KR20130052794A - Method for inspecting a semiconductor package - Google Patents

Method for inspecting a semiconductor package Download PDF

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Publication number
KR20130052794A
KR20130052794A KR1020110118031A KR20110118031A KR20130052794A KR 20130052794 A KR20130052794 A KR 20130052794A KR 1020110118031 A KR1020110118031 A KR 1020110118031A KR 20110118031 A KR20110118031 A KR 20110118031A KR 20130052794 A KR20130052794 A KR 20130052794A
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South Korea
Prior art keywords
image
semiconductor package
marking
region
ball land
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KR1020110118031A
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Korean (ko)
Inventor
이선열
채광석
한동일
윤태준
이성주
이주열
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(주)에이치아이티에스
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Priority to KR1020110118031A priority Critical patent/KR20130052794A/en
Publication of KR20130052794A publication Critical patent/KR20130052794A/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2518—Projection by scanning of the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/265—Contactless testing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Signal Processing (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The semiconductor package inspection method includes obtaining an image of a mold region formed on the front surface of a semiconductor package by a molding process, and obtaining an image of the marking region formed on the front surface of a semiconductor package by a marking process when obtaining an image of the mold region. And obtaining an image of the ball land region formed on the back surface of the semiconductor package by a ball land process when obtaining an image of the mold region and an image of the marking region, and an image of the mold region, an image of the marking region and the Process each image of the ball land area to be processed into data that can be monitored on a single screen, and analyze the data that is monitored on the single screen to check the molding, marking and abnormality of the ball land of the semiconductor package. It is equipped with a step.

Description

Method for inspecting a semiconductor package

The present invention relates to a semiconductor package inspection method, and more particularly, to a semiconductor package inspection method for checking and processing the abnormality of the molding, marking and ball land.

In general, in the manufacture of a semiconductor package, the molding process of sealing a semiconductor chip with an resin such as an epoxy molding compound (EMC) to protect the semiconductor chip from the external environment, the product control items such as the product name and the time of manufacture on the front of the semiconductor package A marking process for printing, a ball land process for electrically connecting the semiconductor package and the external device, and the like are performed. After the semiconductor package mentioned above is manufactured, the semiconductor package is inspected. At this time, the inspection of the semiconductor package is performed not only for the electrical function but also for the states of molding, marking, ball land, and the like.

Inspection of the state of molding, marking, ball land, etc. of the semiconductor package mentioned above mainly uses an area scan camera. In this case, in the case of the area scan camera, since an image must be obtained in one shot, the area scan camera is mainly disposed at a center region perpendicular to the semiconductor package. In addition, inspection of the state of molding, marking, ball land, etc. is performed separately.

Here, the inspection of the state of the molding, marking and ball land separately is because, as mentioned, the area scan camera is placed at the center region position perpendicular to the semiconductor package, thereby making the area scan to obtain a molded image. This is because the camera, the area scan camera for obtaining the marking state, and the area scan camera for obtaining the ball land state cannot be disposed to overlap each other. Thus, in the conventional inspection of the state of the molding, marking and ball land, the member for inspection of the molding state, the member for inspection of the marking state and the ball so that the state for each of the molding, marking and ball land can be inspected separately. Each member for the inspection of land conditions should be separately provided.

Therefore, there is a problem that the molding, marking and inspection of the state of the ball land of the conventional semiconductor package causes a cost increase due to the manufacture of the semiconductor package due to the provision of a separate member as mentioned above. In addition, the inspection of the state of the molding, marking and ball land is made separately, so that the mentioned inspection takes a long time, there is a problem that the productivity of the semiconductor package is reduced.

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor package inspection method for integrally performing inspection of molding, marking and ball land conditions.

The semiconductor package inspection method according to an embodiment of the present invention for achieving the above object, after performing each of the molding process, the marking process and the ball land (ball land) process according to the manufacturing process of the semiconductor package, Obtaining an image of the mold region formed on the front surface of the semiconductor package, and obtaining an image of the marking region formed on the front surface of the semiconductor package by the marking process when obtaining the image of the mold region, Obtaining an image of the mold region and an image of the marking region together with obtaining an image of the ball land region formed on the bottom surface of the semiconductor package by the ball land process, an image of the mold region, the marking Day that can be monitored in a single screen by receiving each image of the area and the image of the ball land area A processing step of processing, and a step of analyzing the monitored data is made in the single-screen Confirm the presence of the molding, marking, and the ball lands in the semiconductor package.

