KR20130094911A - Light emitting device package - Google Patents

Light emitting device package Download PDF

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Publication number
KR20130094911A
KR20130094911A KR1020120016172A KR20120016172A KR20130094911A KR 20130094911 A KR20130094911 A KR 20130094911A KR 1020120016172 A KR1020120016172 A KR 1020120016172A KR 20120016172 A KR20120016172 A KR 20120016172A KR 20130094911 A KR20130094911 A KR 20130094911A
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KR
South Korea
Prior art keywords
emitting device
light emitting
wavelength conversion
device package
holes
Prior art date
Application number
KR1020120016172A
Other languages
Korean (ko)
Inventor
김형근
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR1020120016172A priority Critical patent/KR20130094911A/en
Publication of KR20130094911A publication Critical patent/KR20130094911A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to a light emitting device package, and an aspect of the present invention relates to a light emitting device, a wavelength conversion unit having at least one portion disposed on an upper surface of the light emitting device and having at least one through hole formed therein, and filled in the through hole. It provides a light emitting device package comprising an adhesive portion for bonding the wavelength conversion portion to the light emitting device.

Description

Light Emitting Device Package

The present invention relates to a light emitting device package.

A light emitting diode (LED), which is a kind of light source, is a device that can generate light of various colors based on the recombination of electrons and holes at p- and n-type junctions when a current is applied.

A common method of manufacturing a light emitting device package is to mount a light emitting diode device on a package body, and to fill with a molding resin in which phosphors are dispersed in a space between the surface of the light emitting diode device and the package body and to cure it.

However, in the light emitting device package using the conventional molding resin, the light emitted from the side reacts with the phosphors a lot, resulting in a lot of red and greenish yellow light. Light generated in the wavelength band is emitted. In addition, since a process of injecting molding resin into each light emitting diode package is required, production time increases, and the degree of dispersing of the phosphor varies according to precipitation of phosphor dispersed in the molding resin and heat distribution during the heat curing process. There is a problem that the quality of the product is lowered.

In order to solve the above problem, instead of using a molding resin, a phosphor plate may be adhered on the light emitting device. There is a problem that occurs.

Accordingly, there is a need for a new method of improving color deviation, shortening a process, and preventing light leakage.

A light emitting device package according to an embodiment of the present invention, a light emitting device; At least a portion may be disposed on an upper surface of the light emitting device, and may include a wavelength conversion part having at least one through hole formed therein and an adhesive part filling the inside of the through hole to adhere the wavelength conversion part to the light emitting device.

In addition, the wavelength converter may have a plate structure.

In addition, the wavelength conversion unit may have a structure in which a plurality of plates are stacked in a multilayer.

In addition, the plurality of plates may be formed by overlapping through holes at positions corresponding to each other.

In addition, the plurality of plates may have through holes formed at different positions.

In addition, the light emitting device includes two different electrodes, and all of the electrodes may be formed on a surface facing the wavelength converter.

In addition, the light emitting device may include two different electrodes, and the electrodes may be formed on opposite surfaces of the surface facing the wavelength converter.

In addition, the light emitting device may include two different electrodes, and the electrodes may be formed on surfaces opposite to the surface facing the wavelength converter.

The substrate may further include an underfill resin part filled in a space between the substrate and the light emitting device and a portion of the substrate except for the lower region of the light emitting device.

In addition, the light emitting device may be sealed by the underfill resin part and the wavelength conversion part.

In addition, the underfill resin portion may include a highly reflective material.

In addition, the adhesive part may include a wavelength conversion material.

In addition, the adhesive part may include a dispersant.

In addition, the plurality of through holes may be regularly arranged such that virtual lines connecting four adjacent through holes form a rhombus shape.

In addition, the plurality of through holes may be provided, and the adhesive part filling different ones of the plurality of through holes may include a wavelength conversion material emitting light having the same wavelength.

