at least a portion of the alignment mark.

In addition, the alignment mark includes a reflection pattern and a plurality of opening patterns,

At least some regions of the plurality of opening patterns overlap the alignment holes to expose the alignment holes.

In addition, the reflective pattern may include a support reflection pattern formed on the metal flexible substrate and a reference reflection pattern that is in contact with the support reflection pattern and at least partially overlaps an alignment hole of the metal flexible substrate.

In addition, the reference reflection pattern has a cross shape extending in a direction perpendicular to each other.

In addition, the support reflection pattern is circular and abuts an end of the reference reflection pattern.

In addition, the reference reflection pattern of the alignment mark of the flexible printed circuit board according to another embodiment of the present invention for solving the above problem is a cross shape extending in a direction perpendicular to each other, the support reflection pattern is the reference reflection pattern At the ends of the cross-shaped branches of the reference reflection pattern protrude in a direction perpendicular to the extending direction.

In addition, the reference reflection pattern of the alignment mark of the flexible circuit board according to another embodiment of the present invention for solving the above problems is a cross shape extending in a direction perpendicular to each other, the support reflection pattern is the reference reflection At the end of the pattern, each branch of the cross shape of the reference reflective pattern is branched into at least two or more branches and extends in a direction different from each branch of the reference reflective pattern.

In addition, the reference reflection pattern of the alignment mark of the flexible circuit board according to another embodiment of the present invention for solving the above problems is a plurality of branches extending in the first direction and the second direction perpendicular to the first direction It includes a plurality of branches extending, wherein the support reflection pattern is in contact with the end of the plurality of branches, the plurality of branches extending in the direction perpendicular to the first direction and the second direction extending.

Other specific details of the invention are included in the detailed description and drawings.

1 is a plan view showing a flexible circuit board according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along line III-III ′ of FIG. 1 illustrating an example of a package in which an integrated circuit chip is mounted on the flexible circuit board of FIG. 1.
3 is a cross-sectional view illustrating a portion of a flat panel display device including the package of FIG. 2.
4 is an enlarged cross-sectional view of an area A4 on which the first alignment mark of FIG. 1 is formed.
FIG. 5 is an enlarged perspective view of an area A4 on which the first alignment mark of FIG. 1 is formed.
6 is a cross-sectional view schematically illustrating an inspection process of a flexible circuit board according to an exemplary embodiment of the present invention.
FIG. 7 is a perspective view schematically illustrating a path of light when top lighting is irradiated on a flexible circuit board according to an exemplary embodiment of the present disclosure.
FIG. 8 is a plan view illustrating an image captured when upper lighting is irradiated onto a flexible circuit board according to an exemplary embodiment of the present invention.
FIG. 9 is a perspective view schematically illustrating a path of a light when the lower circuit is illuminated on a flexible circuit board according to an exemplary embodiment of the present invention.
FIG. 10 is a plan view illustrating an image captured when lower illumination is applied to a flexible circuit board according to an exemplary embodiment of the present invention.
11 is a plan view illustrating an alignment mark of a flexible circuit board according to another exemplary embodiment of the present invention.
12 is a plan view illustrating an alignment mark of a flexible circuit board according to still another embodiment of the present invention.
FIG. 13 is a plan view illustrating alignment marks on a flexible circuit board according to still another exemplary embodiment of the present invention.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout.

Although the first, second, etc. are used to describe various elements, components and / or sections, it is needless to say that these elements, components and / or sections are not limited by these terms. These terms are only used to distinguish one element, element or section from another element, element or section. Therefore, it goes without saying that the first element, the first element or the first section mentioned below may be the second element, the second element or the second section within the technical spirit of the present invention.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. As used herein, the terms "comprises" and / or "made of" means that a component, step, operation, and / or element may be embodied in one or more other components, steps, operations, and / And does not exclude the presence or addition thereof.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

1 is a plan view illustrating a flexible circuit board according to an embodiment of the present invention, and FIG. 2 is an example of a package in which an integrated circuit chip is mounted on the flexible circuit board of FIG. 1, along the line III-III ′ of FIG. 1. 3 is a cross-sectional view of the flat panel display including the package of FIG. 2.