In the semiconductor package inspection method according to the aforementioned embodiment, each of the image of the mold region, the image of the marking region, and the image of the ball land region may be obtained using a line scan camera.

In the semiconductor package inspection method according to the aforementioned embodiment, an image of the mold region, an image of the marking region, and an image of the ball land region may be obtained together at the same place.

In the semiconductor package inspection method according to the aforementioned embodiment, the image of the mold region and the image of the marking region are disposed at a position where the front surface of the semiconductor package can be viewed based on the semiconductor package introduced into the same place. Each of the first and second cameras may be obtained, and an image of the ball land region may be obtained by using a third camera disposed at a position facing the rear surface of the semiconductor package.

In the semiconductor package inspection method according to an exemplary embodiment, an image of the mold region, an image of the marking region, and an image of the ball land region may be formed on the front surface of the semiconductor package or based on the semiconductor package introduced into the same place. Obtained using a first camera, a second camera, and a third camera, each of which is disposed at a position facing the rear surface, wherein the semiconductor package obtains an image of the mold region and an image of the marking region at the same location. It can then be reversed or reversed after obtaining an image of the ball land area.

In the semiconductor package inspection method according to the aforementioned embodiment, a step of mapping a semiconductor package in which an abnormality with respect to molding, marking, and ball land of the semiconductor package is confirmed, and the mapped semiconductor package as defective It may further comprise the step of processing.

In the case of the semiconductor package inspection method of the present invention mentioned above, molding images, marking images and ball land images can be obtained together by using a line scan camera capable of obtaining images not only in the vertical position but also in the lateral position of the semiconductor package. In addition, the mold area image, the marking area image, and the ball land area image can be processed in a single screen.

Therefore, in the semiconductor package inspection method according to the present invention, since the data for the mold region image, the data for the marking region image, and the data for the ball land region image can be monitored on a single screen, a simplified member can be used. Simplification of the member has the advantage of reducing the space. Therefore, the effect of sufficiently reducing the costs associated with the manufacture of a semiconductor package can be expected.

In addition, the integrated inspection of molding, marking and ball land conditions can reduce the time required for semiconductor package inspection, and as a result, it is expected to improve the productivity of manufacturing a semiconductor package. Can be.

1 is a schematic process diagram illustrating a method of inspecting a semiconductor package according to an embodiment of the present invention.
2 and 3 are views for explaining each member used in the method for inspecting the semiconductor package of FIG.
4A to 4C are diagrams for describing a method of confirming abnormality of marking in the inspection method of the semiconductor package of FIG. 1.

Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. In describing the drawings, similar reference numerals are used for similar components. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the invention, and are actually shown in a smaller scale than the actual dimensions in order to explain the schematic configuration. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

Example

1 is a schematic process diagram illustrating a method of inspecting a semiconductor package according to an exemplary embodiment of the present invention, and FIGS. 2 and 3 are diagrams for describing each member used in the method of inspecting a semiconductor package of FIG. 1. admit.

First, referring to FIG. 1, a molding process of sealing a semiconductor chip with a resin such as EMC to protect a semiconductor chip from an external environment, and a marking process of printing items necessary for product management such as a product name and a manufacturing time on the front surface of a semiconductor package. And performing a ball land process for electrically connecting the semiconductor package to the external device, and then inspecting whether the molding, marking, and ball land of the semiconductor package are correctly formed. At this time, inspection of the molding, marking and ball land mentioned is mainly achieved through the analysis of the data processed from the image, as will be described later.

Specifically, in the inspection for the molding, marking and ball land mentioned above, an image of a mold region formed on the top surface of the semiconductor package is obtained by the molding process (S21), and the marking region formed on the front surface of the semiconductor package by the marking process. (S23) and a ball land image formed on the bottom surface of the semiconductor package by a ball land process (S25). (S2) In particular, in the present invention, an image of a mold area and an image of a marking area are obtained. And images of the ball land areas are obtained together. Further, in the present invention, the image of the mold area, the image of the marking area and the image of the ball land area are obtained together at the same place. Here, the order of the images of the mold region, the marking region and the ball land region mentioned above are obtained in the same place.

