KR20130078420A - Light emitting device module and lighting system including the same - Google Patents

Abstract

PURPOSE: A light emitting device module and a lighting system including the same are provided to prevent glariness by forming a light emitting device package on an inclined surface. CONSTITUTION: Substrates (210) have inclined surfaces. A light emitting device is positioned on one surface of the substrate. The surfaces of the substrate face each other. A reflector (231,232) faces one surface of the substrate. The reflector reflects the light emitted from the light emitting device.

Description

Light emitting device module and lighting system including the same

The embodiment provides a light emitting device module and an illumination system including the same.

BACKGROUND ART Light emitting devices such as a light emitting diode (LD) or a laser diode using semiconductor materials of Group 3-5 or 2-6 group semiconductors are widely used for various colors such as red, green, blue, and ultraviolet And it is possible to realize white light rays with high efficiency by using fluorescent materials or colors, and it is possible to realize low energy consumption, semi-permanent life time, quick response speed, safety and environment friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps .

Therefore, a transmission module of the optical communication means, a light emitting diode backlight replacing a cold cathode fluorescent lamp (CCFL) constituting a backlight of an LCD (Liquid Crystal Display) display device, a white light emitting element capable of replacing a fluorescent lamp or an incandescent lamp Diode lighting, automotive headlights, and traffic lights.

The light emitting device emits light having energy determined by an energy band inherent in a material in which electrons injected through the first conductive semiconductor layer and holes injected through the second conductive semiconductor layer meet each other to form an active layer (light emitting layer). do. In the light emitting device package, the phosphor is excited by the light emitted from the light emitting device to emit light having a longer wavelength region than the light emitted from the active layer.

In order to increase the amount of light of the light emitting device package, two or more light emitting devices may be disposed in a single light emitting device package. In this case, glare may increase due to the straightness of the light emitted from the light emitting device, and may increase the area of the substrate or the electrode. There is a problem that the length is increased.

The embodiment is intended to reduce glare due to the linearity of light in the light emitting device module and to reduce the area to the length of the substrate and the electrode.

Embodiments include a plurality of substrates having an inclined surface, and a plurality of light emitting elements positioned on one surface of the substrate; The other surface of the substrate is disposed to face each other, facing one surface of the substrate, and provides a light emitting device module including a reflector reflecting light emitted from the plurality of light emitting devices.

The reflecting plates may be disposed to face each other with the plurality of substrates interposed therebetween.

The light emitting device module may further include a first electrode, a second electrode, and a third electrode respectively disposed on the plurality of substrates.

The first electrode and the second electrode may be electrically connected to the plurality of light emitting devices, respectively.

At least one of the first electrode and the second electrode may be disposed to extend on the bottom surface of the substrate.

The reflector may be positioned on the plurality of substrates, and a lens may be positioned on the reflector.

The third electrode may be electrically connected to the plurality of light emitting devices.

The plurality of substrates may be electrically connected to each other through the third electrode and the conductive member.

The height of the highest point of the reflector may be lower than the height of the substrate.

Another embodiment provides an illumination system including the light emitting device module described above.

In the light emitting device module according to the embodiments, since the light emitting device or the light emitting device package is disposed on the inclined surface, the direct light is emitted to the side of the light emitting device module and the indirect light whose path is changed by the reflecting plate is emitted to the top, thereby widening the wide angle and glaring. And the volume of the substrate is increased by the volume by the space formed by the inclined surface and the connecting surface, thereby improving heat dissipation, and the length and area of the electrode are reduced since the substrate forms the inclined surface and the lead frame is disposed on the inclined surface. can do.

1 is a view showing an embodiment of a light emitting device module,
2 is a view showing a light emitting device package disposed in the light emitting device module of FIG.
3 is an enlarged view of a portion 'A' of FIG. 1,
4 is a view showing an embodiment of the light emitting device of FIG.
5A and 5B are views illustrating one embodiment of the reflector of FIG. 1;
6 is a view showing a light exit angle of the light emitting device module of FIG.
7 and 8 are views showing another embodiment of the light emitting device module,
9 is a view showing an embodiment of a head lamp including a light emitting device package,
10 is a diagram illustrating an embodiment of an image display device including a light emitting device package.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

In the description of the embodiment according to the present invention, when described as being formed on the "on or under" of each element, the (up) or down (on) or under) includes both two elements being directly contacted with each other or one or more other elements are formed indirectly between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. In addition, the size of each component does not necessarily reflect the actual size.

