KR20130063378A - Nitride semiconductor device and method of fabricating the same - Google Patents
Nitride semiconductor device and method of fabricating the same Download PDFInfo
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- KR20130063378A KR20130063378A KR1020110129865A KR20110129865A KR20130063378A KR 20130063378 A KR20130063378 A KR 20130063378A KR 1020110129865 A KR1020110129865 A KR 1020110129865A KR 20110129865 A KR20110129865 A KR 20110129865A KR 20130063378 A KR20130063378 A KR 20130063378A
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- nitride semiconductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0075—Processes for devices with an active region comprising only III-V compounds comprising nitride compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/025—Physical imperfections, e.g. particular concentration or distribution of impurities
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/10—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
- H01L33/32—Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
Abstract
A nitride semiconductor device and a method of manufacturing the same are disclosed. The semiconductor device includes a first n-type nitride semiconductor layer having a top surface and a V-pit, and a second n-type nitride semiconductor layer located on the first n-type nitride semiconductor layer and filling the V-pit. The 2 n-type nitride semiconductor layer has a wider bandgap than the first n-type nitride semiconductor layer. As a result, electrostatic discharge through the actual potential can be suppressed, and current dispersing performance in the first n-type nitride semiconductor layer is improved.
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to nitride semiconductor devices, and more particularly to nitride semiconductor devices having improved electrostatic discharge characteristics and methods of manufacturing the same.
AlGaInN-based nitride semiconductors are widely used in ultraviolet, blue / green light emitting diodes, or laser diodes as light sources for full-color displays, traffic lights, general lighting and optical communication devices, and also heterojunction bipolar transistors. (HBT) and high electron mobility transistors (HEMT).
In general, nitride semiconductors are grown on substrates where lattice mismatch occurs, such as sapphire, silicon carbide or silicon, because it is difficult to obtain a lattice matched substrate. Accordingly, nitride semiconductor layers grown on these substrates have a significantly higher threading dislocation density (TDD) of about 1E9 / cm 2 or more.
The actual potential provides electron trap sites to cause non-luminescent recombination, and also provides a current leakage path. Accordingly, when overvoltage such as static electricity is applied to the semiconductor device, current is concentrated through the real potential, and damage due to electrostatic discharge is easily generated. Furthermore, the current is evenly distributed over a wide range in a relatively thin nitride semiconductor layer. Difficult to disperse
Because of the poor electrostatic discharge characteristics of the nitride semiconductor element, a zener diode is usually used together with the nitride semiconductor element. However, Zener diodes are relatively expensive and also require a process and space for mounting Zener diodes.
On the other hand, although a substrate that lattice-matches with a nitride semiconductor, such as a GaN substrate, may be used, the manufacturing cost of the GaN substrate is quite high, and there is a limit in applying it except for a specific device such as a laser.
Meanwhile, in order to improve the electrostatic discharge characteristics of the nitride light emitting device, a growth temperature is controlled to grow a nitride semiconductor layer having a V-pit, and thereafter, a p-type nitride semiconductor layer is grown at a high temperature to fill the V-pit. There is this. This technique improves the electrostatic discharge characteristics by using less doped Mg in the V-pit when growing the p-type nitride semiconductor layer. However, since the V-pit penetrates the active layer, there is a problem in that the light emitting area of the active layer is reduced, and the p-type nitride semiconductor layer for filling the V-pit has a small margin for the growth process, and thus leakage current is increased depending on the Mg doping conditions. Can increase.
On the other hand, a part of the light generated in the active layer proceeds to the substrate side and is absorbed and lost in the semiconductor element or is absorbed and lost by the mounting member mounting the substrate. In order to solve this problem, a technique of arranging a mirror under the substrate is used, but since light propagates through the substrate, it is not possible to prevent light loss due to light absorption generated in the region between the active layer and the mirror.
The problem to be solved by the present invention is to provide a nitride semiconductor device having an improved electrostatic discharge characteristics and a method of manufacturing the same.
Another object of the present invention is to provide a nitride semiconductor device having an improved current dispersion performance and a method of manufacturing the same.
Another object of the present invention is to reduce the loss due to light absorption generated inside the semiconductor device to improve the luminous efficiency of the light emitting diode.
Another problem to be solved by the present invention is to improve the electrostatic discharge characteristics of the nitride semiconductor device while preventing the reduction of the light emitting area by V-pits.
