KR20130080916A - Improved apparatus and method of bonding substrates - Google Patents

Abstract

PURPOSE: An improved substrate boding device and a boding method thereof are provided to prevent the generation of bubbles or foreign substances between a top substrate and a bottom substrate while strongly bonding the substrates. CONSTITUTION: A first nozzle device applies first boding liquid to form a closed boundary seal line (422) along a side border part of a bottom substrate (420). A second nozzle device (445) applies second boding liquid (430) into the closed boundary seal line. A hardening device (450) virtually hardens the first and the second boding liquid while applying the second boding liquid into the closed boundary seal line. A pressurizing device (421) moves while pressurizing a top surface of the top substrate (410). The hardening device hardens the closed boundary seal line and the second boding liquid.

Description

Improved Apparatus and Method of Bonding Substrates

The present invention relates to an improved substrate bonding apparatus and bonding method.

More specifically, the present invention forms a closed boundary seal line along the side edge portion of the lower substrate, and simultaneously cures the closed boundary seal line at the same time while totally coating the adhesive solution inside the closed boundary seal line, and then the upper substrate. Is placed in an inclined state with the lower substrate, and then the upper substrate is pressed to the lower substrate by a contact method or a non-contact method using a pressure device such as a roller or an air curtain generating device, and together with the hardened closed boundary seal line and the bonding liquid together. By curing, the upper substrate and the lower substrate are firmly bonded, foreign matter or bubbles are prevented between the upper substrate and the lower substrate, the number of joining processes and the tact time are reduced, and expensive such as a vacuum device. Eliminates the need for equipment, simplifying the construction of the cementing device, reducing costs, and greatly reducing the likelihood of defective product An improved substrate bonding apparatus and method of bonding are reduced.

As the information society develops, the demand for a display device for outputting image information is diversified, and thus, a plasma display panel (PDP) and a liquid crystal display (LCD) are used to replace a conventional cathode ray tube (CRT). Many flat panel displays (FPDs) such as Liquid Crystal Display (FED), Field Emission Display (FED), Organic Light Emitting Diode (OLED), Monitor for PC, and Monitor for Tablet PC. Flat Panel Display) appeared.

Of the various FPDs described above, a PDP or an LCD, which is widely used from a mobile phone screen to a large-sized TV screen, is used as a typical flat panel display.

For example, in order to manufacture an LCD, preparing a thin film transistor array substrate (first substrate) having a thin film transistor generally; Preparing a color filter array substrate (second substrate) having a color filter layer; Bonding the first and second substrates together. In this case, the step of bonding the first and second substrates is performed by the substrate bonding apparatus.

As one example of the substrate sticking apparatus used in the prior art, a planar stage is used to fix the substrate. This stage includes a flat platen, an electrostatic chuck mounted to the platen, and a plurality of holes formed in the platen and disposed between the electrostatic chucks.

1 is a perspective view showing a base plate according to the prior art.

Referring to FIG. 1, the surface of a base 1 according to the prior art is formed in a planar structure, and a plurality of holes 2 are formed on the surface. The plurality of holes 12 transmit a vacuum force to attract and fix the substrate.

FIGS. 2A to 2E are views showing a method of attaching a substrate by using a substrate bonding apparatus having a planar stage according to the related art. Such a substrate bonding apparatus and a substrate bonding method with a planar stage according to the prior art are disclosed in Korean Patent Application No. 10-2006 (hereinafter, referred to as " substrate bonding apparatus and substrate bonding method " -0138217, filed on July 3, 2008, and Korean Patent Laid-Open No. 10-2008-0062424.

2A to 2E, in the substrate bonding method according to the related art, the first substrate 14a and the second substrate 14b are fixed to each of the planar upper stage 10 and the planar lower stage 20. (See Figure 2A). In this case, the first substrate 14a and the second substrate 14b are fixed to the stage by a vacuum force transmitted through a plurality of holes (see FIG. 1A) formed on the stage.

A seal layer 16 is formed on the first substrate 14a to fix the two substrates to each other and a liquid crystal 18 is dropped on the second substrate 14b.