1 and 2, a flexible circuit board according to an embodiment of the present invention may include a metal flexible substrate 100 having a through hole 130 and a circuit pattern 110 formed on at least one surface of the metal flexible substrate 100. And alignment marks 120a, 120b, 120c, and 120d formed on at least one surface of the flexible circuit board to be spaced apart from the circuit pattern 110.

The metal flexible substrate 100 includes a flexible metal base substrate 102, and further includes an insulating layer 104 formed on the metal base substrate 102 and an adhesive layer 106 formed on the insulating layer 104. can do.

The metal base substrate 102 is a metal material having high thermal conductivity, and may be a metal having sufficient restoring force when bent or bent, or may be a soft metal capable of being easily bent or bent. For example, the metal base substrate 102 may be an alloy comprising copper, aluminum, bronze, silver or stainless steel.

The flexible circuit board according to embodiments of the present invention employs a metal base substrate 102 having high thermal conductivity, thereby rapidly dissipating heat emitted to a display or LED to the outside. Thermal reliability can be secured.

The insulating layer 104 may be a variety of polymer compounds having flexibility and sufficient electrical insulation. For example, the insulating layer 104 may be formed of polyimide (PI), polyester (PE), or polyethylene tere. Phthalate (PET: Polyethylene Terephthalate), polyethylene naphthalene (PEN; poly ethylene napthalene), polycarbonate (PC; poly carbonate), it may be made of a material selected from the group consisting of polymer resins including epoxy (epoxy), General resins having ductility, such as a system resin, can be used.

The adhesive layer 106 may be formed on the insulating layer 104 by transfer coating, adhesion, or coating. The adhesive layer 106 is not particularly limited as long as it is an insulating and adhesive material, and may be, for example, an adhesive in the form of a thermosetting film or an adhesive in an application form.

The adhesive layer 106 is used to solidify the coupling between the reflective pattern of the circuit pattern 110 and the alignment marks 120a, 120b, 120c, and 120d, which will be described later, and the metal flexible substrate 100, and the circuit pattern 110 and The alignment marks 120a, 120b, 120c, and 120d may be omitted according to the method of forming the alignment marks.

The metal flexible substrate 100 also includes a through hole 130 penetrating through the metal base substrate 102, the insulating layer 104, and the adhesive layer 106.

The through hole 130 may be formed in such a manner that a portion of the metal base substrate 102, the insulating layer 104, and the adhesive layer 106 is removed by punching.

The through-holes 130 are formed side by side at both ends of the metal base substrate 102 in the longitudinal direction to assist the transfer of the flexible circuit board sprocket hole 134, the device formed in the position to be combined with the integrated circuit chip It may include a slit (not shown) for bending the hole 132 and the flexible circuit board, and an alignment hole (136 of FIG. 5) overlapping with the alignment marks 120a, 120b, 120c, and 120d. .

On one surface of the metal base substrate 102, an inner lead area A1, which is an area in which the integrated circuit chip 310 of FIG. 2 is mounted, is connected to an external circuit (not shown) for signal transmission with an external circuit (not shown). The outer regions A2 and A3 which are areas to be defined are defined. Here, the outer areas A2 and A3 may be divided into a first outer area A2 connected to a driving printed circuit board to be described later and a second outer area A3 connected to a display panel unit to be described later. .

The circuit patterns 110 are formed on the metal flexible substrate 100 so as to be spaced apart from each other about the inner lead area A1. The circuit pattern 110 may be a material having excellent electrical conductivity as a conductive material for electrical connection between different devices, and may be, for example, gold, silver, copper, aluminum, and an alloy thereof.

The circuit pattern 110 may be formed by continuously laminating a metal foil on the adhesive layer 106 or by forming a metal layer by a sputtering method, followed by patterning by a photoresist method. In addition, the circuit pattern 110 may be borrowed by coating a conductive material on the insulating layer 104 by a printing method, and a metal layer on which the circuit pattern 110 is formed on the adhesive layer 106 directly. It can be borrowed by forming by laminating.

