US8545992B2 - Aluminum article - Google Patents
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- US8545992B2 US8545992B2 US13/474,828 US201213474828A US8545992B2 US 8545992 B2 US8545992 B2 US 8545992B2 US 201213474828 A US201213474828 A US 201213474828A US 8545992 B2 US8545992 B2 US 8545992B2
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/017—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of aluminium or an aluminium alloy, another layer being formed of an alloy based on a non ferrous metal other than aluminium
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
- C22C19/05—Alloys based on nickel or cobalt based on nickel with chromium
- C22C19/058—Alloys based on nickel or cobalt based on nickel with chromium without Mo and W
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
- C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12736—Al-base component
- Y10T428/1275—Next to Group VIII or IB metal-base component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12944—Ni-base component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
- Y10T428/24967—Absolute thicknesses specified
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
Definitions
- the disclosure generally relates to articles made from aluminum or aluminum alloy, and a method for making the articles.
- Aluminum and aluminum alloy are used in manufacturing components of communication devices because of their desirable properties such as light weight, quick heat dissipation, and good conductivity. However, aluminum and aluminum alloy have relatively low erosion resistances. Portions of the aluminum or aluminum alloy are easily corroded (also known as pitting corrosion) in humid environments. The pitting corrosion can reduce the electromagnetic shielding capability of an aluminum component, possibly degrading communication functions of a communication device using the aluminum component.
- FIG. 1 is a cross-sectional view of an exemplary aluminum article.
- FIG. 2 is a cross-sectional view of another exemplary aluminum article.
- FIG. 3 is an X-ray diffraction pattern of a Ni—Cu—P alloy layer applied on an exemplary aluminum article.
- FIG. 4 is a stereoscan photograph (500 ⁇ magnified) of a Ni—Cu—P alloy layer applied on an exemplary aluminum article.
- FIG. 5 is a stereoscan photograph (5000 ⁇ magnified) of a Ni—Cu—P alloy layer applied on an exemplary aluminum article.
- FIG. 6 is an X-ray diffraction pattern of a Ni—P alloy layer applied on an exemplary aluminum article.
- FIG. 7 is a stereoscan photograph (500 ⁇ magnified) of a Ni—P alloy layer applied on an exemplary aluminum article.
- FIG. 8 is a stereoscan photograph (5000 ⁇ magnified) of a Ni—P alloy layer applied on an exemplary aluminum article.
- FIG. 1 shows a cross-section of an exemplary aluminum article 10 including a substrate 11 and a composite coating 13 directly formed on the substrate 11 .
- the substrate 11 can be made of aluminum or aluminum alloy.
- the composite coating 13 includes a Ni—Cu—P alloy layer 131 and a Ni—P alloy layer 133 .
- the Ni—Cu—P alloy layer 131 is directly formed on the substrate 11 .
- “directly” means a surface of one layer is in contact with a surface of the other layer.
- the Ni—Cu—P alloy layer 131 consists substantially of nickel, copper, and phosphorus and has a crystalline structure. Within the Ni—Cu—P alloy layer 131 , the nickel has a weight percentage from about 60% to about 75%; the copper has a weight percentage from about 23% to about 37%; the phosphorus has a weight percentage from about 1% to about 3%.
- the thickness of the Ni—Cu—P alloy layer 131 may be about 7.5 pm to about 8.5 ⁇ m.
- the Ni—P alloy layer 133 is directly formed on the Ni—Cu—P alloy layer 131 .
- the Ni—P alloy layer 133 consists substantially of nickel and phosphorus and has an amorphous structure. Within the Ni—P alloy layer 133 , the nickel has a weight percentage from about 88% to about 93%; the phosphorus has a weight percentage from about 7% to about 12%.
- the thickness of the Ni—P alloy layer 133 may be about 9 ⁇ m to about 11 ⁇ m. Both the Ni—Cu—P alloy layer 131 and the Ni—P alloy layer 133 can be formed by chemical plating (also known as electroless plating).
- the aluminum article 10 may further include a nickel layer 12 located between the composite coating 13 and the substrate 12 .
