KR100512884B1 - Method of Coating Surface of Antenna Bushing for Mobile Phone - Google Patents

Method of Coating Surface of Antenna Bushing for Mobile Phone Download PDF

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KR100512884B1
KR100512884B1 KR10-2003-0003207A KR20030003207A KR100512884B1 KR 100512884 B1 KR100512884 B1 KR 100512884B1 KR 20030003207 A KR20030003207 A KR 20030003207A KR 100512884 B1 KR100512884 B1 KR 100512884B1
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plating
plated
antenna bushing
mobile phone
product
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KR10-2003-0003207A
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Korean (ko)
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KR20040066227A (en
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박해덕
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(주)선마이크로닉스
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1837—Multistep pretreatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

본 발명에 따른 휴대폰용 안테나 부싱 제품의 도금방법은 도금하고자 하는 아연 다이캐스팅 합금 등의 소재를 전처리하고, 전처리된 제품을 무전해 Ni-P 도금으로 하지도금한 후, 최종적으로 하지도금된 제품을 금도금하는 공정으로 이루어진다.The plating method of the antenna bushing product for mobile phones according to the present invention is pre-treated with a material such as zinc die-casting alloy to be plated, and after the pre-treated product is electroplated by electroless Ni-P plating, and finally the gold plated product It is made by the process.

Description

휴대폰용 안테나 부싱의 도금 방법{Method of Coating Surface of Antenna Bushing for Mobile Phone}Plating method of antenna bushing for mobile phone {Method of Coating Surface of Antenna Bushing for Mobile Phone}

발명의 분야Field of invention

본 발명은 휴대폰용 안테나 부싱(bushing)의 표면처리방법에 관한 것이다. 보다 구체적으로 본 발명은 휴대폰용 안테나의 RF(Radio Frequency) 특성을 향상시키고 균일한 도금 두께를 갖는 안테나 부싱에 관한 것이다. The present invention relates to a surface treatment method of an antenna bushing for a mobile phone. More specifically, the present invention relates to an antenna bushing having a uniform plating thickness and improving RF (Radio Frequency) characteristics of an antenna for a mobile phone.

발명의 배경Background of the Invention

휴대폰용 안테나 부싱은 제품의 형상과 구조가 매우 복잡하다. 특히 제품의 기밀유지를 위해 나사부가 많은 것이 특징이다. 이러한 제품을 전기도금한다면 균일성과 평활성이 우수한 도금을 얻기가 매우 어렵다. 특히 내부 도금면의 경우 전기도금을 한다면 균일전착성의 저하로 인해 도금두께가 균일하지 못한 결과가 발생한다. 도금두께가 균일하지 못하면, 안테나 부싱의 주요 특성인 RF 특성에 영향을 미치게 된다. 따라서 안테나 부싱에 균일한 도금층을 형성하는 것은 대단히 중요하다. Antenna bushings for cell phones are very complex in shape and structure. In particular, it features a large number of threads for the confidentiality of the product. If these products are electroplated, it is very difficult to obtain plating with excellent uniformity and smoothness. In particular, in the case of the inner plating surface, the plating thickness is not uniform due to the deterioration of uniform electrodeposition property. If the plating thickness is not uniform, it affects the RF characteristic, which is the main characteristic of the antenna bushing. Therefore, it is very important to form a uniform plating layer on the antenna bushing.

현재까지 이동통신 시스템에 사용되는 안테나 부싱의 표면처리는 대부분 하지도금으로 반광택니켈도금과 광택니켈도금을 행한 후 마지막으로 금도금을 행하고 있다. 그러나 이러한 기존의 도금방식으로는 안테나의 RF 특성의 문제점을 해결하기에는 부족한 점이 많았다. Until now, most of the surface treatments of antenna bushings used in mobile communication systems have been plated with semi-gloss nickel plating and glossy nickel plating. However, these conventional plating methods were not enough to solve the problem of the RF characteristics of the antenna.

따라서 본 발명자는 종래의 문제점을 해결하기 위하여 RF 특성을 향상시키고 균일한 도금 두께를 갖도록 안테나 부싱을 도금하는 새로운 방법을 개발하기에 이른 것이다. Therefore, the present inventors have developed a new method of plating the antenna bushing to improve the RF characteristics and have a uniform plating thickness in order to solve the conventional problems.

본 발명의 목적은 휴대폰용 안테나 부싱에 표면처리를 하여 RF 특성을 향상시킬 수 있는 새로운 안테나 부싱의 도금 방법을 제공하기 위한 것이다.An object of the present invention is to provide a plating method of a new antenna bushing that can improve the RF characteristics by performing a surface treatment on the antenna bushing for mobile phones.

