KR20130104226A - Substrate bonding apparatus and substrate bonding method - Google Patents

Abstract

PURPOSE: A substrate bonding apparatus and a substrate bonding method are provided to certainly detect the drop of a substrate by using a simple and cheap structure. CONSTITUTION: A vacuum chamber (1) includes an upper container (11) and a lower container (12). A holding part (2) holds one substrate (P1). A supporting part (3) supports the other substrate (P2) bonded to the one substrates by an adhesive (R). A pressure detection part detects the pressure of a vacuum chamber. A determination part determines whether failure is caused or not due to the separation of the other substrate from the holding part, based on the change of the pressure detected by the pressure detection part.

Description

Substrate Bonding Apparatus and Substrate Bonding Method {SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD}

TECHNICAL FIELD This invention relates to the board | substrate bonding apparatus and board | substrate bonding method which bond a board | substrate via an adhesive agent, for example in a vacuum chamber.

The board | substrate which comprises recording media, such as an optical disk, the liquid crystal module which comprises a liquid crystal display, board | substrates, such as a touch panel, a backlight, and a protection panel, are mutually bonded by an adhesive agent. In addition, a liquid crystal module, an organic EL module, etc. are also manufactured by bonding a glass substrate together, for example. The process of holding a board | substrate is indispensable for the bonding apparatus for performing such bonding. Generally, as a method of holding a board | substrate, the method by a vacuum suction, the method by a mechanical chuck, the method by an electrostatic chuck, etc. are mentioned.

And in the manufacturing process of a board | substrate as mentioned above, a board | substrate may be bonded in vacuum for the purpose of bubble removal. For this reason, the holding device holds the substrate from above in the vacuum chamber. For example, Patent Literature 1 describes a technique in which the holding device performs adsorption by vacuum adsorption under atmospheric pressure and switches to adsorption by electrostatic adsorption under reduced pressure in consideration of the fact that vacuum adsorption does not occur in vacuum.

Patent Document 1: Japanese Patent Application Laid-Open No. 2002-229044

By the way, in a vacuum chamber, a board | substrate may fall from a holding apparatus before carrying out normal bonding. In this case, an operation such as stopping a line by detecting a drop promptly must be performed.

In this way, in order to determine the presence or absence of a drop in the vacuum chamber, a window must be provided in advance in the vacuum chamber so that it can be checked from the outside. Alternatively, the position of the upper substrate should be detected by the touch sensor or the optical sensor.

However, even if a window is provided in the vacuum chamber, the room is not always able to be confirmed due to a blur. In addition, it is not realistic for an operator to always monitor with a window. It is also expensive to install windows in existing vacuum chambers. On the other hand, even in the case of a touch sensor or an optical sensor, a new detection device must be added to an existing facility, which is expensive.

The present invention has been proposed to solve the above problems of the prior art, and an object thereof is to provide a substrate bonding apparatus and a substrate bonding method capable of reliably detecting falling of a substrate with a simple and inexpensive structure. have.

In order to achieve the above object, the present invention provides a substrate bonding apparatus in which a pair or more substrates are bonded together through an adhesive attached to both or one substrate in a vacuum chamber, wherein one substrate is supported in the vacuum chamber. The support part, the holding part which hold | maintains the other board | substrate in the position which opposes the board | substrate supported by the said support part, and the drive part which joins a pair of board | substrate by driving at least one of the said support part and the said holding part, are provided. The presence or absence of abnormality due to the detachment from the holding portion of the other substrate is based on a pressure detector for detecting the pressure in the vacuum chamber and a pressure detected by the pressure detector at the time of depressurization in the vacuum chamber. It has a determination part to determine.

Another aspect includes a reference information storage unit for storing reference information serving as a reference for determining whether the change in pressure is normal or abnormal, a comparison unit for comparing the change in pressure detected by the pressure detection unit with the reference information. And the determination unit is set to determine the presence or absence of abnormality based on the comparison result of the comparison unit.