- the composite coating 13 comprising the Ni—Cu—P alloy layer 131 and the Ni—P alloy layer 133 has the following advantages:
- the high copper content within the Ni—Cu—P alloy layer 131 provides high conductivity for the composite coating 13 ; the nickel in the Ni—Cu—P alloy layer 131 is magnetic and provides good magnetism for the composite coating 13 . Therefore, the composite coating 13 has a good electromagnetic shielding property.
- A is adsorption loss through the shield from conductivity and magnetic permeability of the shield
- R is reflection loss caused by a sudden change in impedance encountered by the RF wave when it meets the side of the shield
- B multiple internal surface reflection correction term.
- the composite coating 13 the copper with a high content and the nickel cause a large adsorption loss A.
- the Ni—Cu—P alloy layer 131 and the Ni—P alloy layer 133 have different impedances. Therefore, reflection loss R is created due to the sudden change in impedance from the Ni—Cu—P alloy layer 131 to the Ni—P alloy layer 133 .
- the Ni—P alloy layer 133 which is amorphous has good corrosion resistance and abrasion resistance, providing the aluminum article 10 with good corrosion resistance and good abrasion resistance.
- a method for manufacturing the aluminum article 10 mainly includes: providing the substrate 11 ; directly forming the Ni—Cu—P alloy layer 131 on the substrate 11 by chemical plating; and forming the Ni—P alloy layer 133 on the Ni—Cu—P alloy layer 131 by chemical plating.
- Chemical plating the Ni—Cu—P alloy layer 131 may be carried out in a first plating bath containing about 20 g/L-25 g/L NiSO 4 .6H 2 O, about 2.0 g/L-2.5 g/L CuSO 4 .5H 2 O, about 20 g/L-25 g/L NaH 2 PO 2 .H 2 O, about 20 g/L-30 g/L lactic acid, about 20 g/L-25 g/L sodium citrate, about 30 g/L-40 g/L sodium pyrophosphate, and about 0.1 g/L sodium dodecyl sulfate.
- the lactic acid, sodium citrate, Na 4 P 2 O 7 , and sodium dodecyl sulfate are used as complexants.
- the first plating bath may have a pH value from about 8.5 to about 10.5 and in this embodiment it is from about 8.8 to about 9.0.
- the pH value can be adjusted using ammonia water.
- the temperature of the first plating bath is maintained at about 83° C. to about 87° C. during the chemical plating.
- the Ni—Cu—P alloy layer 131 obtained under the above conditions has a crystalline structure. A crystalline state of the Ni—Cu—P alloy layer 131 is best achieved with the pH value of the first plating bath is 8.5 or greater.
- Chemical plating the Ni—P alloy layer 133 may be carried out in a second plating bath containing about 20 g/L-25 g/L NiSO 4 .6H 2 O, about 25 g/L-30 g/L NaH 2 PO 2 .H 2 O, about 25 g/L-35 g/L lactic acid, about 15 g/L-20 g/L sodium citrate, and about 0.1 g/L sodium dodecyl sulfate.
- the second plating bath may have a pH value from about 4.5 to about 5.5.
- the pH value of the second plating bath can be adjusted using sodium hydroxide.
- the temperature of the second plating bath is maintained at about 81° C. to about 85° C. during the chemical plating.
- the method may further include chemical plating a nickel layer 12 on the substrate 11 before the step of chemically plating the Ni—Cu—P alloy layer 131 .
- Chemical plating the nickel layer 12 may be carried out in a third plating bath containing about 0.02 mol/L-0.038 mol/L NiSO 4 .6H 2 O, about 0.20 mol/L-0.38 mol/L sodium citrate, and about 0.02 mol/L-0.038 mol/L potassium sodium tartrate.
- the third plating bath may have a pH value from about 10 to about 12.
- the pH value of the third plating bath can be adjusted using sodium hydroxide.
- the third plating bath is maintained at room temperature during the chemical plating.
- the method may further include a step of pre-treating the substrate 11 before the chemical plating steps.
- the pretreatment may include:
- the substrate 11 may be immersed in a first activating solution prepared by hydrochloric acid and water at a ratio of about 1:4 by volume for about 6 second (s) to about 30 s.
- the first activating solution may be maintained at room temperature.