According to an aspect of the present invention, a nitride semiconductor device includes: a first n-type nitride semiconductor layer having a V-pit and an upper surface surrounding the V-pit; And a second n-type nitride semiconductor layer disposed on the first n-type nitride semiconductor layer and filling the V-pit. Here, the second n-type nitride semiconductor layer has a wider bandgap than the first n-type nitride semiconductor layer.
In addition, the second n-type nitride semiconductor layer may have a higher specific resistance than the first n-type nitride semiconductor layer, the thickness of the second n-type nitride semiconductor layer in the V-pit is the first n-type nitride It may be thicker than the thickness of the second n-type nitride semiconductor layer located on the top surface of the semiconductor layer.
The V-pit is located on the path where the actual potential is transferred. By placing the second n-type nitride semiconductor layer having a wider band gap on the path of the real potential, the current through the real potential can be suppressed, thereby improving the electrostatic discharge characteristics. Further, by forming the second n-type nitride semiconductor layer having a wide band gap in the V-pit formed in the first n-type nitride semiconductor layer, carrier traps due to actual potentials can be prevented, and thus, in the first n-type nitride semiconductor layer Current dispersion characteristics are enhanced.
On the other hand, the first n-type nitride semiconductor layer may be an InAlGaN-based bicomponent, quarter-based or tetracomponent nitride layer, the second n-type nitride semiconductor layer has a wider bandgap than the first n-type nitride semiconductor layer It may be an InAlGaN-based bicomponent, tri- or tetracomponent nitride layer having. In particular, the first n-type nitride semiconductor layer is Al x Ga 1-x N (0≤x <1), and the second n-type nitride semiconductor layer is Al y Ga 1- y N (0 <y <1) Can be. Where x <y.
The second n-type nitride semiconductor layer may be a semiconductor layer having a lower impurity doping concentration than that of the first n-type nitride semiconductor layer or an undoped layer which is not intentionally doped with impurities.
The first n-type nitride semiconductor layer may be a layer grown at a temperature at which a V-pit is formed, and the second n-type nitride semiconductor layer may be a layer grown at a temperature that fills the V-pit to planarize a surface thereof. The first n-type nitride semiconductor layer may be grown in a temperature range of 800 ° C. or more and less than 1000 ° C., and the second n-type nitride semiconductor layer may be grown in a temperature range of 1000 ° C. to 1200 ° C. FIG.
The V-pit may be formed by growth conditions, and thus, the first n-type nitride semiconductor layer and the second n-type nitride semiconductor layer may be grown in-situ. Alternatively, after growing an n-type nitride semiconductor layer having a real potential, the semiconductor layer may be etched to form a V-pit at a portion where the real potential is located.
In some embodiments, two or more pairs of the first n-type nitride semiconductor layer and the second n-type nitride semiconductor layer may be stacked. Accordingly, current may be dispersed in the first n-type nitride semiconductor layers, thereby further improving the electrostatic discharge characteristics. In addition, the laminate of the first n-type nitride semiconductor layer and the second n-type nitride semiconductor layer may be a distributed Bragg reflector.
The semiconductor device may further include a p-type nitride semiconductor layer positioned on the second n-type nitride semiconductor layer, and further, an active layer located between the second n-type nitride semiconductor layer and the p-type nitride semiconductor layer. It may further include.
In some embodiments, the semiconductor device comprises a substrate; And a lower n-type nitride semiconductor layer. In this case, the first n-type nitride semiconductor layer is located on the lower n-type nitride semiconductor layer.
The semiconductor device may be a nitride semiconductor device such as a light emitting diode, an HBT, or an HEMT.
In a method of manufacturing a semiconductor device according to another aspect of the present invention, a lower n-type nitride semiconductor layer is formed on a substrate, and a first n-type nitride semiconductor layer having V-pits is formed on the lower n-type nitride semiconductor layer. And forming a second n-type nitride semiconductor layer filling the V-pit on the first n-type nitride semiconductor layer. Here, the second n-type nitride semiconductor layer has a wider bandgap than the first n-type nitride semiconductor layer.
In addition, the second n-type nitride semiconductor layer may have a higher specific resistance than the first n-type nitride semiconductor layer. Furthermore, the thickness of the second n-type nitride semiconductor layer in the V-pit may be thicker than the thickness of the second n-type nitride semiconductor layer located on the top surface of the first n-type nitride semiconductor layer.
