KR20130081924A - Organic light emitting diode display and manufacturing method thereof - Google Patents

Abstract

PURPOSE: An organic light emitting diode displayer and a manufacturing method thereof are provided to flatly attach a polarizing plate on the lower surface of a thin film transistor substrate, and on the outer periphery of a folding part, thereby preventing a degradation of display quality. CONSTITUTION: A sealing substrate (200) is attached on a thin film transistor substrate (100). The sealing substrate seals the thin film transistor substrate. An adjacent surface which is adjacent to the side of a side part of the thin film transistor substrate has a lower surface groove. The sealing substrate has a folding part. The folding part surrounds the side of the side part of the thin film transistor substrate and the lower surface groove.

Description

TECHNICAL FIELD [0001] The present invention relates to an organic light emitting diode (OLED) display device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic light emitting display and a method of manufacturing the same, and more particularly, to an organic light emitting display including a sealing substrate for sealing a display unit and a method of manufacturing the same.

The organic light emitting display device is a self light emitting display device that displays an image by providing an organic light emitting element that emits light by itself. Since a thin film transistor substrate including a plurality of organic light emitting elements is degraded when exposed to moisture and oxygen, the thin film transistor substrate is sealed using a sealing substrate to suppress external moisture and oxygen penetration.

As such a sealing substrate, a glass sealing substrate and a metal sheet sealing substrate are used. The glass sealing substrate seals the thin film transistor substrate using glass, and the metal sheet sealing substrate seals the thin film transistor substrate by bonding a metal sheet to the front surface of the thin film transistor substrate instead of the glass.

However, in the case of using a separate glass sealing substrate in addition to the glass substrate used for the support substrate of the thin film transistor substrate, it is disadvantageous in terms of cost. In addition, since the metal sheet encapsulation substrate is bonded to the entire surface of the thin film transistor substrate, the organic light emitting display device may be bent due to a difference in thermal expansion between the metal sheet encapsulation substrate and the glass substrate of the thin film transistor substrate.

When the organic light emitting diode display is bent, an alignment miss problem or a reliability problem of the organic light emitting diode display may be caused in a later TAB IC bonding process or a silicon dispenser.

An object of the present invention is to provide an organic light emitting display device and a method of manufacturing the same, which can prevent deformation of the organic light emitting display device.

An organic light emitting diode display according to an exemplary embodiment of the present invention includes a thin film transistor substrate on which an organic light emitting element is formed, a sealing substrate attached to the thin film transistor substrate to seal the thin film transistor substrate. An adjacent bottom surface adjacent to the side of the portion may have an etched bottom groove, and the encapsulation substrate may have a folding portion surrounding the side surface and the bottom groove of the thin film transistor substrate.

The folding part may include a short side folding part surrounding a pair of short sides of the thin film transistor substrate.

The short side folding part may include a short side side folding part surrounding a side of a short side part of the thin film transistor substrate, and a short side bottom folding part inserted into a short side bottom groove of the short side part of the thin film transistor substrate.

A sealant may be interposed between the short side bottom groove and the short side bottom folding part.

An outer surface of the short side bottom folding portion and a height of a bottom surface of the thin film transistor substrate may coincide with each other.

The display device may further include a polarizer that simultaneously covers an outer surface of the short side bottom folding part and a bottom surface of the thin film transistor substrate.

The folding part may include a long side folding part surrounding the long side part of the thin film transistor substrate.

The long side folding part may include a long side side folding part covering a side of a long side part of the thin film transistor substrate, and a long side bottom folding part inserted into a long side bottom groove of the long side part of the thin film transistor substrate.

A sealant may be interposed between the long side bottom groove and the long side bottom folding part.

An outer surface of the long side bottom folding portion and a height of a bottom surface of the thin film transistor substrate may coincide with each other.

The display device may further include a polarizer that simultaneously covers an outer surface of the long side bottom folding part and a bottom surface of the thin film transistor substrate.

The sealing substrate may include a metal sheet.

