KR20130091087A - The electromagnetic shielding film - Google Patents

Abstract

PURPOSE: An electromagnetic shielding film is provided to maintain flexibility and tension strength by forming a primer layer composed of a polymer between a base and a conduction layer. CONSTITUTION: A base (10) composed of a polymer film is made of polyethylene terephthalate, polyimide, polyethylene naphthalate, and polyphenylene sulfide which have high heat-resistance property; or foaming film, paper, and polypropylene which have low heat-resistance property. A primer layer (20) is formed on one side or both sides of the base (10) by coating process. A vapor deposition layer (30) is deposited on the primer layer by dry process. The vapor deposition layer includes a conduction layer and a metal layer. A conduction layer (40) is made conductive by plating process. The metal layer prevents erosion. The electromagnetic shielding film inhibits or reflects electromagnetic noise of an electronic device.

Description

Electromagnetic shielding film {The electromagnetic shielding film}

The present invention relates to an electromagnetic wave shielding film for suppressing or reflecting electromagnetic noise in an electronic component, and more particularly, to form a primer layer made of a polymer resin between a substrate composed of a polymer film and a conductive conductive layer. The present invention relates to an electromagnetic shielding film having a shielding property with excellent physical properties such as flexibility and tensile strength by imparting strong adhesion and high conductivity.

In general, there is an increasing demand for miniaturization or flattening and high functionality of electronic devices. In order to meet this demand, complex electromagnetic noise is generated by implementing components of different frequency ranges in the same electronic device, and it is difficult to take measures against such complex electromagnetic noise. On the other hand, there is an increasing demand for data transmission cables to be thinner and emit less electromagnetic noise. In the case of transmitting a large amount of data, errors often occur in the data due to interference of the data by electromagnetic noise and data is lost.

As a countermeasure for the electromagnetic noise problem, a conductive adhesive tape obtained by treating an adhesive layer on a metal foil is frequently used. However, the conductive adhesive tape using a metal foil is a thin metal foil is required in order to be applied to the thinning of the electronic device and the flexibility of the metal foil, there is a problem that the yield is poor when bonding the thin metal foil and polymer film.

As is well known, in order to make use of the flexibility of the polymer film, various studies and developments have been conducted using a wet process or a dry process. If a metal layer is deposited on a substrate made of a polymer film using a wet process, there is no problem of conductivity, but the adhesion between the substrate and the metal layer has never been able to absolutely satisfy the adhesion required by the customer.

Moreover, when the metal layer is deposited on the substrate using a dry process, the electromagnetic shielding film using the dry process except for a special case is not used because of its generally low adhesion but low conductivity. Although a high conductivity can be obtained by depositing a metal layer of high thickness on the substrate using a dry process, in this case, the adhesion between the substrate and the metal layer can absolutely satisfy the adhesion required by the customer, as in the case of the wet process. Since there is no electromagnetic shielding film using a dry process is not used.

Accordingly, the present invention is to fundamentally solve the conventional problems as described above, by forming a primer layer of a polymer resin between the substrate consisting of a polymer film and the conductive conductive layer has a strong adhesion and high conductivity between the substrate and the conductive layer The purpose of the present invention is to provide an electromagnetic shielding film having a shielding property with excellent physical properties with flexibility and tensile strength.

In order to achieve the above object, the present invention provides an electromagnetic wave shielding film for suppressing or reflecting electromagnetic noise in an electronic component: forming a primer layer by a coating process on one side or both sides of a substrate composed of a polymer film, and on the primer layer The deposition layer by a dry process is deposited, and the conductive layer is characterized by consisting of a metal layer to prevent corrosion and imparting conductivity by the plating process on the deposition layer.

At this time, the substrate composed of the polymer film according to the present invention is characterized by using a PET, PI, PEN, PPS having a high heat resistance or a foam film, paper, PP having a low heat resistance.

In addition, the primer layer according to the present invention is characterized in that the thermosetting resin having a molecular weight of between 3000 and 20000, further comprising a curing agent and an additive in the thermosetting resin.

In addition, the deposition layer according to the present invention is characterized by using an alloy mixed with one or two or more of tin, copper, nickel, silver, iron, platinum and palladium.

In addition, the conductive layer according to the present invention uses any one of copper, silver or gold, or an alloy mixed with them, the metal layer uses one of nickel, silver, gold, tin, tin-bismuth, It is characterized by using one of tin-copper, tin-zinc and tin-iron alloy.

On the other hand, the terms or words used in the present specification and claims are not to be construed as limited to the ordinary or dictionary meanings, the inventors should use the concept of terms in order to explain their own invention in the best way. It should be interpreted as meanings and concepts corresponding to the technical idea of the present invention based on the principle that it can be properly defined. Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention, and not all of the technical ideas of the present invention are described. Therefore, It is to be understood that equivalents and modifications are possible.