In addition, the first n-type nitride semiconductor layer may be grown at a temperature at which the V-pit is formed, and the second n-type nitride semiconductor layer may be grown at a temperature that fills the V-pit to planarize the surface. Particularly, the first n-type nitride semiconductor layer may be grown in a temperature range of 800 ° C. or more and less than 1000 ° C., and the second n-type nitride semiconductor layer may be grown in a temperature range of 1000 ° C. or more and 1200 ° C. or less.
Meanwhile, the first n-type nitride semiconductor layer may be formed of an InAlGaN-based binary, quarter-, or tetra-component nitride layer, and the second n-nitride semiconductor layer may be wider than the first n-type nitride semiconductor layer. It may be formed of an InAlGaN-based bicomponent, semi-branched or tetracomponent nitride layer having a band gap. In particular, the first n-type nitride semiconductor layer is Al x Ga 1- x N (0 ≦ x <1), and the second n-type nitride semiconductor layer is Al y Ga 1- y N (0 <y <1). Can be. Where x <y.
According to the present invention, the second n-type nitride semiconductor layer having a wider band gap on the path of the real potential can be placed to suppress current through the real potential and to prevent carrier traps due to the real potential. Accordingly, it is possible to provide a nitride semiconductor device having improved static discharge characteristics and current dispersion performance. Furthermore, the semiconductor layers can be continuously grown by an in-situ process by controlling the growth temperature of the nitride semiconductor to grow a nitride semiconductor layer having V-pits and a nitride semiconductor layer filling the V-pits.
Furthermore, the light loss inside the light emitting diode can be reduced by alternately stacking a nitride semiconductor layer having V-pits and a nitride semiconductor layer filling V-pits to form a distributed Bragg reflector.
1 is a cross-sectional view illustrating a semiconductor device in accordance with an embodiment of the present invention.
2 is a schematic perspective view for describing current dispersion in a semiconductor device according to an exemplary embodiment of the present invention.
3 is a cross-sectional view illustrating a semiconductor device in accordance with still another embodiment of the present invention.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, etc. of constituent elements can be exaggerated for convenience. Like numbers refer to like elements throughout.
1 is a cross-sectional view illustrating a semiconductor device in accordance with an embodiment of the present invention. Here, a nitride light emitting diode will be described as an example of a semiconductor device.
Referring to FIG. 1, the light emitting diode includes a
The
The
The lower n-type
The lower n-type
The first n-type
When the nitride semiconductor layer is grown at a relatively low temperature, the vertical growth rate is faster than the horizontal growth, and thus V-pits V are formed on the path where the actual potential D is transferred.
The second n-type
In addition, the second n-type
The second n-type
Meanwhile, the
The barrier layer and the quantum well layer of the
The p-type
A
2 is a schematic perspective view for describing current dispersion in a semiconductor device according to an exemplary embodiment of the present invention. Here, (a) shows a first n-type
Referring to FIG. 2A, when a real potential is formed in the first n-type
Referring to FIG. 2B, a V-pit V is formed in the first n-type
Further, since the second n-type
According to this embodiment, since the movement of the carrier into the V-pit is suppressed, the current can be easily dispersed in the first n-type
The first n-type
3 is a cross-sectional view illustrating a semiconductor device in accordance with another embodiment of the present invention.
Referring to FIG. 3, the semiconductor device according to the present embodiment is generally similar to the light emitting diode described with reference to FIG. 1, but the light emitting diode of FIG. 1 includes a pair of first n-type nitride semiconductor layers 27 and second n. In contrast to having the type
That is, as described with reference to FIG. 1, after the first n-type
As described above, by alternately stacking the first n-type nitride semiconductor layer and the second n-type nitride semiconductor layer, the current through the real potential can be further suppressed.
In the present embodiment, it has been described that two pairs of the first n-type nitride semiconductor layer and the second n-type nitride semiconductor layer are formed. However, the present invention is not limited thereto, and more pairs may be formed. Furthermore, since the first n-type
Although the foregoing embodiments have described light emitting diodes as an example, the present invention is not limited to the light emitting diodes, and may be adopted to improve electrostatic discharge characteristics in various devices employing nitride semiconductors such as HBT and HEMT.
Claims (19)
A second n-type nitride semiconductor layer on the first n-type nitride semiconductor layer and filling the V-pit;
The second n-type nitride semiconductor layer has a wider band gap than the first n-type nitride semiconductor layer.
And the thickness of the second n-type nitride semiconductor layer in the V-pit is thicker than the thickness of the second n-type nitride semiconductor layer located on the top surface of the first n-type nitride semiconductor layer.