In addition, according to an embodiment of the present invention, a method of manufacturing an organic light emitting display device may include forming a bottom groove by etching an adjacent bottom surface adjacent to a side portion of a thin film transistor substrate on which an organic light emitting diode is formed, and forming the thin film transistor substrate. Applying a sealant to side and bottom grooves of a side of the thin film, attaching a sealing substrate to a surface of the thin film transistor substrate, and folding the edge of the sealing substrate to surround the side and bottom grooves of the side of the thin film transistor substrate. Forming a folding portion of the substrate may include.

In the forming of the folding part of the encapsulation substrate, a short side folding part may be formed to surround the pair of short sides of the thin film transistor substrate.

The short side folding part includes a short side side folding part surrounding a side of the short side part of the thin film transistor substrate, and a short side bottom folding part inserted into a short side bottom groove of the short side part of the thin film transistor substrate, and the short side bottom folding part and the thin film transistor substrate The method may further include curing the sealant interposed between the short side bottom grooves.

The method may further include curing a sealant interposed between the short side lateral folding part and the side of the short side part of the thin film transistor substrate.

An outer surface of the short side bottom folding portion and a height of a bottom surface of the thin film transistor substrate may coincide with each other.

The method may further include attaching a polarizer to an outer surface of the short side bottom folding part and a bottom surface of the thin film transistor substrate.

In the forming of the folding part of the encapsulation substrate, a long side folding part surrounding the pair of long sides of the thin film transistor substrate may be formed.

The long side folding part includes a long side side folding part covering a side of a long side part of the thin film transistor substrate, a long side bottom folding part inserted into a long side bottom groove of the long side part of the thin film transistor substrate, and the long side bottom folding part and the thin film transistor substrate. The method may further include curing the sealant interposed between the long side bottom grooves.

The method may further include curing a sealant interposed between the long side lateral folding part and the side of the long side part of the thin film transistor substrate.

An outer surface of the long side bottom folding portion and a height of a bottom surface of the thin film transistor substrate may coincide with each other.

The method may further include attaching a polarizer to an outer surface of the long side bottom folding part and a bottom surface of the thin film transistor substrate.

The organic light emitting diode display according to the exemplary embodiment of the present invention forms a bottom groove on the side of the thin film transistor substrate, and the encapsulation substrate has a folding portion inserted into the side surface and the bottom groove of the side of the thin film transistor substrate, whereby the polarizing plate is not stepped. Since it may be flatly attached to the bottom surface of the thin film transistor substrate and the outer surface of the short side bottom folding portion, problems such as light leakage do not occur, thereby preventing deterioration of display quality.

In addition, the warpage phenomenon due to the difference in thermal expansion coefficient between the sealing substrate made of a metal sheet and the supporting substrate of the thin film transistor substrate made of glass can be minimized.

1 is a plan view of an organic light emitting diode display according to a first exemplary embodiment of the present invention.
2 is a rear view of an organic light emitting diode display according to a first exemplary embodiment of the present invention.
3 is a perspective view of an organic light emitting diode display according to a first exemplary embodiment of the present invention.
4 is a cross-sectional view of an organic light emitting diode display according to a first exemplary embodiment of the present invention.
5 is a view illustrating a state before folding a sealing substrate of an organic light emitting diode display according to a first exemplary embodiment of the present invention.
6 is a view illustrating a state in which a folding part of a sealing substrate of a organic light emitting diode display according to a first exemplary embodiment of the present invention is folded and attached to a thin film transistor substrate.
7 is a plan view of an organic light emitting diode display according to a second exemplary embodiment of the present invention.
8 is a rear view of the organic light emitting diode display according to the second exemplary embodiment of the present invention.
9 illustrates a state before folding a sealing substrate of an organic light emitting diode display according to a second exemplary embodiment of the present invention.
FIG. 10 is a view illustrating a state in which a folding part of a sealing substrate of a organic light emitting diode display according to a second exemplary embodiment of the present invention is folded and attached to a thin film transistor substrate.
11 is a plan view of an organic light emitting diode display according to a third exemplary embodiment of the present invention.
12 is a rear view of an organic light emitting diode display according to a third exemplary embodiment of the present invention.
FIG. 13 is a view illustrating a state before folding a sealing substrate of an organic light emitting diode display according to a third exemplary embodiment of the present invention.
14 is a diagram illustrating still another embodiment of a state before folding a sealing substrate of an organic light emitting diode display according to a third exemplary embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. The present invention may be embodied in many different forms and is not limited to the embodiments described herein.

