KR20130064190A - Adhesive sheet composition for solar battery, adhesive sheet and solar battery using the same - Google Patents
Adhesive sheet composition for solar battery, adhesive sheet and solar battery using the same Download PDFInfo
- Publication number
- KR20130064190A KR20130064190A KR1020110130675A KR20110130675A KR20130064190A KR 20130064190 A KR20130064190 A KR 20130064190A KR 1020110130675 A KR1020110130675 A KR 1020110130675A KR 20110130675 A KR20110130675 A KR 20110130675A KR 20130064190 A KR20130064190 A KR 20130064190A
- Authority
- KR
- South Korea
- Prior art keywords
- adhesive sheet
- solar cell
- weight
- sheet composition
- organic peroxide
- Prior art date
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- 239000000853 adhesive Substances 0.000 title claims abstract description 68
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 68
- 239000000203 mixture Substances 0.000 title claims abstract description 35
- 150000001451 organic peroxides Chemical class 0.000 claims abstract description 36
- 229920001038 ethylene copolymer Polymers 0.000 claims abstract description 23
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 17
- 150000001875 compounds Chemical class 0.000 claims abstract description 16
- 230000004956 cell adhesive effect Effects 0.000 claims abstract description 15
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 7
- 238000004132 cross linking Methods 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 19
- 230000001681 protective effect Effects 0.000 claims description 19
- 239000000126 substance Substances 0.000 claims description 15
- -1 alkyl peroxy ester Chemical class 0.000 claims description 11
- NPDDCAZCWJWIBW-UHFFFAOYSA-N dioxiran-3-one Chemical compound O=C1OO1 NPDDCAZCWJWIBW-UHFFFAOYSA-N 0.000 claims description 8
- 150000002978 peroxides Chemical class 0.000 claims description 7
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 4
- 125000002947 alkylene group Chemical group 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 125000000524 functional group Chemical group 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010248 power generation Methods 0.000 abstract description 7
- 238000002834 transmittance Methods 0.000 abstract description 6
- 239000003963 antioxidant agent Substances 0.000 description 13
- 230000003078 antioxidant effect Effects 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 238000004383 yellowing Methods 0.000 description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 239000006087 Silane Coupling Agent Substances 0.000 description 8
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 7
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 7
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 5
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- VFBJXXJYHWLXRM-UHFFFAOYSA-N 2-[2-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]ethylsulfanyl]ethyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCSCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 VFBJXXJYHWLXRM-UHFFFAOYSA-N 0.000 description 3
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 3
- 239000006096 absorbing agent Substances 0.000 description 3
- 239000005038 ethylene vinyl acetate Substances 0.000 description 3
- 239000005341 toughened glass Substances 0.000 description 3
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 2
- 229920002620 polyvinyl fluoride Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000002459 sustained effect Effects 0.000 description 2
- 150000007970 thio esters Chemical class 0.000 description 2
- VVUWYXJTOLSMFV-UHFFFAOYSA-N (2-hydroxy-4-octylphenyl)-phenylmethanone Chemical compound OC1=CC(CCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 VVUWYXJTOLSMFV-UHFFFAOYSA-N 0.000 description 1
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- SYXTYIFRUXOUQP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy butaneperoxoate Chemical compound CCCC(=O)OOOC(C)(C)C SYXTYIFRUXOUQP-UHFFFAOYSA-N 0.000 description 1
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 1