본 발명의 다른 목적은 균일한 도금 두께를 갖도록 안테나 부싱을 도금하는 새로운 방법을 제공하기 위한 것이다.Another object of the present invention is to provide a new method for plating antenna bushings to have a uniform plating thickness.

본 발명의 또 다른 목적은 휴대폰 안테나 부싱의 균일한 도금두께를 행하여 고주파 손실을 방지하고, 안정적인 RF특성을 유지하여 고신뢰성과 내구성을 가지는 제품을 제조할 수 있는 안테나 부싱을 도금하는 새로운 방법을 제공하기 위한 것이다. It is still another object of the present invention to provide a new method for plating antenna bushings which can produce high reliability and durability products by preventing high frequency loss by performing uniform plating thickness of mobile phone antenna bushings and maintaining stable RF characteristics. It is to.

본 발명의 상기 및 기타의 목적들은 하기 상세히 설명되는 본 발명에 의하여 모두 달성될 수 있다. The above and other objects of the present invention can be achieved by the present invention described in detail below.

발명의 요약Summary of the Invention

본 발명에 따른 휴대폰용 안테나 부싱 제품의 도금방법은 도금하고자 하는 아연 다이캐스팅 합금 등의 소재를 전처리하고, 전처리된 제품을 무전해 Ni-P 도금으로 하지도금한 후, 최종적으로 하지도금된 제품을 금도금하는 공정으로 이루어진다.The plating method of the antenna bushing product for mobile phones according to the present invention is pre-treated with a material such as zinc die-casting alloy to be plated, and after the pre-treated product is electroplated by electroless Ni-P plating, and finally the gold plated product It is made by the process.

발명의 구체예에 대한 상세한 설명Detailed Description of the Invention

본 발명은 휴대폰용 안테나 부싱의 표면처리방법에 관한 것으로, 보다 구체적으로 아연 다이캐스팅 합금 소재로 제조된 휴대폰용 안테나 부싱 제품을 금도금하기 위한 것이다. The present invention relates to a surface treatment method of an antenna bushing for a mobile phone, and more particularly to gold plating an antenna bushing product for a mobile phone made of a zinc die casting alloy material.

우선 도금하고자 하는 아연 다이캐스팅 합금 등의 소재를 전처리하는데, 이 전처리 공정은 기존에 사용되고 있는 방법과 동일하게 실시한다. 이 전처리 공정은 아연 다이캐스팅 합금 소재에 행하는 통상적인 방법에 따른다. 아연 다이캐스팅 합금 소재의 경우는 알칼리탈지, 전해탈지, 및 활성화 단계로 이루어진 전처리 공정을 행한다.First, a material such as zinc die-casting alloy to be plated is pretreated, and this pretreatment is performed in the same manner as the conventionally used method. This pretreatment process is in accordance with the usual method of performing a zinc die-casting alloy material. In the case of a zinc die casting alloy material, a pretreatment process consisting of alkali degreasing, electrolytic degreasing, and activation steps is performed.

알칼리탈지는 다이캐스팅 공정 중에 발생되는 제품표면의 유기물과 이형제 성분을 제거하기 위한 공정이다. 유기물과 이형제가 제품표면에 남아 있으면 도금시 밀착불량의 원인이 된다. 따라서 전용탈지제를 사용하여 다량의 더러움을 용해시켜서 제거하는 방법으로 유기물과 이형제 성분을 완전히 제거하여야 한다. 알칼리탈지는 전용탈지제를 실온에서 5-10분간 초음파 탈지를 행함으로써 작업이 완료된다.Alkaline degreasing is a process for removing organic substances and release agent components from the surface of the product generated during the die casting process. If organic matter and release agent remain on the surface of the product, it may cause poor adhesion during plating. Therefore, the organic and release agent components must be completely removed by dissolving and removing a large amount of dirt using a dedicated degreasing agent. Alkaline degreasing is performed by ultrasonic degreasing for 5-10 minutes at room temperature with a dedicated degreasing agent.

전해탈지는 다른 탈지법에 비하여 특별히 얇은 더러움의 제거에 신속하고 완전하므로 마무리탈지로서 도금공정의 필수공정이다.Electrolytic degreasing is fast and complete for the removal of particularly thin dirts compared to other degreasing methods and is therefore an essential step in the plating process as finishing degreasing.

활성화 단계는 도금직전에 행하는 산침지 공정으로 소재표면에 남은 알칼리를 중화하며, 전처리 중에 생긴 얇은 산화층을 제거하여 표면을 활성상태로 만드는 것으로 도금의 밀착성 향상을 위하여 필요한 공정이다.The activation step is an acid immersion process performed immediately before plating to neutralize the alkali remaining on the surface of the material, and to remove the thin oxide layer formed during the pretreatment to make the surface active, which is necessary to improve the adhesion of the plating.