In order to clearly describe the present invention, parts irrelevant to the description are omitted, and like reference numerals designate like elements throughout the specification. Since the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of description, the present invention is not limited to the illustrated examples.

When a part of a layer, film, region, plate, etc. in the specification is said to be "on" or "on" another part, it is not only when the part is "right over" the other part but also when there is another part in the middle. Include.

1 is a plan view of an organic light emitting display device according to a first embodiment of the present invention, FIG. 2 is a rear view of an organic light emitting display device according to a first embodiment of the present invention, and FIG. 3 is a first embodiment of the present invention. 4 illustrates a perspective view of an organic light emitting diode display, and FIG. 4 is a cross-sectional view of the organic light emitting diode display according to the first exemplary embodiment.

1 to 4, an organic light emitting diode display according to a first exemplary embodiment of the present invention is attached to a thin film transistor substrate 100 and a thin film transistor substrate 100 on which an organic light emitting element is formed, and thus, a thin film transistor. And a sealing substrate 200 for sealing the substrate 100.

The thin film transistor substrate 100 includes a display area A10 for displaying an image and a non-display area outside the display area A10. The non-display area may be divided into a wiring and sealing area A20 and a pad area A30 (see FIG. 6). The encapsulation substrate 200 is formed to have a size covering the display area A10 and the sealing area A20 of the thin film transistor substrate 100. Therefore, the pad region A30 of the thin film transistor substrate 100 is exposed to the outside by a predetermined width w1 without overlapping the encapsulation substrate 200.

In the display area A10, an organic light emitting element and a driving circuit unit are formed for each pixel. The organic light emitting device includes a pixel electrode, an organic light emitting layer, and a common electrode. The driving circuit portion is composed of at least two thin film transistors including a switching thin film transistor and a driving thin film transistor and at least one capacitor. The organic light emitting layer includes a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer that are sequentially stacked from the pixel electrode. Holes and electrons are injected from the pixel electrode and the common electrode into the organic light emitting layer, and light emission is performed when an exciton in which the injected holes and electrons are coupled falls from the excited state to the ground state.

In addition, each pixel includes a gate line, a data line, and a common power supply line. The gate line carries the scan signal and the data line carries the data signal. The common power line applies a common voltage to the driving thin film transistor.

The sealant 10 surrounding the display area is positioned in the sealing area A20, and the sealant 10 does not include a conductive material and may include a thermosetting resin, for example, an epoxy resin. The moisture absorbent 30 and the filler 20 are sequentially positioned between the thin film transistor substrate 100 and the sealing substrate 200 inside the sealant 10.

The moisture absorbing material 30 is disposed to absorb moisture introduced from the outside, and the filler 20 covers the display area A10 to protect the display area A10 from external shock.

The pad region A30 is formed at one long side of the thin film transistor substrate 100, and a flexible printed circuit 300 such as a plurality of tab ICs is attached to the pad region A30. . The flexible printed circuit 300 applies a corresponding electric signal to a common power line, a common electrode, and the like.

An adjacent bottom surface adjacent to the side of the thin film transistor substrate 100 has an etched bottom groove, and the bottom groove includes a short side bottom groove 100a formed in a short side portion of the thin film transistor substrate 100.