- RIPYNJLMMFGZSX-UHFFFAOYSA-N (5-benzoylperoxy-2,5-dimethylhexan-2-yl) benzenecarboperoxoate Chemical compound C=1C=CC=CC=1C(=O)OOC(C)(C)CCC(C)(C)OOC(=O)C1=CC=CC=C1 RIPYNJLMMFGZSX-UHFFFAOYSA-N 0.000 description 1
- BLKRGXCGFRXRNQ-SNAWJCMRSA-N (z)-3-carbonoperoxoyl-4,4-dimethylpent-2-enoic acid Chemical compound OC(=O)/C=C(C(C)(C)C)\C(=O)OO BLKRGXCGFRXRNQ-SNAWJCMRSA-N 0.000 description 1
- IMYCVFRTNVMHAD-UHFFFAOYSA-N 1,1-bis(2-methylbutan-2-ylperoxy)cyclohexane Chemical compound CCC(C)(C)OOC1(OOC(C)(C)CC)CCCCC1 IMYCVFRTNVMHAD-UHFFFAOYSA-N 0.000 description 1
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 1
- HSLFISVKRDQEBY-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)cyclohexane Chemical compound CC(C)(C)OOC1(OOC(C)(C)C)CCCCC1 HSLFISVKRDQEBY-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- VNQNXQYZMPJLQX-UHFFFAOYSA-N 1,3,5-tris[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-1,3,5-triazinane-2,4,6-trione Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CN2C(N(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C(=O)N(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C2=O)=O)=C1 VNQNXQYZMPJLQX-UHFFFAOYSA-N 0.000 description 1
- HQOVXPHOJANJBR-UHFFFAOYSA-N 2,2-bis(tert-butylperoxy)butane Chemical compound CC(C)(C)OOC(C)(CC)OOC(C)(C)C HQOVXPHOJANJBR-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- BLCHIKLQYBVYAF-UHFFFAOYSA-N 2,5-dimethylhex-2-enoic acid Chemical compound CC(C)CC=C(C)C(O)=O BLCHIKLQYBVYAF-UHFFFAOYSA-N 0.000 description 1
- YAGPRJYCDKGWJR-UHFFFAOYSA-N 2-(2,4,8,10-tetratert-butylbenzo[d][1,3,2]benzodioxaphosphepin-6-yl)oxy-n,n-bis[2-(2,4,8,10-tetratert-butylbenzo[d][1,3,2]benzodioxaphosphepin-6-yl)oxyethyl]ethanamine Chemical compound O1C2=C(C(C)(C)C)C=C(C(C)(C)C)C=C2C2=CC(C(C)(C)C)=CC(C(C)(C)C)=C2OP1OCCN(CCOP1OC2=C(C=C(C=C2C=2C=C(C=C(C=2O1)C(C)(C)C)C(C)(C)C)C(C)(C)C)C(C)(C)C)CCOP(OC1=C(C=C(C=C11)C(C)(C)C)C(C)(C)C)OC2=C1C=C(C(C)(C)C)C=C2C(C)(C)C YAGPRJYCDKGWJR-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- LEVFXWNQQSSNAC-UHFFFAOYSA-N 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-hexoxyphenol Chemical compound OC1=CC(OCCCCCC)=CC=C1C1=NC(C=2C=CC=CC=2)=NC(C=2C=CC=CC=2)=N1 LEVFXWNQQSSNAC-UHFFFAOYSA-N 0.000 description 1
- ZMWRRFHBXARRRT-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-bis(2-methylbutan-2-yl)phenol Chemical compound CCC(C)(C)C1=CC(C(C)(C)CC)=CC(N2N=C3C=CC=CC3=N2)=C1O ZMWRRFHBXARRRT-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- MQWCQFCZUNBTCM-UHFFFAOYSA-N 2-tert-butyl-6-(3-tert-butyl-2-hydroxy-5-methylphenyl)sulfanyl-4-methylphenol Chemical compound CC(C)(C)C1=CC(C)=CC(SC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O MQWCQFCZUNBTCM-UHFFFAOYSA-N 0.000 description 1
- MSXXDBCLAKQJQT-UHFFFAOYSA-N 2-tert-butyl-6-methyl-4-[3-(2,4,8,10-tetratert-butylbenzo[d][1,3,2]benzodioxaphosphepin-6-yl)oxypropyl]phenol Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCCOP2OC3=C(C=C(C=C3C=3C=C(C=C(C=3O2)C(C)(C)C)C(C)(C)C)C(C)(C)C)C(C)(C)C)=C1 MSXXDBCLAKQJQT-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- AIBRSVLEQRWAEG-UHFFFAOYSA-N 3,9-bis(2,4-ditert-butylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP1OCC2(COP(OC=3C(=CC(=CC=3)C(C)(C)C)C(C)(C)C)OC2)CO1 AIBRSVLEQRWAEG-UHFFFAOYSA-N 0.000 description 1
- HCILJBJJZALOAL-UHFFFAOYSA-N 3-(3,5-ditert-butyl-4-hydroxyphenyl)-n'-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyl]propanehydrazide Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)NNC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 HCILJBJJZALOAL-UHFFFAOYSA-N 0.000 description 1
- CAMBAGZYTIDFBK-UHFFFAOYSA-N 3-tert-butylperoxy-2-methylpropan-1-ol Chemical compound CC(CO)COOC(C)(C)C CAMBAGZYTIDFBK-UHFFFAOYSA-N 0.000 description 1
- UJAWGGOCYUPCPS-UHFFFAOYSA-N 4-(2-phenylpropan-2-yl)-n-[4-(2-phenylpropan-2-yl)phenyl]aniline Chemical compound C=1C=C(NC=2C=CC(=CC=2)C(C)(C)C=2C=CC=CC=2)C=CC=1C(C)(C)C1=CC=CC=C1 UJAWGGOCYUPCPS-UHFFFAOYSA-N 0.000 description 1
- VSAWBBYYMBQKIK-UHFFFAOYSA-N 4-[[3,5-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-2,4,6-trimethylphenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC1=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 VSAWBBYYMBQKIK-UHFFFAOYSA-N 0.000 description 1