1 is a view showing an embodiment of a light emitting device module, Figure 2 is a view showing a light emitting device package disposed in the light emitting device module of Figure 1, Figure 3 is an enlarged view 'A' portion of FIG. .

The light emitting device module according to the embodiment includes a substrate 210, a pair of light emitting device packages 100 disposed on the substrate, and a pair of reflecting plates 231 and 232 reflecting light emitted from each light emitting device package. It is done by A plurality of inclined surfaces are disposed on the substrate 210, and the light emitting device packages 100 are disposed on the inclined surfaces.

When the surface on which the light emitting device package 100 is disposed on the substrate 210 is one surface, the surface on which the reflector is described below is disposed may be referred to as the other surface. In FIG. 1, the other surfaces face each other, and the reflector described later is also described. The substrate 210 may be disposed to face one surface of the substrate 210.

The substrate 210 has a bottom surface a, a pair of inclined surfaces b inclined at an angle θ ₁ with respect to the bottom surface a, and a connection surface c connecting the vertices of the inclined surface b. It can be made, including). The connection surface (c) may be parallel to the bottom surface (a), so the angle (θ ₁ ) between the bottom surface (a) and the inclined surface (b) and the angle between the inclined surface (b) and the connection surface (c) ( θ ₂ ) may be an angled relationship.

The bottom surface (a), the inclined surface (b) and the connection surface (c) may be referred to as substrates, respectively, and the plurality of substrates may be electrically connected to the third electrode and the conductive member (not shown).

The reflecting plates 231 and 232 are disposed to face each other with the inclined surface b interposed therebetween, respectively, to reflect the light emitted from the light emitting device package 100 to adjust the direction of light emitted from the light emitting device module 200. Can be.

First, second, and third electrodes 221, 222, and 223 are disposed on the substrate 210 to supply current to the pair of light emitting device packages 100. In detail, the bottom surface a, the inclined surface b, and the connection are provided. First, second and third electrodes 221, 222, and 223 may be disposed on the surface c.

The first electrode 221 may be disposed on one inclined surface b and may extend to the bottom surface a adjacent to the inclined surface b. The second electrode 222 may be disposed on another inclined surface b and may extend to the bottom surface a adjacent to the inclined surface b. The third electrode 223 may be disposed on the third connection surface c and a part of the third electrode 223 may be extended to the inclined surface b.

The first electrode 221 and the second electrode 222 are electrically connected to different light emitting device packages 100, and the third electrode 223 is all connected to the pair of light emitting device packages 100. Can serve as a common electrode. Accordingly, the first electrode 221 and the second electrode 222 may have the same polarity, and the third electrode 223 may have a different polarity than the first and second electrodes 221 and 222.

In addition, the height h ₂ of the reflective plates 231 and 232 may be lower than the height h ₁ of the connection surface c. The height (h ₁₎ of the reflective plate connection and the height (h ₂₎ of the (231, 232) plane (c) stands for the height from the bottom surface (a) of the substrate (210). Since the height h ₂ of the reflecting plates 231 and 232 is lower than the height h ₁ of the connection surface c, the angle of the light emitted from the light emitting device module can be adjusted more widely than otherwise.

The height h ₂ of the reflector plates 231 and 232 may be the same as the height of the light emitting device disposed in the light emitting device package 100. In this case, the light emitted from the light emitting device may proceed side by side in the left and right directions. The angle of light emitted from the module 200 may be widened.

The light emitting device package 100 may include a package body 110, a first lead frame 121 and a second lead frame 122 installed on the package body 110, and a package body 110. The light emitting device 130 is electrically connected to the frame 121 and the second lead frame 122, and a molding part 150 covering the surface or the side surface of the light emitting device 130.

The package body 110 may include a silicon material, a synthetic resin material, or a metal material. An inclined surface may be formed around the light emitting device 130 to increase light extraction efficiency.