In the above-described invention, since the detachment of the substrate from the holding part is detected on the basis of the change in the pressure in the vacuum chamber, there is no need to provide a window in the vacuum chamber or to always monitor the window with the operator. By using the pressure detector provided in the vacuum chamber of the bonding apparatus, the addition of a new detector is also unnecessary.

Another aspect is characterized in that the reference information includes a predetermined pressure drop rate.

In the above aspect, when the pressure drop rate in a vacuum chamber is quicker than a normal case, or when approximating the speed | rate when it is abnormal, it can determine with an abnormality.

Another aspect is characterized in that the reference information includes a waveform of a predetermined pressure change.

In the above aspect, when the waveform of the pressure change in a vacuum chamber has an irregular fluctuation or approximates the waveform in the case of abnormality, it can determine with an abnormality.

Another aspect is characterized in that the reference information includes a predetermined pressure change curve and its slope.

In the above aspect, when there is no change in normal, or there is a change approximating the change in abnormality, the pressure change curve and inclination in a vacuum chamber can be determined as abnormal.

In another embodiment, the reference information includes a predetermined final attained pressure.

In the above aspect, when it differs from the final reached pressure at the time of normal or approximates to the final reached pressure at the time of abnormality, it can determine with an abnormality.

In another embodiment, the holding unit has a vacuum suction unit, and the reference information includes a predetermined pressure rise.

In the above aspect, when there exists a sudden pressure rise in a vacuum chamber by opening a vacuum adsorption part by detachment of a board | substrate from a holding | maintenance part, abnormality can be determined.

In addition, each aspect mentioned above can also be grasped as invention of the board | substrate bonding method.

As mentioned above, according to this invention, it is providing the board | substrate bonding apparatus and board | substrate bonding method which can detect the fall of a board | substrate reliably with a simple and inexpensive structure.

BRIEF DESCRIPTION OF THE DRAWINGS The longitudinal cross-sectional view which shows the board | substrate loading (A), the vacuumization (B), and the board | substrate fall (C) in one Embodiment of the bonding apparatus of this invention.
FIG. 2 is a block diagram showing the configuration of a control device in the embodiment of FIG. 1. FIG.
FIG. 3 is a flowchart showing the flow of bonding in the embodiment of FIG. 1. FIG.
4 is an explanatory diagram showing an example of pressure change in the case where the substrate falls and in the normal case;

Next, embodiments of the present invention (hereinafter referred to as embodiments) will be specifically described with reference to the drawings.

[A. Configuration of Embodiment]

First, the structure of the board | substrate bonding apparatus (henceforth this apparatus) of this embodiment is demonstrated with reference to FIG. 1 and FIG. This apparatus is, for example, an apparatus for joining a pair of substrates P1 and P2 to each other via an adhesive agent R. As the adhesive (R), for example, an ultraviolet curable resin is used.

That is, as shown in Fig. 1 and Fig. 2, the apparatus includes a vacuum chamber 1, a holding part 2, a supporting part 3, a control device 100, a pressure detecting part 4, an input part 5, The output part 6, the drive part 7, etc. are provided. The vacuum chamber 1 is comprised by the upper container 11 and the lower container 12, The upper container 11 which moves up and down by the lifting mechanism which is not shown in figure contacts the lower container 12 inside, In the vacuum chamber is formed. This vacuum chamber is comprised so that pressure reduction is possible by being connected to the vacuum source which is not shown in figure.

The holding | maintenance part 2 is a structure part holding the board | substrate P1. As this holding | maintenance part 2, all the holding apparatus which can be used now or in the future, such as an electrostatic chuck, a mechanical chuck, a vacuum chuck, an adhesion chuck, is applicable, for example. It is also possible to use multiple chucks together. In addition, the holding | maintenance part 2 is provided so that raising / lowering is possible independently of the upper container 11 by the lifting mechanism not shown in figure in order to press the board | substrate P1 to the board | substrate P2 in a vacuum chamber.