Thereafter, the upper stage 10 is lowered to bring the first substrate 14a close to the second substrate 14b, and then the lower stage 20 is translated or rotated in the left and right and front and back directions to form the first substrate 14a And the second substrate 14b are aligned with each other (see FIG. 2B). In this case, use a turbo molecular pump (TMP) or a mechanical booster pump to make the surrounding environment a vacuum environment. When the ambient environment becomes a vacuum environment, the substrate is not fixed to the stage by the vacuum force. Therefore, the substrate is fixed by chucking the stage by the electrostatic force supplied from the electrostatic chuck mounted on the stage.

Thereafter, the first substrate 14a fixed to the upper stage is detached from the upper stage 10, and then the first substrate 14a and the second substrate 14b are attached to each other and the upper stage 10 is raised 2C). In this case, the process of detaching the coalesced substrate is performed by dechucking the coalesced substrate by removing the electrostatic force supplied from the electrostatic chuck. Thereafter, a stable gas such as N ₂ gas is used to uniformly pressurize the bonded substrate (see FIG. 2D). Thereafter, the seal layer 16 is cured by irradiating UV light 24 under the bonded substrate (see Fig. 2E).

All of the processes used in the above-described prior art substrate bonding method are performed under a vacuum environment such as a vacuum chamber.

Since the apparatus and method for bonding a substrate according to the related art described above must be performed under a vacuum environment, equipment such as a vacuum chamber, a vacuum pumping apparatus, an electrostatic chuck, and the like must be essentially used. Therefore, there is a problem that the configuration of the bonding apparatus is complicated, and the bonding process is increased to increase the total time and cost required for the bonding process.

Another conventional technique for solving the problems of the above-described prior art is disclosed in Korean Patent Application No. 10-2011-A, entitled " Glass substrate coalescence method and glass substrate cohesion apparatus " Korean Patent No. 10-1059952 (hereinafter referred to as " 952 patent ") filed as U.S. Patent Application No. 0044754, filed on August 22, 2011,

3 is a flow chart of a glass substrate bonding method according to another prior art 952 patent.

Referring to FIG. 3, in the glass substrate bonding method according to the 952 patent, an optical clear adhesive (OCA) film is formed on a surface of another glass substrate of one of the upper substrate 110 and the lower substrate 120. S1 step of attaching 130; In step S1, the surface on which the optical adhesive film 130 is attached is transferred to one surface of the other glass substrate, and one end of the glass substrate contacts one surface of the other glass substrate before the other end; And a step S3 in which the optical adhesive film 130 is attached to another glass substrate by pressing a surface of the glass substrate on which the optical adhesive film 130 is not attached.

Further, in the method of attaching the glass substrate according to the 952 patent, the lower substrate 120 is seated on the lower stage 100. The upper substrate 110 is detachably adsorbed on the upper stage 200. In addition, the upper stage 200 is pressed using the rollers 221 provided on the upper surface of the upper stage 200. The roller 221 is coupled to a roller conveying unit (not shown) and can move up and down and left and right.

In the above-described method of attaching a glass substrate according to the '952 patent, when the upper substrate 110 comes into contact with one end of the lower substrate 120, the roller 221 is lowered by a roller transfer unit (not shown) So that the upper stage 200 is sequentially pressed to remove the air bubbles between the upper substrate 110 and the lower substrate 120.

The above-described method of attaching a glass substrate according to the 952 patent has an advantage that it is not necessary to use an expensive vacuum equipment, but the following problems still occur.

More specifically, in the method of attaching a glass substrate according to the '952 patent, a transparent optical adhesive (OCA) film 130 is used in lieu of a lacquer to bond the upper substrate 110 and the lower substrate 120 together. The optical adhesive film 130 is a double-sided adhesive film, one side of which is attached to the upper substrate 110 and the other side of which is attached to the lower substrate 120. In this case, when the optical adhesive film 130 adhered on the upper substrate 110 is adhered to the lower substrate 120 by using the rollers 221 after the upper substrate 110 is inclined with respect to the lower substrate 120 , Bubbles that may occur between the optical adhesive film (130) and the lower substrate (120) can be removed. However, since the optical adhesive film 130 itself must be attached to the upper substrate 110 in advance, the surface roughness of the surface of the optical adhesive OCA on the film 130 may cause a difference between the optical adhesive film 130 and the upper substrate 110 There is a high possibility that bubbles are generated. Accordingly, defects may occur in the substrate on which the upper substrate 110 and the lower substrate 120 are bonded.