In addition, a plurality of through holes may be provided, and the adhesive part filling different ones of the plurality of through holes may include a wavelength conversion material emitting light of different wavelengths.

In addition, a plurality of through holes may be provided, and concentrations of the wavelength conversion material included in the adhesive part filling different ones of the plurality of through holes may be different.

In addition, the adhesion portion may be lowered in the concentration of the wavelength conversion material from the center portion of the wavelength conversion portion to the peripheral portion.

In addition, the plurality of through holes may be provided, and a wavelength conversion material may be included only in some of the plurality of through holes.

In addition, the through hole may have a diameter of 10 ㎛ to 500 ㎛.

In addition, a reflective electrode may be formed in a portion of the substrate, and the light emitting device may be mounted on the reflective electrode.

The mounting unit may surround the light emitting device to form a mounting unit, and the wavelength conversion unit may cover an upper portion of the mounting unit.

According to one embodiment of the present invention, it is possible to provide a light emitting device package having improved color deviation characteristics, shortening a process, and no light leakage phenomenon.

1 is a cross-sectional view schematically showing a light emitting device package according to an embodiment of the present invention.
2 to 6 are cross-sectional views schematically showing a light emitting device package according to an embodiment of the present invention.
7 to 9 are plan views schematically illustrating wavelength conversion parts according to an exemplary embodiment of the present invention.
10 is a cross-sectional view schematically showing a light emitting device package according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Further, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shape and size of elements in the drawings may be exaggerated for clarity.

1 is a cross-sectional view schematically showing a light emitting device package according to an embodiment of the present invention. Referring to FIG. 1, a light emitting device package according to an embodiment of the present invention includes a light emitting device 20, at least a portion of which is disposed on an upper surface of the light emitting device and having at least one through hole 35 formed therein. And an adhesive part 40 filled in the through hole 35 to adhere the wavelength conversion part 30 to the light emitting device 20. In addition, the light emitting device package according to the present embodiment may further include a substrate 10 for mounting the light emitting device 20. Hereinafter, each component constituting the light emitting device package provided in the present embodiment and the coupling relationship therebetween will be described in detail with continued reference to FIG. 1.

The light emitting device 20 includes a junction structure such as p-n or n-p-n of a semiconductor, and emits light when the injected electrons or holes recombine. In the present embodiment, the light emitting device 20 may be formed of one of various chips such as a red light emitting diode chip, a green light emitting diode chip, a blue light emitting diode chip, a white light emitting diode chip, a yellow light emitting diode, or a UV light emitting diode chip.

At least a portion of the wavelength converter 30 is disposed on an upper surface of the light emitting device 20, and light emitted from the light emitting device 20 is incident thereon, and scattered through the wavelength converting material dispersed therein. It can be provided in a structure. As such, since the wavelength converter 30 converts the wavelength of light emitted from the light emitting device 20 positioned below the wavelength converter, all of the light emitted from the light emitting device 20 is the wavelength converter 30. It is preferable to form wide enough to be released to the outside through.

The light emitting device 20 and the wavelength converter 30 may be formed of a combination of colors for obtaining white light. For example, the light emitting device 20 may emit blue light, and the wavelength converter 30 may be configured to include a yellow wavelength converting material.

In addition, at least one through hole 35 may be formed in the wavelength conversion part 30, and an adhesive part 40 is filled in the through hole 35 to convert the wavelength to the light emitting device 20. The part 30 can be bonded. The through hole may have a diameter of 10 μm to 500 μm, and when the adhesive part 40 is made of transparent silicon without a phosphor, the adhesive part 40 may have a wavelength conversion part 30 in the light emitting device 20. It may be made of a silicone resin to bond to, and may include a wavelength conversion material for converting the wavelength of the light emitted from the light emitting device (20). In addition, the adhesive portion 40 may further include a dispersant.

2 to 6 are cross-sectional views schematically showing a light emitting device package according to an embodiment of the present invention.