In the present invention, the image of the mold region, the image of the marking region and the image of the ball land region are obtained together in the same place, rather than separately from each other. In the present invention, an image of the mold area, an image of the marking area, and an image of the ball land area are obtained using a line scan camera. Here, in the case of the line scan camera, it is possible to obtain an image even in the side position unlike the area scan camera. In addition, when using an area scan camera as in the conventional inspection, a semiconductor package including at least two dies, mainly nine dies, is a photographing target for obtaining an image, but as mentioned in the inspection of the present invention, In the case of using a line scan camera, it is possible to obtain an image having a higher resolution since the semiconductor package including one die is used as a photographing target for image acquisition.

In the inspection of the semiconductor package of the present invention, as shown in FIGS. 2 and 3, the first camera 21 capable of obtaining an image of the mold area, the second camera 23 capable of obtaining an image of the marking area, and the ball land A member having a third camera 25 capable of obtaining an image of the area is used. Here, each of the first camera 21, the second camera 23, and the third camera 25 mentioned above may be provided as a line scan camera, and the first camera 21, the second camera 23, and Each of the third cameras 25 may include an illumination system.

Accordingly, in the semiconductor package inspection according to the present invention, an image of the mold region and an image of the marking region may be obtained by photographing the front surface of the semiconductor package 11 using each of the first camera 21 and the second camera 23 together. In addition, an image of the ball land region may be obtained by photographing the rear surface of the semiconductor package 11 using the third camera 25 together with the first camera 21 and the second camera 23.

That is, as shown in FIG. 2, the first camera 21 is disposed at a position where the front surface of the semiconductor package 11 can be viewed with respect to the semiconductor package 11 introduced in the direction of 11b from the direction of 11a. Each of the second cameras 23 is used to obtain an image of the mold area and an image of the marking area, respectively, and is viewed using the third camera 25 disposed in a position where the rear side of the semiconductor package 11 can be viewed. It is possible to obtain an image of the land area.

2, the image of the mold region, the image of the marking region and the image of the ball land region can be obtained together at the same place.

In addition, as shown in FIG. 3, the first camera 21 is disposed at a position where the front surface of the semiconductor package 11 can be viewed with respect to the semiconductor package 11 introduced in the direction of 11b from the direction of 11a. Each of the second camera 23 and the third camera 25 is used to obtain an image of the mold area, an image of the marking area and an image of the ball land area, respectively. In particular, in the case of FIG. 3, after obtaining the image of the mold region and the image of the marking region, reverse the semiconductor package 11 so that the rear surface of the semiconductor package 11 may face the third camera 25 as shown by reference numeral 11c. By reversing, an image of the ball land area can be obtained using the third camera 25. Here, although the first camera 21, the second camera 23 and the third camera 25 are described as being disposed in a position where the front surface of the semiconductor package 11 can be seen, otherwise the first Each of the camera 21, the second camera 23, and the third camera 25 may be disposed at a position where the rear surface of the semiconductor package 11 can be viewed. In addition, while the image of the mold region and the image of the marking region are obtained, the semiconductor package 11 is reversed to obtain an image of the ball land region. Alternatively, the semiconductor package is obtained after the image of the ball land region is obtained. (11) may be reversed to obtain an image of the mold area and an image of the marking area.

Thus, in the case of FIG. 3 mentioned in the same manner as in FIG. 2, an image of the mold region, an image of the marking region, and an image of the ball land region may be obtained together at the same place.

As described above, in the inspection of the semiconductor package according to the present invention, the image of the mold region, the image of the marking region, and the image of the ball land region can be obtained together at the same place. It may be more advantageous in spatial terms than to obtain each of an image of the marking area and an image of the ball land area separately. This means that in the case of the present invention, the first camera 21 for obtaining an image of the mold area, the second camera 23 for obtaining an image of the marking area and the third camera for obtaining an image of the ball land area ( This is because it is possible to further reduce the space occupied by the member for inspecting the semiconductor package as compared with the prior art by arranging 25) at the same place and directing the device arrangement.

As mentioned, in the inspection of the semiconductor package according to the present invention, the image of the mold region, the image of the marking region and the image of the ball land region are obtained together at the same place (S2), and then the image of the mold region, the image of the marking region. And data processing each image of the ball land area. At this time, the data processing is made possible to monitor on a single screen. That is, the image of the mold area, the image of the marking area, and the image of the ball land area are each processed into data that can be monitored on a single screen. (S4) Here, the image of the mold area, the image of the marking area, and the ball are processed. Processing of the image of the land area into data that can be monitored on a single screen is achieved by an IC chip or the like in which a program capable of processing the data mentioned above is embedded.