When the substrate on which the bubbles are generated between the optical adhesive film 130 and the upper substrate 110 is defective, the upper substrate 110 and the lower substrate 120 are separated and then the optical adhesive film 130 is removed. The upper substrate 110 and the lower substrate 120 should be cleaned. Thereafter, the upper substrate 110 and the lower substrate 120 are bonded together using the new optical adhesive film 130 according to the above-described coalescence method. Alternatively, the final substrate on which the failure has occurred should be discarded. As a result, the process time (tact time) of the substrate bonding is increased or the cost is increased.

In addition, in the glass substrate bonding method according to the 952 patent, the pressing force by the roller 221 is directly transmitted to the upper substrate 110 adsorbed to the upper stage 200 and the lower substrate 120 adsorbed to the lower stage 100. . Accordingly, if the pressing force applied by the roller 221 is not precisely controlled, damage may occur to the upper substrate 110 and / or the lower substrate 120 which are vulnerable to pressure, which may cause the failure of the final bonded substrate. It can be cause.

Therefore, there is a need for a new method for solving the problems of the above-described prior art substrate sticking method.

Korean Patent Publication No. 10-2008-0062424 Korean Patent No. 10-1059952

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem, and forms a closed boundary seal line along the side edge portion of the lower substrate, and simultaneously cures the closed boundary seal line while simultaneously coating the adhesive solution inside the closed boundary seal line. Thereafter, the upper substrate is placed in an inclined state with the lower substrate, and then the upper substrate is pressed onto the lower substrate by contact or non-contact method using a pressing device such as a roller or an air curtain generating device, By curing the bonding liquid together, the upper substrate and the lower substrate are firmly bonded, foreign matter or bubbles are prevented between the upper substrate and the lower substrate, the number of bonding processes and the tact time are reduced, and the vacuum device This eliminates the need for expensive equipment such as simplifies the construction of the cementing device, reduces costs, and The possibility to provide a significantly reduced the improved apparatus and a substrate attached to each other cementation method.

A substrate bonding apparatus according to a first aspect of the present invention includes a stage on which a lower substrate is mounted; A first nozzle arrangement for applying a first adhesive liquid to form a closed boundary seal line along the side edge portion of the lower substrate; A second nozzle device for totally applying a second bonding liquid in the closed boundary seal line; A curing apparatus for applying the second bonding liquid into the closed boundary seal line and simultaneously curing the first bonding liquid and the second bonding liquid together; A moving member for moving the upper substrate onto the lower substrate; A pair of supporting members provided on the stage and supporting the upper substrate moved by the moving member in an inclined state with respect to the lower substrate; And a pressurizing device configured to move while pressing the upper surface of the upper substrate in a contact manner or a non-contact manner to form a compressed substrate on which the upper substrate and the lower substrate are compressed. The bonding liquid is characterized in that it is cured by the curing device or a second curing device provided separately.

According to a second aspect of the invention, a) applying a first coalesced liquid to form a closed boundary seal line along a side edge portion of a lower substrate mounted on a stage using a first nozzle device; b) preliminarily applying the second adhesive liquid into the closed boundary seal line using a second nozzle device while simultaneously curing the first adhesive liquid and the second adhesive liquid together using a curing apparatus; c) moving the upper substrate onto the lower substrate using a transfer device to support the upper substrate in an inclined state with respect to the lower substrate; d) moving the upper surface of the upper substrate while pressing in a contact manner or a non-contact manner using a pressing device to obtain a compressed substrate; And e) using the curing device to cure the temporary hardened closed boundary seal line and the second bonding liquid in the crimped substrate together.

Using the improved substrate bonding apparatus and the bonding method according to the present invention, the following effects are achieved.

1. While the upper and lower substrates are firmly bonded, foreign substances or bubbles are prevented between the upper and lower substrates.

2. The tact time is greatly reduced.

3. The use of expensive equipment, such as vacuum devices, is unnecessary, which simplifies the construction of the cementing device and reduces costs.

4. The likelihood of failure of the final product is greatly reduced.

Further advantages of the present invention can be clearly understood from the following description with reference to the accompanying drawings, in which like or similar reference numerals denote like elements.

1 is a perspective view showing a base plate according to the prior art.
FIGS. 2A to 2E are views showing a method of attaching a substrate by using a substrate bonding apparatus having a planar stage according to the related art.
3 is a flow chart of a glass substrate bonding method according to another prior art.
4A to 4G are views for explaining a substrate bonding apparatus and method according to an embodiment of the present invention.
5 is a flowchart of a substrate bonding method according to an embodiment of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described with reference to embodiments and drawings of the present invention.