The first lead frame 121 and the second lead frame 122 are electrically separated from each other, and provide power to the light emitting device 130. In addition, the first lead frame 121 and the second lead frame 122 may increase the light efficiency by reflecting the light generated from the light emitting device 130, the heat generated from the light emitting device 130 to the outside It can also play a role.

The light emitting device 130 may be a horizontal light emitting device, a vertical light emitting device, or the like, and one or two or more light emitting devices may be mounted and disposed on the package body 110 or the first lead frame 121 or the second light emitting device. It is disposed on the lead frame 122, it is disposed on the first lead frame 121 through the conductive adhesive layer 130 in FIG.

The light emitting device 130 may be electrically connected to the first lead frame 121 and the second lead frame 122 by any one of a wire method, a flip chip method, or a die bonding method. In FIG. 2, the light emitting device 130 is connected to the first lead frame 121 and the conductive adhesive layer 130 and is bonded to the second lead frame 122 and the wire 140.

The molding part 150 may surround and protect the light emitting device 130. In addition, the molding unit 150 may include a wavelength conversion material such as a phosphor, and may be excited by light of a first wavelength region emitted from the light emitting device 130 to emit light of a second wavelength region having a longer wavelength. . The molding part 150 may act as a lens for changing the path of the light emitted from the light emitting device 130.

 In FIG. 3, a connection state between the light emitting device package 100 and the first and third electrodes 221 and 223 is illustrated.

The first electrode 221 disposed on one inclined surface b and extending to the bottom surface a adjacent to the inclined surface b is electrically connected to the first lead frame 121 in the light emitting device package 100. Is connected. In addition, the third electrode 223 disposed on the third connection surface c and a part of which extends on the inclined surface b is electrically connected to the second lead frame 222 in the light emitting device package 100. It is becoming.

The light emitting device package 100 is coupled through the inclined surface a of the substrate 210 and the adhesive layer 241. The adhesive layer 241 is disposed between the first electrode 221 and the third electrode 223, thereby preventing It may be malleable.

The reflective plate 231 may cover a portion of the first electrode 221 extending on the bottom surface a and may improve light efficiency of the light emitting device module.

4 is a diagram illustrating an embodiment of the light emitting device of FIG. 3.

In the light emitting device 130 according to the embodiment shown in FIG. 4, the bonding layer 60, the reflective layer 50, the ohmic layer 40, and the light emitting structure 20 are stacked on a conductive support substrate 70. It is done.

Since the conductive support substrate 70 may serve as a second electrode, a metal having excellent electrical conductivity may be used, and a metal having high thermal conductivity may be used because it must be able to sufficiently dissipate heat generated when the light emitting device is operated.

The conductive support substrate 70 may be made of a material selected from the group consisting of molybdenum (Mo), silicon (Si), tungsten (W), copper (Cu), and aluminum (Al) or alloys thereof. , Gold (Au), copper alloy (Cu Alloy), nickel (Ni), copper-tungsten (Cu-W), carrier wafers (e.g. GaN, Si, Ge, GaAs, ZnO, SiGe, SiC, SiGe, Ga ₂ O _3, etc.) may be optionally included.

In addition, the conductive support substrate 70 may have a mechanical strength enough to separate well into separate chips through a scribing process and a breaking process without causing warpage to the entire nitride semiconductor. have.

The bonding layer 60 may combine the reflective layer 50 and the conductive support substrate 70, and the reflective layer 50 may function as an adhesion layer. The bonding layer is composed of (60) gold (Au), tin (Sn), indium (In), aluminum (Al), silicon (Si), silver (Ag), nickel (Ni), and copper (Cu). It may be formed of a material selected from or alloys thereof.

The reflective layer 50 may be about 2500 angs thick. The reflective layer 50 may be formed of a metal layer including aluminum (Al), silver (Ag), nickel (Ni), platinum (Pt), rhodium (Rh), or an alloy containing Al, Ag, Pt, or Rh. have. Aluminum or silver may effectively reflect light generated from the active layer 24, thereby greatly improving the light extraction efficiency of the light emitting device.

Since the light emitting structure 20, in particular, the second conductivity-type semiconductor layer 26 has a low impurity doping concentration and a high contact resistance, and thus may have poor ohmic characteristics, the ohmic layer 40 may be improved. Transparent electrodes and the like can be formed.