The encapsulation substrate 200 is fixed to the thin film transistor substrate 100 by the sealant 10. The encapsulation substrate 200 may be formed of a metal sheet having low resistance and excellent moisture and oxygen blocking effects, for example, an aluminum sheet, an aluminum alloy sheet, a copper sheet, or a copper alloy sheet. The encapsulation substrate 200 completely covers and protects the display area A10 of the thin film transistor substrate 100, and blocks moisture and oxygen penetration from the outside.

The encapsulation substrate 200 includes an attachment portion 210 attached to the display area of the thin film transistor substrate 100, and a folding portion surrounding side and bottom grooves of an edge portion of the thin film transistor substrate 100.

The folding unit includes a short side folding unit 220 surrounding a pair of short sides of the thin film transistor substrate 100. The short side folding part 220 is a short side side folding part 221 which covers the side of the short side of the thin film transistor substrate 100, and a short side which is inserted into the short side bottom groove 100a adjacent to the side of the short side of the thin film transistor substrate 100. The bottom folding part 222 is included.

The depth t1 of the short side bottom groove 100a may be 5 to 20 μm, and the length t2 of the short side bottom groove 100a may coincide with the length of the short side bottom folding part 222 of the sealing substrate 200. Can be.

The sealant 10 is interposed between the short side folding portion 220 and the thin film transistor substrate 100. At this time, the sealant 10 is interposed between the short side bottom groove 100a and the short side bottom folding part 222. Therefore, the short side lateral folding portion 221 and the short side bottom folding portion 222 are bonded to the side and short side bottom grooves 100a of the thin film transistor substrate 100 by curing the sealant 10.

As illustrated in FIG. 4, a polarizer 500 is attached to an outer surface of the short side bottom folding portion 222 and a bottom surface of the thin film transistor substrate 100. At this time, since the short side bottom folding part 222 is inserted into the short side bottom groove 100a, the height of the outer surface of the short side bottom folding part 222 and the bottom of the thin film transistor substrate 100 coincide with each other. Accordingly, since the polarizer 500 may be attached to the bottom surface of the thin film transistor substrate 100 flatly without a step, problems such as light leakage do not occur and thus the display quality may be prevented from deteriorating.

The support substrate of the thin film transistor substrate 100 may be made of transparent glass or transparent polymer resin. The support substrate of the transparent polymer resin material is polyether sulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, cellulose triacetate, and cellulose acetate It can include any of propionate.

Since a plurality of processes for forming a plurality of pixels on the thin film transistor substrate 100 proceed and heat is applied during such a process, the thin film transistor substrate 100 is expanded by heat. For example, when the sealant 10 is cured at a high temperature to bond the thin film transistor substrate 100 and the sealing substrate 200, the thermal expansion coefficient difference between the two substrates 100 and 200 causes expansion of the thin film transistor substrate 100. At this time, the short side of the thin film transistor substrate 100 is bent in the upper direction p1. Therefore, the expansion of the thin film transistor substrate 100 reduces the durability of the organic light emitting diode display and the precision of the display area A10.

However, in the first embodiment of the present invention, since the short side folding portion 220 surrounds the pair of short sides of the thin film transistor substrate 100, the short side folding portion 220 faces the short side portion of the thin film transistor substrate 100 in the downward direction. to (p2).

That is, the force of pulling the thin film transistor substrate 100 in the upper direction p1 by the attachment portion 210 of the sealing substrate 200 is pulled by the short side bottom folding portion 222 of the sealing substrate 200 with the force in the opposite direction. The organic light emitting diode display is prevented from bending.

Therefore, the warpage phenomenon due to the difference in thermal expansion coefficient between the sealing substrate 200 made of the metal sheet and the supporting substrate of the thin film transistor substrate 100 made of glass can be minimized.

A filler 20 is formed between the attachment portion 210 of the encapsulation substrate 200 and the thin film transistor substrate 100 to protect the thin film transistor substrate 100 from external shock, and the filler 20 and the sealant 10. An absorbent material 30 is formed therebetween to prevent external moisture or oxygen from entering the pixel.

A method of manufacturing an organic light emitting display device according to a first embodiment of the present invention will be described in detail with reference to FIGS. 3 to 6 below.