4A to 4G are views for explaining a substrate bonding apparatus and method according to an embodiment of the present invention.

4A to 4G, the substrate bonding apparatus 400 according to an embodiment of the present invention includes a stage 100 on which a lower substrate 420 is mounted; A first nozzle device (440) for applying a first bonding liquid to form a closed boundary seal line (422) along the side edge portion of the lower substrate (420); A second nozzle device 445 for totally applying a second bonding liquid 430 in the closed boundary seal line 422; A curing device 450 for applying the second bonding liquid 430 into the closed boundary seal line 422 and simultaneously curing the first bonding liquid and the second bonding liquid 430 together; A moving member (not shown) for moving the upper substrate 410 onto the lower substrate 420; A pair of support members (412) provided on the stage (100) for supporting the upper substrate (410) moved by the moving member (not shown) with respect to the lower substrate (420); And a pressing device 421 which moves while pressing the upper surface of the upper substrate 410 in a contact or non-contact manner to form a compressed substrate 415 in which the upper substrate 410 and the lower substrate 420 are compressed. And the temporary hardened closed boundary seal line 422 and the second bonding liquid 430 are cured by the curing apparatus 450 or a second curing apparatus (not shown) provided separately. do.

In one embodiment of the present invention described above, the operation of applying the second adhesive liquid 430 in the closed boundary seal line 422 is performed by the first nozzle device 440 instead of the second nozzle device 445. Note that you can. In this case, the first bonding liquid and the second bonding liquid 430 forming the closed boundary seal line 422 are the same bonding liquid.

In addition, the pressurizing device 421 is embodied by a roller 421a that moves while pressing the upper surface of the upper substrate 410 in a contact manner or moves air while pressing the upper surface of the upper substrate 410 in a non-contact manner. It may be implemented as a curtain generating device (421b).

In addition, the moving member (not shown) of the upper substrate 410 used in the embodiment of the present invention is a pick-up element that is detachable using a robot arm or a vacuum, for example. Can be implemented.

Hereinafter, a substrate bonding method according to an embodiment of the present invention will be described in detail.

Referring back to FIGS. 4A-4G, in the substrate bonding method according to an embodiment of the present invention, first, the side edges of the lower substrate 420 mounted on the stage 100 using the first nozzle device 440. The first coalescent is applied to form a closed boundary sealline 422 along the portion (see FIG. 4A). In this case, the first bonding liquid may be made of the same or different material as the second bonding liquid 430. Moreover, the stage 100 and the gantry G are located on the base member B, and the 2nd nozzle apparatus 445 and the hardening apparatus 450 are attached to the gantry G (refer FIG. 4B). . It should be noted that in the embodiment of the present invention, the base member B and the gantry G are shown only in Fig. 4B for convenience of explanation.

Thereafter, using the second nozzle device 445 and the curing device 450 mounted on the gantry G, the second bonding liquid 430 is completely applied inside the closed boundary seal line 422, and at the same time, the first Temporarily hardening the cemented solution and the second cemented solution 430 together (see FIG. 4C). The curing device 450 may be implemented by, for example, an ultraviolet (UV) irradiation device. It should also be noted that a second nozzle arrangement 445 may be used instead of the first nozzle arrangement 440 to apply the first coalescing fluid forming the closed boundary sealline 422. In addition, each of the first nozzle device 440 and the second nozzle device 445 may be implemented as, for example, a slit die nozzle.

The upper substrate 410 is then moved onto the lower substrate 420 using a transfer device (not shown) (see FIG. 4D). In this case, the upper substrate 410 is supported by a pair of support members 412 provided on the stage 100. To this end, the pair of support members 412 may include a plurality of first and second support pins 412a and 412b, respectively. The height of the plurality of first support pins 412a is lower than the height of the plurality of second support pins 412b. Therefore, when the upper substrate 410 is moved onto the lower substrate 420 by a moving member (not shown), the upper substrate 410 is inclined by the plurality of first and second support pins 412a and 412b. Supported. Typically, the size of the upper substrate 410 is larger than the size of the lower substrate 420. At this time, one end (left end in FIG. 2D) of the upper substrate 410 is in contact with one end of the lower substrate 420 (not shown) or is slightly spaced apart as shown in FIG. 4D. .