First, referring to FIG. 2, the light emitting device package according to the exemplary embodiment of the present invention includes a light emitting device 120, at least a portion of which is disposed on an upper surface of the light emitting device, and the first and second through holes 132 and 137 are formed. The first and second wavelength conversion parts 130 and 135 and the adhesive part 140 are filled in the through holes 132 and 137 to adhere the wavelength conversion part 130 to the light emitting device 120. It may include.

The first and second wavelength converters 130 and 135 may include wavelength converting materials having different wavelengths. For example, the first wavelength converter 130 may be configured to include a red phosphor and the second wavelength converter 135 may be configured to emit green light or emit light of various colors. Can be.

In addition, the first through hole 132 of the first wavelength conversion unit 130 and the second through hole 137 of the second wavelength conversion unit 135 are formed to overlap each other to correspond to each other, the same adhesive portion 140 May be filled.

Next, referring to FIG. 3, the light emitting device package according to the embodiment of the present invention includes a light emitting device 220, at least a portion of which is disposed on an upper surface of the light emitting device, and includes first and second through holes 232 and 237. The first and second wavelength conversion parts 230 and 235 and the first and second through holes 232 and 237 formed therein to adhere the wavelength conversion part 230 to the light emitting device 220. The first and second adhesive parts 240 and 242 may be included.

The first through hole 232 of the first wavelength converting part 230 and the second through hole 237 of the second wavelength converting part 235 are formed at different positions so that the first and second adhesive parts 240 are different from each other. , 242, and the first and second adhesive parts 240 and 242 may be filled with the same material or filled with different materials.

The light emitting device package having the above structure is configured such that wavelength conversion materials having different wavelengths are included in the first and second wavelength conversion parts 230 and 235 and the first and second adhesive parts 240 and 242, thereby providing It can emit near light, or it can emit light of a variety of colors.

Next, referring to FIG. 4, in the light emitting device package according to the embodiment of the present invention, the light emitting device 320, at least a part of which is disposed on an upper surface of the light emitting device, has at least one through hole formed therein ( 330, and an adhesive part 340 that is filled in the through hole to adhere the wavelength conversion part 330 to the light emitting device 320. In addition, the light emitting device package according to the present embodiment may further include a substrate 310 for mounting the light emitting device 320.

The light emitting device 320 includes two different electrodes 322 and 324, all of which may be formed on opposite surfaces of the surface corresponding to the wavelength converter 330.

First and second electrode patterns 360 and 362 are formed on the substrate 310, and are electrically connected to two different electrodes 322 and 324 of the light emitting device 320 to supply power applied from the outside. It may be provided in a form that can be supplied to the light emitting device (320). In addition, the first and second electrode patterns 360 and 362 may be provided in a form spaced apart from each other at a predetermined interval, for example, each of the first and second electrode patterns 360 and 362 may be disposed thereon. When viewed in the form of a rectangular shape, it may be provided in a form arranged side by side facing each other. In this way, the first and second electrode patterns 360 and 362 may be physically spaced apart and insulated. In addition, although not shown in the drawing, the first and second electrode patterns 360 and 362 may have a structure in which a lower surface thereof is exposed to the outside in order to effectively discharge heat generated from the light emitting device.

The substrate may further include an underfill resin part 350 filled in a space between the substrate and the light emitting device and a portion of the substrate except for the lower region of the light emitting device.

The underfill resin part 350 may be formed of a molding material such as silicon, and may include a highly reflective material to improve reflection efficiency, and the highly reflective material has electrical insulation property, and the highly reflective material is TiO. 2 , Al 2 O 3 , and the like, and the highly reflective material may be in the form of powder particles having a diameter of about 10 nm to 10 μm.

The light emitting device 320 is configured to be sealed by the underfill resin part 350 and the wavelength conversion part 330 to prevent the light leakage phenomenon from occurring.