- DINHDCDXDCIYHI-UHFFFAOYSA-N 4-tert-butylperoxy-2-methyloctane Chemical compound C(C)(C)(C)OOC(CC(C)C)CCCC DINHDCDXDCIYHI-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- 239000004283 Sodium sorbate Substances 0.000 description 1
- CGRTZESQZZGAAU-UHFFFAOYSA-N [2-[3-[1-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]-2-methylpropan-2-yl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]-2-methylpropyl] 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCC(C)(C)C2OCC3(CO2)COC(OC3)C(C)(C)COC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 CGRTZESQZZGAAU-UHFFFAOYSA-N 0.000 description 1
- VSVVZZQIUJXYQA-UHFFFAOYSA-N [3-(3-dodecylsulfanylpropanoyloxy)-2,2-bis(3-dodecylsulfanylpropanoyloxymethyl)propyl] 3-dodecylsulfanylpropanoate Chemical compound CCCCCCCCCCCCSCCC(=O)OCC(COC(=O)CCSCCCCCCCCCCCC)(COC(=O)CCSCCCCCCCCCCCC)COC(=O)CCSCCCCCCCCCCCC VSVVZZQIUJXYQA-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- BEIOEBMXPVYLRY-UHFFFAOYSA-N [4-[4-bis(2,4-ditert-butylphenoxy)phosphanylphenyl]phenyl]-bis(2,4-ditert-butylphenoxy)phosphane Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(C=1C=CC(=CC=1)C=1C=CC(=CC=1)P(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C BEIOEBMXPVYLRY-UHFFFAOYSA-N 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- OOCILPYOPQKPJY-UHFFFAOYSA-N calcium;(3,5-ditert-butyl-4-hydroxyphenyl)methyl-ethoxyphosphinic acid Chemical compound [Ca].CCOP(O)(=O)CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 OOCILPYOPQKPJY-UHFFFAOYSA-N 0.000 description 1
- UIPVMGDJUWUZEI-UHFFFAOYSA-N copper;selanylideneindium Chemical compound [Cu].[In]=[Se] UIPVMGDJUWUZEI-UHFFFAOYSA-N 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 1
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 150000003902 salicylic acid esters Chemical class 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- DLSMLZRPNPCXGY-UHFFFAOYSA-N tert-butylperoxy 2-ethylhexyl carbonate Chemical compound CCCCC(CC)COC(=O)OOOC(C)(C)C DLSMLZRPNPCXGY-UHFFFAOYSA-N 0.000 description 1
- LVEOKSIILWWVEO-UHFFFAOYSA-N tetradecyl 3-(3-oxo-3-tetradecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCC LVEOKSIILWWVEO-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 239000000326 ultraviolet stabilizing agent Substances 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The present invention relates to a solar cell adhesive sheet composition, a solar cell adhesive sheet and a solar cell using the same.
Adhesive sheet composition for solar cells according to the present invention comprises a compound comprising an ethylene copolymer resin, an organic peroxide and an epoxy group.
Even in the high temperature and high humidity durability test manufactured by the adhesive sheet composition for solar cells, there is an advantage that the adhesion is maintained well. In particular, the adhesive sheet for solar cells according to the present invention is less influenced by temperature or moisture, so that the solar cell using the same maintains high transmittance and high power generation efficiency continuously for a long time even when exposed to external environment such as sunlight, wind or rain. Can ensure a long service life.
Description
The present invention relates to a solar cell adhesive sheet composition, a solar cell adhesive sheet and a solar cell using the same.
As environmental problems increase in recent years, hydro power, wind power, and solar power have come into the spotlight as clean energy. Among them, solar power generation using solar energy is growing in recent years as an energy source that is clean and useful for preventing global warming. As a representative of this photovoltaic power generation, a solar cell using semiconductors such as monocrystalline silicon, polycrystalline silicon, amorphous silicon and the like can be given. The solar cell is a practical use of the principle that emits a current when sunlight is irradiated to the semiconductor.