- the substrate 11 may be immersed in an etching agent consisting of nitric acid and water at a ratio of about 1:1 by volume for about 3 s to about 5 s.
- the etching agent may be maintained at room temperature.
- the substrate 11 may be immersed in a second activating solution containing 10% (by weight) sulphuric acid for about 50 s to about 60 s.
- the second activating solution may be maintained at room temperature.
- Chemical plating the Ni—Cu—P alloy coating 131 uses a basic first plating bath (pH value in a range of 8.5-10.5).
- a basic plating bath aids in creating a nanocrystalline Ni—Cu—P alloy coating 131 .
- the first plating bath for chemical plating the Ni—Cu—P alloy coating 131 includes multiple complexants especially the sodium pyrophosphate having a strong complexing action, ensuring the stability of the basic first plating bath during the chemical plating.
- a high CuSO 4 .5H 2 O content of about 2.0 g/L-2.5 g/L in the first plating bath is used, ensuring a copper-based Ni—Cu—P alloy coating 131 is created.
- FIG. 3 shows an X-ray diffraction pattern of the Ni—Cu—P alloy layer 131 applied on an exemplary aluminum article manufactured by the present method.
- the X-ray diffraction pattern indicates that Ni—Cu—P alloy layer 131 has three diffraction peaks from the Cu(111), Cu(200), and Cu (220) faces respectively. But each diffraction peak is narrower than a corresponding diffraction peak of a copper crystal (diffraction peaks of a copper crystal are almost line-shaped), which is a characteristic of nanocrystalline structures.
- the stereoscan photographs of the Ni—Cu—P alloy layer 131 indicates that the Ni—Cu—P alloy layer 131 consists of a plurality of large cellular units and each cellular unit further consists of a plurality of small nano-sized cellular units, which is a surface topography characteristic of nanocrystalline structures.
- Such a nanocrystalline Ni—Cu—P alloy layer 131 has both good conductivity and good magnetic permeability, and therefore has improved electromagnetic shielding property.
- FIG. 6 shows an X-ray diffraction pattern of the Ni—P alloy layer 133 applied on an exemplary aluminum article manufactured by the present method.
- the X-ray diffraction pattern indicates that Ni—P alloy layer 133 has a widened diffraction peak from the Ni(111) face, which is a characteristic of amorphous structures.
- the stereoscan photographs of the Ni—P alloy layer 133 indicates that the Ni—P alloy layer 133 consists of a plurality of clear cellular units and the cellular units are very compactly arranged, which is a surface topography characteristic of amorphous structures.
- Such an amorphous Ni—P alloy layer 133 has no grain boundary and therefore has improved corrosion resistance.
- a sample S 1 of aluminum alloy substrate was pretreated as according to the following steps.
- a) degreasing The substrate was immersed in a degreasing agent containing 30 g/L Na 3 PO 4 , 25 g/L Na 2 CO 3 , and 8 g/L Na 2 SiO 3 for about 2 minutes.
- the degreasing agent was maintained at a temperature of about 70° C.-75° C.
- a first activation The substrate was immersed in a first activating solution prepared by mixing hydrochloric acid and water at a ratio of about 1:4 by volume for about 10 s.
- c) acid etching The substrate 11 was immersed in an etching agent prepared by mixing nitric acid and water at a ratio of about 1:1 by volume for about 3 s.
- a second activation The substrate 11 was immersed in a second activating solution containing 10% (by weight) sulphuric acid for about 50 s.
- the plating bath for chemical plating the nickel layer contained about 0.025 mol/L NiSO 4 .6H 2 O, about 0.25 mol/L sodium citrate, and about 0.03 mol/L potassium sodium tartrate.
- the plating bath had a pH value of about 10.
- the plating bath for chemical plating the Ni—Cu—P alloy layer contained about 21 g/L NiSO 4 .6H 2 O, about 2.2 g/L CuSO 4 .5H 2 O, about 20 g/L NaH 2 PO 2 .H 2 O, about 25 g/L lactic acid, about 24 g/L sodium citrate, about 35 g/L sodium pyrophosphate, and about 0.1 g/L sodium dodecyl sulfate.
- the plating bath had a pH value from about 8.9 to about 9.0 and was maintained at about 83° C. to about 87° C.