The support part 3 is a structural part which supports the board | substrate P2 joined to the board | substrate P1. In addition, the adhesive agent R is apply | coated to the upper surface of the board | substrate P2 in a previous process. In addition, the pressure detection part 4 is a sensor which detects the pressure in a vacuum chamber. The pressure detector 4 may be provided anywhere as long as it can detect the pressure in the vacuum chamber during the decompression. The number is not limited, either.

The control apparatus 100 is an apparatus which controls the whole operation | movement of this apparatus. As shown in FIG. 2, the control unit 100 is connected to the input unit 5, the output unit 6, the drive unit 7, and the like, in addition to the pressure detection unit 4 described above.

The input part 5 is a component part which inputs various information, such as data, a setting, and an operation instruction which are required by this apparatus. The input unit 5 includes all input devices that can be used now or in the future, such as operation buttons, touch panels, keyboards, mice, and the like.

The output part 6 is a component part which outputs the operation | movement state, a determination result, etc. of this apparatus. As the output part 6, all the output devices which can be used now or in future, such as a display and a printer, are included.

The drive part 7 includes a drive mechanism for driving each part of this apparatus widely, such as a lifting mechanism. In addition, the mechanism etc. which operate a vacuum source are also included in the drive part 7 controlled by the control apparatus 100. FIG.

Moreover, the control apparatus 100 is equipped with the following structures, in order to determine an abnormality based on the change of the pressure detected by the pressure detection part 4. In addition, the part which controls operation | movement as a normal bonding apparatus in the control apparatus 100 simplifies description. That is, the control apparatus 100 has the memory | storage part 110, the calculation part 120, the extraction part 130, the comparison part 140, the determination part 150, the indicating part 160, etc.

The storage unit 110 is a processing unit that stores information necessary for the apparatus. The information stored in this storage unit 110 includes, for example, detected pressure change information, reference information, setting information, and the like.

The detected pressure change information is information indicating the pressure detected by the pressure detector 4 and the change thereof. The detected pressure change information includes, for example, a set of pressures continuously detected over time, and various data generated based on this. Such data includes at least a pressure change aspect, a pressure change rate, a pressure waveform, a pressure change curve and its slope, an attained pressure, and the like.

The reference information is information serving as a reference for determining an abnormality due to detachment of the substrate P1 from the holding unit 2. This reference information includes, for example, pressure change information at normal time and pressure change information at abnormal time. Normal pressure change information is information which shows the pressure change shown at normal time. When this information and detection pressure change information are approximated, it is normal, and when it differs, it can be said to be abnormal.

The normal pressure change information includes, for example, a set of pressures continuously displayed over time in normal time and various data based thereon. Such data includes at least a normal pressure change mode, a pressure change rate, a pressure waveform, a pressure change curve and its slope, an attained pressure, and the like.

This normal pressure change information may be previously input from the input part 5, etc., and may be created based on the pressure detected by the pressure detection part 4 at the time of the past normal as mentioned later.

The abnormality pressure change information includes, for example, a set of pressures that are continuously displayed as time passes in case of abnormality, and various data based thereon. Such data includes at least an abnormal pressure change mode, a pressure change rate, a pressure waveform, a pressure change curve and its slope, an attained pressure, and the like.

This abnormality pressure change information may be previously input from the input part 5, etc., and may be created based on the pressure detected by the pressure detection part 4 at the time of the past abnormality, as mentioned later.

In addition, setting information is the information regarding the various settings required for this apparatus. For example, the operation timing of each part by the drive part 7, the time or timing of pressure detection by the pressure detection part 4, the information and generation timing which are produced by the calculation part 120, and the extraction object by the extraction part 130 The comparison target by the comparison unit 140, the determination criteria (threshold value, etc.) by the determination unit 150, the operation instruction contents by the indicating unit 160, and the like are considered.

The calculating part 120 is a processing part which produces | generates the information required for the above determination by calculating various data based on the pressure detected by the pressure detection part 4, the information stored in the memory | storage part 110, etc. That is, the calculation unit 120 may generate any of the detected pressure change information, the normal pressure change information, and the abnormal pressure change information based on the pressure detected by the pressure detector 4.