In addition, the solar cell module is generally manufactured by protecting a solar cell device such as silicon, gallium arsenide, copper-indium selenium with an upper transparent protective material and a lower substrate protective material, and fixing the solar cell device and the protective material with an adhesive sheet. will be.
At this time, the adhesive sheet used in the solar cell module is required to have a property of excellent transmittance and adhesiveness and less yellowing in the reliability test in order to increase the power generation efficiency of the solar cell. The reason is that the place where the solar cell is installed is the roof of a house, a portable power generator, etc., but all of them are places where the sun shines and are exposed to the natural state outdoors. That is, when the solar cell module is exposed, the adhesive sheet used for the solar cell module is deteriorated by moisture or heat, so yellowing is generated. Therefore, the transmittance and adhesiveness are excellent, and yellowing is less generated in the reliability test. .
The adhesive sheet used for the solar cell module is generally prepared using a composition comprising an ethylene copolymer, an organic peroxide, and a crosslinking aid. Various compounds are known as the crosslinking aid, and in this regard, Japanese Patent No. 3323560 discloses a technique of using triallyl isocyanurate as a crosslinking aid. However, the adhesive sheet prepared by using the composition for the adhesive sheet containing triallyl isocyanurate as a crosslinking aid has a problem that the adhesive strength is lowered at the time of high temperature and high humidity durability test.
Therefore, the present invention is to provide a solar cell adhesive sheet composition that does not reduce the power generation efficiency when applied to a solar cell module because the adhesive strength does not decrease even at high temperature and humidity durability test (3000 hours left at 85 ℃, 85% RH constant temperature and humidity). .
Still another object of the present invention is to provide a solar cell adhesive sheet capable of maintaining a low yellowing rate and a sustained transmittance even after long-term exposure to the external environment.
Still another object of the present invention is to provide a solar cell having a low yellowing incidence rate and a sustained transmittance even after long-term exposure to the external environment.
In order to achieve the object of the present invention, the present invention provides a solar cell adhesive sheet composition comprising an ethylene copolymer, an organic peroxide and a crosslinking aid, wherein the crosslinking aid comprises a compound represented by the following formula (1) comprising an epoxy group It provides an adhesive sheet composition for a solar cell.
[Formula 1]
(In
The compound represented by Chemical Formula 1 is preferably a compound represented by the following Chemical Formula 2 or 3.
[Formula 2]
(3)
It is preferable that 0.1-2.5 weight part of said crosslinking adjuvant is added with respect to 100 weight part of ethylene copolymer resins.
In order to achieve another object of the present invention, there is provided a solar cell adhesive sheet made of an adhesive sheet composition according to the present invention.
For still another object of the present invention, there is provided a solar cell device, an upper protective material located above the solar cell device, and a lower protective material located below the solar cell device, wherein the solar cell device and the protective material are bonded according to the present invention. Provided is a solar cell fixed with a sheet.
Adhesive sheet prepared by the adhesive sheet composition for solar cells according to the present invention has the advantage that the adhesion is maintained well even at high temperature and high humidity durability test. In particular, the adhesive sheet for solar cells according to the present invention is less influenced by temperature or moisture, so that the solar cell using the same maintains high transmittance and high power generation efficiency continuously for a long time even when exposed to external environment such as sunlight, wind or rain. Can ensure a long service life.
1 is a schematic cross-sectional view of a solar cell according to an embodiment of the present invention.
Hereinafter, the present invention will be described in more detail, but for the purpose of describing the present invention, it is not intended to limit the scope of the present invention.
The adhesive sheet composition for a solar cell according to the present invention comprises an ethylene copolymer resin, an organic peroxide and a crosslinking aid. The solar cell adhesive sheet composition may further include at least one additive selected from a silane coupling agent, an antioxidant, and an ultraviolet absorber.
(A) Ethylene Copolymer Resin
The ethylene copolymer resin can be used without limitation so long as it is generally used in the art. Preferably, the ethylene copolymer resin is 20 to 40% by weight, preferably 25 to 35% by weight of vinyl acetate content in the ethylene copolymer in consideration of transparency, flexibility, impregnation of the organic peroxide and the like. In addition, the ethylene copolymer has a melt flow rate of 0.1 to 100 g / 10 min, preferably 0.5 to 50 g / 10 min at 190 degrees and a 2.160 kg load in consideration of moldability and mechanical properties.