The ohmic layer 40 may be about 200 angstroms thick. The ohmic layer 40 may include indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), indium aluminum zinc oxide (IAZO), indium gallium zinc oxide (IGZO), and indium gallium tin (IGTO). oxide), aluminum zinc oxide (AZO), antimony tin oxide (ATO), gallium zinc oxide (GZO), IZO (IZO Nitride), AGZO (Al-Ga ZnO), IGZO (In-Ga ZnO), ZnO, IrOx, RuOx, NiO, RuOx / ITO, Ni / IrOx / Au, and Ni / IrOx / Au / ITO, Ag, Ni, Cr, Ti, Al, Rh, Pd, Ir, Sn, In, Ru, Mg, Zn, Pt At least one of Au, Hf, and the like may be formed, and the material is not limited thereto.

The light emitting structure 20 is formed on the first conductive semiconductor layer 22 and the first conductive semiconductor layer 22 and the active layer 24 emitting light and the second formed on the active layer 24. And a conductive semiconductor layer 26.

The first conductivity type semiconductor layer 22 may be implemented as a group III-V compound semiconductor doped with a first conductivity type dopant, and when the first conductivity type semiconductor layer 22 is an N-type semiconductor layer, The first conductive dopant may be an N-type dopant and may include Si, Ge, Sn, Se, or Te, but is not limited thereto.

The first conductive semiconductor layer 22 may be formed of a semiconductor material having a compositional formula of Al _x In _y Ga _(1-xy) N (0 ≦ x ≦ 1, 0 ≦ y ≦ 1, 0 ≦ x + y ≦ 1). It may include. The first conductive semiconductor layer 22 may be formed of any one or more of GaN, InN, AlN, InGaN, AlGaN, InAlGaN, AlInN, AlGaAs, InGaAs, AlInGaAs, GaP, AlGaP, InGaP, AlInGaP, InP.

In the active layer 24, electrons injected through the first conductive semiconductor layer 22 and holes injected through the second conductive semiconductor layer 26 formed thereafter meet each other to form an energy band inherent to the active layer (light emitting layer) material. The layer may emit light having energy determined by the light, and the light emitted from the active layer 24 may emit light in the ultraviolet region in addition to the visible region.

The active layer 24 may be formed of at least one of a single quantum well structure, a multi quantum well structure (MQW), a quantum-wire structure, or a quantum dot structure. For example, the active layer 24 may include trimethyl gallium gas (TMGa), ammonia gas (NH ₃ ), nitrogen gas (N ₂ ), and trimethyl indium gas (TMIn) to form a multi-quantum well structure. It is not limited to this.

The well layer / barrier layer of the active layer 24 is formed of one or more pair structures of InGaN / GaN, InGaN / InGaN, GaN / AlGaN, InAlGaN / GaN, GaAs (InGaAs) / AlGaAs, GaP (InGaP) / AlGaP. But it is not limited thereto. The well layer may be formed of a material having a lower band gap than the band gap of the barrier layer.

A conductive cladding layer (not shown) may be formed on or under the active layer 24. The conductive clad layer may be formed of an AlGaN-based semiconductor, and may have a higher band gap than the band gap of the active layer 24.

The second conductive type semiconductor layer 26 is a second conductive type dopant is doped III-V compound semiconductor, for example _{-5, In x Al y Ga 1 -x-} y N (0≤x≤1, 0≤y≤ And 1, 0 ≦ x + y ≦ 1). When the second conductive semiconductor layer 26 is a P-type semiconductor layer, the second conductive dopant may include Mg, Zn, Ca, Sr, Ba, or the like as a P-type dopant.

The first electrode 80 may be formed on the light emitting structure 20, that is, on the surface of the first conductive semiconductor layer 22, and includes aluminum (Al), titanium (Ti), chromium (Cr), and nickel ( Ni), copper (Cu), and gold (Au) may be formed to have a single layer or a multilayer structure.

A passivation layer 90 may be formed on the side surface of the light emitting structure 20.

The passivation layer 90 may be made of an insulating material, and the insulating material may be made of an oxide or nitride which is non-conductive. As an example, the passivation layer 90 may be formed of a silicon oxide (SiO ₂ ) layer, an oxynitride layer, and an aluminum oxide layer. In addition to the vertical light emitting device 130 illustrated in FIG. 4, a horizontal light emitting device may be disposed.