For example, on the basis of the pressure detected by the pressure detector 4, the pressure change mode, the pressure change speed, the pressure waveform, the pressure change curve and its slope, the reached pressure, and the like can be obtained. Further, on the basis of the pressure detected by the pressure detector 4 at the time of normal or abnormal time in the past, the pressure change mode at normal or abnormal time, the pressure change rate, the pressure waveform, the pressure change curve and its slope, the reached pressure, and the like can be obtained. Can be. You may use the average value etc. of the past multiple detection value.

The extraction part 130 is a processing part which extracts the information required for abnormality determination from the memory | storage part 110 based on setting information. The comparison unit 140 is a processing unit that compares the detected pressure change information with the normal pressure change information or the abnormal pressure change information based on the setting information. The determination unit 150 is a processing unit that determines abnormality based on the comparison result by the comparison unit 140. The instruction unit 160 is a processor that outputs an instruction signal to the driver 7 based on the setting information.

Such a control device 100 can be realized by, for example, a dedicated electronic circuit or a computer operating with a predetermined program. Therefore, a computer program for controlling the operation of the apparatus and the recording medium recording the same in accordance with the procedure described below are also an aspect of the present invention.

[B. Operation of Embodiment]

[One. Joining procedure]

The bonding procedure of the board | substrate which concerns on this embodiment as mentioned above is demonstrated with reference to the flowchart of FIG. 3 with FIG. 1 and FIG. First, as shown to FIG. 1A, the upper container 11 of the vacuum chamber 1 raises, isolate | separates from the lower container 12, and is in the state of open | released air.

And the board | substrate P1 is conveyed in the vacuum chamber 1 which is open | released to the air by the conveyance apparatus which is not shown in figure, and the upper surface is hold | maintained by the holding | maintenance part 2. On the other hand, the board | substrate P2 by which the adhesive agent was previously apply | coated to the support part 3 of the lower container 12 is arrange | positioned.

Next, as shown in FIG. 1B, the driving unit 7 lowers the upper container 11 to adhere to the lower container 12, and seals the inside of the vacuum chamber 1 (step 301). ). Thereafter, internal vacuuming (decompression) is started by the vacuum source (step 302). At the start of this vacuuming, the pressure detection by the pressure detector 4 is performed (step 303).

The timely detected pressure is stored in the storage unit 110 as detection pressure change information (step 304). At the same time, the information to be compared with the reference information is generated by the calculation unit 120 based on the detected pressure, which is also stored in the storage unit 110 as the detection pressure change information.

The comparison unit 140 compares the detected pressure change information stored in the storage unit 110 with the reference information (step 305). Based on this comparison result, it is determined whether the determination unit 150 is abnormal (step 306).

When it determines with abnormality (YES of step 306), when the board | substrate P1 fell and the output part 6 outputs abnormality, an operator is notified of abnormality (step 315). In addition, the drive unit 7 stops evacuation and introduces atmospheric air (step 316) to raise the upper container 11 (step 314).

When it is determined to be normal (NO in step 306), the drive unit 7 bonds the substrate P1 to the substrate P2 by lowering the holding unit 2 at a preset bonding timing (YES in step 307) ( Step 308). Then, the drive unit 7 stops evacuation and introduces atmospheric air (step 309).

Further, the detected pressure change information so far and the reference information are compared (step 310), and it is determined whether or not it is abnormal (step 311). When it determines with abnormality (YES of step 311), the output part 6 outputs an abnormality, and notifies a worker an abnormality (step 312). Then, the driving unit 7 raises the holding unit 2 and the upper container 11 (steps 313 and 314).

When it is determined to be normal (NO in step 311), the joining unit 7 is raised normally, and the driving unit 7 raises the holding unit 2 and the upper container 11 (steps 313 and 314). In addition, the worker who has been notified of the abnormality can cope with taking out the substrates P1 and P2 by stopping the apparatus or the line. At the time when abnormality is determined, it is also possible to set the drive part 7 to stop an apparatus or a line.