The first n-type nitride semiconductor layer is Al x Ga 1- x N (0≤x <1),
The second n-type nitride semiconductor layer is Al y Ga 1 -y N (0 <y <1),
A semiconductor device in which x <y.
And at least two pairs of the first n-type nitride semiconductor layer and the second n-type nitride semiconductor layer.
The stack of the first n-type nitride semiconductor layer and the second n-type nitride semiconductor layer is a distributed Bragg reflector.
And the first n-type nitride semiconductor layer is grown at a temperature at which a V-pit is formed, and the second n-type nitride semiconductor layer is grown at a temperature to fill a V-pit and planarize a surface thereof.
And the first n-type nitride semiconductor layer and the second n-type nitride semiconductor layer are grown in-situ.
The first n-type nitride semiconductor layer has a lower specific resistance than the second n-type nitride semiconductor layer.
The semiconductor device further comprises a p-type nitride semiconductor layer positioned on the second n-type nitride semiconductor layer.
And an active layer disposed between the second n-type nitride semiconductor layer and the p-type nitride semiconductor layer.
Board; And
Further comprising a lower n-type nitride semiconductor layer,
And the first n-type nitride semiconductor layer is on the lower n-type nitride semiconductor layer.
Forming a first n-type nitride semiconductor layer having a V-pit on the lower n-type nitride semiconductor layer,
Forming a second n-type nitride semiconductor layer filling the V-pit on the first n-type nitride semiconductor layer,
The second n-type nitride semiconductor layer has a wider band gap than the first n-type nitride semiconductor layer.
And the thickness of the second n-type nitride semiconductor layer in the V-pit is thicker than the thickness of the second n-type nitride semiconductor layer located on the top surface of the first n-type nitride semiconductor layer.
The first n-type nitride semiconductor layer is grown at a temperature at which the V-pit is formed, the second n-type nitride semiconductor layer is grown at a temperature to fill the V-pit to planarize the surface.
The first n-type nitride semiconductor layer is grown in a temperature range of 800 ℃ or more, less than 1000 ℃, the second n-type nitride semiconductor layer is grown in a temperature range of 1000 ℃ or more, 1200 ℃ or less.
The first n-type nitride semiconductor layer is Al x Ga 1- x N (0≤x <1),
The second n-type nitride semiconductor layer is Al y Ga 1 -y N (0 <y <1),
A semiconductor device manufacturing method wherein x <y.
The lower n-type nitride semiconductor layer, the first n-type nitride semiconductor layer and the second n-type nitride semiconductor layer is formed in-situ.
The first n-type nitride semiconductor layer and the second n-type nitride semiconductor layer are stacked in two or more pairs to form a distributed Bragg reflector.
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20160008749A (en) * | 2014-07-15 | 2016-01-25 | 엘지이노텍 주식회사 | Light emitting device, Method for fabricating the same and Lighting system |
CN105633230A (en) * | 2016-03-31 | 2016-06-01 | 厦门市三安光电科技有限公司 | Nitride light emitting diode with AIN quantum dots and manufacturing method thereof |
KR20160121837A (en) * | 2015-04-13 | 2016-10-21 | 엘지이노텍 주식회사 | Light emitting device and lighting system |
WO2018076901A1 (en) * | 2016-10-31 | 2018-05-03 | 厦门三安光电有限公司 | Thin-film light-emitting diode chip and manufacturing method therefor |
-
2011
- 2011-12-06 KR KR1020110129865A patent/KR20130063378A/en not_active Application Discontinuation
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20160008749A (en) * | 2014-07-15 | 2016-01-25 | 엘지이노텍 주식회사 | Light emitting device, Method for fabricating the same and Lighting system |
KR20160121837A (en) * | 2015-04-13 | 2016-10-21 | 엘지이노텍 주식회사 | Light emitting device and lighting system |
CN105633230A (en) * | 2016-03-31 | 2016-06-01 | 厦门市三安光电科技有限公司 | Nitride light emitting diode with AIN quantum dots and manufacturing method thereof |
CN105633230B (en) * | 2016-03-31 | 2018-08-14 | 厦门市三安光电科技有限公司 | A kind of iii-nitride light emitting devices and preparation method thereof with AlN quantum dots |
WO2018076901A1 (en) * | 2016-10-31 | 2018-05-03 | 厦门三安光电有限公司 | Thin-film light-emitting diode chip and manufacturing method therefor |
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