As mentioned above, the monitoring data is analyzed on a single screen to check the molding, marking and abnormality of the ball land of the semiconductor package (S6), that is, the image of the molding area, the image of the marking area, and the ball land area. The data for each image is monitored and analyzed on a single screen. Herein, in the analysis of the mold, chip out, incomplete mold, void hole, bubble, porosity, crack, Check whether scratches, sticking, etc. have occurred, check whether the marking is correct in the analysis of the marking, do not double marking, etc., and whether the adsorption of particles, substrate in the analysis of the ball land Check for exposure, scratches, etc.

As mentioned, the inspection of the semiconductor package according to the present invention can process and analyze the image of the mold area, the image of the marking area and the image of the ball land area with data that can be monitored on a single screen. Likewise, it is possible to monitor and analyze data more efficiently than using individual screens, and also to arrange a single monitor instead of individual monitors. The space occupied by the member can be further reduced.

Therefore, in the semiconductor package inspection method according to the present invention, since the monitoring and analysis of data can be efficiently performed, the reliability of the inspection can be expected, and the member for the inspection of the semiconductor package through the improvement of the device integration degree. It can reduce the production cost because it can reduce the space occupied.

Subsequently, as mentioned above, the molding, marking and ball land of the semiconductor package are checked for abnormalities, and if there is no abnormality, a subsequent process is performed. However, when an abnormality is confirmed, the location of the semiconductor package in which the abnormality is confirmed is mapped. do. Also, in the case of mapping, the mold anomaly, the marking anomaly, and the ball land anomaly may be displayed with different marks.

The semiconductor package in which the above-mentioned mapping is performed is treated as defective (S10). In this case, the defective processing selectively separates the semiconductor package in which the mapping is performed. In other words, the semiconductor package that can be repaired and the semiconductor package that cannot be repaired are selectively separated.

As described above, in the inspection of the semiconductor package according to the present invention, the image of the mold region, the image of the marking region, and the image of the ball land region can be obtained together at the same place and processed into data that can be monitored on a single screen.

Hereinafter, a method of confirming abnormality of the aforementioned marking and a method of confirming abnormality of the mold will be described in detail.

4A to 4C are diagrams for describing a method of confirming abnormality of marking in the inspection method of the semiconductor package of FIG. 1.

First, referring to FIG. 4A, an image 41 of the actual marking area is obtained using a second camera. At this time, the image 41 of the actual marking area has a slightly inclined state.

4B, the image 43 of the reference marking area is compared with the image 41 of the actual marking area mentioned. Here, the image 43 of the reference marking area is somewhat larger than the image 41 of the actual marking area. Thus, the image 43 of the reference marking area is adjusted to have the same size as the image 41 of the actual marking area. In addition, since the image 41 of the actual marking area has a slightly inclined state, the image 43 of the reference marking area is adjusted to have the same inclination state as the image 41 of the actual marking area. That is, the image of the actual marking area is adjusted by adjusting the image 43 of the reference marking area to the first converted image 43a by adjusting the size, and adjusting the image 43 of the reference marking area to the second converted image 43b by adjusting the tilted state. To make a comparison image 45 for comparison with (41).

As such, by adjusting the size and tilt of the image 43 of the reference marking area, the image 43 of the reference marking area is compared with the image 41 of the actual marking area obtained using the second camera mentioned above. It is formed into a comparison image 45 having the same size and tilted state.

Referring to FIG. 4C, the comparison image 45 having the converted size and the tilted state is compared with the image 41 of the actual marking area obtained by using the second camera. Here, by comparing the difference after projecting the comparison image 45, which is the image of the converted reference marking region, and the image 41 of the actual marking region, the difference images are obtained by making the centers coincide with each other as shown in FIG. 4C. This can be achieved by. That is, as shown in FIG. 4C, when there is a defective area in the image 41 of the actual marking area, a difference image 47 having the defective area will be obtained, and it can be confirmed that there is an abnormality in the marking.

In addition, whether there is an abnormality in marking through the difference image 47 obtained by comparing the comparison image 45 obtained through the conversion of the image 41 of the actual marking area and the image 43 of the reference marking area with each other. In addition to the checking method, there is also a method of checking whether there is an abnormality in the marking by extracting a correlation between the gray value and the marking depth in the marking area using an oblique camera as the second camera. In other words, by using the area where the marking is deeply calculated, the gray value is lower than that of the area where the marking is shallow, and using the structural features of the side camera and the lighting to confirm the change in the gray value in the marking area To check for abnormalities.