Thereafter, the upper surface of the upper substrate 410 is pressed using the pressurizing device 421 by a contact method (when using the roller 421a) or a non-contact method (when using the air curtain generating device 421b). While moving (see FIG. 4E). At this time, as the pressing device 421 moves while pressing in a contact manner or a non-contact manner along the surface on the upper substrate 410 in an inclined state, a plurality of second support pins 412b (one end of the upper substrate 410). Is in contact with one end of the lower substrate 420, or a plurality of first and second support pins 412a and 412b (one end of the upper substrate 410 is connected to one end of the lower substrate 420). The spaced (non-contact) state is lowered to a height substantially equal to the surface height of the lower substrate 420 (see FIG. 4F). As a result, a compressed substrate 415 is obtained in which the upper substrate 410 and the lower substrate 420 are compressed.

Thereafter, by using the above-described curing apparatus 450, the temporary hardened closed boundary seal line 422 inside the crimp substrate 415 and the second bonding liquid 430 therein are cured together (mainly hardened). Thus, the bonded substrate 415a is obtained (see FIG. 4G). Alternatively, the crimped substrate 415 shown in FIG. 4F may be transferred to a second curing device (not shown) provided separately and then tapered closed boundary seal line inside the crimping substrate 415 by the second curing device. The bonding substrate 415a may be finally obtained by curing (main curing) the 422 and the second bonding liquid 430 therein together.

As described above, in the embodiment of the present invention, since the bonding liquid 430 is applied in the closed boundary seal line 422 and temporarily hardened, the upper substrate 410 and the lower substrate ( When squeezing 420, the coalescing liquid 430 is compressed in a very uniform state between the upper substrate 410 and the lower substrate 420 without leaving the closed boundary sealline 422. Accordingly, a uniform bonding force is formed over the entire bonding surfaces of the upper substrate 410 and the lower substrate 420 so that the upper substrate 410 and the lower substrate 420 may be firmly bonded.

In addition, since the closed boundary seal line 422 and the second bonding liquid 430 therein are temporarily hardened at the same time, the flatness of the upper surface of the bonding liquid 430 is formed very uniformly. Accordingly, the possibility of bubbles occurring between the lower surface of the upper substrate 410 and the upper surface of the second bonding liquid 430 is minimized or substantially eliminated, so that the failure of the final product (ie, the bonding substrate 415a) may occur. This is greatly reduced.

5 is a flowchart of a substrate bonding method according to an embodiment of the present invention.

Referring to FIG. 5 along with FIGS. 4A to 4G, a substrate bonding method 500 according to an embodiment of the present invention may include a) a lower substrate mounted on the stage 100 using the first nozzle device 440. Applying (510) the first coalescent to form a closed boundary sealline (422) along the side edge portion of 420; b) using the second nozzle device 445 to apply the entire surface of the second bonding liquid 430 to the inside of the closed boundary seal line 422, and simultaneously using the curing apparatus 450, the first bonding liquid and the Temporarily curing (520) the second coalescing solution (430) together; c) moving the upper substrate 410 onto the lower substrate 420 by using a transfer device (not shown) to support the upper substrate 410 in an inclined state with respect to the lower substrate 420 ( 530); d) using a pressing device 421 to move the upper surface of the upper substrate 410 while pressing in a contact manner or a non-contact manner to obtain a compressed substrate 415 (540); And e) curing (550) the temporary hardened closed boundary sealline 422 and the second cemented liquid 430 together within the crimp substrate 415 using the curing device 450. do.

In the substrate bonding method 500 according to the embodiment of the present invention described above, the first bonding liquid and the second bonding liquid 430 may be the same bonding liquid.

In addition, in the step d) of the substrate bonding method 500 according to an embodiment of the present invention, in the case of the contact method, the pressing device 421 is implemented by a roller 421a, and in the case of the non-contact method, the pressing It is the case that the device 421 is implemented with the air curtain generating device 421b.

Further, in the step c) of the substrate bonding method 500 according to an embodiment of the present invention, the inclined state of the upper substrate 410 is a pair of supporting members 412 provided on the stage 100. ) Is formed by the height difference of the plurality of first and second support pins (412a, 412b) respectively provided.

In addition, in the substrate bonding method 500 according to an embodiment of the present invention, the step e) may be performed by a second curing apparatus provided separately.

In addition, in the step a) of the substrate bonding method 500 according to an embodiment of the present invention, the closed boundary seal line 422 may be formed by applying a sealant.