5 is a view illustrating a state before folding a sealing substrate of the organic light emitting diode display according to the first exemplary embodiment of the present invention, and FIG. 6 is a folding of the sealing substrate of the organic light emitting diode display according to the first exemplary embodiment of the present invention. It is a figure which shows the state which folds and attaches to a thin film transistor substrate.

As shown in FIG. 5, a sealing substrate 200 having a long side portion longer than the length L1 of the long side portion of the thin film transistor substrate 100 is prepared.

Then, the folding line F is formed in advance on the pair of short sides of the sealing substrate 200. That is, the short side side folding portion 221 in contact with the side of the short side portion of the thin film transistor substrate 100 and the short side bottom folding portion 222 in contact with the adjacent bottom surface of the short side portion of the thin film transistor substrate 100 may be easily folded. The folding line F is formed. The folding line F may be formed as a groove through an etching or pressing process.

Next, as shown in FIG. 6, the adjacent bottom surface adjacent to the side of the short side portion of the thin film transistor substrate 100 on which the organic light emitting element is formed is etched to form the short side bottom groove 100a.

Then, the sealant 10 is applied to the side surface and the short side bottom groove 100a of the short side portion of the thin film transistor substrate 100.

The encapsulation substrate 200 is attached to the surface of the thin film transistor substrate 100. The short side folding portion 220 of the encapsulation substrate 200 is folded to cover the side surface and the short side bottom groove 100a of the thin film transistor substrate 100. At this time, since the short side bottom folding part 222 is inserted into the short side bottom groove 100a, the height of the outer surface of the short side bottom folding part 222 and the bottom surface of the thin film transistor substrate 100 coincide and planarize.

Next, as shown in FIG. 3, the sealant 10 is cured so that the short side lateral folding portion 221 and the short side bottom folding portion 222 have side and short side bottom grooves 100a of the thin film transistor substrate 100. To each). Therefore, since the short side folding portion 220 pulls the short side portion of the thin film transistor in the downward direction p2, the force of pulling the thin film transistor substrate 100 from the attachment portion 210 of the sealing substrate 200 is sealed. The short side bottom folding part 222 of FIG. 2) is pulled by the force in the opposite direction to prevent the OLED display from bending.

Next, as illustrated in FIG. 4, the polarizer 500 is attached on the outer surface of the short side bottom folding portion 222 and the bottom surface of the thin film transistor substrate 100. Since the outer side surface of the short side bottom folding portion 222 and the bottom surface of the thin film transistor substrate 100 are flattened, there is no level difference in the polarizing plate 500 so that problems such as light leakage do not occur. .

Meanwhile, in the first embodiment, the short side folding portion is formed in the sealing substrate, but the second embodiment in which the long side folding portion is formed in the sealing substrate is also possible.

Hereinafter, the second embodiment will be described in detail with reference to FIGS. 7 to 10.

7 is a plan view of an organic light emitting display device according to a second embodiment of the present invention, FIG. 8 is a rear view of the organic light emitting display device according to a second embodiment of the present invention, and FIG. 9 is a second embodiment of the present invention. FIG. 10 is a view illustrating a state before folding an encapsulation substrate of an organic light emitting diode display, and FIG. 10 is a state in which a folding part of the encapsulation substrate of an organic light emitting diode display is folded and attached to a thin film transistor substrate. It is a figure which shows.

7 to 10 are substantially the same as those of the second embodiment shown in FIGS. 1 to 3 except that the long side folding part is formed on the sealing substrate, and thus the repeated description thereof will be omitted. .

As shown in FIG. 7 to FIG. 10, the adjacent bottom surface adjacent to the side of the thin film transistor substrate 100 of the organic light emitting diode display according to the second exemplary embodiment of the present invention has an etched bottom groove and a bottom groove. The long side bottom groove 100b is formed in the long side portion of the thin film transistor substrate 100.