The alignment marks 120a, 120b, 120c, and 120d may be formed to be spaced apart from the circuit pattern 110 by a predetermined interval, and at least one of the alignment marks 120a, 120b, 120c, and 120d may be formed of the metal flexible substrate 100. It may be formed on. The alignment marks 120a, 120b, 120c, and 120d are spaced apart from the circuit pattern 110 by a predetermined interval, thereby providing a reference point during inspection by imaging of the circuit pattern 110 and the through hole 130.

In the flexible circuit board according to the exemplary embodiment of the present invention, the alignment marks 120a, 120b, 120c, and 120d may include the first alignment mark 120a, the second alignment mark 120b, and the third alignment mark ( 120c) and a fourth alignment mark 120d, each of which is disposed at a lower left end, a lower right end of the first outer lead area A2, and an upper left end and an upper right end of the second outer lead area A3. The arrangement position and the number of the alignment marks 120a, 120b, 120c, and 120d may be adjusted according to the characteristics of the flexible circuit board.

The alignment marks 120a, 120b, 120c, and 120d may be formed together by the same process when the circuit pattern 110 is formed, and may be substantially the same material. For example, gold, silver, copper, Aluminum and their alloys. However, the present disclosure is not limited thereto, and the alignment marks 120a, 120b, 120c, and 120d may be formed on the metal flexible substrate 100 through a separate process before and after the circuit pattern 110 is formed. The circuit pattern 110 may be formed of a different material.

Hereinafter, the shape and function of the alignment marks 120a, 120b, 120c, and 120d will be described in detail.

4 is an enlarged cross-sectional view of an area A4 on which the first alignment mark 120a of FIG. 1 is formed, and FIG. 5 is an enlarged perspective view of an area A4 on which the first alignment mark 120a of FIG. 1 is formed. to be.

4 and 5, the alignment marks 120a, 120b, 120c, and 120d of the flexible circuit board according to the exemplary embodiment of the present invention may include a reflection pattern 122 and a plurality of opening patterns 124a, 124b, and 124c. , 124d). The alignment marks 120a, 120b, 120c, and 120d are overlapped on the alignment holes 136 of the metal flexible substrate 100, and the plurality of opening patterns of the alignment marks 120a, 120b, 120c, and 120d are formed. Some areas of the reflective patterns 122 and 124a, 124b, 124c, and 124d overlap the alignment holes 136.

The reflection pattern 122 is in contact with the support reflection pattern 122a and the support reflection pattern 122a formed on the metal flexible substrate 100, and at least a portion of the reference reflection pattern overlaps with the alignment hole of the metal flexible substrate 100. 122b. The reference reflective pattern 122b may be a cross-shaped pattern extending in a direction perpendicular to each other, and the cross-shaped end portion of the reference reflective pattern 122b may contact the circular support reflective pattern 122a.

The support reflective pattern 122a is formed on the metal flexible substrate 100 to increase the area where the reflective patterns of the alignment marks 120a, 120b, 120c, and 120d are adhered onto the metal flexible substrate 100, thereby increasing the area. It may serve to secure the coupling between the in marks 120a, 120b, 120c, and 120d and the metal flexible substrate 100, and to support the reference reflection pattern 122b overlapping the alignment hole 136. .

The plurality of opening patterns 124a, 124b, 124c, and 124d may be partitioned as an area except for an area where the alignment hole 136 and the reflection pattern 122 overlap each other. The plurality of opening patterns 124a, 124b, 124c, and 124d according to an embodiment of the present invention may include a first opening pattern 124a, a second opening pattern 124b, a third opening pattern 124c, and a fourth opening pattern. 124d, and may be a region in which a portion of the metal layer is removed by a photoresist process. At least some regions of the plurality of opening patterns 124a, 124b, 124c, and 124d overlap the alignment holes 136 to expose the alignment holes 136.

6 is a cross-sectional view schematically illustrating an inspection process of a flexible circuit board according to an exemplary embodiment of the present invention.

The camera 500 is disposed on the flexible circuit board, and photographs an image in which the illumination 10 irradiated from the upper light 610 disposed on the flexible circuit board is reflected on the flexible circuit board. An image of the illumination 20 emitted from the lower illumination 620 disposed below the image transmitted is transmitted through the flexible circuit board. The camera 500 may be at least one CCD camera, and may be a line scan type camera.