5A and 5B illustrate exemplary embodiments of the reflector of FIG. 1.

In FIG. 5A, the reflection surface R inside the reflection plate 231 reflects the light emitted from the light emitting device package, the reflection surface R may have a parabolic shape, and the reflection plate 231 may have a light reflectance. This excellent aluminum or silver can be made.

In the embodiment illustrated in FIG. 5B, the reflective surface 231a is separately coated on the reflective plate 231, and the reflective surface 231a may have silver, aluminum, or the like having excellent light reflectance on the inner surface of the reflective plate 231. have.

6 is a view illustrating a light exit angle of the light emitting device module of FIG. 5. Among the light emitted from the light emitting device module 200, an angle formed by the light ₁ traveling in the leftmost direction and the light ₂ traveling in the rightmost direction may be 140 degrees.

If the height h ₂ of the reflecting plates 231 and 232 is the same as the height of the light emitting device disposed in the light emitting device package 100, the light emitted from the light emitting device may proceed side by side in the left and right directions so that the light emitting device module ( The angle of light emitted from 200 may be 180 degrees.

7 and 8 illustrate another embodiment of a light emitting device module.

In the light emitting device module 200 illustrated in FIG. 7, a lens 260 may be disposed at an upper portion thereof to change a light propagation path. The lens 260 may be supported by the reflecting plates 231 and 232, and may be made of a transparent resin, a silicone resin, or the like, and may include a wavelength conversion material such as a phosphor.

8 is similar to the embodiment of FIG. 7, but an air gap may be disposed between the light emitting device package 100 and the lens 260. The path of exiting light by the action of the air gap may be different from the embodiment shown in FIG. 7.

In the light emitting device module according to the embodiments described above, since the light emitting device or the light emitting device package is disposed on the inclined surface, the direct light is emitted to the side of the light emitting device module and the indirect light whose path is changed by the reflecting plate is emitted to the upper part so that the wide angle is wide. To prevent glare. In addition, the volume of the substrate is increased by the volume corresponding to the space formed by the inclined surface and the connecting surface, thereby improving heat dissipation characteristics. In addition, since the substrate forms an inclined surface and the lead frame is disposed on the inclined surface, the length to the area of the electrode may be reduced.

A plurality of light emitting device modules according to the embodiment may be arrayed, and a light guide plate, a prism sheet, a diffusion sheet, or the like, which is an optical member, may be disposed on an optical path of the light emitting device module. The light emitting device module, the substrate, and the optical member may function as a light unit.

Yet another embodiment may be implemented as a display device, an indicator device, or a lighting system including the semiconductor light emitting device or the light emitting device module described in the above embodiments, for example, the lighting system may include a lamp, a street lamp. . Hereinafter, a head lamp and a backlight unit will be described as an embodiment of a lighting system in which the above-described light emitting device module is disposed.

9 is a diagram illustrating an embodiment of a head lamp including a light emitting device package.

The light emitted from the light emitting device module 401 in which the light emitting device package is disposed is reflected by the reflector 402 and the shade 403 and then transmitted through the lens 404 to the front of the vehicle body You can head.

As described above, the head lamp according to the embodiment may have a wider angle in the light emitting device module, prevent glare, and reduce the length of the substrate and the electrode.

10 is a diagram illustrating an embodiment of a display device including a light emitting device module.

As shown, the display device 500 according to the present exemplary embodiment includes a light emitting device module, a reflecting plate 520 on the bottom cover 510, and light disposed in front of the reflecting plate 520 and emitted from the light source module. A light guide plate 540 for guiding the front of the display device, a first prism sheet 550 and a second prism sheet 560 disposed in front of the light guide plate 540, and a front of the second prism sheet 560. And a color filter 580 disposed throughout the panel 570.

The light emitting device module includes a light emitting device package 535 on the circuit board 530. Here, the circuit board 530 may be a PCB, etc., the specific arrangement of the light emitting device package 535 is as described above.

The bottom cover 510 may accommodate components in the display device 500. The reflective plate 520 may be formed as a separate component as shown in the drawing, or may be provided on the rear surface of the light guide plate 540 or on the front surface of the bottom cover 510 with a highly reflective material.