The encapsulation substrate 200 includes an attaching portion 210 attached to the display area of the thin film transistor substrate 100, and a folding portion surrounding the side and bottom surfaces of the thin film transistor substrate 100. The folding unit includes a long side folding unit 230 surrounding a pair of long sides of the thin film transistor substrate 100. The long side folding part 230 is a long side side folding part 231 surrounding the side of the long side part of the thin film transistor substrate 100, and a long side inserted into the short side bottom groove 100b adjacent to the side of the long side part of the thin film transistor substrate 100. The bottom folding part 232 is included.

The sealant 10 is interposed between the long side folding part 230 and the thin film transistor substrate 100. At this time, the sealant 10 is interposed between the long side bottom groove 100b and the long side bottom folding part 232. Accordingly, the long side side foldable part 231 and the long side bottom foldable part 232 are bonded to the side and long side bottom grooves 100b of the thin film transistor substrate 100 by curing the sealant 10.

The polarizer 500 may be attached to an outer surface of the long side bottom folding part 232 and a bottom surface of the thin film transistor substrate 100. At this time, since the long side bottom folding portion 232 is inserted into the long side bottom groove 100b, the height of the outer surface of the long side bottom folding portion 232 and the bottom surface of the thin film transistor substrate 100 coincide with each other. Accordingly, since the polarizer 500 may be attached to the bottom surface of the thin film transistor substrate 100 flatly without a step, problems such as light leakage do not occur and thus the display quality may be prevented from deteriorating.

Since the long side folding part 230 surrounds the pair of long sides of the thin film transistor substrate 100, the long side folding part 230 pulls the long side part of the thin film transistor substrate 100 in the downward direction p2. As such, the force of pulling the thin film transistor substrate 100 in the upper direction p1 by the attachment portion 210 of the encapsulation substrate 200 is a force in the opposite direction of the long side bottom folding portion 232 of the encapsulation substrate 200. Pulling prevents the organic light emitting display from bending.

A method of manufacturing an organic light emitting diode display according to a second exemplary embodiment of the present invention will be described in detail with reference to FIGS. 9 and 10.

As shown in FIG. 9, a sealing substrate 200 having a short side portion longer than the length L2 of the short side portion of the thin film transistor substrate 100 is prepared.

Then, the folding line F is formed in advance on the pair of long sides of the sealing substrate 200. That is, the long side side folding portion 231 in contact with the side of the long side portion of the thin film transistor substrate 100 and the long side bottom folding portion 232 in contact with the adjacent bottom surface of the long side portion of the thin film transistor substrate 100 may be easily folded. The folding line F is formed. The folding line F may be formed as a groove through an etching or pressing process.

Next, as shown in FIG. 10, the adjacent bottom surface adjacent to the side of the long side portion of the thin film transistor substrate 100 on which the organic light emitting element is formed is etched to form the long side bottom groove 100b.

Then, the sealant 10 is applied to the side surface and the long side bottom groove 100b of the long side portion of the thin film transistor substrate 100.

The encapsulation substrate 200 is attached to the surface of the thin film transistor substrate 100. The long side folding portion 230 of the encapsulation substrate 200 is folded to cover the side surface and the long side bottom groove 100b of the thin film transistor substrate 100. At this time, since the long side bottom folding portion 232 is inserted into the long side bottom groove 100b, the height of the outer surface of the long side bottom folding portion 232 and the bottom surface of the thin film transistor substrate 100 coincide with each other to be flattened.

Then, the sealant 10 is cured so that the long side side foldable part 231 and the long side bottom foldable part 232 are adhered to the lateral side and the long side bottom groove 100b of the thin film transistor substrate 100, respectively. Therefore, since the long side folding part 230 pulls the long side part of the thin film transistor in the downward direction p2, the force of pulling the thin film transistor substrate 100 by the attachment part 210 of the sealing substrate 200 is sealed. The long side bottom folding portion 232 of FIG. 2) is pulled by a force in an opposite direction to prevent the OLED display from bending.