Suitable ethylene copolymers specifically include ethylene vinyl ester copolymers such as ethylene vinyl acetate copolymers, ethylene methyl acrylate copolymers, ethylene ethyl acrylate copolymers, ethylene methyl methacrylate copolymers and ethylene isobutyl acrylate copolymers. Ethylene-unsaturated carboxylic acid copolymers such as ethylene-unsaturated carboxylic acid ester copolymers such as ethylene-acrylic acid n-butyl copolymers, ethylene-acrylic acid copolymers, ethylene-methacrylic acid copolymers, and ethylene-acrylic acid isobutyl-methacrylic acid copolymers And the ionomer etc. can be illustrated as a representative example. Among these, it is preferable to use an ethylene-vinyl acetate copolymer in consideration of the suitability to the required physical properties of the adhesive sheet composition for solar cells such as moldability, transparency, flexibility, adhesiveness, light resistance, and impregnation of organic peroxides. .
Examples of commercially available ethylene-vinyl acetate copolymers include MA-10 (32% vinyl acetate content, 40 g / 10 minutes melt flow rate) of TPC, PV 1650 (33% vinyl acetate content, melt flow rate) from DuPont 31 g / 10 min) PV 1400 (32% vinyl acetate content, melt flow rate 43 g / 10 min) PV 1410 (vinyl acetate content 32%, melt flow rate 43 g / 10 min) It is possible.
It is preferable that the said ethylene copolymer resin is contained 94-99.5 weight part with respect to 100 weight part of whole adhesive sheet compositions for solar cells. If the ethylene copolymer resin is more than 99.5 parts by weight there is a problem that the curing is not, when less than 94 parts by weight there is a problem that the adhesive strength is inferior.
(B) organic peroxide
The organic peroxide includes at least one selected from a dialkyl peroxide type, an alkyl peroxy ester type or a peroxy ketone type.
As the organic peroxide of the dialkyl peroxide type, an organic peroxide having a half-life temperature of 130 hours to 160 ° C, preferably 135 to 150 ° C may be used.
The dialkyl peroxide type organic peroxide is specifically dicumyl peroxide (135 ° C.), 1,3-bis (2-t-butylperoxyisopropyl) hexane (137 ° C.), 2,5-dimethyl-2, 5-bis (tertiary butyl peroxy) hexane (140 degreeC), t-butyl cumyl peroxide (142 degreeC), di-t-butyl peroxide (149 degreeC), etc. can be illustrated. The organic peroxides of the above-described dialkylperoxide type may be used alone or in combination of two or more thereof.
As the organic peroxide of the alkyl peroxy ester type, an organic peroxide having a half life temperature of 100 to 130 ° C. may be used.
The alkyl peroxy ester type organic peroxide is specifically t-butyl peroxy isobutylate (102 ℃), t-butyl peroxy maleic acid (110 ℃), t-butyl peroxy isopropyl carbonate (119 ℃), t -Butyl peroxy 2-ethylhexyl carbonate (121 degreeC), 2,5-dimethyl-2,5-bis (benzoyl peroxy) hexane (118 degreeC), t-butyl peroxy acetate (123 degreeC), t-butyl Peroxy benzoate (125 degreeC) etc. can be illustrated. The organic peroxides of the alkylperoxy ester type exemplified above may be used alone or in combination of two or more thereof.
As the peroxyketone type organic peroxide, an organic peroxide having a half-life temperature of 100 ° C. to 140 ° C. may be used.
The peroxyketone type organic peroxide is specifically 1,1-bis (t-butylperoxy) 3,3,5-trimethylcyclohexane (112 ° C.), 1,1-bis (t-butylperoxy) cyclo Hexane (112 ° C), 1,1-bis (t-amylperoxy) cyclohexane (112 ° C), 2,2-bis (t-butylperoxy) butane (119 ° C), ethyl-3,3-di Peroxy ketones, such as (t-butyl peroxy) butyrate (135 degreeC), etc. can be illustrated. The peroxyketone type organic peroxides exemplified above may be used alone or in combination of two or more thereof.
Preferably, when the adhesive sheet composition for a solar cell is to be manufactured in a fast curing type, the organic peroxide is preferably used at least one selected from the alkyl peroxy ester type.