[2. Abnormality determination processing]

Specific examples of the above abnormality determination processing will be described below. 4 is a graph which actually detected the pressure from the start of decompression to the stop in the vacuum chamber. The solid line shows the pressure change in the chamber C1 where the drop of the substrate P1 has occurred, and the dotted line shows the pressure change in the chamber C2 at the normal state. In particular, what should be made into the comparison object by the comparison part 140 is the pressure change of the part enclosed by the dashed-dotted line. In addition, a double line shows the start time of the holding | maintenance part 2 descend | falling.

[2-1. Pressure drop rate]

An example using the pressure drop rate will be described as a comparison target by the comparison unit 140. For example, when normal bonding is performed, after reaching a sufficient vacuum (decompression state), the substrate P1 can be pressed hard against the substrate P2.

However, when the adhesive agent R of resin (resin) is apply | coated to the upper surface of the board | substrate P2, as shown to FIG. 1B, with the outgas G which generate | occur | produces from the adhesive agent R, a vacuum chamber Decompression inside is inhibited, and the pressure drop rate is slowed down.

By the way, when the board | substrate P1 detaches | falls from the holding | maintenance part 2 and falls before joining, as shown in FIG.1 (C), the surface of the adhesive agent R is covered by the board | substrate P1. Then, at a faster stage than normal bonding, since the surface area of the adhesive R exposed to the vacuum becomes small, the amount of out gas G decreases.

Therefore, if there exists a fall of the board | substrate P1, the pressure drop rate in a vacuum chamber will become faster than a normal case. For example, in FIG. 4, compared with the moderate pressure drop rate of the chamber C2, there exists a very fast part in the pressure drop rate of the chamber C1.

Thus, the comparison target by the comparison unit 140 is set as the rate of decrease (change) of the detected pressure and the rate of change (pressure) of normal pressure. And the determination part 150 can determine that the board | substrate P1 fell when the difference of the rate of fall of the detected pressure compared with the comparison part 140, and the normal pressure fall rate is larger than a predetermined threshold value. .

[2-2. Pressure waveform]

After exhausting the substrate P1, if the exhaust in the vacuum chamber is continued, as shown in FIG. 1C, the outgas trapped inside is separated from the side surfaces of the adhesive agent R between the upper and lower substrates P1 and P2. (G) is discharged irregularly. For this reason, irregular fluctuations occur in a waveform that detects a pressure change in the vacuum chamber. For example, in FIG. 4, compared with the pressure waveform of the chamber C2, there exists a part which fluctuates irregularly in the pressure waveform of the chamber C1.

Therefore, the comparison object by the comparison unit 140 is set as the waveform of the detected pressure and the pressure waveform at the normal state. And the determination part 150 can determine that the board | substrate P1 fell when the difference of the waveform of the detected pressure compared with the comparison part 140 and the pressure waveform at the time of normal is larger than a predetermined threshold value.

[2-3. Pressure change mode]

As the holding device which holds the board | substrate P1 as the holding part 2, when the pressure in the vacuum chamber at the time of joining is low, it cannot hold | maintain with a vacuum suction (chuck) apparatus. However, in order to hold | maintain at the time of supply and removal of the board | substrate P1, the apparatus which used together the vacuum adsorption function and the function of another holding apparatus is used in many cases.

In this case, if the vacuum is sucked at the time of supplying the substrate P1 and the vacuum chamber is evacuated while the suction surface is pressed firmly on the substrate P1, the pressure in the vacuum chamber may be lower than that in the suction line. In this state, when the substrate P1 falls, the substrate P1 falls from the vacuum suction surface, so that the holes in the suction line are exposed in the vacuum chamber, and the pressure in the vacuum chamber rises by one order.

Therefore, the comparison object by the comparison part 140 is set as the change aspect of a detection pressure, and the pressure change aspect at the time of normality. And the determination part 150 can determine that the board | substrate P1 fell when there exists a pressure rise which is not in the normal pressure change aspect in the detection pressure change aspect compared by the comparison part 140.