Next, the polarizer 500 may be attached onto the outer surface of the long side bottom folding portion 232 and the bottom surface of the thin film transistor substrate 100. Since the outer surface of the long side bottom folding portion 232 and the bottom surface of the thin film transistor substrate 100 are flattened, there is no level difference in the polarizer 500, so that problems such as light leakage do not occur. .

Meanwhile, in the first embodiment, only the short side folding part is formed in the sealing substrate, but the third embodiment in which both the short side folding part and the long side folding part are formed in the sealing substrate is also possible.

Hereinafter, the third embodiment will be described in detail with reference to FIGS. 11 to 13.

11 is a plan view of an organic light emitting diode display according to a third exemplary embodiment of the present invention, FIG. 12 is a rear view of an organic light emitting diode display according to a third exemplary embodiment of the present invention, and FIG. 13 is a third exemplary embodiment of the present invention. FIG. 14 is a view illustrating a state before folding a sealing substrate of an organic light emitting diode display, and FIG. 14 illustrates another embodiment of a state before folding a sealing substrate of an organic light emitting diode display according to a third exemplary embodiment of the present invention. One drawing.

11 to 14 are substantially the same as those of the third embodiment shown in FIGS. 1 to 3 except that a long side folding part is further formed on the encapsulation substrate, and thus repeated descriptions thereof are omitted. do.

11 to 13, bottom grooves 100a and 100b in which adjacent bottom surfaces adjacent to side surfaces of the thin film transistor substrate 100 of the organic light emitting diode display according to the third exemplary embodiment of the present invention are etched are etched. The bottom grooves 100a and 100b include a short side bottom groove 100a formed in a short side portion of the thin film transistor substrate 100 and a long side bottom groove 100b formed in a long side portion of the thin film transistor substrate 100.

The encapsulation substrate 200 includes an attachment portion 210 attached to the display area of the thin film transistor substrate 100, a short side folding portion 220 and a thin film transistor substrate 100 surrounding the pair of short sides of the thin film transistor substrate 100. It includes a long side folding portion 230 surrounding the pair of long sides.

The short side folding part 220 is a short side side folding part 221 which covers the side of the short side of the thin film transistor substrate 100, and a short side which is inserted into the short side bottom groove 100a adjacent to the side of the short side of the thin film transistor substrate 100. The bottom folding part 222 is included.

The long side folding part 230 is inserted into the long side side folding part 231 surrounding the side of the long side part of the thin film transistor substrate 100 and the long side bottom groove 100b adjacent to the side of the long side part of the thin film transistor substrate 100. The long side bottom folding portion 232 is included.

Since the short side folding part 220 and the long side folding part 230 simultaneously surround the pair of short side parts and the long side parts of the thin film transistor substrate 100, the sealing substrate 200 made of a metal sheet and the thin film transistor substrate made of glass. It is possible to further minimize the bending of the organic light emitting diode display due to the difference in thermal expansion coefficient between the supporting substrates of the 100. In this case, portions in which the short side folding portion 220 and the long side folding portion 230 overlap each other may overlap to surround the edge portion of the thin film transistor substrate.

In addition, as illustrated in FIG. 14, since the short side folding portion 220 and the long side folding portion 230 overlap each other, the edges of the thin film transistor substrate may be more firmly wrapped, thereby deforming the OLED display. Can be further minimized.

At this time, the edge portion 2 of the short side folding unit 220 and the long side folding unit 230 may be chamfered to minimize the overlapping portions when the short side folding unit 220 and the long side folding unit 230 are folded. .

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, Of course.