전처리된 제품은 무전해 Ni-P 도금으로 하지도금한다. 종전의 휴대폰용 안테나 부싱은 모두 반광택니켈도금과 광택니켈도금을 행함으로써 하지도금을 하였는데, 본 발명에서는 무전해 Ni-P도금을 한다. 본 발명의 방법에 따라 제조된 휴대폰용 안테나 부싱 제품은 기존의 반광택니켈도금과 광택니켈도금 행할 때 전기적인 도금이 가지는 도금두께의 불균형을 해소하여 전체적으로 균일한 도금두께를 제공하면서 전자부품 나사부에 균일한 도금두께를 제공하여 RF 특성과 같은 전기적인 특성을 안정시켜 높은 신뢰성을 제공하게 된다.Pretreated products are plated with electroless Ni-P plating. Conventional mobile phone antenna bushings were all plated by semi-gloss nickel plating and glossy nickel plating. In the present invention, electroless Ni-P plating is performed. The antenna bushing product for mobile phones manufactured according to the method of the present invention eliminates the imbalance in the plating thickness of electrical plating when the conventional semi-gloss nickel plating and the polished nickel plating are performed, thereby providing a uniform plating thickness as a whole, and providing a uniform plating thickness to the electronic component screw parts. It provides a uniform plating thickness to stabilize the electrical characteristics such as RF characteristics to provide high reliability.

상기 하지도금 공정은 전처리 공정이 완료된 제품을 무전해 Ni-P 도금하는 공정으로 실제로 청화동 도금을 한 후, 무전해 Ni-P 도금을 한다. 청화동 도금은 밀착력 향상과 완충작용을 위하여 실시한다. pH는 12-13, 온도는 45-60℃에서 청화동 도금을 행한다. The base plating process is a process of electroless Ni-P plating the finished product of the pretreatment process is actually plated copper blue, then electroless Ni-P plating. The cyanide copper plating is carried out to improve adhesion and cushioning. Tungsten copper plating is performed at a pH of 12-13 and a temperature of 45-60 ° C.

도금의 균일성 확보를 위해 기존의 전기적인 반광택니켈도금과 광택니켈도금을 행하는 방법을 균일성이 우수한 무전해 Ni-P 도금공정을 추가하여 안정적인 RF 특성을 구하도록 하였다. 즉 RF 특성에 미치는 영향을 최소화하면서 안정적인 도금층을 형성하도록 무전해 Ni-P 도금을 행한 것이다. 무전해 Ni-P 도금은 pH가 4.3-4.9, 황산니켈의 농도는 4-9 g/l, 차아인산나트륨은 40-60 g/l 그리고 착화제는 5-10 g/l로 이루어져 있다. 이때 도금두께는 3-5㎛가 되도록 한다. 이렇게 무전해 Ni-P 도금을 행함으로써 사용 가능 주파수대에서의 RF 특성이 안정성을 확보할 수 있었다.In order to secure the uniformity of plating, the conventional method of electro-gloss nickel plating and gloss nickel plating was added to obtain stable RF characteristics by adding electroless Ni-P plating process with excellent uniformity. In other words, electroless Ni-P plating was performed to form a stable plating layer while minimizing the influence on the RF characteristics. Electroless Ni-P plating has a pH of 4.3-4.9, a concentration of nickel sulfate 4-9 g / l, sodium hypophosphite 40-60 g / l and a complexing agent 5-10 g / l. At this time, the plating thickness is to be 3-5㎛. By performing electroless Ni-P plating in this manner, the RF characteristics in the usable frequency bands were able to secure stability.

무전해 니켈-인 하지도금된 제품을 최종적으로 전기 금도금처리하는 공정으로 표면처리를 행한다. 금도금은 RF 특성의 신뢰성 확보에 중요하다. 두께는 FLASH 도금을 행하며 온도는 30-50℃에서, 농도는 3-6 g/l로 한다. 상기 무전해 Ni-P도금막과 상기 금도금막을 표면에 형성한 아연다이캐스팅합금의 표면 합계 두께가 5 - 25㎛인 것이 바람직하다. The electroless nickel-phosphorus base plated product is subjected to surface treatment in the final electrogold plating process. Gold plating is important for ensuring the reliability of RF characteristics. The thickness is FLASH plating, the temperature is 30-50 ℃, the concentration is 3-6 g / l. It is preferable that the total surface thickness of the zinc die-casting alloy in which the electroless Ni-P plated film and the gold plated film are formed on the surface thereof is 5 to 25 µm.

금도금이 완료되면 변색방지처리를 한다. 변색방지처리는 조립시까지 도금층의 변색을 방지하기 위한 것으로, 변색방지처리를 하고 건조 후 포장한다. 변색방지처리는 이 분야에서 통상적으로 사용되는 어떤 방법도 사용할 수 있다.When gold plating is completed, discoloration prevention treatment is performed. Discoloration prevention treatment is to prevent discoloration of the plated layer until assembly, the discoloration prevention treatment and packaging after drying. The discoloration prevention treatment can use any method conventionally used in this field.