In addition, when the adhesive sheet composition for solar cells is to be manufactured in a standard hardening type rather than a fast curing type, the organic peroxide is at least one selected from a dialkyl peroxide type, and at least one selected from an alkyl peroxy ester type and a peroxy ketone type. It is preferable that it is a mixture form which mixes. At this time, the mixing ratio is not limited, but based on 100 parts by weight of the mixture 10 to 90 parts by weight of the organic peroxide of the dialkyl peroxide type, consisting of 90 to 10 parts by weight of the organic peroxide of the alkyl peroxy ester type and peroxy ketone type It is good.
The organic peroxide may be 0.2 to 4 parts by weight, preferably 0.5 to 3 parts by weight, based on 100 parts by weight of the ethylene copolymer resin. If the amount of the organic peroxide used is less than 0.2 parts by weight, there is a problem in that the ethylene copolymer resin cannot be sufficiently crosslinked. If the amount of the organic peroxide is more than 4 parts by weight, the crosslinking rate may be increased, but the shrinkage may increase and yellowing may not be prevented.
Crosslinking auxiliary
According to the present invention, the crosslinking aid includes a compound represented by the following
[Formula 1]
(In
The compound including the epoxy group represented by the formula (1) is added to improve the adhesive force with the back sheet, which is a protective material of the solar cell device and to prevent a decrease in adhesion during high temperature and high humidity durability test.
Preferably, in
[Formula 2]
(3)
Monoallyl- diglycidyl isocyanuric acid represented by the formula (2) and diallyl- monoglycidyl isocyanuric acid represented by the formula (3) can be used alone or in combination, respectively. Commercially available trade names include MA-DGIC (SHIKOKU Chemical Company; Formula 1), DA-MGIC (SHIKOKU Chemical Company; Formula 2), and the like.
The crosslinking aid is suitably added in an amount of 0.1 to 2.5 parts by weight based on 100 parts by weight of the ethylene copolymer resin. If the addition amount of the crosslinking aid is less than 0.1 part by weight based on the above standards, there is no adhesion enhancement effect, and when the addition amount is used in excess of 2.5 parts by weight, there is a problem that a yellowing problem occurs.
Various additives
Other various additives may be added to the adhesive sheet composition for solar cells of this invention as needed. As such an additive, a ultraviolet absorber, a silane coupling agent, antioxidant, etc. can be mentioned specifically ,.
The ultraviolet absorbent may help to block ultraviolet rays and to improve durability.
As said ultraviolet absorber, a benzophenone series, a benzotriazole series, a triazine system, a salicylic acid ester system, etc. can be used specifically ,. Commercially available UV absorbers include TINUVIN 328, TINUVIN 1577 FF, TINUVIN 120, and Cimasorb 81 from Ciba, Sumitosorb Chemical, Sumisorb 130, Sumisorb 350, Sumisorb 110, Seesorb 102 from Ciprocasei, seesorb 707, seesorb 101 can be used.
It is preferable to mix | blend the said ultraviolet absorber about 0.1-2 weight part with respect to 100 weight part of ethylene copolymer resins. If less than 0.1 parts by weight of the ultraviolet absorber is added, there is no UV blocking effect, if more than 2 parts by weight of the yellowing problem occurs.
The silane coupling agent may improve the adhesion between the low iron tempered glass and the back sheet and the adhesive sheet when the solar cell is manufactured after the adhesive sheet is manufactured with the adhesive sheet composition for solar cells.
Examples of the silane coupling agent include a compound having a hydrolyzable group such as an alkoxy group together with a ball saturation group such as a vinyl group, an acryloxy group or a methacrylic group, an amino group, an epoxy group and the like.
Specific examples of the silane coupling agent include N- (β-aminoethyl) -aminopropyltrimethoxysilane, N- (β-aminoethyl) -aminopropylmethyldimethoxysilane,
-Aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, etc. can be illustrated.It is suitable to add about 0.1-2 weight part of said silane coupling agents with respect to 100 weight part of ethylene copolymer resins. If it is out of the range, the effect of adhesive strength is inferior.
The antioxidant may be a phenolic antioxidant, phosphite type antioxidant, thioester type antioxidant, amine type antioxidant, inorganic type antioxidant and the like.