10: sealant 20: filler
100: substrate 100a: short side bottom groove
100b: long side bottom groove 200: sealing substrate
210: attachment portion 220: short side folding portion
221: short side side folding part 222: short side bottom folding part
230: long side folding portion 231: long side folding
232: long side bottom folding portion 500: polarizing plate

Claims (23)

A thin film transistor substrate on which an organic light emitting element is formed,
An encapsulation substrate attached to the thin film transistor substrate to seal the thin film transistor substrate.
/ RTI >
An adjacent bottom surface adjacent to a side of the thin film transistor substrate has an etched bottom groove,
The encapsulation substrate includes a folding part surrounding side surfaces and a bottom groove of an edge portion of the thin film transistor substrate. The method of claim 1,
And the folding part includes a short side folding part surrounding a pair of short sides of the thin film transistor substrate. The method of claim 2,
The short side folding part includes a short side side folding part surrounding a side of a short side part of the thin film transistor substrate, and a short side bottom folding part inserted into a short side bottom groove of the short side part of the thin film transistor substrate. The method of claim 3,
And a sealant interposed between the short side bottom groove and the short side bottom folding portion. 5. The method of claim 4,
And an outer surface of the short side bottom folding part and a height of a bottom surface of the thin film transistor substrate coincide with each other. The method of claim 5,
And a polarizer covering the outer surface of the short side bottom folding portion and the bottom surface of the thin film transistor substrate. 5. The method of claim 4,
The folding unit includes a long side folding portion surrounding the long side of the thin film transistor substrate. The method of claim 7, wherein
The long side folding part includes a long side side folding part covering a side of a long side part of the thin film transistor substrate, and a long side bottom folding part inserted into a long side bottom groove of the long side part of the thin film transistor substrate. 9. The method of claim 8,
And a sealant interposed between the long side bottom groove and the long side bottom folding portion. 10. The method of claim 9,
And an outer surface of the long side bottom folding portion and a height of a bottom surface of the thin film transistor substrate are the same. The method of claim 10,
And a polarizing plate covering an outer surface of the long side bottom folding portion and a bottom surface of the thin film transistor substrate at the same time. The method of claim 1,
The encapsulation substrate includes a metal sheet. Etching a bottom adjacent to the side of the side of the thin film transistor substrate on which the organic light emitting element is formed to form a bottom groove;
Applying a sealant to side and bottom grooves of edge portions of the thin film transistor substrate,
Attaching a sealing substrate to a surface of the thin film transistor substrate,
Folding a side portion of the sealing substrate to form a folding portion of the sealing substrate surrounding the side and bottom grooves of the edge portion of the thin film transistor substrate;
Wherein the organic light emitting display device further comprises: The method of claim 13,
And forming a folding side of the sealing substrate to form a short side folding portion surrounding the pair of short sides of the thin film transistor substrate. 15. The method of claim 14,
The short side folding part includes a short side side folding part surrounding a side of a short side part of the thin film transistor substrate, and a short side bottom folding part inserted into a short side bottom groove of the short side part of the thin film transistor substrate,
And curing the sealant interposed between the short side bottom folding part and the bottom side bottom groove of the thin film transistor substrate. 16. The method of claim 15,
And curing the sealant interposed between the short side side folding portion and the side surface of the thin film transistor substrate. 17. The method of claim 16,
And a height of an outer surface of the short side bottom folding portion and a bottom surface of the thin film transistor substrate coincides with each other. 18. The method of claim 17,
And attaching a polarizing plate on an outer surface of the short side bottom folding part and a bottom surface of the thin film transistor substrate. 15. The method of claim 14,
And forming a long side folding portion surrounding the pair of long side portions of the thin film transistor substrate. 20. The method of claim 19,
The long side folding part includes a long side side folding part covering a side of a long side part of the thin film transistor substrate, a long side bottom folding part inserted into a long side bottom groove of the long side part of the thin film transistor substrate,
And curing the sealant interposed between the long side bottom folding portion and the long side bottom groove of the thin film transistor substrate. 21. The method of claim 20,
And curing the sealant interposed between the long side side folding portion and the side surface of the thin film transistor substrate. The method of claim 21,
And a height of an outer surface of the long side bottom folding portion and a bottom surface of the thin film transistor substrate is the same. The method of claim 21,
And attaching a polarizing plate on an outer surface of the long side bottom folding portion and a bottom surface of the thin film transistor substrate.

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