Referring to FIG. 5, the light emitting device package according to the embodiment of the present invention includes a light emitting device 420, a wavelength conversion unit 430 having at least one portion disposed on an upper surface of the light emitting device, and having at least one through hole formed therein. And an adhesive part 440 filled in the through hole to adhere the wavelength conversion part 430 to the light emitting device 420. In addition, the light emitting device package according to the present embodiment may further include a substrate 410 for mounting the light emitting device 420.

The light emitting device 420 may include two different electrodes 422 and 424, and the electrodes may be formed on opposite and opposite surfaces of the wavelength converter 430, respectively.

In addition, first and second electrode patterns 460 and 462 may be formed on the substrate 410 to be electrically connected to two different electrodes 422 and 424 of the light emitting device 420. As illustrated in FIG. 5, the light emitting device 420 is mounted on one electrode pattern 460 so that an electrode 422 formed on an opposite surface of the surface opposite to the wavelength converter 430 is formed in the electrode pattern. The electrode 424, which is directly contacted with the 460 and connected to the wavelength converter 430, may be electrically connected to the other electrode pattern 462 through one wire 470.

Referring to FIG. 6, the light emitting device package according to the exemplary embodiment of the present invention may include a light emitting device 520, a wavelength conversion unit 530 having at least one portion disposed on an upper surface of the light emitting device and having at least one through hole formed therein. And an adhesive part 540 filled in the through hole to adhere the wavelength conversion part 530 to the light emitting device 520, and a substrate 510 for mounting the light emitting device 520. It may further include.

The light emitting device 520 may include two different electrodes 522 and 524, all of which may be formed on a surface of the light emitting device 530 that faces the wavelength converter 530.

In addition, first and second electrode patterns 560 and 562 may be formed on the substrate 510 to be electrically connected to two different electrodes 522 and 524 of the light emitting device 520. The electrode patterns may be electrically connected through the wire 570.

7 to 9 are plan views schematically illustrating wavelength conversion parts according to an exemplary embodiment of the present invention.

First, referring to FIG. 7, the wavelength conversion unit 630 according to the exemplary embodiment of the present invention may have a virtual line connecting four through holes 640 adjacent to the plurality of through holes 640 to form a rhombus. It can be arranged regularly.

The adhesive part filling different ones of the plurality of through holes 640 may include a wavelength conversion material emitting light having the same wavelength, and may include a wavelength conversion material emitting light having different wavelengths. In addition, the adhesion portions filling different ones of the through holes 640 may have different concentrations of the wavelength converting material included therein, and some may not include the wavelength converting material, and only some of the through holes 640 may include the wavelength converting material. In addition, a red phosphor may be used as a wavelength conversion material of the adhesive part filling the through hole 640, and the wavelength of the red phosphor is configured to have a wavelength of 600 to 610 nm, 610 to 620 nm, 620 to 630 nm or 630 to 640. Can be.

As described above, the structure in which the plurality of through holes 640 are regularly arranged such that a virtual line connecting four adjacent through holes 640 to form a rhombus has a spacing between the holes in the sections of all the wavelength converters 630. Because of this constant and regular arrangement, it is possible to emit light of uniform wavelength without color scattering.

Next, referring to FIG. 8, the wavelength converter 730 according to the exemplary embodiment of the present invention may be configured such that a plurality of through holes form point symmetry around the center through hole 740, and is far from the center. The higher the wavelength conversion material may be configured to have a lower concentration. For example, in FIG. 8, silicon containing a high concentration of the wavelength conversion material is coated on the central through hole 740, and silicon including a wavelength conversion material having a lower concentration is applied to the through hole 742 around the through hole 740. In addition, the most through hole 744 may be formed by applying silicon including a wavelength conversion material having a lower concentration.