Among the antioxidants on the market, phenolic types include Aldrich's BHT, hydroquinone, and Shiva's irganox 1076, irganox 1035, irganox 1010, irganox 1081, irganox 1330, irganox 1425 WL, irganox 3114, irganox E201, irganox MD 1024, irganox PS 800, irganox PS 802, Sumilizer GA-80, AO-76, AO-101, Chemtura's ANOX 70, etc.For phosphite types, Weston 618 from Chemtura, irgafos 12 from Shiva, and irgafos 38 , irgafos 126, irgafos 168, irgafos P-EPQ, Sumitomo Chemical's P-16, sumilizer GP, etc.The thioester types include Naugard 412 from Chemtura, irganox 1035 from Shiva, Sumilizer TPL from Sumitomo Chemical, sumilizer TPM, Sumilizer TPS, sumilizer TP-D, etc.Amine types include Chemthu's Naugard 445 and antigene 6C.Inorganic antioxidant types DHT-4A, DHT-4A2, DHT-4C, etc. can be used. Do. In addition, products of the above two or more antioxidants are mixed with Shiva's irganox B1411, irganox B1412, irganox B215, irganox B220, irganox B225, irganox B501W, irganox B561, irganox B900, irganox B921, irganox HP2215, irganox HP2225, irganox HP2251, irganox HP2411, irganox HP2921, irganox XP 420, irganox XP620, and the like.
It is preferable that the said antioxidant uses 0.001-1 weight part with respect to 100 weight part of ethylene copolymer resins. If the antioxidant is less than 0.001 parts by weight, a sufficient antioxidant effect may not be obtained, and if it is more than 1 part by weight, yellowing may occur.
The present invention provides a solar cell adhesive sheet consisting of the adhesive sheet composition described above.
The adhesive sheet for a solar cell according to the present invention can be produced by a known sheet forming method using a T-die extruder, a calendar molding machine and the like. For example, at least one crosslinking aid selected from the group consisting of compounds represented by the formulas (1) and (2) according to the present invention comprising an organic peroxide and an epoxy group in the ethylene copolymer resin and other selectively added ultraviolet absorbers and ultraviolet stabilizers And an antioxidant or the like can be dry blended in advance, and fed into a hopper of a T-die extruder, followed by extrusion molding into a sheet.
The present invention provides a solar cell comprising a solar cell adhesive sheet produced by the above method.
1 is a schematic cross-sectional view of a solar cell according to an embodiment of the present invention. Referring to the accompanying drawings in more detail, the solar cell according to the present invention includes a
The manufacturing of the solar cell having the above structure is performed at a temperature at which the organic peroxide is not substantially decomposed and the solar cell
At this time, the adhesive sheet for solar cells according to the present invention is excellent in the adhesive strength with the back sheet in the solar cell of the above-described structure, in particular, excellent characteristics that the adhesive strength does not decrease even at 3000 hours reliability test of high temperature and high humidity (85 ℃, 85%) Indicates.
The present invention will be described in more detail by the following examples and comparative examples, the following examples are only some specific examples of the present invention and are not intended to limit or limit the protection scope of the present invention.
< Example 1>
100 parts by weight of an ethylene-vinyl acetate copolymer (TPC MA-10; vinyl acetate content of 32%) with organic peroxide, 1 part by weight of Alchema TBEC, and monoallyl- diglycidyl isocyanurate (Shikoku) as a crosslinking aid. 0.1 parts by weight of chemical company MA-DGIC), 0.5 parts by weight of Shinnets KBM-503 as a silane coupling agent, and 0.3 parts by weight of 2-hydroxy-4-n-octoxybenzophenone (sumisorb 130 from Sumitomo Chemical Co., Ltd.) at 25 ° C. The mixer was advanced for 1 hour and a 0.5 mm adhesive sheet was produced at a processing temperature of 90 ° C. using a planetary extruder (screw diameter 40 mm, L / D = 26).
< Example 2>
A 0.5 mm adhesive sheet was prepared in the same manner as in Example 1 except that 0.5 parts by weight of MA-DGIC manufactured by Shikoku Chemical Co., Ltd. was used instead of 0.1 part by weight of the crosslinking aid.
< Example 3>
A 0.5 mm adhesive sheet was prepared in the same manner as in Example 1 except that 1 part by weight of Shikoku Chemical Co., Ltd. was used instead of 0.1 part by weight of MA-DGIC.
< Example 4>
A 0.5 mm adhesive sheet was prepared in the same manner as in Example 1 except that 2 parts by weight of Shikoku Chemical Co., Ltd. was used instead of 0.1 part by weight of MA-DGIC.