The illumination 10 irradiated from the upper illumination 610 is reflected by a metal layer having a high reflectance such as the circuit pattern 110 of the flexible circuit board and the reflection pattern 122 of the alignment marks 120a, 120b, 120c, and 120d. The opening patterns 124a of the surface of the metal flexible substrate 100, the through holes 130, and the alignment marks 120a, 120b, 120c, and 120d that are incident on the camera 500 and have relatively low or no reflectance. Irradiation light 10 of the upper light 610 incident to 124b, 124c, and 124d is relatively less reflected or not reflected, and the camera 500 captures an image accordingly.

Since the illumination 20 irradiated from the lower illumination 620 does not penetrate the metal base substrate 102 of the flexible circuit board, the device hole 132, the sprocket hole 134, Only a plurality of opening patterns 124a, 124b, 124c, and 124d of the through holes 130 such as the alignment hole 136 and the alignment marks 120a, 120b, 120c, and 120d may pass through the camera 500. Captures an image according to the light incident through the flexible circuit board.

In the case of a conventional flexible circuit board using a polyimide-based flexible plastic as the base substrate, since the light irradiated from the lower illumination 620 may be incident on the upper camera 500 through the base substrate, the upper illumination 610 And the captured image of the flexible circuit board according to the lower illumination 620, it is possible to check the coupling of the flexible circuit board.

On the other hand, in the case of using the base substrate, which is a metal, the light incident from the lower illumination 620 cannot pass through the metal base substrate 102, and thus the image and the lower illumination captured based on the upper illumination 610 ( In order to compare the captured images based on 620, it may be difficult to form a reference point for aligning the two images.

However, the flexible circuit board according to the present invention forms the alignment marks 120a, 120b, 120c, and 120d overlapping portions of the alignment holes 136 and the alignment holes 136 of the metal flexible substrate 100. In addition, a reference point for comparing, collecting, and analyzing an image captured based on the upper illumination 610 and an image captured based on the lower illumination 620 may be provided.

Hereinafter, the optical path when the upper illumination 610 and the lower illumination 620 are irradiated, and the captured image at that time will be described in detail.

FIG. 7 is a perspective view schematically illustrating a path of light when top lighting is irradiated on a flexible circuit board according to an exemplary embodiment of the present disclosure.

FIG. 8 is a plan view illustrating an image captured when upper lighting is irradiated onto a flexible circuit board according to an exemplary embodiment of the present invention.

7 and 8, the illumination 10 irradiated from the upper illumination 610 is a reflection pattern 122 of the circuit pattern 110 and the alignment marks 120a, 120b, 120c, and 120d on the flexible circuit board. As reflected by the metallic material, it is incident on the camera 500. In addition, the illumination irradiated from the upper illumination 610 incident on the surface of the metal flexible substrate 100 is relatively less reflected and enters the camera 500 or is not reflected. In addition, light incident on the plurality of opening patterns 124a, 124b, 124c, and 124d of the alignment marks 120a, 120b, 120c, and 120d, the sprocket hole 134, and the device hole 132 is a flexible circuit board. Since it passes through, it does not enter the camera 500.

Accordingly, as shown in FIG. 8, the reflective patterns of the circuit patterns 110 and the alignment marks 120a, 120b, 120c, and 120d on the metal flexible substrate 100 are imaged relatively brighter than other portions. The captured image of the circuit pattern 110 may be obtained.

FIG. 9 is a perspective view schematically illustrating a path of a light when the lower circuit is illuminated on a flexible circuit board according to an exemplary embodiment of the present invention.

FIG. 10 is a plan view illustrating an image captured when lower illumination is applied to a flexible circuit board according to an exemplary embodiment of the present invention.

9 and 10, since the illumination 20 irradiated from the lower illumination 620 does not penetrate the metal flexible substrate 100, the lower illumination incident to the surface of the metal flexible substrate 100 ( Most of the illumination irradiated at 620 is blocked by the metal flexible substrate 100 and is not incident to the upper camera 500. On the other hand, the lower illumination 620 incident to the plurality of opening patterns 124a, 124b, 124c and 124d of the alignment marks 120a, 120b, 120c and 120d, the sprocket hole 134 and the device hole 132. Since the illumination irradiated from the light passes through the flexible circuit board, it is incident on the camera 500, and the shape of the plurality of opening patterns 124a, 124b, 124c, and 124d of the alignment marks 120a, 120b, 120c, and 120d and A captured image of the shape of the through hole 130 such as a device hole can be obtained.