- Chemical plating the Ni—Cu—P alloy layer took about 50 minutes and the thickness of the Ni—Cu—P alloy layer was about 8 ⁇ m.
- the plating bath for chemical plating the Ni—P alloy layer contained about 20 g/L NiSO 4 .6H 2 O, about 25 g/L NaH 2 PO 2 .H 2 O, about 30 g/L lactic acid, about 15 g/L sodium citrate, and about 0.1 g/L sodium dodecyl sulfate.
- the plating bath had a pH value from about 4.5 to about 5.5 and was maintained at about 81° C. to about 85° C.
- Chemical plating the Ni—P alloy layer took about 60 minutes and the thickness of the Ni—P alloy layer was about 10 ⁇ m.
- a sample S 2 of aluminum alloy substrate was pretreated. The pretreatment was conducted the same as the example 1.
- the plating bath for chemical plating the nickel layer contained about 0.03 mol/L NiSO 4 .6H 2 O, about 0.3 mol/L sodium citrate, and about 0.035 mol/L potassium sodium tartrate.
- the plating bath has a pH value of about 11.
- the plating bath for chemical plating the Ni—Cu—P alloy layer contained about 25 g/L NiSO 4 .6H 2 O, about 2.4 g/L CuSO 4 .5H 2 O, about 23 g/L NaH 2 PO 2 .H 2 O, about 30 g/L lactic acid, about 20 g/L sodium citrate, about 40 g/L sodium pyrophosphate, and about 0.1 g/L sodium dodecyl sulfate.
- the plating bath had a pH value from about 8.9 to about 9.0 and was maintained at about 83° C. to about 87° C.
- Chemical plating the Ni—Cu—P alloy layer took about 50 minutes and the thickness of the Ni—Cu—P alloy layer was about 8.2 ⁇ m.
- the plating bath for chemical plating the Ni—P alloy layer contained about 20 g/L NiSO 4 .6H 2 O, about 28 g/L NaH 2 PO 2 .H 2 O, about 30 g/L lactic acid, about 20 g/L sodium citrate, and about 0.1 g/L sodium dodecyl sulfate.
- the plating bath had a pH value from about 4.5 to about 5.5 and was maintained at about 81° C. to about 85° C.
- Chemical plating the Ni—P alloy layer took about 60 minutes and the thickness of the Ni—P alloy layer was about 9.5 ⁇ m.
- a sample S 3 of aluminum alloy substrate was pretreated. The pretreatment was conducted the same as the example 1.
- the plating bath for chemical plating the nickel layer contained about 0.035 mol/L NiSO 4 .6H 2 O, about 0.35 mol/L sodium citrate, and about 0.032 mol/L potassium sodium tartrate.
- the plating bath had a pH value of about 12.
- the plating bath for chemical plating the Ni—Cu—P alloy layer contained about 23 g/L NiSO 4 .6H 2 O, about 2.3 g/L CuSO 4 .5H 2 O, about 25 g/L NaH 2 PO 2 .H 2 O, about 20 g/L lactic acid, about 25 g/L sodium citrate, about 30 g/L sodium pyrophosphate, and about 0.1 g/L sodium dodecyl sulfate.
- the plating bath had a pH value from about 8.9 to about 9.0 and was maintained at about 83° C. to about 87° C.
- Chemical plating the Ni—Cu—P alloy layer took about 50 minutes and the thickness of the Ni—Cu—P alloy layer was about 7.8 ⁇ m.
- the plating bath for chemical plating the Ni—P alloy layer contained about 25 g/L NiSO 4 .6H 2 O, about 30 g/L NaH 2 PO 2 .H 2 O, about 35 g/L lactic acid, about 20 g/L sodium citrate, and about 0.1 g/L sodium dodecyl sulfate.
- the plating bath had a pH value from about 4.5 to about 5.5 and was maintained at about 81° C. to about 85° C.
- Chemical plating the Ni—P alloy layer took about 60 minutes and the thickness of the Ni—P alloy layer was about 10.2 ⁇ m.