As described above, in the present invention, while the upper substrate and the lower substrate are firmly bonded, foreign matters or bubbles are prevented between the upper substrate and the lower substrate, the bonding time is greatly reduced, and a high price such as a vacuum device. This eliminates the need for the use of equipment, which simplifies the construction of the cementation apparatus, reduces costs, and significantly reduces the likelihood of defective product.

Various modifications may be made by those skilled in the art without departing from the spirit and scope of the invention as defined by the following claims. It is not. Accordingly, the scope of the present invention should not be limited by the above-described exemplary embodiments, but should be determined only in accordance with the following claims and their equivalents.

1: plate 2: hole 10, 20, 100, 200: stage
14a, 14b, 110, 120, 410, 420: substrate 16: seal layer 18: liquid crystal
130: optical adhesive film 221,421a: roller
400: substrate bonding apparatus 412: support member
412a, 412b: support pin 415: crimp substrate
415a: bonding substrate 421: pressing device
421b: air curtain generator 422: closed boundary seal line
430: bonding liquid 440,445: nozzle device
450: curing device B: base member G: gantry

Claims (14)

In the substrate bonding apparatus,
A stage on which the lower substrate is mounted;
A first nozzle arrangement for applying a first adhesive liquid to form a closed boundary seal line along the side edge portion of the lower substrate;
A second nozzle device for totally applying a second bonding liquid in the closed boundary seal line;
A curing apparatus for applying the second bonding liquid into the closed boundary seal line and simultaneously curing the first bonding liquid and the second bonding liquid together;
A moving member for moving the upper substrate onto the lower substrate;
A pair of supporting members provided on the stage and supporting the upper substrate moved by the moving member in an inclined state with respect to the lower substrate; And
A pressing device which moves while pressing the upper surface of the upper substrate in a contact manner or a non-contact manner to form a compressed substrate on which the upper substrate and the lower substrate are compressed;
Lt; / RTI >
The temporary hardened closed seal line and the second coalescing liquid are cured by the curing device or a second curing device provided separately.
Substrate bonding device. The method of claim 1,
A substrate bonding apparatus, wherein said first bonding liquid and said second bonding liquid are the same bonding liquid. The method of claim 1,
And the first nozzle device and the second nozzle device are each formed of a slit die nozzle. The method of claim 1,
In the case of the contact method, the pressing device is implemented by a roller,
In the case of the non-contact type, the pressing device is implemented as an air curtain generating device
Substrate bonding device. The method of claim 1,
And the closed boundary seal line is sealant. The method of claim 1,
And the second nozzle device and the curing device are each attached to a gantry. 7. The method according to any one of claims 1 to 6,
The pair of support members each include a plurality of first and second support pins, wherein the plurality of first support pins have different heights from the plurality of second support pins. 8. The method of claim 7,
And / or one of the plurality of first and second support pins descends to the same height as the surface height of the lower substrate as the pressing device moves along the surface on the upper substrate. In the method for bonding a substrate,
a) applying a first coalescing liquid to form a closed boundary seal line along the side edge portion of the lower substrate mounted on the stage using the first nozzle device;
b) preliminarily applying the second adhesive liquid into the closed boundary seal line using a second nozzle device while simultaneously curing the first adhesive liquid and the second adhesive liquid together using a curing apparatus;
c) moving said upper substrate onto said lower substrate using a transfer device to support said upper substrate in an inclined state relative to said lower substrate;
d) moving the upper surface of the upper substrate while pressing in a contact manner or a non-contact manner using a pressing device to obtain a compressed substrate; And
e) using the curing device to cure the temporary hardened closed boundary seal line inside the crimped substrate and the second bonding liquid together.
≪ / RTI > The method of claim 9,
And the first bonding liquid and the second bonding liquid are the same bonding liquid. The method of claim 9,
And substrate e) performed by a second curing device in which step e) is provided separately. The method of claim 9,
In the step c), the inclined state of the upper substrate is a substrate bonding method formed by the height difference of the plurality of first and second support pins respectively provided on the pair of support members provided on the stage. The method of claim 9,
In the step d), in the case of the contact method, the pressing device is implemented by a roller, in the case of the non-contact method, the pressing device is implemented with an air curtain generating device substrate bonding method. 14. The method according to any one of claims 9 to 13,
And in step a), said closed boundary seal line is formed sealant.

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