Although not shown, in the subsequent process, the image captured by the illumination of the upper light 610 and the image captured by the illumination of the lower light 620 are based on the alignment marks 120a, 120b, 120c, and 120d as reference points. Aggregation, comparison, and analysis are possible, whereby defect inspection of the flexible circuit board including the metal flexible substrate 100 may be performed.

11 is a plan view illustrating an alignment mark of a flexible circuit board according to another exemplary embodiment of the present invention.

Referring to FIG. 11, the alignment mark 220 of the flexible circuit board according to another exemplary embodiment may include a reflective pattern 222 and a plurality of opening patterns 224a, 224b, 224c, and 224d. Hereinafter, the same identification symbols are used for substantially the same configuration as the alignment marks 120a, 120b, 120c, and 120d according to the exemplary embodiment of the present invention illustrated in FIG. 4, and redundant descriptions are omitted.

The alignment mark 220 according to another exemplary embodiment of the present invention overlaps the alignment hole 136 of the metal flexible substrate 100, and forms a plurality of opening patterns 224a and 224b of the alignment mark 220. , 224c, 224d, and some regions of the reflective pattern 222 overlap with the alignment hole 136.

The reflective pattern 222 is in contact with the support reflective pattern 222a and the support reflective pattern 222a formed on the metal flexible substrate 100, and at least a portion thereof overlaps the alignment hole 136 of the metal flexible substrate 100. The reference reflection pattern 222b is included. The reference reflection pattern 222b may be a cross-shaped pattern extending in a direction perpendicular to each other, and the support reflection pattern 222a is perpendicular to a direction in which each branch of the reference reflection pattern extends at an end of the cross-shaped reference reflection pattern. It may be a shape protruding in one direction.

12 is a plan view illustrating an alignment mark of a flexible circuit board according to another exemplary embodiment of the present invention.

Referring to FIG. 12, an alignment mark 230 of a flexible circuit board according to another exemplary embodiment may include a reflective pattern 232 and a plurality of opening patterns 234a, 234b, 234c, and 234d. . Hereinafter, the same identification symbols are used for substantially the same configuration as the alignment marks 120a, 120b, 120c, and 120d according to the exemplary embodiment of the present invention illustrated in FIG. 4, and redundant descriptions are omitted.

Alignment mark 230 according to another embodiment of the present invention is formed overlapping on the alignment hole 136 of the metal flexible substrate 100, the opening patterns 234a, 234b, Some areas of the 234c and 234d and the reflective pattern 222 overlap the align hole 136.

The reflection pattern is in contact with the support reflection pattern 232a and the support reflection pattern 232a formed on the metal flexible substrate 100, and the reference reflection pattern 232b at least partially overlapping the alignment hole of the metal flexible substrate 100. It includes. The reference reflection pattern 232b may be a cross-shaped pattern extending in a direction perpendicular to each other, and the support reflection pattern 232a may be branched into at least two branches at an end of the cross-referenced reference reflection pattern 232b to refer to a reference shape. It may have a shape extending in a direction different from each branch of the reflective pattern 232b.

FIG. 13 is a plan view illustrating alignment marks on a flexible circuit board according to another exemplary embodiment of the present invention.

Referring to FIG. 13, the alignment mark 240 of the flexible circuit board according to another exemplary embodiment may include a reflective pattern 242 and a plurality of opening patterns 244. Hereinafter, the same identification symbols are used for substantially the same configuration as the alignment marks 120a, 120b, 120c, and 120d according to the exemplary embodiment of the present invention illustrated in FIG. 4, and redundant descriptions are omitted.

The alignment mark 240 according to another embodiment of the present invention is formed to overlap on the alignment hole 136 of the metal flexible substrate 100, and the opening pattern 244 and the reflection pattern of the alignment mark 240. Some areas of 242 overlap with the alignment holes 136.