In the case of a method for checking an abnormality of a mold, there are a method using a multiple distribution curve and a method of using a defect assumption method of a minimum size and a minimum gray value.

First, in a method of checking an abnormality of a mold using a multiple distribution curve, a brightness distribution curve of an image of a reference mold region is extracted, and a brightness distribution curve of an image of an actual mold region is extracted. Here, each of the brightness distribution curves for the image of the reference mold region and the brightness distribution curves for the image of the actual mold region correspond to a double distribution chart. After extracting the average value and the allowable offset gray value for each of the brightness distribution curves for the image of the reference mold region and the brightness distribution curves for the image of the actual mold region, and comparing them with each other, the abnormality of the mold is confirmed. .

In addition, in the method of confirming the abnormality of the mold using the defect assumption method of the minimum size and the minimum gray value, the roughness of the normal mold surface, that is, the reference mold surface, is extracted. Further, the degree of roughness in the region where the actual mold is formed is extracted. The gray values of the reference mold roughness and the gray values of the actual mold roughness are then sorted in ascending order for the randomly partitioned regions. Each gray value is compared with each other to check whether there is an abnormality in the mold by satisfying the set range. Here, the set range is arbitrarily set by the operator, and may be mainly within about 1 to 5%.

As described above, in the present invention, it is possible to check the abnormality of the mold and the marking through various methods using the image mentioned above.

Therefore, since the inspection space of the semiconductor package mentioned above can be reduced, the cost reduction can be expected when the semiconductor package inspection method of the present invention is applied to the manufacture of semiconductor devices. In addition, the integrated inspection of molding, marking and ball land conditions can reduce the time required for semiconductor package inspection, and as a result, it is expected to improve the productivity of manufacturing a semiconductor package. Can be.

Accordingly, the semiconductor package inspection method of the present invention can be more actively applied to the manufacture of semiconductor devices requiring the latest cost reduction and productivity.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.

Claims (6)

Performing each of a molding process, a marking process, and a ball land process according to a manufacturing process of the semiconductor package, and then obtaining an image of a mold region formed on the top surface of the semiconductor package by the molding process;
Obtaining an image of the marking region formed on the entire surface of the semiconductor package by the marking process when obtaining the image of the mold region;
Obtaining an image of the ball land region formed on the bottom surface of the semiconductor package by the ball land process when obtaining the image of the mold region and the marking region;
Processing an image of the mold area, an image of the marking area, and an image of the ball land area into data that can be monitored on a single screen; And
And analyzing the data to be monitored on the single screen to check whether there is an abnormality in molding, marking and ball land of the semiconductor package. The method of claim 1, wherein each of the image of the mold region, the image of the marking region, and the image of the ball land region are obtained using a line scan camera. The method of claim 1, wherein the image of the mold region, the image of the marking region, and the image of the ball land region are obtained together at the same place. The first camera and the second camera of claim 3, wherein the image of the mold region and the image of the marking region are disposed at positions facing the front surface of the semiconductor package based on the semiconductor package introduced into the same place. Obtained using each camera, and the image of the ball land region is obtained by using a third camera disposed at a position facing the back side of the semiconductor package. The position of claim 3, wherein the image of the mold region, the image of the marking region, and the image of the ball land region are viewed from the front or rear surface of the semiconductor package based on the semiconductor package introduced into the same place. Obtained using a first camera, a second camera and a third camera respectively disposed in the semiconductor package, and the semiconductor package is reversed after obtaining an image of the mold area and an image of the marking area at the same place; or And obtaining an image of the ball land region and then reversed. The method of claim 1, further comprising: mapping a position of the semiconductor package in which an abnormality with respect to molding, marking, and a ball land of the semiconductor package is identified; And
And inspecting the mapped semiconductor package as a defect.
KR1020110118031A 2011-11-14 2011-11-14 Method for inspecting a semiconductor package KR20130052794A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10373330B2 (en) 2016-02-12 2019-08-06 Samsung Electronics Co., Ltd. Method for predicting location of mark
KR20230000054A (en) * 2021-06-24 2023-01-02 (주)에이치아이티에스 Method of packing a die

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10373330B2 (en) 2016-02-12 2019-08-06 Samsung Electronics Co., Ltd. Method for predicting location of mark
KR20230000054A (en) * 2021-06-24 2023-01-02 (주)에이치아이티에스 Method of packing a die

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