As described in the above configuration and operation, the electromagnetic wave shielding film according to the present invention forms a primer layer, which is a polymer resin, between a substrate composed of a polymer film and a conductive conductive layer, thereby providing strong adhesion and high conductivity between the substrate and the conductive layer. This provides a shielding effect with excellent physical properties as well as flexibility and tensile strength.

1 is a block diagram showing an electromagnetic wave shielding film according to the present invention.
2 is a flowchart showing a process of manufacturing an electromagnetic shielding film according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The present invention relates to the structure of the electromagnetic wave shielding film for suppressing or reflecting electromagnetic noise in an electronic component, the primer layer 20, the deposition layer 30, the conductive layer 40, The metal layer 50 relates to the electromagnetic wave shielding film formed sequentially.

In the electromagnetic wave shielding film according to the present invention, a primer layer 20 is formed by a coating process on one or both surfaces of the substrate 10 composed of a polymer film. Substrate 10 composed of a polymer film is a physical or chemical coating of the polymer on a thin material (film) to be used on the object or product required by the customer, and is formed in various ways without being limited to a specific shape or shape. That is, the substrate 10 is coated with a polymer on any one of PET, PI, PEN, PPS having high heat resistance or foam film, paper, and PP having low heat resistance.

At this time, the primer layer 20 is formed on the surface of the substrate 10 by a coating process, and may be formed on both sides as shown in FIG. 1A or as shown in FIG. 1B. The primer layer 20 prevents the plating solution from penetrating onto the substrate 10 in the process of forming the conductive layer 40 and the metal layer 50, which will be described later, and the deposition layer 30 and the conductive layer 40. , Serves to increase the adhesion between the metal layer (50). That is, the main material used as the primer layer 20 is a thermosetting resin having a molecular weight of about 3000 to 20000, and a curing agent and an additive are used as the material.

The thermosetting resin used as the main material of the primer layer 20 includes acrylic resin, polyether resin, polyamide resin, cellulose resin, polyurethane resin, epoxy resin, and the like. It may be used in combination with more than one. For example, the molecular weight of the polyester-based resin is preferably between 1000 and 50000, preferably between 3000 and 20000. When the molecular weight is 3000 or less, the adhesion is excellent, but the plating liquid is low in penetrating power, and when the molecular weight is 20000 or more, the plating liquid is excellent in penetrating power but inferior in adhesion. Therefore, since the function of the primer layer 20 varies depending on the type and molecular weight of the thermosetting resin, it should be appropriately selected.

And the curing agent basically uses a compound having an isocyanate group (-NCO). For example, tridiisocyanate (TDI), diphenyl-4,4'- diisocyanate (MDI), hexamethylene diisocyanate (HDI), xylene diisocyanate (XDI), 1,3-bis (isocyanate methyl), cyclohexane (H6XDI) and the like, but may be used in any one of them, may be used in combination with more than one, but TDI system and XDI system is most preferred.

In addition, the additive basically uses a compound having C 3 N 6 H 6 and —NH—CO—NH. For example, butylurea series, n-butylated melamine series, butylated urea melamine series, iso-butylated melamine series, and the like can be cited. Any of these may be used alone or in combination of one or more of them.

The thickness of the primer layer 20 is not limited because it does not significantly affect the above-described function, but is preferably formed in a thickness in the range of 0.2 to 2.0 μm. That is, when the thickness of the primer layer 20 is smaller than 0.2 micrometer, it becomes hard, and when larger than 2.0 micrometer, there exists a tendency for adhesive force to fall. Therefore, the primer layer 20 has to be appropriately selected within the range of 0.2 ~ 2.0μm because the function and hardness vary depending on the thickness.

In addition, in the electromagnetic shielding film according to the present invention, a deposition layer 30 by a dry process is deposited on the primer layer 20, and a conductive layer that imparts conductivity through a plating process on the deposition layer 30 ( 40) and a metal layer 50 to prevent corrosion. The deposition layer 30 is deposited on one surface of the primer layer 20 by a dry process, and is used as a base for inducing the conductive layer 40 to be plated. That is, the deposition layer 30 used as the non-plating is a physical vapor deposition method such as vacuum deposition, sputtering, etc. using an alloy mixed with one or two or more of tin, copper, nickel, silver, iron, platinum, and palladium. However, it is deposited by chemical vapor deposition. The vapor deposition layer 30 is most preferably in the range of 100 kV to 1000 kV, among them 300 kV to 500 kV.

The conductive layer 40 and the metal layer 50 to be plated by the plating process are provided on the deposition layer 30. The conductive layer 40 serves to impart conductivity, and the metal layer 50 serves to prevent corrosion of the conductive layer 40.