[2-4. Pressure change curve and slope]

As described above, when normal bonding is performed, the surface of the adhesive is initially covered with the substrate P1 when the substrate P1 and the substrate P2 are pressed hard. For this reason, at that timing, the outgas G from the adhesive surface rapidly decreases, and the pressure change curve and the slope up to that point change.

Therefore, the comparison target by the comparison unit 140 is set as the change curve and the slope of the detected pressure, and the pressure change curve and the slope at the normal state. And the determination part 150 can determine that the board | substrate P1 fell when there is no correspondence in the pressure change curve and inclination compared by the comparison part 140 at normal time.

[2-5. Reaching pressure]

As shown in FIG. 4, when there exists the fall of the board | substrate P1, the final reached pressure will become lower than normal. For this reason, the comparison object by the comparison part 140 is set as the final reached pressure of a detection pressure, and the final reached pressure at the time of normality. And the determination part 150 determines that the board | substrate P1 fell when the value which compared the final arrival value of the detection pressure compared by the comparison part 140 is lower than the predetermined threshold value. Can be. In addition, the determination by this attained pressure can raise determination precision by combining with the various determination mentioned above.

[C. Effect of Embodiment]

According to the present embodiment as described above, since the drop of the substrate P1 from the holding unit 2 can be detected based on the change in the pressure in the vacuum chamber, the window is installed in the vacuum chamber or the operator always monitors the window. no need. In addition, the pressure sensor installed in the vacuum chamber of a general bonding apparatus eliminates the need to add a new special detector. Thus, the fall of the board | substrate P1 can be detected reliably with a simple and inexpensive structure.

[D. Other Embodiments]

This invention is not limited to said embodiment. For example, in the above-described embodiment, an example of determining the abnormality is given by the difference between the detected pressure change information and the normal pressure change information. However, the abnormality may be determined based on the approximation (whether or not in the threshold value) of the detected pressure change information and the pressure change information at the time of abnormality.

In addition, in said embodiment, the pressure change information used as the comparison object with a detection pressure was distinguished by the expression of normal time and abnormal time. In practice, however, it does not necessarily have to be appended with information on making such a meaning. For example, the determined information is simply stored as a reference information, and it may be determined by whether or not the pressure change information and the change in the detected pressure differ or approximate.

In addition, it is also possible to increase the accuracy of the determination by using any one of the above determination methods in combination.

In addition, the specific content and value of the information used for this invention, such as said detected pressure change information, reference information, a threshold value for determination, and other setting values, are free, and are not limited to a specific content and a numerical value.

In addition, it is free to judge whether or not to include a value as above, below, or not as including a value as above or below in the judgment of a threshold value, the judgment of a mismatch of a match, and the like.

In addition, as the storage unit, any storage medium such as registers, memories, disks or the like that can be used now or in the future is applicable, and it is not asked whether it is built-in or detachable. The various pieces of information stored in the storage unit may be input from the outside via a communication network. All or part of the control apparatus may be connected via a remote communication network.

In addition, the structure for joining a board | substrate is also not limited to said thing. For bonding, either one of the substrates may be moved or both may be moved. For example, the above-mentioned support part may raise the board | substrate by the lifting mechanism, and may be the structure which joins to the board | substrate hold | maintained by the holding | maintenance part, and the structure which both the holding | maintenance part and the support part are moved and bonded by the lifting mechanism may be sufficient as it.

Moreover, all the methods and apparatus which can be used now or in the future are applicable also about supply of an adhesive agent to a board | substrate, and conveyance of a board | substrate. Although the board | substrate to which an adhesive agent is apply | coated was lower side in said embodiment, it may be upper side and both may be sufficient as it. It is applicable not only to a pair but also to the apparatus which joins several board | substrates. What is necessary is just to comprise the space which can be made into a vacuum chamber also. It may be a structure in which the lower member is lifted and closed and opened, or a structure in which only a passage of the substrate is opened and closed.