The arrangement of the through holes 740 as described above is uniformly corrected by the wavelength converter 730 when the wavelength of the light emitted from the light emitting device is not uniform and the light of the specific wavelength is concentrated in the center portion. Make it possible. For example, if the light emitted from the central portion of the light emitting device is a blue series whose wavelength is shorter than the wavelength of the light emitted from the periphery, the central through hole 740 may include silicon containing a high concentration of red-based wavelength conversion material. In the periphery of the through hole 742, a silicon containing a wavelength conversion material having a lower concentration may be applied to emit light having a uniform wavelength on all surfaces.

Next, referring to FIG. 9, the wavelength converter 830 according to the exemplary embodiment of the present invention may have a configuration in which a plurality of through holes include two or more different wavelength converting materials, and illustrated in FIG. 10. As described above, the holes may be configured such that a imaginary line connecting eight holes circumferentially around one point forms a rectangular shape, and a plurality of concentric rectangles are formed around the one point. In the present exemplary embodiment, an adhesive including a blue wavelength converting material 842 is applied to the through holes forming the rectangular vertices, and an adhesive including a red wavelength converting material 840 is applied to the remaining through holes. Can be. The wavelength conversion unit 830 having the above structure includes a yellow wavelength conversion material in a region excluding the through hole, and may emit light close to natural light if blue light is emitted from the light emitting device.

10 is a cross-sectional view of a light emitting device package according to an embodiment of the present invention. Referring to FIG. 10, a light emitting device package according to an embodiment of the present invention includes a light emitting device 920, at least a portion of which is disposed on an upper surface of the light emitting device, and at least one through hole 935. And an adhesive part 940 that is filled in the through hole 935 and adheres the wavelength conversion part 930 to the light emitting device 920. In addition, the light emitting device package according to the present embodiment may further include a substrate 10 for mounting the light emitting device 20. In addition, the present embodiment further includes a mounting unit 990 provided to surround the side surface of the light emitting device, and the wavelength conversion unit 930 may cover the upper surface of the mounting unit 990. In addition, the mounting unit 990 may include a light reflective material. In the present exemplary embodiment, the mounting portion including the light reflection material may be formed to further increase the reflectance, and the wavelength converter 930 may cover the top surface of the mounting portion 990 to prevent light leakage.

As described above, in the exemplary embodiment of the present invention, the wavelength conversion part is manufactured in the form of a plate, and then attached to the light emitting device to enable uniform dispersion of the wavelength conversion material, thereby improving color uniformity. That is, in the related art, since the encapsulant is formed through the dispensing method, the concentration of the phosphor in the encapsulant is unevenly distributed due to the precipitation of the phosphor mixed in the transparent resin, thereby decreasing the color uniformity. In the present invention, the wavelength conversion part in the form of a plate is produced, thereby preventing the precipitation of the wavelength conversion material at the source and improving the uniformity of the color and improving the color reproducibility through the uniform distribution of the phosphor in the wavelength conversion part. Can be. In addition, the present invention by forming a through-hole in the wavelength conversion portion, and injecting an adhesive in the through-hole, the light leakage phenomenon between the light emitting element and the wavelength conversion portion by forming the adhesive between the light emitting element and the wavelength conversion portion is separated It can be prevented from occurring.

The present invention is not limited by the above-described embodiments and the accompanying drawings, but is intended to be limited only by the appended claims. It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. something to do.

10, 110, 210, 310, 410, 510, 910: substrate
20, 120, 220, 320, 420, 520, 920: light emitting element
30, 330, 430, 530, and 930: wavelength converter 130, 230: first wavelength converter
135, 235: second wavelength converter 35, 935: through hole
132 and 232: first through hole 137 and 237: second through hole
40, 140, 340, 440, 540, 940: adhesive
240: first adhesive portion 242: second adhesive portion
350: underfill resin
360, 460, 560: first pattern electrode 362, 462, 562: second pattern electrode

Claims (22)