The reflection pattern 242 is in contact with the support reflection pattern 242a and the support reflection pattern 242a formed on the metal flexible substrate 100, and at least a portion of the reference reflection pattern overlaps with the alignment hole of the metal flexible substrate 100. 242b.

The reference reflection pattern 242a may have a shape including a plurality of branches 246a extending in the first direction and a plurality of branches 246b extending in the second direction perpendicular to the first direction, and the support reflection pattern ( 242a may be in contact with end portions 246a and 246b of the plurality of branches and may extend in a direction perpendicular to the first and second directions in which the plurality of branches 246a and 246b extend.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, You will understand. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

100: metal flexible substrate 110: circuit pattern
120a, 120b, 120c, 120d: alignment mark
130: through hole
500: camera

Claims (17)

A metal flexible substrate having through holes formed therein;
A circuit pattern formed on at least one surface of the metal flexible substrate;
An alignment mark formed on at least one surface of the metal flexible substrate and spaced apart from the circuit pattern,
At least a portion of the alignment mark overlaps at least a portion of the through hole. The method according to claim 1,
The through hole may include an alignment hole overlapping at least a portion of the alignment mark. The method of claim 2,
The alignment mark includes a reflection pattern and a plurality of opening patterns,
At least a portion of the plurality of opening patterns overlap the alignment hole to expose the alignment hole. The method of claim 2,
The alignment mark includes a reflection pattern and a plurality of opening patterns,
The reflection pattern is,
A support reflection pattern formed on the metal flexible substrate; And
And a reference reflective pattern in contact with the support reflective pattern and at least partially overlapping an alignment hole of the metal flexible substrate. 5. The method of claim 4,
And the reference reflective pattern has a cross shape extending in a direction perpendicular to each other. 5. The method of claim 4,
Wherein the support reflective pattern is circular and abuts an end of the reference reflective pattern. 5. The method of claim 4,
The reference reflection pattern has a cross shape extending in a direction perpendicular to each other.
The support reflection pattern is a flexible circuit board protruding from the end of the reference reflection pattern in the direction perpendicular to the direction in which each branch of the cross shape of the reference reflection pattern extends. 5. The method of claim 4,
The reference reflection pattern has a cross shape extending in a direction perpendicular to each other.
The support reflection pattern is a flexible circuit board in which each branch of the cross shape of the reference reflection pattern is branched into at least two branches at the end of the reference reflection pattern, and extends in a direction different from each branch of the reference reflection pattern. . 5. The method of claim 4,
The reference reflection pattern includes a plurality of branches extending in a first direction and a plurality of branches extending in a second direction perpendicular to the first direction.
And the support reflection pattern is in contact with an end portion of the plurality of branches and extends in a direction perpendicular to the first direction and the second direction in which the plurality of branches extend. The method according to claim 1,
The metal flexible substrate,
Metal base substrates;
An insulating layer formed on the metal base substrate; And
A flexible circuit board comprising an adhesive layer formed on the insulating layer. The method of claim 10,
And the metal base substrate comprises at least one of copper, aluminum, bronze, silver or stainless steel. The method of claim 10,
The insulating layer is polyimide (PI), polyester (PE; polyester), polyethylene terephthalate (PET), polyethylene naphthalene (PEN), polycarbonate (PC; poly carbonate), A flexible circuit board which is a material selected from the group consisting of polymer resins including epoxy and the like. The method of claim 10,
The adhesive layer is a heat curable film adhesive or a coating adhesive. The method according to claim 1,
The through hole may include an alignment hole overlapping at least a portion of the alignment mark and a device hole in which the semiconductor chip is mounted.
Wherein the alignment hole and the device hole are formed by removing a portion of the metal flexible substrate together by punching. The method according to claim 1,
And the circuit pattern and the alignment mark are formed of substantially the same material. The flexible circuit board of claim 15, wherein the circuit pattern and the alignment mark comprise at least one of gold, silver, copper, or aluminum. 16. The method of claim 15,
And the circuit pattern and the alignment mark are formed together by forming a metal layer on the same metal flexible substrate, and patterning the metal layer.

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