That is, the conductive layer 40 is plated by the electroplating method and the electroless plating method using any one of copper, silver or gold, or an alloy mixed with them, and the metal layer 50 is one of nickel, silver and gold. It is plated by the electroplating method and the electroless plating method using one of tin, tin-bismuth, tin-copper, tin-zinc and tin-iron alloy.

Looking at the process of manufacturing the electromagnetic shielding film using Figures 1 and 2, first, to prepare a substrate 10 coated with a polymer. Then, the primer layer 20 is formed on the cross-section and both sides of the prepared substrate 10 by a coating process. Subsequently, tin to be used as the plating on the primer layer 20 is formed through the chemical or physical vapor deposition to form the deposition layer 30. Then, the substrate 10 on which the primer layer 20 and the deposition layer 30 are formed is subjected to an acid treatment in a 5-50 ml / L sulfuric acid solution at room temperature at 45 ° C. for 0.5-2 minutes and washed with water in one to three stages. The reason for the acid treatment is to remove the contaminants of the deposition layer 30 and to act as a catalyst in the plating process.

Then, copper sulfate pentahydrate 0.03-0.07 mol / L, caustic soda 0.1-0.5 mol / L, formaldehyde 0.03-0.15 mol / L, ethylenediamine tetraacetic acid salt or ethylenediaminetetrapropanol salt 0.03-0.30 mol / L, 2, 2-dipyridyl 0.3mg / L-30mg / L, primary alcohol 1g / L-50g / L, cyan salt 0.2mg / L-40mg / L and a small amount of fluoride and benzotriazole or benzothiazole salt Using a plating solution, which is electroless copper plated at 35-60 ° C. for 2-15 minutes, washed in two or three stages. Then, using copper electroplating solution containing 0.03-0.07 mol / L of sulfuric acid pentahydrate, 0.1-0.5 mol / L of sulfuric acid, and stabilizer, undergo electrocopper plating at 35-60 ° C for 0.5-10 minutes and wash with two or three stages.

Subsequently, ammonia water was added to the plating liquid containing nickel sulfate hexahydrate 0.02-0.2 mol / L + citric acid or sodium citrate dihydrate 0.02-0.2 mol / L + sodium hypophosphite monohydrate 0.02-0.2 mol / L + small amount of stabilizer After adjusting the pH to the range of 8.0-10.0, the nickel plating is carried out for 1-2 minutes at 35-60 ℃. Then, ammonia water was added to a plating solution containing nickel sulfate hexahydrate 0.02-0.2 mol / L + citric acid or sodium citrate dihydrate 0.02-0.2 mol / L + sodium hypophosphite monohydrate 0.02-0.2 mol / L + small amount of stabilizer After adjusting the pH to the range of 8.0-10.0, it is subjected to electroless nickel plating at 35-60 ° C. for 1-5 minutes, washed with two or three stages, and then dried.

On the other hand, it is apparent that the process of manufacturing the electromagnetic wave shielding film and its components may be variously changed according to characteristics.

As such, the present invention forms a primer layer, which is a polymer resin, between a substrate composed of a polymer film and a conductive conductive layer, thereby providing strong adhesion and high conductivity between the substrate and the conductive layer, thereby providing excellent physical properties and excellent flexibility and tensile strength. Together, there is an effect of shielding.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined by the appended claims. It is therefore intended that such variations and modifications fall within the scope of the appended claims.

10: base material 20: primer layer
30: deposited layer 40: conductive layer
50: metal layer

Claims (5)

In the electromagnetic shielding film for suppressing or reflecting electromagnetic noise in an electronic component:
The primer layer 20 by the coating process is formed on one side and both sides of the substrate 10 made of a polymer film,
Deposition layer 30 by a dry process is deposited on the primer layer 20,
Electromagnetic shielding film, characterized in that consisting of a conductive layer 40 to impart conductivity by the plating process on the deposition layer 30 and a metal layer 50 to prevent corrosion. The method of claim 1,
The substrate (10) consisting of the polymer film is an electromagnetic shielding film, characterized in that using a PET, PI, PEN, PPS having a high heat resistance or a foamed film, paper, PP having a low heat resistance. The method of claim 1,
The primer layer 20, but using a thermosetting resin having a molecular weight of 3000 ~ 20000, electromagnetic shielding film, characterized in that the thermosetting resin further contains a curing agent and additives. The method of claim 1,
The deposition layer 30 is an electromagnetic shielding film, characterized in that using one or two or more alloys of tin, copper, nickel, silver, iron, platinum, palladium. The method of claim 1,
The conductive layer 40 uses any one of copper, silver, or gold, or an alloy thereof. The metal layer 50 uses one of nickel, silver, and gold, tin, tin-bismuth, An electromagnetic shielding film comprising one of tin-copper, tin-zinc and tin-iron alloys.

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