A light emitting element;
A wavelength conversion unit at least partially disposed on an upper surface of the light emitting device and having at least one through hole formed therein; And
An adhesive part filled in the through hole to adhere the wavelength conversion part to the light emitting device;
Light emitting device package comprising a.
The method of claim 1,
The wavelength conversion unit has a light emitting device package, characterized in that it has a plate structure.
The method of claim 2,
The wavelength conversion unit has a light emitting device package, characterized in that having a structure in which a plurality of plates are stacked.
The method of claim 2,
The plurality of plates is a light emitting device package, characterized in that the through-holes are formed in overlapping positions corresponding to each other.
The method of claim 2,
The plurality of plates are light emitting device package, characterized in that the through-holes are formed in different positions.
The method of claim 1,
The light emitting device comprises two different electrodes, the light emitting device package, characterized in that all the electrodes formed on the surface facing the wavelength conversion unit.
The method of claim 1,
The light emitting device includes two different electrodes, wherein the electrodes are all formed on the opposite surface of the surface facing the wavelength conversion unit.
The method of claim 1,
The light emitting device comprises two different electrodes, the light emitting device package, characterized in that the electrodes are formed on the opposite surface and the opposite surface to the wavelength conversion portion.
The method of claim 1,
The light emitting device package further comprises an underfill resin part filled in a space between the substrate and the light emitting device and a portion of the substrate except for the lower region of the light emitting device.
10. The method of claim 9,
The light emitting device package, characterized in that the light emitting device is sealed by the underfill resin portion and the wavelength conversion portion.
The light emitting device package of claim 9, wherein the underfill resin part comprises a highly reflective material.
The method of claim 1,
The adhesive unit comprises a wavelength conversion material.
The method of claim 1,
The adhesive unit comprises a light emitting device package comprising a dispersant.
The method of claim 1,
The plurality of through-holes is a light emitting device package, characterized in that arranged regularly so that the imaginary line connecting the four adjacent through holes to form a rhombus.
The method of claim 12,
The through-hole is provided with a plurality, the light-emitting device package, characterized in that the bonding portion for filling the different one of the plurality of through-holes includes a wavelength conversion material for emitting light of the same wavelength to each other.
The method of claim 12,
The through-hole is provided with a plurality, the light-emitting device package, characterized in that the bonding portion for filling the different one of the plurality of through-holes includes a wavelength conversion material for emitting light of different wavelengths.
The method of claim 12,
The through-hole is provided with a plurality, the light-emitting device package, characterized in that the concentration of the wavelength conversion material included in the adhesive portion for filling the different one of the plurality of through-holes.
The method of claim 12,
The adhesive part is a light emitting device package, characterized in that the concentration of the wavelength conversion material is lowered from the center portion of the wavelength conversion portion to the peripheral portion.
The method of claim 12,
The through-hole is provided with a plurality, the light emitting device package, characterized in that only a portion of the plurality of through-holes include a wavelength conversion material.
The method of claim 1,
The through-hole is a light emitting device package, characterized in that having a diameter of 10㎛ to 500㎛.
The method of claim 1,
The reflective electrode is formed on a portion of the substrate, and the light emitting device is mounted on the reflective electrode.
The light emitting device package of claim 1, further comprising a mounting unit provided to surround a side surface of the light emitting device, wherein the wavelength conversion unit covers an upper portion of the mounting unit.
KR1020120016172A 2012-02-17 2012-02-17 Light emitting device package KR20130094911A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160121764A (en) * 2015-04-09 2016-10-20 삼성전자주식회사 Semiconductor packages having heat spreaders and methods for fabricating the same
JP2021068917A (en) * 2021-01-20 2021-04-30 三菱電機株式会社 Light-emitting device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160121764A (en) * 2015-04-09 2016-10-20 삼성전자주식회사 Semiconductor packages having heat spreaders and methods for fabricating the same
JP2021068917A (en) * 2021-01-20 2021-04-30 三菱電機株式会社 Light-emitting device

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