- the shielding efficiencies of the samples S 1 -S 3 were tested using a frequency spectrometer (type: E5071C, provided by Agilent Ltd). The results indicated that, in the range between about 100 KHz and about 4.5 GHz, the shielding efficiencies for the samples S 1 -S 3 were 100 dB, 105 dB, and 110 dB, respectively. In the range between about 10 Hz and about 10 KHz, the shielding efficiencies for the samples S 1 -S 3 were 60 dB, 63 dB, and 65 dB respectively.
- the corrosion resistances of the samples S 1 -S 3 were tested.
- the test was conducted by immersing the samples S 1 -S 3 in a 5% (by weight) NaCl solution for about 12 days, and inspecting the samples every 4 days. The results showed that, none of the samples S 1 -S 3 had pitting corrosion after 8 days. After 12 days, the sample S 1 had one point of pitting corrosion; the samples S 2 and S 3 had no pitting corrosion, indicating the samples S 1 -S 3 have high corrosion resistances.
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Abstract
Description
SE=A+R+B
wherein A is adsorption loss through the shield from conductivity and magnetic permeability of the shield; R is reflection loss caused by a sudden change in impedance encountered by the RF wave when it meets the side of the shield; B is multiple internal surface reflection correction term. In the case of the
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN201110403314.2A CN103144370B (en) | 2011-12-07 | 2011-12-07 | Aluminum products and preparation method thereof |
CN201110403314.2 | 2011-12-07 |
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Publication Number | Publication Date |
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US20130149550A1 US20130149550A1 (en) | 2013-06-13 |
US8545992B2 true US8545992B2 (en) | 2013-10-01 |
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US13/474,828 Expired - Fee Related US8545992B2 (en) | 2011-12-07 | 2012-05-18 | Aluminum article |
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US20150069614A1 (en) * | 2013-09-09 | 2015-03-12 | Kabushiki Kaisha Toshiba | Semiconductor device and manufacturing method thereof |
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CN104157374B (en) * | 2014-08-14 | 2016-05-04 | 福州大学 | A kind of surface is containing the preparation of the corrosion resisting steel core aluminum stranded wire of Ni-P-phytic acid amorphous deposit |
CN104123988B (en) * | 2014-08-14 | 2016-06-01 | 国家电网公司 | A kind of Aluminium Cable Steel Reinforced with good fatigue resistance energy |
CN104339752B (en) * | 2014-09-19 | 2016-04-13 | 中南大学 | A kind of corrosion protection abrasion resistant material with Ni-Cu-P-TiN composite deposite and preparation method thereof |
CN109628780B (en) * | 2019-01-15 | 2021-01-26 | 北华大学 | Automobile lightweight aluminum-based composite material and preparation method thereof |
RU2756620C1 (en) * | 2021-03-05 | 2021-10-04 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Российский химико-технологический университет имени Д.И. Менделеева" (РХТУ им. Д.И. Менделеева) | Method for chemical coating of nickel-copper-phosphorus alloy |
CN117926233B (en) * | 2024-03-21 | 2024-06-25 | 山东天瑞重工有限公司 | Nickel-phosphorus plating solution for 7075 aluminum alloy double-layer chemical plating and preparation method of 7075 aluminum alloy with chemical plating layer on surface |
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US4981741A (en) * | 1986-03-19 | 1991-01-01 | Mitsubishi Denki Kabushiki Kaisha | Coating alloy |
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CN1536100A (en) * | 2003-04-07 | 2004-10-13 | 李 明 | Environment-protecting catalytic liquor for chemically-plating copper, nikel and phosphorus three-element alloy and its preparation method |
CN101204860A (en) * | 2007-12-12 | 2008-06-25 | 山东天诺光电材料有限公司 | Aluminum foil belt of compound metal and preparation method and uses |
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US4981741A (en) * | 1986-03-19 | 1991-01-01 | Mitsubishi Denki Kabushiki Kaisha | Coating alloy |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US20150069614A1 (en) * | 2013-09-09 | 2015-03-12 | Kabushiki Kaisha Toshiba | Semiconductor device and manufacturing method thereof |
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TWI564432B (en) | 2017-01-01 |
US20130149550A1 (en) | 2013-06-13 |
CN103144370A (en) | 2013-06-12 |
CN103144370B (en) | 2016-07-13 |
TW201323659A (en) | 2013-06-16 |
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