The reflector 520 can be made of a material having a high reflectance and can be used in an ultra-thin shape, and a polyethylene terephthalate (PET) can be used.

The light guide plate 540 scatters the light emitted from the light emitting device package module so that the light is uniformly distributed over the entire screen area of the LCD. Accordingly, the light guide plate 530 is made of a material having a good refractive index and transmittance. The light guide plate 530 may be formed of poly methylmethacrylate (PMMA), polycarbonate (PC), or polyethylene (PE). Also, if the light guide plate 540 is omitted, an air guide display device can be realized.

The first prism sheet 550 is formed on one side of the support film with a translucent and elastic polymer material. The polymer may have a prism layer in which a plurality of steric structures are repeatedly formed. Here, the plurality of patterns may be provided in the stripe type and the valley repeatedly as shown.

In the second prism sheet 560, a direction of a floor and a valley of one side of the supporting film may be perpendicular to a direction of a floor and a valley of one side of the supporting film in the first prism sheet 550. This is for evenly distributing the light transmitted from the light source module and the reflective sheet in all directions of the panel 570.

In this embodiment, the first prism sheet 550 and the second prism sheet 560 constitute an optical sheet, which may be made of other combinations, for example, a microlens array or a combination of a diffusion sheet and a microlens array Or a combination of one prism sheet and a microlens array, or the like.

A liquid crystal display (LCD) panel may be disposed on the panel 570. In addition to the liquid crystal display panel 560, other types of display devices requiring a light source may be provided.

In the panel 570, a liquid crystal is positioned between glass bodies, and a polarizing plate is placed on both glass bodies to utilize the polarization of light. Here, the liquid crystal has an intermediate property between a liquid and a solid, and liquid crystals, which are organic molecules having fluidity like a liquid, are regularly arranged like crystals. The liquid crystal has a structure in which the molecular arrangement is changed by an external electric field And displays an image.

A liquid crystal display panel used in a display device is an active matrix type, and a transistor is used as a switch for controlling a voltage supplied to each pixel.

A color filter 580 is provided on the front surface of the panel 570 so that only the red, green, and blue light is transmitted through the panel 570 for each pixel.

In the backlight unit according to the embodiment, the head lamp according to the embodiment may have a wider angle and prevent glare in the light emitting device module, and the length of the substrate and the electrode may be reduced.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100: light emitting device package 110: package body
121 and 122: first and second lead frames 130: light emitting elements
140: conductive adhesive layer 145: wire
250: molding 200: light emitting device module
210: substrate 221,222,223: first, second, third electrode
231, 231: reflector plates 241, 242: adhesive layer
260 lens
400: head lamp 410: light emitting element module
420: reflector 430: shade
440 lens
800: display device 810: bottom cover
820: reflector 830: circuit board module
840: Light guide plate 850, 860: First and second prism sheet
870 panel 880 color filter

Claims (10)

A plurality of substrates having inclined surfaces, and a plurality of light emitting elements positioned on one surface of the substrate;
The other surface of the substrate is disposed facing each other,
A light emitting device module facing a surface of the substrate, the light emitting device comprising a reflector reflecting light emitted from the plurality of light emitting devices. The method according to claim 1,
The reflector plate is disposed to face each other with the plurality of substrates in between. The method according to claim 1,
The light emitting device module further comprises a first electrode, a second electrode and a third electrode disposed on the plurality of substrates, respectively. The method of claim 3,
The first electrode and the second electrode is a light emitting device module electrically connected to the plurality of light emitting devices, respectively. 5. The method of claim 4,
At least one of the first electrode and the second electrode extends on a bottom surface of the substrate. The method of claim 2,
The reflective plate is positioned on the plurality of substrates, the light emitting device module is positioned on the reflective plate. The method of claim 3,
The third electrode is a light emitting device module electrically connected to the plurality of light emitting devices. The method of claim 7, wherein
And the plurality of substrates are electrically connected to each other through the third electrode and the conductive member. The method according to claim 1,
The height of the highest point of the reflector plate is lower than the height of the substrate module. 10. An illumination system comprising the light emitting device module of claim 1.

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