본 발명은 휴대폰용 안테나 부싱에 표면처리를 하여 RF 특성을 향상시킬 수 있고, 균일한 도금 두께를 갖도록 안테나 부싱을 도금하는 새로운 방법을 제공하며, 휴대폰 안테나 부싱의 균일한 도금두께를 행하여 고주파 손실을 방지하고, 안정적인 RF 특성을 유지하여 고신뢰성과 내구성을 가지는 제품을 제조할 수 있는 안테나 부싱을 제공하는 발명의 효과를 갖는다. The present invention can improve the RF characteristics by surface-treating the antenna bushing for mobile phones, and provides a new method for plating the antenna bushing to have a uniform plating thickness, and by performing a uniform plating thickness of the mobile phone antenna bushing, It has the effect of the invention to provide an antenna bushing that can prevent and maintain a stable RF characteristics to produce a product having high reliability and durability.

본 발명의 단순한 변형 내지 변경은 이 분야의 통상적인 지식을 가진 자에 의하여 용이하게 이용될 수 있으며, 이러한 변형이나 변경은 모두 본 발명의 영역에 포함되는 것으로 볼 수 있다.Simple modifications and variations of the present invention can be readily used by those skilled in the art, and all such variations or modifications can be considered to be included within the scope of the present invention.

Claims (7)

도금하고자 하는 아연 다이캐스팅 합금 등의 소재를 전처리하고;Pretreatment of materials such as zinc die casting alloy to be plated; 전처리된 제품을 무전해 Ni-P 도금으로 하지도금하고, 그리고The pretreated product is plated with electroless Ni-P plating, and 하지도금된 제품을 금도금하는;Gold-plated not plated products; 단계로 이루어지는 것을 특징으로 하는 휴대폰용 안테나 부싱 제품의 도금방법.Plating method of antenna bushing products for mobile phones, characterized in that consisting of steps. 제1항에 있어서, 상기 전처리 공정은 알칼리탈지, 전해탈지, 및 활성화 단계로 이루어지는 것을 특징으로 하는 휴대폰용 안테나 부싱 제품의 도금방법.The method of claim 1, wherein the pretreatment process comprises alkali degreasing, electrolytic degreasing, and activation steps. 제1항에 있어서, 상기 하지도금은 pH는 12-13, 온도는 45-60℃에서 청화동 도금을 행한 후, 무전해 Ni-P 도금을 행하는 것을 특징으로 하는 휴대폰용 안테나 부싱 제품의 도금방법.2. The method of claim 1, wherein the base plating is performed by electroplating Ni-P plating after the cyanide copper plating is performed at a pH of 12-13 and a temperature of 45-60 ° C. . 제3항에 있어서, 상기 무전해 Ni-P 도금은 pH가 4.3-4.9, 황산니켈의 농도는 4-9 g/l, 차아인산나트륨은 40-60 g/l 그리고 착화제는 5-10 g/l로 이루어진 용액으로 행하고, 도금두께가 3-5㎛인 것을 특징으로 하는 휴대폰용 안테나 부싱 제품의 도금방법.The method of claim 3, wherein the electroless Ni-P plating has a pH of 4.3-4.9, the concentration of nickel sulfate is 4-9 g / l, sodium hypophosphite 40-60 g / l and the complexing agent is 5-10 g A plating method for an antenna bushing product for a mobile phone, which is carried out with a solution composed of / l and has a plating thickness of 3-5 µm. 제1항에 있어서, 상기 금도금은 FLASH 도금을 행하며 온도는 30-50℃에서, 농도는 3-6 g/l에서 행하는 것을 특징으로 하는 휴대폰용 안테나 부싱 제품의 도금방법.The plating method of claim 1, wherein the gold plating is performed by FLASH plating, and the temperature is performed at 30-50 ° C. and the concentration is 3-6 g / l. 제1항에 있어서, 상기 금도금 단계 후에 도금층의 변색을 방지하기 위하여 변색방지처리 단계를 더 포함하는 것을 특징으로 하는 휴대폰용 안테나 부싱 제품의 도금방법.The method of claim 1, further comprising a discoloration preventing treatment step to prevent discoloration of the plating layer after the gold plating step. 제1항 내지 제6항의 어느 한 항의 도금방법에 따라 제조되는 것을 특징으로 하는 휴대폰용 안테나 부싱 제품.An antenna bushing product for a mobile phone, which is manufactured according to the plating method of any one of claims 1 to 6.
KR10-2003-0003207A 2003-01-17 2003-01-17 Method of Coating Surface of Antenna Bushing for Mobile Phone KR100512884B1 (en)

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