< Example 5>
A 0.5 mm adhesive sheet was produced in the same manner as in Example 1 except that 2.5 parts by weight of Shikoku Chemical Co., Ltd. was used instead of 0.1 part by weight of MA-DGIC.
< Example 6>
A 0.5 mm adhesive sheet was produced in the same manner as in Example 1 except that 1 part by weight of Shikoku Chemical Co., Ltd. DA-MGIC was used instead of 0.1 part by weight of Shikoku Chemical Co., Ltd. MA-DGIC.
< Example 7>
A 0.5 mm adhesive sheet was produced in the same manner as in Example 1 except that 2 parts by weight of diallyl-monoglycidyl isocyanurate (DA-MGIC, available from Shikoku Chemical Co., Ltd.) was used instead of 0.1 part by weight of Shikoku Chemical Co., Ltd. MA-DGIC.
< Example 8>
A 0.5 mm adhesive sheet was produced in the same manner as in Example 1 except that 0.05 parts by weight of Shikoku Chemical Co., Ltd. MA-DGIC was used instead of 0.1 part by weight of MA-DGIC from Nippon Chemical Co., Ltd. as a crosslinking aid.
< Example 9>
A 0.5 mm adhesive sheet was prepared in the same manner as in Example 1 except that 3 parts by weight of Shikoku Chemical Co., Ltd. MA-DGIC was used instead of 0.1 part by weight of MA-DGIC from Nippon Chemical Corporation.
< Comparative example 1>
100 parts by weight of an ethylene-vinyl acetate copolymer (TPC MA-10; vinyl acetate content of 32%) with organic peroxide, 1 part by weight of Alchema TBEC, and a crosslinking aid of triallyl isocyanurate (TAIC) Parts by weight, 0.5 parts by weight of Shinnets KBM-503 as a silane coupling agent, 0.3 parts by weight of 2-hydroxy-4-n-octoxybenzophenone (sumisorb 130 from Sumitomo Chemical Co., Ltd.) as a UV absorber at 25 ° C. for 1 hour. , 0.5mm adhesive sheet was produced at the processing temperature of 90 degreeC using the oil-based industrial single extruder (screw diameter 40mm, L / D = 26).
< Comparative example 2>
A 0.5 mm adhesive sheet was prepared in the same manner as in Comparative Example 1 except that 1 part by weight instead of 0.1 part by weight of TAIC Corporation was used as the crosslinking aid.
< Comparative example 3>
A 0.5 mm adhesive sheet was produced in the same manner as in Comparative Example 1 except that 2.5 parts by weight of TAIC Inc. instead of 0.1 parts by weight of TAIC was used as the crosslinking aid.
< Experimental Example >
Using the adhesive sheet prepared in the Examples and Comparative Examples was carried out in the adhesive strength measurement and moisture resistance test in the following manner and the results are shown in Table 1 below.
One. High temperature and high humidity Durability Test (Adhesion Retention Rate)
Backsheet (Tedlar / PET / Tedlar) / 2 sheets of 0.5mm adhesive sheet manufactured / 2 PET laminated structures are made, and 150 ℃, 3 minutes vacuum process and 150 ℃, 8 minutes press process are used for vacuum curing. After proceeding, a 180-degree peel test was conducted using an Instron UTM machine (initial adhesion A1). The other sample was placed in a high temperature and high humidity machine (85 ° C., 85% RH) and subjected to a 180 degree peel force test (adhesive strength A2 after 3000 hours) in the same manner after 3000 hours.
2. Moisture resistance TEST
Two sheets of 0.5 mm adhesive sheet prepared between the low iron reinforced glass and the back sheet are put together and melt-bonded by using a vacuum bonding machine at 150 ° C. for 20 minutes, and the laminate is left to stand at 85 ° C. and 85% RH at high temperature and high humidity for 3000 hours. After 3000 hours, the yellowness ΔYI value is measured using a yellowing meter (NIPPON DENSHOKU's Spectro Color Meter SE 2000).
As shown in Table 1, the adhesive sheet composition for a solar cell including the compound represented by
1: solar cell element 2: upper protective material
3: lower protective material 4: adhesive sheet
Claims (9)
[Formula 1]
(In Formula 1, R1 to R3 are independently an alkylene group having 2 to 10 carbon atoms having a glycidyl group or a vinyl group at each end. However, R1 to R3 do not represent the same functional group at the same time.)
(2)
(3)
Solar cell, characterized in that the adhesive sheet for a solar cell of claim 8 formed in at least one of the solar cell element and the protective material.
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