Moreover, the method of performing a part of said operation manually is also considered. For example, the supply of the adhesive to the substrate may be performed by a worker using a tool for coating, dropping, or the like. An operator can also carry out the carrying in and taking out of a board | substrate.

In addition, the kind of adhesive agent to be used is not limited to resin of ultraviolet curing. All kinds of adhesives, such as resin hardened | cured by another electromagnetic wave and thermosetting resin, can be applied.

In addition, as long as the board | substrate which is an application target of this invention can be a joining object, the magnitude | size, a shape, a material, etc. do not matter. There is no difference in structure, such as whether there is a connection terminal, a conductive film, a recording film, or a flexible substrate. For example, the present invention can also be applied to bonding modules, operating touch panels, protective panels, etc., which constitute a display device. Moreover, it is applicable also to the various board | substrates which comprise a semiconductor wafer and an optical disk. The substrate to be bonded may not necessarily be the same size.

That is, this invention can be applied to all the board | substrates which need an abnormality detection by the detachment from a holding | maintenance part in a bonding process.

1: vacuum chamber, 2: holding part, 3: supporting part, 4: pressure detecting part, 5: input part, 6: output part, 7: driving part, 11: upper container, 12: lower container, 100: control device, 110: memory Section 120: calculating section 130: extracting section 140 comparing section 150: determining section 160 indicating section

Claims (13)

In the substrate bonding apparatus which bonds a pair or more board | substrate in the vacuum chamber through the adhesive agent adhered to both or one board | substrate,
In the vacuum chamber,
A support for supporting one substrate,
A holding portion for holding the other substrate at a position opposed to the substrate supported on the supporting portion;
A drive unit for bonding a pair of substrates by driving at least one of the support unit and the holding unit.
And,
A pressure detector for detecting a pressure in the vacuum chamber;
At the time of depressurization in the vacuum chamber, a determination unit that determines the presence or absence of abnormality due to detachment from the holding unit of the other substrate based on the change in the pressure detected by the pressure detecting unit.
Substrate bonding apparatus which has a. The reference information storage unit according to claim 1, further comprising: a reference information storage unit for storing reference information serving as a reference for determining whether the change in pressure is normal or abnormal;
A comparison unit for comparing the change in pressure detected by the pressure detection unit with the reference information
Lt; / RTI >
The determination unit is set to determine the presence or absence of abnormality based on the comparison result of the comparison unit. The substrate bonding apparatus according to claim 2, wherein the reference information includes a predetermined pressure drop rate. The substrate joining apparatus according to claim 2, wherein the reference information includes a waveform of a predetermined pressure change. The substrate bonding apparatus according to claim 2, wherein the reference information includes a predetermined pressure change curve and its slope. The board | substrate bonding apparatus of Claim 2 in which the said reference information contains the predetermined final | attained pressure. The method of claim 2, wherein the holding portion has a vacuum suction portion,
The reference information includes a predetermined pressure rise. In a substrate joining method, in which a pair of substrates are bonded together in an vacuum chamber through an adhesive attached to both or one substrate,
In the vacuum chamber,
The supporting part supports one substrate,
The holding part holds the other substrate,
The board | substrate bonding method is judged based on the change of the pressure at the time of pressure_reduction | reduced_pressure in a vacuum chamber, the presence or absence of abnormality by detachment of a board | substrate from a holding part. The substrate joining method according to claim 8, wherein an abnormality is determined when the pressure drop rate in the vacuum chamber is faster than the normal case. The substrate joining method according to claim 8, wherein the abnormality is determined when there is irregular fluctuation in the waveform of the pressure change in the vacuum chamber. The substrate joining method according to claim 8, wherein an abnormality is determined when there is no normal change in the pressure change curve and the slope in the vacuum chamber. 9. The substrate bonding method according to claim 8, wherein the final determination is made abnormal when the final attained pressure in the vacuum chamber is lower than that in the normal case. The method of claim 8, wherein the holding portion has a vacuum suction portion,
When there is a sudden pressure rise in a vacuum chamber, it determines with an abnormality, The board | substrate bonding method characterized by the above-mentioned.

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